阅读说明：本技术 一种导光板结构及其制备方法 (Light guide plate structure and preparation method thereof ) 是由 晏东 张宸浩 金晟镇 于 2021-07-20 设计创作，主要内容包括：本发明提供了一种导光板结构及其制备方法,包括UTG层、QD量子点涂层、反射片、增光膜以及扩散片,所述UTG层分为入光侧部分与出光部分,入光侧部分厚度大于出光部分形成断差,QD量子点均匀涂布在UTG层的出光部分上表面形成QD量子点涂层；所述扩散片与增光膜从上至下设置在QD量子点涂层表面；所述反射片贴合于UTG层下表面。本发明提出的导光板结构整体变薄,UTG厚度会低于1mm；应用该导光板结构的背光模组色域值NSTC>100％以上；形成QD量子点涂层-UTG层-反射片三合一的整体架构,使背光模组组装成本降低。(The invention provides a light guide plate structure and a preparation method thereof, and the light guide plate structure comprises UTG layers, QD quantum dot coatings, a reflector plate, a brightness enhancement film and a diffusion sheet, wherein the UTG layer is divided into a light incident part and a light emergent part, the thickness of the light incident part is larger than that of the light emergent part to form a break difference, and QD quantum dots are uniformly coated on the upper surface of the light emergent part of the UTG layer to form the QD quantum dot coatings; the diffusion sheet and the brightness enhancement film are arranged on the surface of the QD quantum dot coating from top to bottom; the reflecting sheet is attached to the lower surface of the UTG layer. The light guide plate structure provided by the invention is integrally thinned, and the UTG thickness is lower than 1 mm; the color gamut value NSTC of the backlight module using the light guide plate structure is more than 100 percent; the QD quantum dot coating-UTG layer-reflector three-in-one integral framework is formed, so that the assembly cost of the backlight module is reduced.)

1. A light guide plate structure is characterized by comprising UTG layers, QD quantum dot coatings, reflectors, brightness enhancement films and diffusion sheets, wherein the UTG layer is divided into a light incident part and a light emergent part, the thickness of the light incident part is larger than that of the light emergent part to form a break difference, and QD quantum dots are uniformly coated on the upper surface of the light emergent part of the UTG layer to form the QD quantum dot coatings; the diffusion sheet and the brightness enhancement film are arranged on the surface of the QD quantum dot coating from top to bottom; the reflecting sheet is attached to the lower surface of the UTG layer.

2. The light guide plate structure of claim 1, further comprising an air layer formed by a surface roughness of the QD quantum dot coating layer being different from a surface roughness of UTG layer, between the QD quantum dot coating layer and the UTG layer.

3. The light guide plate structure of claim 1, wherein the junction between the light incident side portion and the light exiting portion of the UTG layer forms an angle of 135 degrees or 90 degrees.

4. The preparation method of the light guide plate structure is characterized by comprising the following steps of:

step 1, manufacturing UTG base materials, namely dividing a UTG base material into a light-in side part and a light-out part, wherein the thickness of the light-in side part is larger than that of the light-out part;

step 2, manufacturing a dot pattern on the UTG base material;

step 3, coating the QD quantum dots on the surface of the light-emitting part of the UTG substrate, and curing by UV baking to form a QD quantum dot coating, an air layer and a UTG layer structure;

and 4, attaching the reflector plate to the lower surface of the UTG layer, attaching the brightness enhancement film to the surface of the QD quantum dot coating layer, and attaching the diffusion sheet to the brightness enhancement film to complete the preparation of the light guide plate structure.

5. The method for preparing a light guide plate structure according to claim 4, wherein the specific method in the step 1 is as follows: the UTG base material is thinned through a glass thinning process to manufacture a light part, so that the thickness of the light-in side part is larger than that of the light-out part to form a break difference, and the included angle of the joint of the two parts is 135 degrees or 90 degrees.

6. The method for manufacturing a light guide plate structure according to claim 4 or 5, wherein the substep of step 2 is:

step 2.1, coating acid-resistant ink on the UTG substrate to form a protective layer, and coating a layer of photoresist on the surface of the protective layer;

step 2.2, covering a mask plate with a required mesh pattern on UTG base materials coated with photoresist, and carrying out exposure treatment;

step 2.3, developing the photoresist by a developing solution;

and 2.4, spraying hydrofluoric acid on the surface of the photoresist, wherein the hydrofluoric acid and UTG which is not covered by the photoresist are subjected to chemical reaction, and UTG surface entities are etched to form a dot pattern.

