阅读说明：本技术 一种电子产品灌封工装及灌封方法 (Encapsulating tool and encapsulating method for electronic product ) 是由 潘静 刘曦 于 2020-12-12 设计创作，主要内容包括：本发明涉及灌封装置技术领域,具体为一种电子产品灌封工装及灌封方法,该方法包括预烘、配料、清洗、加装灌封工装、灌封、加压吹球、固化和脱模,既能在灌封固化后快速脱模,又达到了产品的灌封性能和要求,灌封方法简单实用,脱模时受力均匀,能显著延长工装的使用寿命,亦能保护灌封表面质量,提高产品质量和生产效率,通过对灌封灌装设计,使得工装抗冲击冲击能力强,制造成本低,使用寿命长。(The invention relates to the technical field of filling and sealing devices, in particular to a filling and sealing tool for electronic products and a filling and sealing method.)

1. An electronic product encapsulating method is characterized by comprising the following steps:

(1) pre-baking: mixing Fe₂O₃Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;

(2) preparing materials: weighing the organosilicon gel and Fe₂O₃Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;

(3) cleaning: cleaning the electronic component and the encapsulating tool;

(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;

(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;

(6) pressurizing and blowing balls: treating under gauge pressure of 0.092MPa for 10-15 min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;

(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;

(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.

2. The method for encapsulating electronic products according to claim 1, wherein the method further comprisesThe organosilicone gel and Fe₂O₃The weight ratio of 254: (0.5-1).

3. The method for encapsulating electronic products according to claim 1, wherein the silicone gel is GN522A, GN522B, GN502M, GN 502N.

4. The method for encapsulating electronic products according to claim 2, wherein the weight ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.

5. The method for encapsulating and sealing the electronic product according to claim 1, wherein the pre-drying temperature is 100 ℃ to 110 ℃ and the time is 2h to 3h, and after the power failure, the temperature is naturally reduced to 25 ℃ to 30 ℃.

6. The method for encapsulating and sealing the electronic product according to claim 1, wherein the curing is carried out at a temperature of (45 ± 2 ℃) for 2 hours, and after the oven is powered off, the curing is carried out for 20 hours under the conditions that the temperature is 25 ℃ to 30 ℃ and the relative humidity is 30% to 70%.

7. The electronic product potting method according to claim 1, wherein the electronic product comprises a cavity 1, a through cavity 2, a blind cavity 3 and an electronic component 8, the electronic component 8 is fastened in the cavity 1 by a screw, and a recessed platform is arranged on the reverse side of the through cavity 3.

8. The encapsulating tool for the electronic product is characterized by being divided into a blind cavity encapsulating tool and a through cavity encapsulating tool, wherein the blind cavity encapsulating tool consists of a clamp body 4 and a base 5, the through cavity encapsulating tool consists of a clamp body 6 and a base 7, and the clamp body 4 and the clamp body 6 are made of polytetrafluoroethylene; the base 5 and the base 7 are made of stainless steel.

9. The electronic product potting tool of claim 8, wherein the contact surfaces of the clamp body 4 and the base 5 have the same physical dimensions and are connected by countersunk screws; the contact surface of the clamp body 6 is consistent with the contact surface of the base serial number 7 in shape and size and is connected through a countersunk head screw.

10. The electronic product potting tool of claim 1, wherein the through cavity potting tool is comprised of a main body portion and a flange portion, the main body portion matches with the through cavity 2 in terms of structural characteristics and dimensions, the flange portion matches with the recessed platform, and the flange portion is mounted and fastened with screws through threaded holes in the recessed platform on the back side of the cavity.

Technical Field

The invention relates to the technical field of filling and sealing devices, in particular to a filling and sealing tool and a filling and sealing method for an electronic product.

Background

In order to ensure the normal work of electronic products and prevent the circuit board and devices from being damaged or failed in connection due to impact and vibration, the currently adopted method is that the whole electronic assembly is encapsulated in a cavity for reinforcement, but some devices can be assembled after encapsulation, so that the devices need to be replaced by tools for simulated assembly during encapsulation, the effect of leaking stoppage can be achieved, and the purpose of occupying the space positions of the devices can be achieved.

During integral encapsulation, due to functional requirements, a tool is required to be used for isolation, the encapsulation is carried out by adopting glue, due to the performance of the glue and the high insulation requirement of an electronic product after encapsulation, the tool is usually made of a non-metal material, the tool is very easy to deform when being impacted by external force during demolding, the normal demolding cannot be carried out after encapsulation and curing, the service life of the tool is short, the glue can flow to the part of a circuit board which does not need encapsulation to influence the product performance due to good fluidity of the glue, a large amount of time can be spent on removing the redundant glue after the curing is finished, excessive materials and products are easy to generate and damage, and the operation is tedious and unsafe.

