阅读说明：本技术 半导体装置封装 (Semiconductor device package ) 是由 詹雅芳 蒋源峰 于 2020-11-04 设计创作，主要内容包括：半导体装置封装包含重新分布层、多个导电柱、增强层及包封物。所述导电柱与所述第一重新分布层直接接触。所述增强层围绕所述导电柱的侧表面。所述包封物包封所述第一重新分布层及所述增强层。所述导电柱通过所述增强层彼此分隔开。(The semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcement layer, and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds the side surfaces of the conductive posts. The encapsulant encapsulates the first redistribution layer and the reinforcement layer. The conductive posts are separated from each other by the reinforcing layer.)

1. A semiconductor device package, comprising:

a first redistribution layer having a first surface;

a plurality of conductive pillars in direct contact with the first surface of the first redistribution layer;

a reinforcing layer surrounding side surfaces of the conductive posts; and

an encapsulant encapsulating the reinforcing layer and in contact with the first surface of the first redistribution layer;

wherein the conductive posts are separated from each other by the reinforcing layer.

2. The semiconductor device package of claim 1, wherein the reinforcement layer contains a filler that is smaller than a filler of the encapsulant.

3. The semiconductor device package of claim 1, wherein the reinforcement layer has a first surface facing away from the first redistribution layer, and wherein the conductive pillars are exposed from the first surface of the reinforcement layer.

4. The semiconductor device package of claim 3, wherein at least one of the conductive posts exposed from the first surface of the reinforcement layer is connected to a solder ball.

5. The semiconductor device package of claim 1, wherein the reinforcement layer defines a cavity for receiving a first electronic component, and wherein the first electronic component has a first surface facing away from the first redistribution layer.

6. The semiconductor device package of claim 1, wherein the first redistribution layer further comprises a second surface opposite the first surface of the first redistribution layer, and wherein a second electronic component is mounted to the second surface of the first redistribution layer.

7. The semiconductor device package of claim 1, wherein the reinforcement layer contacts the first surface of the first redistribution layer.

8. The semiconductor device package of claim 1, wherein each of the conductive pillars has a first pillar portion and a second pillar portion, wherein the second pillar portion is disposed on the first surface of the first redistribution layer and a side surface of the second pillar portion is covered by the encapsulant, and wherein the first pillar portion is in direct contact with the second pillar portion and a side surface of the first pillar portion is covered by the reinforcement layer.

9. The semiconductor device package of claim 8, wherein a diameter of the first pillar portion is different than a diameter of the second pillar portion.

10. The semiconductor device package of claim 5, further comprising a metal layer or a heat spreading layer attached to the first surface of the first electronic component.

11. The semiconductor device package of claim 5, further comprising a metal layer or a heat spreading layer attached to the first surface of the first electronic component, wherein the metal layer or the heat spreading layer has a first surface facing away from the first redistribution layer, and wherein the first surface of the metal layer or the heat spreading layer is coplanar with a first surface of the enhancement layer.

12. A semiconductor device package, comprising:

an electrical connection member including a reinforcement layer and a plurality of conductive pillars passing through the reinforcement layer;

a first electronic component;

an encapsulant encapsulating the first electronic component and the electrical connection member; and

a first redistribution layer disposed on a top surface of the encapsulant and electrically connected to at least one of the conductive pillars;

wherein the bottom surfaces of the conductive posts are coplanar with the bottom surface of the reinforcement layer and the bottom surface of the encapsulant.

13. The semiconductor device package of claim 12, further comprising solder balls or a second redistribution layer disposed on a bottom surface of the encapsulant and electrically connected to at least one of the conductive pillars.

14. The semiconductor device package of claim 12, further comprising a second electronic component disposed on the top surface of the first redistribution layer.

15. The semiconductor device package of claim 12, wherein each of the conductive pillars has a first pillar portion and a second pillar portion, and wherein the second pillar portion is disposed on the bottom surface of the first redistribution layer and a side surface of the second pillar portion covered by the encapsulant, and wherein the first pillar portion is in direct contact with the second pillar portion and a side surface of the first pillar portion is covered by the reinforcement layer.

16. A method of manufacturing a semiconductor device package, comprising preparing an electrical connection member by:

providing a first carrier, wherein a first conductive layer is disposed on a surface of the first carrier;

forming a plurality of first conductive pillars on the first conductive layer;

providing a dielectric material on the first conductive layer, wherein the dielectric material fills between the first conductive pillars; and

removing the first carrier.

