阅读说明：本技术 一种ict测试平台的校验方法及系统 (ICT test platform verification method and system ) 是由 陈占旭 于 2020-12-28 设计创作，主要内容包括：本发明公开了一种ICT测试平台的校验方法及系统,该方法包括：提供针点验证板,在所述针点验证板表面形成多个图形；所述多个图形的形状大小及位置与PCB上的多个焊盘的形状大小及位置分别对应；通过夹具夹持固定所述针点验证板；将设置有多个探针的测试平台与所述针点验证板对齐,控制所述多个探针抵靠所述针点验证板,在所述针点验证板上形成多个针印,再根据所述多个针印的位置,对所述测试平台上的探针位置进行校验；所述多个图形包含有多个类别的图形,不同类别图形的大小及颜色不同。本发明可以对ICI测试平台上的探针位置进行校验,避免划伤PCB,造成PCB的浪费。(The invention discloses a method and a system for checking an ICT test platform, wherein the method comprises the following steps: providing a needle point verification plate, and forming a plurality of patterns on the surface of the needle point verification plate; the shapes, sizes and positions of the patterns correspond to those of the pads on the PCB respectively; clamping and fixing the needle point verification plate through a clamp; aligning a test platform provided with a plurality of probes with the pin point verification board, controlling the plurality of probes to abut against the pin point verification board, forming a plurality of pin marks on the pin point verification board, and verifying the positions of the probes on the test platform according to the positions of the plurality of pin marks; the graphics comprise graphics of multiple categories, and the sizes and colors of the graphics of different categories are different. The invention can verify the position of the probe on the ICI test platform, and avoid scratching the PCB to cause PCB waste.)

1. A checking method for an ICT test platform is characterized by comprising the following steps:

providing a needle point verification plate, and forming a plurality of patterns on the surface of the needle point verification plate; the shapes, sizes and positions of the patterns correspond to those of the pads on the PCB respectively;

clamping and fixing the needle point verification plate through a clamp;

the test platform that will be provided with a plurality of probes with the needle point verifies the board and aligns, control a plurality of probes support and lean on the needle point verifies the board form a plurality of needle marks on the needle point verifies the board, again according to the position of a plurality of needle marks, right the last probe position of test platform checks.

The graphics comprise graphics of multiple categories, and the sizes and colors of the graphics of different categories are different.

2. The ICT test platform verification method of claim 1, wherein the pin point verification board is made of polypropylene;

the method further comprises the following steps:

and attaching a blue film on the surface of the needle point verification board.

3. The method for verifying the ICT test platform according to claim 1, wherein the shapes of the plurality of patterns are all circular.

4. The method for verifying the ICT test platform according to claim 1, wherein the verifying the positions of the probes on the test platform according to the positions of the plurality of pins comprises:

and judging whether the plurality of pin prints are positioned in the plurality of graphs or not, and if not, determining that the probes corresponding to the pin prints positioned outside the plurality of graphs are dislocated.

5. The method for verifying the ICT test platform according to claim 4, further comprising:

and controlling the dislocation probe to reset according to the relative position between the corresponding pin mark formed on the pin point verification board by the dislocation probe and the graph.

6. The ICT test platform verification method of claim 5, wherein the controlling the misplaced probes to reposition according to the relative positions of the corresponding pin marks formed by the misplaced probes on the pin point verification board and the pattern comprises:

if at least two dislocation probes exist, taking the graph which is closest to the corresponding pin print of the dislocation probe and has no pin print inside as a default graph, and resetting according to the relative position between the default graph and the dislocation probe.

7. The method for verifying the ICT test platform according to claim 5, further comprising:

after the dislocation probe is reset, the test platform is aligned with the pin point verification plate, the plurality of probes are controlled to abut against the pin point verification plate, a plurality of pin marks are formed on the pin point verification plate, and whether the dislocation probe is reset successfully or not is judged according to the positions of the plurality of pin marks.

8. A verification system of an ICT test platform is characterized by comprising:

the pin point verifying plate is provided with a plurality of patterns on the surface; the shapes, sizes and positions of the plurality of patterns correspond to the shapes, sizes and positions of the plurality of bonding pads on the PCB respectively, the plurality of patterns comprise a plurality of types of patterns, and the sizes and colors of the patterns in different types are different;

the clamp is used for clamping and fixing the needle point verification plate;

the test platform, the last a plurality of probes that are provided with of test platform, test platform with the relative setting of pinpoint verification board is used for control a plurality of probes support and lean on the pinpoint verification board form a plurality of pinpoints on the pinpoint verification board, again according to the position of a plurality of pinpoints, it is right probe position on the test platform checks.