7. The method for manufacturing a light guide plate structure according to claim 6, wherein the dots in the mask plate are arranged in a non-linear manner, the dot diameter is 0.01-0.5mm, and the depth is 0.01-0.1 mm.

8. The method for manufacturing a light guide plate structure according to claim 4 or 5, wherein in the step 3, the QD quantum dots are coated on the surface of the light-emitting portion of the UTG substrate by printing or ink-jet.

9. The method for manufacturing a light guide plate structure according to claim 8, wherein in the step 3, the UTG layer and the QD quantum dot coating layer have different surface roughness so as to form the air layer.

10. The method for preparing a light guide plate structure according to claim 6, wherein the concentration of the hydrofluoric acid is 5% to 50%.

Technical Field

The invention relates to the technical field of liquid crystal display, in particular to a light guide plate structure and a preparation method thereof.

Background

Generally, a display device such as a notebook computer, a desktop computer, a television, and the like mainly uses a Liquid Crystal Display (LCD) because of its advantages of being light, thin, short, and low in power consumption. However, since the LCD is not a self-luminous element but an excited-light element, a backlight module is required in addition to the liquid crystal display, and the lgp (light guide plate) in the backlight module is a main component.

The conventional LGP (light guide plate) is relatively large in thickness, thinner and insufficient in reliability due to the adoption of the conventional scheme, and the conventional ultrathin LGP (light guide plate) is made of PMMA (polymethyl methacrylate), common glass and the like, and cannot be made to be less than 0.5mm due to the limitation of temperature and material; when the backlight module is used, the zero distance between the LED lamp beads and the LGP (light guide plate) cannot be realized, the luminous efficiency of the LED lamp beads is difficult to improve, the thickness of the LED lamp beads in the existing market volume production is generally larger than 0.1mm, if the thinner LGP (light guide plate) is selected, the thickness is smaller than 0.4mm, the selectivity of the LED lamp beads is very small, the cost is very high, the light mixing effect of the LGP (light guide plate) and the lamp beads is very poor, and the luminous efficiency is influenced.

Common English abbreviations and their Chinese releases:

LGP: a light guide plate;

PMMA: polymethyl methacrylate;

QD: quantum dots;

UTG: ultra-thin glass.

Disclosure of Invention

Aiming at the problems in the prior art, the light guide plate structure and the preparation method thereof are provided, the LGP (light guide plate) thickness can be reduced by one grade by the light guide plate structure prepared by the method, the thickness is smaller than 0.1mm, and the luminous efficiency of the LED lamp bead is improved.

The technical scheme adopted by the invention is as follows: a light guide plate structure comprises UTG layers, QD quantum dot coatings, a reflector plate, a brightness enhancement film and a diffusion sheet, wherein the UTG layer is divided into a light incident part and a light emergent part, the thickness of the light incident part is larger than that of the light emergent part to form a break difference, and the QD quantum dots are uniformly coated on the upper surface of the light emergent part of the UTG layer to form the QD quantum dot coatings; the diffusion sheet and the brightness enhancement film are arranged on the surface of the QD quantum dot coating from top to bottom; the reflecting sheet is attached to the lower surface of the UTG layer.

Further, the light guide plate structure further comprises an air layer which is located between the QD quantum dot coating and the UTG layer, luminance loss can be minimized by the air layer, and the air layer can be naturally formed through different surface roughness of the QD quantum dot coating and the surface roughness of the UTG layer in the preparation process.

Furthermore, the included angle of the joint of the light-in side part and the light-out part of the UTG layer is 135 degrees or 90 degrees, so that the utilization rate of the LED is improved.

The invention also provides a preparation method of the light guide plate structure, which comprises the following steps:

step 1, manufacturing UTG base materials, namely dividing a UTG base material into a light-in side part and a light-out part, wherein the thickness of the light-in side part is larger than that of the light-out part;

step 2, manufacturing a dot pattern on the UTG base material;

step 3, coating the QD quantum dots on the surface of the light-emitting part of the UTG substrate, and curing by UV baking to form a QD quantum dot coating, an air layer and a UTG layer structure;

and 4, attaching the reflector plate to the lower surface of the UTG layer, attaching the brightness enhancement film to the surface of the QD quantum dot coating layer, and attaching the diffusion sheet to the brightness enhancement film to complete the preparation of the light guide plate structure.