17. The method of claim 16, comprising:

disposing the electrical connection member and first electronic component on a second carrier;

forming an encapsulant on the carrier, wherein the encapsulant encapsulates the electrical connection member and the first electronic component and exposes a top surface of the first conductive pillar of the connection member;

forming a redistribution layer on the encapsulant, wherein the redistribution layer is electrically connected to the first conductive pillars;

removing the second carrier; and

removing the first conductive layer of the electrical connection member.

18. The method as claimed in claim 16, forming second conductive pillars on respective ones of the first conductive pillars before removing the first carrier.

19. The method of claim 18, wherein a second conductive layer is formed on the first conductive layer when forming the first conductive pillar.

20. The method of claim 19, further comprising:

disposing the electrical connection member and first electronic component on a second carrier;

forming an encapsulant on the carrier, wherein the encapsulant encapsulates the electrical connection member and the first electronic component and exposes a top surface of the second conductive pillar of the electrical connection member;

forming a redistribution layer on the encapsulant, wherein the redistribution layer is electrically connected to the second conductive pillars;

removing the second carrier; and

removing the first conductive layer of the electrical connection member.

Technical Field

The present disclosure relates to a semiconductor device package, and more particularly, to a package structure having a plurality of conductive pillars.

Background

In fan-out Package-on-Package (fan-out-on-Package) technology for three-dimensional integrated circuits, through-silicon vias or copper pillars are commonly used as electrical channels for the stack-up Package. However, the cost of manufacturing through-silicon vias or copper pillars is high. In addition, the heights of the copper pillars may be different from each other due to the manufacturing process, and the height difference may be as high as 30 μm or more. Therefore, there may be a short circuit fault between the stacked packages.

Disclosure of Invention

In some embodiments, a semiconductor device package includes a first redistribution layer, a plurality of conductive pillars, a reinforcement layer, and an encapsulant. The first redistribution layer has a first surface, and the conductive pillars are in direct contact with the first surface of the first redistribution layer. The reinforcing layer surrounds the side surfaces of the conductive posts. The encapsulant encapsulates the reinforcing layer and is in contact with the first surface of the first redistribution layer. The conductive posts are separated from each other by the reinforcing layer.

In some embodiments, a semiconductor device package includes an electrical connection member, a first electronic component, an encapsulant, and a first redistribution layer. The electrical connection means includes a reinforcing layer and a plurality of conductive posts passing through the reinforcing layer. The encapsulant encapsulates the first electronic component and the electrical connection member. The first redistribution layer is disposed on a top surface of the encapsulant and electrically connected to at least one of the conductive pillars. The bottom surfaces of the conductive posts are coplanar with the bottom surface of the reinforcement layer and the bottom surface of the encapsulant.

In some embodiments, a method of manufacturing a semiconductor device package includes manufacturing an electrical connection member. The electrical connection member is manufactured by: providing a first carrier, wherein a first conductive layer is disposed on a surface of the first carrier; forming a plurality of first conductive pillars on the first conductive layer; providing a dielectric material on the first conductive layer, wherein the dielectric material fills between the first conductive pillars; and removing the first carrier.

Drawings

Fig. 1 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 2 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 3 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 4 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 5 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 6 illustrates a cross-sectional view of a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 7A, 7B, 7C, 7D, 7E and 7F illustrate one or more stages of a method of manufacturing an electrical connection member according to some embodiments of the present disclosure.

Fig. 8A, 8B, 8C, 8D, 8E, 8F, 8G, 8H, 8I and 8J illustrate one or more stages of a method of manufacturing an electrical connection member according to some embodiments of the present disclosure.

Fig. 9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, and 9J illustrate one or more stages of a method of manufacturing a semiconductor device package, according to some embodiments of the present disclosure.

Fig. 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I, and 10J illustrate one or more stages of a method of manufacturing a semiconductor device package, according to some embodiments of the present disclosure.

Common reference numerals are used throughout the drawings and the detailed description to refer to the same or like components. The disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

Detailed Description

The foregoing description, as well as the following detailed description, are exemplary for the purpose of further explaining the scope of the present disclosure. Other objects and advantages associated with the present disclosure will be set forth in the description which follows and in the drawings.

Unless otherwise specified, spatial descriptions such as "upper," "lower," "upward," "left," "right," "downward," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "above," "below," and the like are indicative of the orientation shown in the drawings. It is to be understood that the spatial descriptions used herein are for purposes of illustration and that actual implementations of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not so arranged.