9. The ICT test platform verification system of claim 8, wherein the pin point verification board is polypropylene and a blue film is attached to the surface of the pin point verification board.

10. The ICT test platform verification system of claim 8, wherein the test platform is further configured to determine whether the pin prints are all located within the graphics, and if not, determine that the probes corresponding to the pin prints located outside the graphics are misaligned.

Technical Field

The invention relates to the technical field of electronics, in particular to a method and a system for checking an ICT test platform.

Background

The PCBA is a combination of a PCB (Printed Circuit Board) and components, and when the PCBA detects an ICT (In Circuit Tester) test platform, each needle point of the ICT test platform is required to be In good contact with a PAD (PAD) of a contact point on the PCBA, so that the ICT test can be effectively completed, and the position of the needle point is required to be In the PAD area. At present, when verifying the needle point position of the ICT test platform, a piece of PCB is generally selected to be manufactured, a blue film is pasted on the PCB, the PCB is placed into a jig and is attracted to the jig, whether the needle point position is in a PAD area or not is determined, and when the needle point position of the ICT test platform deviates, if the needle point is outside the PAD area on the PCB, the PCB can be scratched, and the waste of the PCB is caused.

Disclosure of Invention

By providing the ICT test platform calibration method and system, the probe position on the ICI test platform can be calibrated, and PCB waste caused by scratching of the PCB is avoided.

The invention provides a checking method of an ICT test platform, which comprises the following steps:

providing a needle point verification plate, and forming a plurality of patterns on the surface of the needle point verification plate; the shapes, sizes and positions of the patterns correspond to those of the pads on the PCB respectively;

clamping and fixing the needle point verification plate through a clamp;

aligning a test platform provided with a plurality of probes with the pin point verification board, controlling the plurality of probes to abut against the pin point verification board, forming a plurality of pin marks on the pin point verification board, and verifying the positions of the probes on the test platform according to the positions of the plurality of pin marks;

the graphics comprise graphics of multiple categories, and the sizes and colors of the graphics of different categories are different.

Preferably, the needle point verification plate is made of polypropylene;

the method further comprises the following steps:

and attaching a blue film on the surface of the needle point verification board.

Preferably, the shapes of the plurality of patterns are all circular.

Preferably, the verifying the probe positions on the test platform according to the positions of the plurality of pin marks includes:

and judging whether the plurality of pin prints are positioned in the plurality of graphs or not, and if not, determining that the probes corresponding to the pin prints positioned outside the plurality of graphs are dislocated.

Preferably, the method further comprises the following steps:

and controlling the dislocation probe to reset according to the relative position between the corresponding pin mark formed on the pin point verification board by the dislocation probe and the graph.

Preferably, the control according to misplace the probe on the needle point verification board form correspond the needle seal with the relative position between the figure, misplace the probe and reset, include:

if at least two dislocation probes exist, taking the graph which is closest to the corresponding pin print of the dislocation probe and has no pin print inside as a default graph, and resetting according to the relative position between the default graph and the dislocation probe.

Preferably, the method further comprises the following steps:

after the dislocation probe is reset, the test platform is aligned with the pin point verification plate, the plurality of probes are controlled to abut against the pin point verification plate, a plurality of pin marks are formed on the pin point verification plate, and whether the dislocation probe is reset successfully or not is judged according to the positions of the plurality of pin marks.

The invention also provides a checking system of the ICT test platform, which comprises the following components:

the pin point verifying plate is provided with a plurality of patterns on the surface; the shapes, sizes and positions of the plurality of patterns correspond to the shapes, sizes and positions of the plurality of bonding pads on the PCB respectively, the plurality of patterns comprise a plurality of types of patterns, and the sizes and colors of the patterns in different types are different;

the clamp is used for clamping and fixing the needle point verification plate;

the test platform, the last a plurality of probes that are provided with of test platform, test platform with the relative setting of pinpoint verification board is used for control a plurality of probes support and lean on the pinpoint verification board form a plurality of pinpoints on the pinpoint verification board, again according to the position of a plurality of pinpoints, it is right probe position on the test platform checks.

Preferably, the needle point verification board is made of polypropylene, and a blue film is attached to the surface of the needle point verification board.