Disclosure of Invention

The invention provides an electronic product encapsulating tool and an encapsulating method, which can effectively solve the technical defects, can realize quick demoulding after encapsulation and solidification, and also achieve the encapsulating performance and requirements of products, and the tool has strong impact resistance, low manufacturing cost and long service life, the encapsulating method is simple and practical, the stress is uniform during demoulding, the service life of the tool can be obviously prolonged, the encapsulating surface quality can be protected, and the product quality and the production efficiency are improved, and the encapsulating method specifically comprises the following steps:

(1) pre-baking: mixing Fe₂O₃Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;

(2) preparing materials: weighing the organosilicon gel and Fe₂O₃Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;

(3) cleaning: cleaning the electronic component and the encapsulating tool;

(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;

(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;

(6) pressurizing and blowing balls: treating under gauge pressure of 0.092MPa for 10-15 min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;

(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;

(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.

The organosilicone gel and Fe₂O₃The weight ratio of 254: (0.5-1).

The silicone gel is GN522A, GN522B, GN502M, GN502N, and the silicone gel product is provided by Zhonghao Chen photochemical research institute, Inc.

The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.

Further, when preparing the materials, firstly, the GN522A component is weighed, the GN522B component is added, the mixture is quickly and uniformly stirred by an electric stirrer, and then GN502M, GN502N and prebaked Fe are added₂O₃Stirring for 2min, placing in a vacuum defoaming machine, and vacuumizing to minus 0.092MPa for 5 min.

The pre-drying temperature is 100-110 ℃, the time is 2-3 h, and after power failure, the temperature is naturally reduced to 25-30 ℃.

And (3) curing at the temperature of (45 +/-2) ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of the temperature of 25-30 ℃ and the relative humidity of 30-70 percent and taking out.

The electronic product comprises a cavity 1, a through cavity 2, a blind cavity 3 and an electronic component 8, wherein the electronic component 8 is fastened in the cavity 1 through a screw, and a concave platform is arranged on the reverse side of the through cavity 3.

The encapsulating tool is divided into a blind cavity encapsulating tool and a through cavity encapsulating tool, the blind cavity encapsulating tool consists of a clamp body 4 and a base 5, the through cavity encapsulating tool consists of a clamp body 6 and a base 7, and the clamp body 4 and the clamp body 6 are made of polytetrafluoroethylene; the base 5 and the base 7 are made of stainless steel.

The contact surfaces of the clamp body 4 and the base 5 have the same overall dimension and are connected through countersunk screws; the contact surface of the clamp body 6 is consistent with the contact surface of the base serial number 7 in shape and size and is connected through a countersunk head screw.

The cavity filling and sealing tool is composed of a main body part and a flange part, the main body part is matched with the structural characteristics and the size of the cavity 2, the flange part is matched with the sunken platform, and screws are used for installing and fastening through threaded holes in the sunken platform on the back surface of the cavity.

Advantageous effects

1. Short process time and simple and convenient operation.

2. After curing and demolding, the cleaning process is greatly reduced, so that the use amount of the organic solvent is reduced, potential safety hazards in operation are eliminated, and the product quality and reliability are greatly improved.

3. After curing and demolding, the demolding time and the cleaning time are reduced, and the production efficiency is improved by 80%.

4. The tool is strong in impact resistance, convenient and fast to demold, capable of effectively occupying space and preventing rubber materials from overflowing, long in service life, 2/3 is reduced compared with an original method by using an organic solvent for organically cleaning the tool, and production cost is greatly reduced.

5. The encapsulating glue stock with excellent insulativity and impact resistance is prepared, the density is low, the fluidity is good, and the encapsulating performance and the safety of the product are improved.

6. And the cavity phenomenon after the sizing material is solidified is prevented by adjusting the technological parameters of the pressurizing and ball blowing.

Drawings

FIG. 1 is a process flow diagram of the present invention

FIG. 2 is a schematic diagram of an electronic product;

FIG. 3 is a schematic diagram of an electronic product;

FIG. 4 is a schematic structural view of a blind cavity potting tool of the present invention;

FIG. 5 is a left side view of FIG. 4;

FIG. 6 is a schematic structural view of a through-cavity potting tool of the present invention;

FIG. 7 is a left side view of FIG. 6;

reference numerals:

1-cavity, 2-through cavity, 3-blind cavity, 4-clamp body, 5-base, 6-clamp body, 7-base, 8-electronic component

Detailed Description

The technical solution of the present invention is further limited by the following specific embodiments, but the scope of the claims is not limited to the description.

(1) Pre-baking: mixing Fe₂O₃Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;

(2) preparing materials: weighing the organosilicon gel and Fe₂O₃Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;

(3) cleaning: cleaning the electronic component and the encapsulating tool;

(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;

(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;

(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 10min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;

(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;

(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.

The organosilicone gel and Fe₂O₃The weight ratio of 254: 0.5.

the silicone gel is GN522A, GN522B, GN502M, GN 502N.

The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.