The present disclosure describes techniques for fabricating a semiconductor device package without using through-silicon vias (TSVs) as electrical channels. In some embodiments according to the present disclosure, an electrical connection member including a plurality of conductive pillars is formed in advance and serves as an electrical path. The conductive posts are covered by the reinforcement layer, thus potentially displacing the conductive posts during the step of applying the molding compound can be avoided. In addition, in some embodiments according to the present disclosure, the height of the conductive pillar may be controlled by grinding the electrical connection member, so that a short circuit failure due to a height difference of the conductive pillar or the TSV in the comparative embodiment may be avoided.

Fig. 1 illustrates a cross-sectional view of a semiconductor device package 1, according to some embodiments of the present disclosure. The semiconductor device package 1 may include an electrical connection member 10, a redistribution layer 11, an encapsulant 12, a first electronic component 15, a second electronic component 17, and a third electronic component 18.

The electrical connection means 10 may comprise a plurality of conductive pillars 13 and a reinforcement layer 14. For example, the conductive pillars 13 may include copper or other metals, or metal alloys, or other conductive materials. In some embodiments, conductive pillars 13 are copper pillars. The reinforcing layer 14 may be a dielectric layer. The reinforcing layer 14 may be made of solder resist, Ajinomoto Build-up Film (ABF), or other dielectric material. In some embodiments, the enhancement layer 14 is made of a dielectric material (e.g., ABF) having a lower Coefficient of Thermal Expansion (CTE), for example, 30 ppm/c or less, 25 ppm/c or less, 20 ppm/c or less, 18 ppm/c or less, or 15 ppm/c or less, and can reduce warpage of the semiconductor device package 1. In some embodiments, the conductive pillars 13 are copper pillars, the reinforcing layer 14 is made of ABF, and the semiconductor device package 1 has reduced warpage. Reinforcing layer 14 surrounds the side surface of each conductive post 13, and conductive posts 13 are separated from each other by reinforcing layer 14. In the embodiment illustrated in fig. 1, the reinforcing layer 14 completely covers the side surfaces of the conductive pillars 13. Therefore, the thickness of the reinforcing layer 14 is substantially equal to the height of the conductive post 13. Further, conductive pillars 13 may pass through reinforcing layer 14 and may be exposed from first surface 142 of reinforcing layer 14, where first surface 142 of reinforcing layer 14 is substantially planar and faces away from redistribution layer 11.

Redistribution layer 11 is disposed on reinforcement layer 14 of electronic component 10 and electrically connects conductive posts 13. As shown in fig. 1, the second surface 141 of the reinforcing layer 14 may be attached to and in contact with the first surface 111 of the redistribution layer 11, and the conductive posts 13 are in direct contact with the first surface 111 of the redistribution layer 11.

The encapsulant 12 may surround or encapsulate the side surface of the reinforcing layer 14 of the electrical connection member 10 and the first electronic component 15. The encapsulant 12 may be in contact with the first surface 111 of the redistribution layer 11. For example, the encapsulant 12 may include a phenolic-based resin, an epoxy-based resin, a silicone-based resin, or another suitable encapsulant. Suitable fillers may also be included, for example powdered SiO₂. In some embodiments, the reinforcing layer 14 may contain a filler, and the filler in the reinforcing layer 14 may be smaller than the filler of the encapsulate 12. Referring to fig. 1, the enclosure 12 may have: a first surface 121 attached to the first surface 111 of the redistribution layer 11; and a second surface 122 opposite to the first surface 121 and substantially coplanar with the first surface 142 of the reinforcing layer 14 of the electrical connection member 10. The surfaces 132 of the conductive pillars 13 exposed from the first surface 142 of the reinforcing layer 14 may also be coplanar with the second surface 122 of the encapsulant 12.

The first electronic component 15 may be a die or chip and has an active surface facing the redistribution layer 11. In some embodiments, the electrical connection member 10 (or two or more electrical connection members 10) defines a cavity for receiving the first electronic component 15. In other words, the first electronic component 15 is accommodated within the cavity defined by the electrical connection member (i.e., the reinforcement layer 14 of the electrical connection member), and the enclosure 12 is filled within the cavity and covers the first electronic component 15. The first electronic component 15 may be electrically connected to the redistribution layer 11. The first electronic component 15 may have a back surface 151 (e.g., a passive surface) that faces away from the redistribution layer 11 and is coplanar with the second surface 141 of the reinforcement layer 14. In some embodiments, an additional layer 16, such as a heat spreading layer or a metal layer, may be attached to the surface 151 of the first electronic component 15.

