阅读说明：本技术 一种应用于电子行业替代导热硅胶的石墨烯散热涂料 (Graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel ) 是由 张萍 于 2019-11-05 设计创作，主要内容包括：本发明公开了一种应用于电子行业替代导热硅胶的石墨烯散热涂料,其特征在于,包括以下重量份,混合树脂30-40份,石墨烯10-20份、流平剂3-5份、分散剂5-7份、着色剂3-5份,乙醇溶剂35-40份,氧化硅10-20份、消泡剂16-18份、改性纳米活性炭30-50份、固化剂8-16份、聚苯胺20-36份、纳米氧化钙10-30份、异辛酯12-15份。本发明都采用环保材料吗,并且能显著提升导热效率；大幅提高产品质量；省工省料使用方便,薄涂即可,同时具有优良的防水性、耐热性、耐候性、稳定性等各方面性能。(The invention discloses a graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel, which is characterized by comprising, by weight, 30-40 parts of mixed resin, 10-20 parts of graphene, 3-5 parts of a leveling agent, 5-7 parts of a dispersing agent, 3-5 parts of a coloring agent, 35-40 parts of an ethanol solvent, 10-20 parts of silicon oxide, 16-18 parts of a defoaming agent, 30-50 parts of modified nano activated carbon, 8-16 parts of a curing agent, 20-36 parts of polyaniline, 10-30 parts of nano calcium oxide and 12-15 parts of isooctyl ester. The invention adopts environment-friendly materials, and can obviously improve the heat conduction efficiency; the product quality is greatly improved; the coating is convenient to use, can be coated in a thin mode, and has excellent performances such as waterproofness, heat resistance, weather resistance and stability.)

1. The graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel is characterized by comprising, by weight, 30-40 parts of mixed resin, 10-20 parts of graphene, 3-5 parts of a leveling agent, 5-7 parts of a dispersing agent, 3-5 parts of a coloring agent, 35-40 parts of an ethanol solvent, 10-20 parts of silicon oxide, 16-18 parts of a defoaming agent, 30-50 parts of modified nano activated carbon, 8-16 parts of a curing agent, 20-36 parts of polyaniline, 10-30 parts of nano calcium oxide and 12-15 parts of isooctyl ester.

2. The graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel is characterized by comprising, by weight, 30 parts of mixed resin, 10 parts of graphene, 3 parts of a leveling agent, 5 parts of a dispersing agent, 3 parts of a coloring agent, 35 parts of an ethanol solvent, 10 parts of silicon oxide, 16 parts of a defoaming agent, 30 parts of modified nano activated carbon, 8 parts of a curing agent, 20 parts of polyaniline, 10 parts of nano calcium oxide and 12 parts of isooctyl ester.

3. The substitute thermal silica gel applied to the electronic industry as claimed in claim 1, wherein the substitute thermal silica gel comprises, by weight, 35 parts of mixed resin, 15 parts of graphene, 4 parts of a leveling agent, 6 parts of a dispersing agent, 4 parts of a coloring agent, 38 parts of an ethanol solvent, 15 parts of silicon oxide, 17 parts of a defoaming agent, 40 parts of modified nano activated carbon, 12 parts of a curing agent, 28 parts of polyaniline, 20 parts of nano calcium oxide, and 13 parts of isooctyl ester.

4. The substitute thermal silica gel applied to the electronic industry as claimed in claim 1, wherein the substitute thermal silica gel comprises, by weight, 40 parts of mixed resin, 20 parts of graphene, 5 parts of a leveling agent, 7 parts of a dispersing agent, 5 parts of a coloring agent, 40 parts of an ethanol solvent, 20 parts of silicon oxide, 18 parts of a defoaming agent, 50 parts of modified nano-active material, 16 parts of a curing agent, 36 parts of polyaniline, 30 parts of nano-calcium oxide and 15 parts of isooctyl ester.

5. The substitute thermal silica gel applied to the electronic industry as claimed in claim 1, wherein the mixed resin is a mixture of water-based acrylic emulsion and water-based silicone modified acrylic resin.