Preferably, the test platform is further configured to determine whether the plurality of pin prints are located in the plurality of patterns, and if not, determine that the probes corresponding to the pin prints located outside the plurality of patterns are dislocated.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

according to the method and the system for checking the ICT test platform, provided by the invention, whether the positions of a plurality of probes on the test platform are accurate can be determined by directly using the pin marks on the pin point check plate, if the positions of the probes are not accurate, the probes can be controlled to reset, the size and the shape of the graph of the pin point check plate correspond to the size and the shape of the PCB, the pin point check plate is used for checking, the situation that the PCB is directly scratched due to dislocation of the probes is avoided, the waste of the PCB is avoided, and the scrapping quantity of the PCB is reduced. Moreover, the classification of the figure of the pin point verification board can be distinguished through colour and size, and the classification of figure corresponds with the classification of probe, and then can judge the classification of dislocation probe according to the needle mark that the probe formed on the pin point verification board, confirms the dislocation probe fast to reset to the dislocation probe.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

FIG. 1 is a flowchart of a verification method for an ICT test platform provided by the present invention;

FIG. 2 is a top view of a needle point verification board provided by the present invention;

FIG. 3 is a schematic diagram of a verification system of an ICT test platform provided by the present invention.

Detailed Description

In order to make the present application more clearly understood by those skilled in the art to which the present application pertains, the following detailed description of the present application is made with reference to the accompanying drawings by way of specific embodiments.

The invention provides a method for checking an ICT test platform, which comprises the following steps of:

s1, as shown in fig. 2, providing a pin point verification board 1, and forming a plurality of patterns 11 on the surface of the pin point verification board 1 by using ink; the shapes, sizes and positions of the patterns 11 correspond to those of the pads on a Printed Circuit Board (PCB). The pin point verification board 1 is prepared according to a design blueprint of the PCB, and the position of the graph 11 on the pin point verification board 1 is within the optimal tolerance of the design blueprint. The size and shape of the pin point verification board 1 are completely the same as those of the PCB, and the size and shape and position of the pattern 11 on the pin point verification board 1 are also completely the same as those of the pad on the PCB.

Wherein, the shapes of the plurality of figures 11 on the needle point verification board 1 are all round. The material of the needle point verification board 1 is polypropylene. The plurality of patterns 11 on the pin point verification board 1 include a plurality of types of patterns, the patterns of different types are different in size and color, and the patterns of the same type are the same in size and color. The same type of pattern corresponds to the same type of probe 21, and the pattern 1 may be labeled with the type of the corresponding probe 21.

In step S1, the method may further include: the surface of the needle point verification board 1 is pasted with a blue film, and when a probe 21 is pricked on the needle point verification board 1, the needle mark on the surface of the needle point verification board 1 can be observed through the blue film.

And S2, clamping and fixing the needle point verification board 1 through a clamp.

S3, as shown in fig. 3, aligning the testing platform 2 provided with a plurality of probes 21 with the pin point verification board 1, controlling the plurality of probes 21 to abut against the pin point verification board 1, forming a plurality of pin marks on the pin point verification board 1, and verifying the positions of the probes 21 on the testing platform 2 according to the positions of the plurality of pin marks. The test platform 2 is an ICT (In circuit tester) test platform 2, and after the verification is completed, the probes 21 of the test platform 2 may be used to send test electrical signals to the PCB to test the PCB.

The plurality of probes 21 on the testing platform 2 can be divided into a plurality of types of probes 21, the cross-sectional diameters of different types of probes 21 are different, and the cross-sectional diameters of the same type of probes 21 are the same. The diameters of the plurality of kinds of patterns on the needle point verification plate 1 are respectively the same as the cross-sectional diameters of the plurality of kinds of probes 21. The different types of patterns are distinguished by using different colors, so that the probe 21 with dislocation can be conveniently and quickly confirmed.

Verifying the position of the probe 21 on the test platform 2 based on the position of the plurality of pin marks comprises:

and judging whether the plurality of needle marks are all positioned in the plurality of graphs 11 on the needle point verification board 1, and if not, determining that the probes 21 corresponding to the needle marks positioned outside the plurality of graphs 11 of the needle point verification board 1 are staggered.

The ICT test platform verification method further comprises the following steps:

and controlling the dislocation probe to reset according to the relative position between the corresponding pin mark formed on the pin point verification board 1 by the dislocation probe and the pin point verification board pattern.

According to the dislocation probe corresponding needle seal and the relative position between the needle point verification board figure that form on needle point verification board 1, control dislocation probe resets, includes:

if at least two dislocation probes exist, taking a pin point verification board graph which is closest to the corresponding pin mark of the dislocation probe and has no pin mark inside as a default graph, and resetting according to the relative position between the default graph and the dislocation probe.