In some embodiments, the semiconductor device package may also include one or more electronic components, such as DRAMs or capacitors, mounted on the second surface 112 of the redistribution layer 11. In the embodiment illustrated in fig. 1, the semiconductor device package further comprises a second electronic component 17 and a third electronic component 18 mounted on a second surface 112 of the redistribution layer 11, the second surface being opposite to the first surface 111 of the redistribution layer 11.

Fig. 2 illustrates a cross-sectional view of a semiconductor device package 1' according to some embodiments of the present disclosure. The semiconductor device package 1' shown in fig. 2 is similar in some respects to the semiconductor device package 1 shown in fig. 1, except that, in fig. 2, a plurality of solder balls 19 are disposed on the first surface 142 of the reinforcement layer 14 of the electrical connection means 10 and are electrically connected to the conductive posts 13. Thus, in at least some embodiments, the semiconductor device package 1' further includes a plurality of solder balls 19 disposed on the first surface 142 of the reinforcement layer 14 of the electrical connection means 10 and electrically connected to the conductive posts 13.

Fig. 3 illustrates a cross-sectional view of a semiconductor device package 1 "in accordance with some embodiments of the present disclosure. The semiconductor device package 1 "shown in fig. 3 is similar in some respects to the semiconductor device package 1 shown in fig. 1, except that in fig. 3, an additional redistribution layer 100 is disposed on the first surface 142 of the reinforcement layer 14 of the electrical connection means 10 and is electrically connected to the conductive pillars 13. Thus, in at least some embodiments, semiconductor device package 1 "also includes redistribution layer 100 disposed on first surface 142 of reinforcing layer 14 of electrical connection member 20 and electrically connected to conductive pillars 13.

Fig. 4 illustrates a cross-sectional view of a semiconductor device package 2, according to some embodiments of the present disclosure. Semiconductor device package 2 may include electrical connection means 20, redistribution layer 21, encapsulant 22, first electronic component 25, second electronic component 27, and third electronic component 28.

The electrical connection means 20 may comprise a plurality of conductive pillars 23 and a reinforcement layer 24. For example, the conductive posts 23 may comprise copper or other metal, or metal alloy, or other conductive material. In some embodiments, the conductive posts 23 are copper posts. The reinforcing layer 24 may be a dielectric layer. The reinforcing layer 24 may be made of solder resist or ABF, or other dielectric material. Similar to those reinforcement layers described above for the semiconductor device package 1 of fig. 1, the reinforcement layer 24 may be made of a dielectric material having a lower CTE and may reduce warpage of the semiconductor device package 2. In some embodiments, the conductive pillars 23 are copper pillars and the reinforcement layer 24 is made of ABF, and the semiconductor device package 2 has reduced warpage. The conductive pillar 23 may include a first pillar portion 231 and a second pillar portion 232. The diameter of the first column section 231 may be substantially the same as the diameter of the second column section 232 or different from the diameter of the second column section 232. In some embodiments, the diameter of first post section 231 is greater than the diameter of second post section 232. The reinforcing layer 24 surrounds the side surface of each first pillar portion 231, and the first pillar portions 231 are separated from each other by the reinforcing layer 24. Further, the first post portion 231 may pass through the reinforcement layer 24 and may be exposed from the first surface 242 of the reinforcement layer 24 of the electronic component 20, wherein the first surface 242 of the reinforcement layer 24 is substantially flat and faces away from the redistribution layer 21. In addition, the second column portion 232 is in direct contact with the first column portion 231 and is not covered by the reinforcing layer 24.

Redistribution layer 21 is disposed on electronic component 20 and electrically connects conductive pillars 23. As shown in fig. 4, the second post portion 231 is attached to the first surface 211 of the redistribution layer 21 and is in contact with the first surface 211 of the redistribution layer 21. That is, the conductive pillars 23 of the electronic component 20 are in direct contact with the first surface 211 of the redistribution layer 21.