6. A use method of a graphene heat dissipation coating applied to electronic industry for replacing heat conduction silica gel is characterized by comprising the following steps:

s1, cleaning the surface of the electronic part by using a practical fan and a brush;

s2, spraying and coating the anticorrosive material on the surface layer of the electronic part, firstly performing thin coating once, and standing for several minutes;

s3, performing two-pass cross thick coating spraying on the surface layer of the electronic part;

s4, putting the electronic parts into vacuum equipment for vacuum extrusion defoaming treatment;

and S5, heating and drying the sprayed electronic parts.

7. The method as claimed in claim 6, wherein the required standing time in S2 is three minutes.

8. The method as claimed in claim 6, wherein the thickness of the thin coating in S3 is 10 μm.

9. The method as claimed in claim 6, wherein the thickness of the second cross in S3 is 20 μm.

10. The use method of the substitute thermal silica gel applied to the electronic industry as claimed in claim 6, wherein the drying temperature in S4 is 70 ℃, and the drying time is ten minutes.

Technical Field

The invention relates to the field of heat dissipation protection in the photoelectric industry, in particular to a graphene heat dissipation coating applied to the electronic industry to replace heat-conducting silica gel.

Background

The heat dissipation material used in the electronic industry is basically a heat conductive silica gel sheet. The heat-conducting silicone sheet is a heat-conducting medium material synthesized by taking silicone as a base material and adding various auxiliary materials such as metal oxides through a special process, and is also called a heat-conducting silicone pad, a heat-conducting silicone sheet, a soft heat-conducting pad and the like in the industry. The heat-radiating structure can utilize the gap to transfer heat, and can complete the heat transfer between the heating part and the heat-radiating part while filling the gap. Meanwhile, the heat-conducting filling material has the effects of insulation, shock absorption, sealing and the like, has excellent performances of atmospheric aging resistance, ultraviolet aging resistance and the like, can meet the design requirements of equipment miniaturization and ultra-thinness, has high manufacturability and usability, has wide thickness application range, and is an excellent heat-conducting filling material.

In addition, the existing heat-conducting silica gel sheet has the following defects: 1. the heat conductivity coefficient is slightly lower, and is generally 1.75-2.75 w/m; 2. the heat-conducting silica gel sheet with the thickness of less than 0.5mm has complex process and relatively high thermal resistance; 3. the heat-conducting silica gel has a limited temperature-resistant range, generally between-50 ℃ and 220 ℃; 4. the heat-conducting silica gel sheet is expensive, so that the heat-conducting silica gel sheet is generally applied to thin, small and precise electronic products such as notebook computers and the like; 5. in order to meet the heat dissipation requirement, a large heat-conducting silica gel sheet is generally adhered, so that the consumption is large, the occupied space is large, and the gap cannot be filled in place.

Disclosure of Invention

The present invention aims to overcome the above-mentioned shortcomings and provide a technical solution to solve the above-mentioned problems.

The graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel is characterized by comprising, by weight, 30-40 parts of mixed resin, 10-20 parts of graphene, 3-5 parts of a leveling agent, 5-7 parts of a dispersing agent, 3-5 parts of a coloring agent, 35-40 parts of an ethanol solvent, 10-20 parts of silicon oxide, 16-18 parts of a defoaming agent, 30-50 parts of modified nano activated carbon, 8-16 parts of a curing agent, 20-36 parts of polyaniline, 10-30 parts of nano calcium oxide and 12-15 parts of isooctyl ester.

A graphene heat dissipation coating applied to electronic industry for replacing heat conduction silica gel comprises the following steps:

s1, cleaning the surface of the electronic part by using a practical fan and a brush;

s2, spraying and coating the anticorrosive material on the surface layer of the electronic part, firstly performing thin coating once, and standing for several minutes;

s4, putting the electronic parts into vacuum equipment for vacuum extrusion defoaming treatment;

and S5, heating and drying the sprayed electronic parts.

As a further scheme of the invention: the required standing time in S2 was three minutes.

As a further scheme of the invention: the thickness of the thin coating in the S3 is 10 mu m.

As a further scheme of the invention: the thickness of the second cross in the S3 is 20 μm.