The ICT test platform verification method further comprises the following steps:

after the dislocation probe resets and accomplishes, align test platform 2 and pinpoint verification board 1, control a plurality of probes 21 and lean on pinpoint verification board 1, form a plurality of pinpoints on pinpoint verification board 1, judge whether the dislocation probe resets successfully according to the position of a plurality of pinpoints again. When a plurality of pin marks are all positioned in the graph 11 on the pin point verification board 1, the resetting of the dislocation probe is determined to be successful.

In another embodiment, the pin point verification board 1 with through holes and pads may be manufactured, the pads are located on the pattern 11 of the pin point verification board 1, and are used for manufacturing the adhesive film board during the trial production, and after the trial production is completed, the surface material (for example, the pad material) of the adhesive film board is cleaned off for the next trial production. The through holes on the pin point verification board 1 are used for fixing electronic components, and the welding pads are used for welding pins of the electronic components.

The present invention further provides a system for checking an ICT test platform, as shown in fig. 2 and 3, the system includes: a needle point verification board 1, a clamp (not shown in the figure) and a test platform 2.

A plurality of patterns 11 are formed on the surface of the needle point verification plate 1; the shapes, sizes and positions of the patterns 11 on the pin point verification board 1 correspond to those of the pads on the PCB, respectively. The needle point verification board 1 is made of polypropylene, and the shapes of the plurality of patterns 11 are all circular. The surface of the needle point verification board 1 is also adhered with a blue film for observing the needle mark formed on the surface of the needle point verification board 1 by the probe 21.

The plurality of patterns 11 on the pin point verification board 1 include a plurality of types of patterns, and the sizes and colors of the different types of patterns are different.

The clamp is used for clamping the fixed needle point verification plate 1.

Be provided with a plurality of probes 21 on test platform 2, test platform 2 sets up with the relative of needle point verification board 1 for control a plurality of probes 21 support and lean on needle point verification board 1, form a plurality of needle marks on needle point verification board 1, according to the position of a plurality of needle marks, check up the probe 21 position on test platform 2 again.

Specifically, the testing platform 2 is further configured to determine whether the plurality of needle prints are located in the plurality of patterns 11 on the needle spot verification board 1, and if not, determine that the probes 21 corresponding to the needle prints located outside the plurality of patterns 11 on the needle spot verification board 1 are misaligned.

And controlling the dislocation probe to reset according to the relative position between the corresponding pin mark formed on the pin point verification board 1 by the dislocation probe and the plurality of graphs 11 of the pin point verification board 1.

If at least two dislocation probes exist, taking a pin point verification board graph which is closest to the corresponding pin mark of the dislocation probe and has no pin mark inside as a default graph, and resetting according to the relative position between the default graph and the dislocation probe.

After the dislocation probe resets and accomplishes, align test platform 2 and pinpoint verification board 1, control a plurality of probes 21 and lean on pinpoint verification board 1, form a plurality of pinpoints on pinpoint verification board 1, judge whether the dislocation probe resets successfully according to the position of a plurality of pinpoints again. When a plurality of pin marks are all positioned in the graph 11 on the pin point verification board 1, the resetting of the dislocation probe is determined to be successful.

In summary, the method and the system for checking the ICT test platform provided by the invention can directly determine whether the positions of the plurality of probes 21 on the test platform 2 are accurate by using the pin marks on the pin point verification board 1, and can control the probes 21 to reset if the positions of the probes 21 are inaccurate, the size and the shape of the graph 11 of the pin point verification board 1 correspond to the size, the shape and the position of the PCB, and the pin point verification board 1 is used for checking, so that the probes 21 are prevented from being misplaced to directly scratch the PCB, waste of the PCB is avoided, and the number of scrapped PCBs is reduced. Moreover, the classification of the figure 11 of the pin point verification board 1 can be distinguished through color and size, and the classification of the figure 11 corresponds with the classification of the probe 21, and then can judge the classification of the dislocation probe according to the pin mark that the probe 21 formed on the pin point verification board 1, confirm the dislocation probe fast, and reset the dislocation probe.

In addition, whether the probe 21 of the test platform 2 is misplaced or not is judged, and further, the difference between the probe 21 and the furniture at the time of factory shipment is judged, so that the reliability of the clamp is judged. Whether the actual position and the type of the probe 21 are correctly used during production can be efficiently confirmed, and an engineer can be instructed to operate efficiently. While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.