The encapsulant 22 may surround or encapsulate the side surface of the reinforcement layer 24, the side surface of the second pillar portion 232 of the electrical connection member 20, and the first electronic component 25. For example, the encapsulant 12 may include a phenolic-based resin, an epoxy-based resin, a silicone-based resin, or another suitable encapsulant. Suitable fillers may also be included, for example powdered SiO₂. In some embodiments, the reinforcing layer 24 may contain a filler, and the filler in the reinforcing layer 24 may be smaller than the filler of the encapsulate 22. Referring to fig. 4, the enclosure 22 may have: a first surface 221 attached to the first surface 211 of the redistribution layer 21; and a second surface 222 opposite to the surface 211 and substantially coplanar with the first surface 242 of the reinforcing layer 24 of the electrical connection member 20. That is, the surface 2312 of the first post portion 231 may also be coplanar with the second surface 222 of the enclosure 22.

The first electronic component 25 may be a die or chip and has an active surface facing the redistribution layer 21. In some embodiments, the electrical connection member 20 (or two or more electrical connection members 20) defines a cavity for receiving the first electronic component 25. In other words, the first electronic component 25 is accommodated within the cavity defined by the electrical connection member (i.e., the reinforcement layer 24 of the electrical connection member), and the encapsulant 22 fills the cavity and covers the first electronic component 25. The first electronic component 25 may be electrically connected to the redistribution layer 21.

The first electronic component 25 may have a back surface (e.g., a passive surface) that is opposite the active surface of the electronic component 25. In some embodiments, similar to those illustrated in fig. 1, the back surface of the first electronic component 25 may be coplanar with the first surface 242 of the reinforcement layer 24. In other embodiments illustrated in fig. 2, the back surface of the first electronic component 25 may be higher than the first surface 242 of the reinforcement layer 24, and an additional layer 26, such as a heat spreading layer or a metal layer, may be attached to the back surface of the first electronic component 25. Layer 26 has a first surface 261 and a second surface 262 opposite first surface 261. The first surface 261 of the layer 26 is in contact with the rear surface of the first electronic component 25. The second surface 262 of the layer 26 faces away from the redistribution layer 21 and may be substantially coplanar with the first surface 242 of the reinforcement layer 24 of the electrical connection member 20. The layer 26 may extend laterally to contact the electrical connection member 20.

The first and third electronic components 27, 28, which may be DRAMs and/or capacitors, are mounted on a second surface 212 of the redistribution layer 21, which is opposite the first surface 211 of the redistribution layer 21.

Fig. 5 illustrates a cross-sectional view of a semiconductor device package 2' according to some embodiments of the present disclosure. The semiconductor device package 2' shown in fig. 5 is similar in some respects to the semiconductor device package 2 shown in fig. 4, except that, in fig. 5, a plurality of solder balls 29 are disposed on the first surface 242 of the reinforcing layer 24 of the electrical connection member 20 and are electrically connected to the first pillar portions 231 of the conductive pillars 23. Thus, in at least some embodiments, the semiconductor device package 2' further includes a plurality of solder balls 29 disposed on the first surface 242 of the reinforcement layer 24 of the electrical connection means 20 and electrically connected to the conductive posts 23.

Fig. 6 illustrates a cross-sectional view of a semiconductor device package 2 "in accordance with some embodiments of the present disclosure. The semiconductor device package 2 "shown in fig. 6 is similar in some respects to the semiconductor device package 2 shown in fig. 4, except that in fig. 6, an additional redistribution layer 200 is disposed on the first surface 242 of the reinforcement layer 24 of the electrical connection member 20 and is electrically connected to the first pillar portions 231 of the conductive pillars 23. Thus, in at least some embodiments, the semiconductor device package 2 "also includes a redistribution layer 200 disposed on the first surface 242 of the reinforcement layer 24 of the electrical connection member 20 and electrically connected to the conductive pillars 23.

Fig. 7A, 7B, 7C, 7D, 7E and 7F illustrate one or more stages of a method of manufacturing an electrical connection member according to some embodiments of the present disclosure.

In fig. 7A, a carrier 5 (e.g., prepreg) is provided. The carrier 5 has a conductive layer 50 disposed on a first surface 501 of the carrier, and may have a conductive layer (not labeled) disposed on an opposite surface. Conductive layer 50 is a metal layer comprising copper or other metal, or metal alloy, or other conductive material.

As shown in fig. 7B, a photoresist layer 51 is formed on the conductive layer 50 of the carrier 5. The photoresist layer 51 includes a via 511.