Further, the specific method in step 1 is as follows: the UTG base material is thinned through a glass thinning process to manufacture a light part, so that the thickness of the light-in side part is larger than that of the light-out part to form a break difference, and the included angle of the joint of the two parts is 135 degrees or 90 degrees.

Further, the substep of step 2 is:

step 2.1, coating acid-resistant ink on the UTG substrate to form a protective layer, and coating a layer of photoresist on the surface of the protective layer;

step 2.2, covering a mask plate with a required mesh pattern on UTG base materials coated with photoresist, and carrying out exposure treatment;

step 2.3, developing the photoresist by a developing solution;

and 2.4, spraying hydrofluoric acid on the surface of the photoresist, wherein the hydrofluoric acid and UTG which is not covered by the photoresist are subjected to chemical reaction, and UTG surface entities are etched to form a dot pattern.

Furthermore, the dots in the mask plate are in nonlinear arrangement, the diameter of the dots is 0.01-0.5mm, and the depth is 0.01-0.1 mm.

Further, in the step 3, the UTG layer and the QD quantum dot coating layer have different surface roughness to form the air layer.

Further, in step 3, the QD quantum dot is coated on the surface of UTG substrate by printing or inkjet.

Further, the concentration of the hydrofluoric acid is 5% -50%. Compared with the prior art, the beneficial effect of adopting the technical scheme is that

(1) The light guide plate structure makes the whole thin, and the UTG thickness can be less than 1 mm.

(2) The color gamut value NSTC of the backlight is more than 100%.

(3) The QD quantum dot coating-UTG layer-reflector three-in-one integral framework is formed, so that the assembly cost of the backlight module is reduced.

Drawings

Fig. 1 is a schematic view of a light guide plate structure according to the present invention.

Reference numerals: 1-reflector plate, 2-UTG layers, 3-QD quantum dot coating, 4-brightness enhancement film, 5-diffusion sheet, 6-light-incident side part and 7-light-emergent part.

Detailed Description

The invention is further described below with reference to the accompanying drawings. Example 1

As shown in fig. 1, the present embodiment provides a light guide plate structure, which can reduce the thickness of an lgp (light guide plate) by one level, and the thickness is smaller than 0.1mm, so as to improve the light emitting efficiency of an LED lamp bead. The light guide plate structure comprises UTG layers 2, a QD quantum dot coating 3, a reflecting sheet 1, a brightness enhancement film 4 and a diffusion sheet 5;

specifically, the UTG layer 2 is divided into a light incident side part 6 and a light emergent part 7, the thickness of the light incident side part 6 is larger than that of the light emergent part 7 to form a step, and the light incident side part 6 can be made into a step shape or a trapezoidal shape; through the structure, the thickness can be reduced, and meanwhile, the light mixing effect of the blue LED and UTG-QD LGP (light guide plate) can be increased, and the utilization rate of the LED is improved.

In order to improve the utilization rate of the LED, the included angle of the joint of the light-in side part 6 and the light-out part 7 of the UTG layer is set to be 135 degrees or 90 degrees.

UTG the laminated light-incident side portion 6 has a thickness corresponding to the width of the LED, and in another preferred embodiment has a thickness in the range of 0.3-1.0mm and a width greater than 0.8 times the width of the LED.

The UTG layer 2 structure in this embodiment can be realized by a glass thinning process, and the thickness of the UTG layer light-out part is reduced to be less than or equal to 0.1 mm.

QD quantum dot coating 3QD quantum dot coating is achieved by coating the QD quantum dots at UTG layer light-out portions 7; in the coating, it is preferable to perform coating by printing or inkjet, and after the coating, curing is performed by UV rays. After curing, a three-layer structure of QD quantum dot coating-air layer-UTG layer is formed, and an air layer (not shown in the figure) is positioned between the QD quantum dot coating and UTG layer. In this embodiment, when the UTG layer 2 is adhered to the QD quantum dot coating 3, the UTG layer 2 surface has a roughness of nanometer size and the QD quantum dot coating 3 surface has a roughness of micrometer size, and because of the difference in surface roughness, a natural air layer can be directly formed, and the luminance loss of the light guide plate structure can be minimized by this air layer.

UTG layer 2 lower surface has the reflector plate through the photoresist laminating, forms QD quantum dot coating 3, UTG layer 2, the trinity integrated whole framework of reflector plate 1, adopts this kind of whole framework not only can avoid UTG layer surface damage, can also reduce backlight assembly cost and thickness.