During compounding, GN522A component is first weighed, GN522B component is added, the mixture is stirred quickly and evenly by an electric stirrer, and then GN502M, GN502N and prebaked Fe are added₂O₃Stirring for 2min, placing in a vacuum defoaming machine, and vacuumizing to minus 0.092MPa for 5 min.

The pre-drying temperature is 100 ℃, the time is 2hh, and after power failure, the temperature is naturally reduced to 25 ℃.

And (3) curing at 43 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of 25 ℃ and 30% of relative humidity and taking out.

Example 2

(1) Pre-baking: mixing Fe₂O₃Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;

(2) preparing materials: weighing the organosilicon gel and Fe₂O₃Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;

(3) cleaning: cleaning the electronic component and the encapsulating tool;

(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;

(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;

(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 15min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;

(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;

(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.

The organosilicone gel and Fe₂O₃The weight ratio of 254: 1.

the silicone gel is GN522A, GN522B, GN502M, GN 502N.

The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.

And vacuumizing to minus 0.092MPa and keeping for 5 min.

The pre-drying temperature is 110 ℃, the time is 3 hours, and after power failure, the temperature is naturally reduced to 30 ℃.

And (3) curing at 47 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of the temperature of 30 ℃ and the relative humidity of 70 percent and taking out.

Example 3

(1) Pre-baking: mixing Fe₂O₃Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;

(2) preparing materials: weighing the organosilicon gel and Fe₂O₃Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;

(3) cleaning: cleaning the electronic component and the encapsulating tool;

(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;

(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;

(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 12min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;

(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;

(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.

The organosilicone gel and Fe₂O₃The weight ratio of 254: 0.8.

the silicone gel is GN522A, GN522B, GN502M, GN 502N.

The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.

And vacuumizing to minus 0.092MPa and keeping for 5 min.

The pre-drying temperature is 105 ℃, the time is 2.5 hours, and after power failure, the temperature is naturally reduced to 28 ℃.

And (3) curing at 45 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of 28 ℃ and 50% of relative humidity and taking out.

In the embodiment 1-3, the tool is sprayed with the aerial fog release agent, and a static lubricant film layer is generated due to adsorption, so that the friction force between a polymer and processing equipment is reduced, a remarkable demoulding effect is generated, the surface smoothness of the tool made of special materials is improved, and the tool is protected from being damaged; by preparing the encapsulating rubber material with excellent insulativity and impact resistance, the viscosity is low, the fluidity is good, and the encapsulating performance and the safety of the product are improved.

Example 4

The utility model provides an electronic product embedment frock, including cavity 1, logical chamber 2, blind chamber 3, electronic component 8 in the electronic product, electronic component 8 passes through the screw fastening in cavity 1, leads to 3 reverse sides in chamber and is provided with sunken platform.

The encapsulating tool is a blind cavity encapsulating tool and consists of a clamp body 4 and a base 5, wherein the clamp body 4 is made of polytetrafluoroethylene; the base 5 is made of stainless steel.

The contact surfaces of the clamp body 4 and the base 5 have the same overall dimension and are connected through countersunk screws;

example 5

The utility model provides an electronic product embedment frock, including cavity 1, logical chamber 2, blind chamber 3, electronic component 8 in the electronic product, electronic component 8 passes through the screw fastening in cavity 1, leads to 3 reverse sides in chamber and is provided with sunken platform.

The filling and sealing tool is divided into a through cavity filling and sealing tool, the through cavity filling and sealing tool is composed of a clamp body 6 and a base 7, and the clamp body 6 is made of polytetrafluoroethylene; the base 7 is made of stainless steel.

The contact surface of the clamp body 6 and the base 7 has the same overall dimension and is connected through a countersunk head screw.

The clamp bodies 4 and 6 are made of non-metallic materials such as polytetrafluoroethylene, so that the effects of static electricity prevention and insulation can be achieved, and meanwhile, the strength is high, and the corrosion resistance is high

Stainless steel material is selected for use to base 5 and base 7, and intensity is high, and corrosion resistance is strong, and is difficult for rustting, reduces the bonding volume of sizing material on the frock simultaneously, is convenient for the drawing of patterns and gets rid of the sizing material.

Through adopting the scheme of implementing 4 and embodiment 6, the embedment frock of preparation is strong to shock resistance, and the drawing of patterns is convenient, has effectually played the effect of taking place and preventing the sizing material overflow, frock long service life.

Example 6

In some embodiments, the cavity filling and sealing tool is composed of a main body part and a flange part, the main body part is matched with the structural characteristics and the size of the cavity 2, the flange part is matched with the sunken platform, and screws are used for installing and fastening through threaded holes in the sunken platform on the back surface of the cavity.

It should be noted that the above examples and test examples are only for further illustration and understanding of the technical solutions of the present invention, and are not to be construed as further limitations of the technical solutions of the present invention, and the invention which does not highlight essential features and significant advances made by those skilled in the art still belongs to the protection scope of the present invention.