As shown in fig. 7C, the conductive pillars 33 are formed in the via holes 511 of the photoresist layer 51. The conductive post 33 may be made of copper or other metal, or metal alloy, or other conductive material. The conductive pillars 33 may be integrated with the conductive layer 50.

As shown in fig. 7D, the photoresist layer 51 is removed from the carrier 5.

As shown in fig. 7E, the reinforcing layer 34 is formed on the conductive layer 50 by using a dielectric material so as to surround the conductive pillar 33. The dielectric material may be a solder resist. The dielectric material is filled between the conductive posts 33, so the resulting reinforcing layer 34 surrounds the side surfaces of each conductive post 33 and the conductive posts 13 are separated from each other by the reinforcing layer 34. In addition, the reinforcing layer 34 also covers the conductive layer 50.

As shown in fig. 7F, the carrier 5 is removed. After removing the carrier 5, an electrical connection means 30 is formed and attached on the conductive layer 50, the electrical connection means including a plurality of conductive pillars 33 and a reinforcement layer 34 surrounding side surfaces of the conductive pillars 33.

Fig. 8A, 8B, 8C, 8D, 8E, 8F, 8G, 8H, 8I and 8J illustrate one or more stages of a method of manufacturing an electrical connection member 40 according to some embodiments of the present disclosure.

In fig. 8A, a carrier 6 (e.g., prepreg) is provided. The carrier 6 has a conductive layer 60 disposed on a first surface 601 of the carrier, and may have a conductive layer (not labeled) disposed on an opposite surface. Conductive layer 60 is a metal layer comprising copper or other metal, or metal alloy, or other conductive material.

As shown in fig. 8B, a first photoresist layer 61 is formed on the conductive layer 60 of the carrier 6. The first photoresist layer 61 includes a via 611 and a cavity 612.

As shown in fig. 8C, the first pillar portion 431 is formed in the through hole 611 of the first photoresist layer 61, and the other conductive layer 46 is formed in the cavity 612 of the first photoresist layer 61. The first pillar portion 431 and the further conductive layer 46 may be made of the same or different materials, including copper or other metals, or metal alloys, or other conductive materials. The first pillar portion 431 may be integrated with the conductive layer 60. In addition, the further conductive layer 46 may also be integrated with the conductive layer 60.

As shown in fig. 8D, the first photoresist layer 61 is removed from the carrier 6.

As shown in fig. 8E, the reinforcing layer 44 is formed on the conductive layer 60 by using a dielectric material to encapsulate the first pillar portion 431. The dielectric material may be ABF. The dielectric material is filled between the first pillar portions 431, and thus the resultant reinforcing layer 44 surrounds the side surface of each of the first pillar portions 431 and the first pillar portions 431 are separated from each other by the reinforcing layer 44. The reinforcing layer 43 also surrounds the side surfaces or periphery of the conductive layer 46. The reinforcing layer 44 covers the conductive layer 60. In addition, the reinforcement layer 44 may cover the top of the first pillar portion 431 and the top of the conductive layer 46.

As shown in fig. 8F, a portion of the reinforcement layer 44 is removed, such as by grinding, so the first pillar portion 431 and the conductive layer 46 may be exposed from the surface 441 of the reinforcement layer 44. The first pillar portion 431 and the conductive layer 46 may be grounded together with the reinforcing layer 44 at the same time. In some embodiments, after grinding, the top of first pillar portion 431, the top of conductive layer 46, and the top of reinforcement layer 44 are coplanar.

As shown in fig. 8G, a second photoresist layer 63 is formed on the enhancement layer 44 and the conductive layer 46, the second photoresist layer 63 including a plurality of vias 631, each of which is aligned with a respective one of the first pillar portions 431. The diameter of the through hole 631 may be the same as or different from the diameter of the corresponding first column portion 431. In some embodiments, the diameter of the through hole 631 may be smaller than the diameter of the corresponding first column portion 431.

As shown in fig. 8H, the second column portion 432 is formed in the through hole 631 of the second photoresist layer 63. The resulting second conductive pillar 33 has a shape defined by the through hole 631. The second post portion 432 may be made of copper or other metal, or metal alloy, or other conductive material. The conductive pillar 33 may be integrated with the first pillar portion 431.

As shown in fig. 8I, the second photoresist layer 63 is removed. In addition, since the first and second column parts 431 and 432 are formed at different stages, there may be an interface between the first and second column parts 431 and 432.