The bright enhancement film 4 is attached to the surface of the QD quantum dot coating 3, the diffusion sheet 5 is attached to the bright enhancement film 4, and after the bright enhancement film 4 and the diffusion sheet 5 are attached, the synthesized bright enhancement film and the diffusion sheet are just positioned at UTG thinning parts.

Example 2

The embodiment provides a method for preparing a light guide plate structure, which comprises the following steps:

step 1, manufacturing UTG base materials, namely dividing a UTG base material into a light-in side part and a light-out part, wherein the thickness of the light-in side part is larger than that of the light-out part;

step 2, manufacturing a dot pattern on the UTG base material;

step 3, coating the QD quantum dots on the surface of the light-emitting part of the UTG substrate, and curing by UV baking to form a QD quantum dot coating, an air layer and a UTG layer structure;

and 4, attaching the reflector plate to the lower surface of the UTG layer, attaching the brightness enhancement film to the surface of the QD quantum dot coating layer, and attaching the diffusion sheet to the brightness enhancement film to complete the preparation of the light guide plate structure.

The UTG base material is processed mainly by adopting a glass thinning process in the step 1, and since the UTG base material is divided into a light-in side part and a light-out side part, the thickness of the light-in side part is larger than that of the light-out part, the light-out side part can be thinned by directly adopting the glass thinning process. In a preferred embodiment, the included angle between the light-in side portion and the light-out portion of the UTG substrate is processed to be 135 degrees or 90 degrees during the thinning process.

Since the light-emitting portion of the UTG substrate proposed in the present invention is extremely thin, and the conventional dot pattern manufacturing method cannot satisfy the optical requirements, a method for manufacturing a dot pattern suitable for the UTG substrate is proposed in this embodiment to satisfy the optical requirements, specifically:

and 2.1, coating acid-resistant ink on the UTG substrate to form a protective layer, and coating a layer of photoresist on the surface of the protective layer. The method comprises the following steps: firstly, cleaning UTG base materials, then coating acid-resistant ink on the surface of UTG base materials to form a protective layer, and coating a layer of photoresist on the surface of the protective layer; finally, the UTG substrate coated with the photoresist was subjected to a drying process and an end-face cleaning.

And 2.2, covering the mask plate with the required mesh pattern on the UTG substrate coated with the photoresist, and carrying out exposure treatment. Wherein, the diameter of the mesh points is 0.01-0.5mm, the depth is 0.01-0.1mm, the mesh points are arranged in a nonlinear way, and the optical effect can be adjusted by two different arrangement modes of the same size and different space or the same space with different size. In one embodiment, the photoresist is irradiated by UV light through the mask for exposure.

Step 2.3, developing the photoresist by a developing solution;

and 2.4, spraying hydrofluoric acid on the surface of the photoresist, wherein the hydrofluoric acid and UTG which is not covered by the photoresist are subjected to chemical reaction, and UTG surface entities are etched to form a dot pattern. In this embodiment, the concentration of hydrofluoric acid is 5% to 50%.

In step 3, the QD quantum dots are uniformly coated on the surface of the light-emitting part UTG by printing and ink-jet, and are cured by UV ultraviolet to form a QD quantum dot coating. In this embodiment, an air layer is provided between the QD quantum dot coating and UTG, forming a QD layer-air layer-UTG structure. To form an air layer between the QD quantum dot coating and UTG, in a preferred embodiment, a natural air layer may be formed using the nano-sized roughness of the UTG surface and the micro-sized roughness of the QD quantum dot coating surface when the QD quantum dot coating and UTG are adhered. The addition of an air layer between the QD quantum dot coating and UTG can minimize the loss of brightness of the light guiding structure.

In order to reduce the assembly cost and the thickness of the backlight module while avoiding the surface damage of UTG, the reflector plate is attached to the lower surface of UTG by adopting photoresist, and a three-in-one integral framework of QD quantum dot coating-UTG-reflector plate is formed.

Finally, the preparation of the light guide plate structure can be completed only by adding the diffusion sheet and the brightness enhancement film on the obtained three-in-one integral framework; the brightness enhancement film is attached to the surface of the QD quantum dot coating, the diffusion sheet is attached to the brightness enhancement film, and the synthesized brightness enhancement film and the diffusion film are just positioned at UTG thinning parts.

The light guide plate structure prepared by the light guide plate structure preparation method provided by the invention can enable the whole backlight module to be thinned, the UTG thickness is lower than 1mm, and meanwhile, the assembly cost of the backlight module is reduced; the color gamut value NSTC of the backlight module applying the light guide plate structure is more than 100 percent.

The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.