As a further scheme of the invention: and in the step S4, the drying temperature is 70 ℃, and the drying time is ten minutes.

Compared with the prior art, the invention has the beneficial effects that: the heat conduction efficiency is obviously improved; the product quality is greatly improved; the coating is convenient to use, can be coated in a thin mode, and has excellent performances such as waterproofness, heat resistance, weather resistance and stability. The concrete expression is as follows:

1. the microscopic heat-dissipating coating is composed of a plurality of crystal grains, has unique crystal grain orientation, and conducts heat uniformly along two directions, thereby shielding heat sources and components and improving the performance of consumer electronic products;

2. the nano surface effect is achieved, so that after the heat dissipation surface is coated, the heat dissipation area is expanded by multiple times or even tens of times, the heat dissipation efficiency is greatly improved, and the heat conductivity coefficient can reach 5300W/m.K;

3. the heat conducting performance is more excellent under the condition of reducing the weight of the device, and the heat conducting performance has excellent insulating, waterproof and corrosion-resistant performances;

4. the construction process is simple, convenient and efficient, saves time and labor, can be completed by only conventional spraying, and has small equipment investment;

5. the paint is a green environment-friendly product (which passes the SGS detection of European Standard), has no pollution to the environment, is simple to coat, and is energy-saving and emission-reducing.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

The graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel is characterized by comprising, by weight, 30-40 parts of mixed resin, 10-20 parts of graphene, 3-5 parts of a leveling agent, 5-7 parts of a dispersing agent, 3-5 parts of a coloring agent, 35-40 parts of an ethanol solvent, 10-20 parts of silicon oxide, 16-18 parts of a defoaming agent, 30-50 parts of modified nano activated carbon, 8-16 parts of a curing agent, 20-36 parts of polyaniline, 10-30 parts of nano calcium oxide and 12-15 parts of isooctyl ester.

A graphene heat dissipation coating applied to electronic industry for replacing heat conduction silica gel comprises the following steps:

s1, cleaning the surface of the electronic part by using a practical fan and a brush;

s2, spraying and coating the anticorrosive material on the surface layer of the electronic part, firstly performing thin coating once, and standing for several minutes;

s3, performing two-pass cross thick coating spraying on the surface layer of the electronic part;

s4, putting the electronic parts into vacuum equipment for vacuum extrusion defoaming treatment;

and S5, heating and drying the sprayed electronic parts.

As a further scheme of the invention: the required standing time in S2 was three minutes.

As a further scheme of the invention: the thickness of the thin coating in the S3 is 10 mu m.

As a further scheme of the invention: the thickness of the second cross in the S3 is 20 μm.

As a further scheme of the invention: and in the step S4, the drying temperature is 70 ℃, and the drying time is ten minutes.

Example two

The graphene heat dissipation coating applied to electronic industry to replace heat conduction silica gel is characterized by comprising, by weight, 30 parts of mixed resin, 10 parts of graphene, 3 parts of a leveling agent, 5 parts of a dispersing agent, 3 parts of a coloring agent, 35 parts of an ethanol solvent, 10 parts of silicon oxide, 16 parts of a defoaming agent, 30 parts of modified nano activated carbon, 8 parts of a curing agent, 20 parts of polyaniline, 10 parts of nano calcium oxide and 12 parts of isooctyl ester.

EXAMPLE III

35 parts of mixed resin, 15 parts of graphene, 4 parts of flatting agent, 6 parts of dispersing agent, 4 parts of coloring agent, 38 parts of ethanol solvent, 15 parts of silicon oxide, 17 parts of defoaming agent, 40 parts of modified nano activated carbon, 12 parts of curing agent, 28 parts of polyaniline, 20 parts of nano calcium oxide and 13 parts of isooctyl ester.

Example four

40 parts of mixed resin, 20 parts of graphene, 5 parts of flatting agent, 7 parts of dispersing agent, 5 parts of coloring agent, 40 parts of ethanol solvent, 20 parts of silicon oxide, 18 parts of defoaming agent, 50 parts of modified nano-active material, 16 parts of curing agent, 36 parts of polyaniline, 30 parts of nano-calcium oxide and 15 parts of isooctyl ester.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.