As shown in fig. 8J, the carrier 6 is removed. After removing the carrier 6, electrical connection means including a plurality of conductive posts 43, a reinforcing layer 44, and a conductive layer 46 are formed and attached on the conductive layer 60. Each conductive post 43 includes a first post portion 431 and a second post portion 432. The reinforcing layer 44 surrounds the side surface of the first pillar portion 431 and the side surface (or the periphery) of the conductive layer 46.

Fig. 9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, and 9J illustrate one or more stages of a method of fabricating a semiconductor package according to some embodiments of the present disclosure.

Referring to fig. 9A, a carrier 7 having a conductive layer 70 on a top surface of the carrier is provided. The electrical connection member 30 is prepared according to the method illustrated in fig. 7A, 7B, 7C, 7D, 7E, and 7F, and the chip 35 is arranged on the conductive layer 70 of the carrier 7, as shown in fig. 9A. The conductive layer 50 integrated with the electrical connection member 30 is attached to the conductive layer 70 of the carrier 7. The chip 35 has an active surface and a back surface opposite the active surface. Electrical contacts 355 are disposed on the active surface of chip 35. The rear surface of the chip 35 is attached to the conductive layer 70 of the carrier 7.

As shown in fig. 9B, the encapsulant 32 is applied on the conductive layer 70 of the carrier 7, the electrical connection members 30 and the chip 35. The encapsulant 32 encapsulates the electrical connection member 30 and the chip 35.

As shown in fig. 9C, a portion of the encapsulant 32 is removed, for example by grinding, so that the reinforcing layer 34 of the electrical connection member 30 has a surface 341 and the encapsulant 32 has a surface 321, and the surface 341 is substantially coplanar with the surface 321. In addition, the conductive posts 33 are exposed from the surface 341 of the reinforcement layer 34, and the electrical contacts 355 of the chip 35 are exposed from the surface 321 of the encapsulant 32.

As shown in fig. 9D, redistribution layer 31 is disposed on electrical connection members 30 and encapsulant 32, and is electrically connected to conductive pillars 33 and electrical contacts 355 of chip 35. The redistribution layer 31 has a surface 311 attached to a surface 341 of the reinforcement layer 34 of the electrical connection means 30 and a surface 321 of the encapsulant 32.

As shown in fig. 9E, a plurality of solder balls 315 are mounted on a surface 312 of the redistribution layer 31 opposite the surface 311.

As shown in fig. 9F, electronic components 37 and 38 are mounted on surface 312 of redistribution layer 31 and electrically connected to solder balls 315.

As shown in fig. 9G, a tape 317 is applied over surface 312 of redistribution layer 31 and covers electronic components 37 and 38 and solder balls 315.

As shown in fig. 9H, the carrier 7 and the conductive layer 70 of the carrier 7 are removed.

As shown in fig. 9I, the conductive layer 50 is removed, for example, by grinding. After polishing the conductive layer 50, the electrical connection member 30 has a substantially flat surface (i.e., the surface 342 of the enhancement layer 34 and the surface 332 of the conductive pillar 33 are flat and coplanar), and the encapsulant 32 has a substantially flat surface 322. Surface 342 and surface 332 are substantially coplanar with surface 322. In addition, the back surface of chip 35 is substantially coplanar with surface 342 of enhancement layer 34.

As shown in fig. 9J, the strip 317 is removed. In addition, a plurality of solder balls 39 are mounted and electrically connected to the surface 332 of the conductive post 33.

Fig. 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I, and 10J illustrate one or more stages of a method of fabricating a semiconductor package according to some embodiments of the present disclosure.

As shown in fig. 10A, a carrier 8 having a conductive layer 80 on a top surface of the carrier is provided. The electrical connection member 40 prepared according to the method illustrated in fig. 8A, 8B, 8C, 8D, 8E, 8F, 8G, 8H, 8I, and 8J is arranged on the conductive layer 80 of the carrier 8. The chip 45 is arranged on the conductive layer 46 of the electrical connection member 40. The conductive layer 60 integrated with the electrical connection member 40 is attached to the conductive layer 80 of the carrier 8. The chip 45 has an active surface and a back surface opposite the active surface. The electrical contacts 455 are disposed on the active surface of the chip 45. The rear surface of the chip 45 is attached to the conductive layer 80 of the carrier 8.

As shown in fig. 10B, the encapsulant 42 is applied over the conductive layer 80 of the carrier 8, the electrical connection means 40 and the chip 45. Thus, the encapsulant 42 encapsulates the carrier 8, the electrical connection member 40, and the chip 45.

As shown in fig. 10C, a portion of the encapsulant 42 is removed, such as by grinding, so the encapsulant 42 has a surface 421. In addition, the second post portions 432 of the conductive posts 43 and the electrical contacts 455 of the chip 45 are exposed from the surface 421 of the encapsulant 42.

As shown in fig. 10D, the redistribution layer 41 is disposed on the electrical connection means 40 and the encapsulant 42, and is electrically connected to the second pillar portions 432 of the conductive pillars 43 and the connection members 455 of the chip 45. The redistribution layer 41 has a surface 411 attached to the surface 421 of the encapsulant 42.

As shown in fig. 10E, a plurality of solder balls 415 are mounted on a surface 412 of redistribution layer 41, surface 412 being opposite surface 411.

As shown in fig. 10F, electronic components 47 and 48 are mounted on surface 412 of redistribution layer 41 and electrically connected to solder balls 415.

As shown in fig. 10G, a tape 417 is applied over surface 412 of redistribution layer 41 and covers electronic components 47 and 48 and solder balls 415.

As shown in fig. 10H, carrier 8 and conductive layer 80 of carrier 8 are removed.

As shown in fig. 10I, the conductive layer 60 is removed, for example, by grinding. After polishing the conductive layer 60, the electrical connection member 40 has a substantially flat surface (i.e., the surface 442 of the reinforcing layer 44 and the surface 4312 of the conductive post 43 are flat and coplanar), and the encapsulant 42 has a substantially flat surface 422. Surface 442 is substantially coplanar with surface 422. Additionally, conductive layer 46 may have a surface 462 that is substantially coplanar with surface 442 of reinforcing layer 42.

As shown in fig. 10J, the strip 417 is removed. Further, a plurality of solder balls 49 are mounted on and electrically connected to the first column portions 431 of the conductive columns 43.

As used herein, relative terms such as "inner," "outer," "top," "bottom," "front," "back," "upper," "upwardly," "lower," "downwardly," "vertical," "vertically," "lateral," "laterally," "above," and "below" refer to the orientation of a set of components relative to one another; this orientation is according to the drawings, but not required during manufacture or use.

As used herein, the singular terms "a", "an" and "the" may include plural referents unless the context clearly dictates otherwise.

As used herein, the terms "connected," "connected," and "connection" refer to an operative coupling or linkage. The connecting components may be coupled to each other, directly or indirectly, for example, through another set of components.

As used herein, the terms "conductive", "electrically conductive", and "conductivity" refer to the ability to transmit electrical current. Conductive materials generally indicate those materials that exhibit little or zero opposition to current flow. One measure of conductivity is siemens per meter (S/m). Typically, the conductive material is more than about 10 times conductive⁴S/m, e.g. at least 10⁵S/m or at least 10⁶One kind of S/mA material. The conductivity of a material can sometimes change with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

As used herein, the terms "substantially", "substantial", and "about" refer to a substantial degree or range. When used in conjunction with an event or circumstance, the terms can refer to the exact occurrence of the event or circumstance, as well as the occurrence of the event or circumstance in close proximity, such as when explaining the typical tolerance levels for the manufacturing methods described herein. For example, when used in conjunction with numerical values, the term can refer to a range of variation of less than or equal to ± 10% of the stated numerical value, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, two numerical values are "substantially" identical or equal if the difference between the two numerical values is less than or equal to ± 10% of the mean of the values, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%.

Two surfaces can be considered coplanar or substantially coplanar if the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm.

A surface may be considered planar or substantially planar if the difference between the highest and lowest points of the surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm.

Further, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity, and should be interpreted flexibly to include the numerical values explicitly recited as the limits of the range, as well as all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited.

In the description of some embodiments, an element provided "on" or "above" another element may encompass the case that the preceding element is directly on (e.g., in physical contact with) the succeeding element, as well as the case that one or more intermediate elements are located between the preceding element and the succeeding element.

While the present disclosure has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present disclosure. It will be understood by those skilled in the art that various changes may be made and equivalents substituted without departing from the true spirit and scope of the disclosure as defined by the appended claims.

The construction and arrangement of structures and methods as shown in the various example embodiments are illustrative only. Accordingly, all such modifications are intended to be included within the scope of this disclosure. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the example embodiments without departing from the scope of the present disclosure.