阅读说明：本技术 真空泵 (Vacuum pump ) 是由 田中晋悟 于 2020-08-28 设计创作，主要内容包括：本发明提供一种能够在短时间内使泵主体的温度上升到所期望的温度的真空泵。真空泵(100)包括：泵主体(6)；加热器(7),设置于泵主体(6)；电源装置(1),对泵供给电力；冷却器(2),设置于泵主体(6)与电源装置(1)之间；连接板(4),设置于泵主体(6)与冷却器(2)之间；第一隔热板(3),配置于冷却器(2)与连接板(4)之间；以及第二隔热板(5),配置于泵主体(6)与连接板(4)之间。(The invention provides a vacuum pump capable of raising the temperature of a pump body to a desired temperature in a short time. A vacuum pump (100) comprises: a pump body (6); a heater (7) provided in the pump body (6); a power supply device (1) for supplying power to the pump; a cooler (2) provided between the pump body (6) and the power supply device (1); a connecting plate (4) provided between the pump body (6) and the cooler (2); a first heat insulation plate (3) arranged between the cooler (2) and the connecting plate (4); and a second heat shield plate (5) disposed between the pump body (6) and the connection plate (4).)

1. A vacuum pump, comprising: a pump body;

a heater provided to the pump main body;

a power supply device that supplies power to the pump main body;

a cooler provided between the pump main body and the power supply device;

a connection plate provided between the pump main body and the cooler;

a first heat shield disposed between the cooler and the connection plate; and

and a second heat insulation plate disposed between the pump body and the connection plate.

2. A vacuum pump according to claim 1, wherein at least one of the cooler and the connecting plate has a first embedding region in which the first heat insulating plate is embedded, and

a first gap is formed between the cooler and the connection plate,

the thickness of the first heat insulation plate is larger than that of the first gap.

3. A vacuum pump according to claim 1 or 2, wherein at least one of the pump main body and the connecting plate has a second embedding region in which the second heat insulating plate is embedded, and

a second gap is formed between the pump body and the connecting plate,

the thickness of the second insulating plate is greater than that of the second gap.

4. A vacuum pump as claimed in claim 1 or 2, wherein the pump body has a first face opposed to the connecting plate and has an outer peripheral face,

the cooler has a second face opposed to the connection plate,

the connecting plate has a protruding portion protruding outward from the outer peripheral surface of the pump body when viewed in a first direction perpendicular to the first surface,

the first heat insulating plate is disposed between the protrusion and the second surface of the cooler.

5. A vacuum pump as defined in claim 4, wherein the protruding portion is formed so as to at least partially surround the outer peripheral surface of the pump main body as viewed in the first direction,

the first heat insulating plate is provided continuously or intermittently so as to at least partially surround the outer peripheral surface of the pump main body as viewed in the first direction,

the second heat insulating plate is continuously or intermittently provided along the outer circumferential surface of the pump main body as viewed in the first direction.

6. A vacuum pump, comprising: a pump body;

a heater provided to the pump main body;

a power supply device that supplies power to the pump main body;

a cooler provided between the pump main body and the power supply device;

a connection plate provided between the pump main body and the cooler; and

a first heat shield disposed between the cooler and the connection plate and having a first heat-shielding surface

At least one of the cooler and the connecting plate has a first embedding region in which the first heat insulating plate is embedded, and

a first gap is formed between the cooler and the connection plate,

the thickness of the first heat insulation plate is larger than that of the first gap.

7. A vacuum pump as claimed in claim 6, wherein the pump body has an outer peripheral surface,

the cooler has an opposing face opposing the connecting plate,

the connecting plate has a protruding portion formed to protrude outward from the outer peripheral surface of the pump body when viewed in a first direction perpendicular to the facing surface,

the first embedding region is provided to at least one of the cooler and the protrusion,

the first heat insulating plate is disposed between the cooler and the protruding portion so as to be embedded in the first embedding region.

8. A vacuum pump as defined in claim 7, wherein the protruding portion is formed so as to at least partially surround the outer peripheral surface of the pump main body when viewed in the first direction,

the first fitting region is provided continuously or intermittently in at least one of the cooler and the protruding portion so as to at least partially surround the outer peripheral surface of the pump body when viewed in the first direction,

the first heat insulating plate is disposed between the cooler and the protruding portion so as to be embedded in the first embedding region.

9. A vacuum pump as claimed in claim 7 or 8, wherein the width of the first heat shield, as viewed in the first direction, is less than half the minimum width of the projection.

10. A vacuum pump according to claim 9, wherein a distance between an inner edge portion of the first heat insulating plate and the outer peripheral surface of the pump main body is one-half or more of the minimum width of the protruding portion as viewed in the first direction.

Technical Field

The present invention relates to a vacuum pump with an integrated power supply device.

Background

A turbo molecular pump as a vacuum pump is used in various vacuum processing apparatuses. A power source-integrated turbo molecular pump includes a pump main body and a power source device. In the turbomolecular pump described in patent document 1, a water cooling device is provided between the pump main body and the power supply device in order to cool each component constituting the power supply device.

On the other hand, depending on the kind of gas discharged from the turbo-molecular pump, the product adheres to the inside of the pump main body. Therefore, in order to maintain the internal temperature of the pump main body to such an extent that no product adheres thereto, a heater is provided in the pump main body (see, for example, patent document 2). Thereby, the decrease of the exhaust performance due to the adhesion of the product is suppressed.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent laid-open No. 2014-148977

[ patent document 2] Japanese patent laid-open No. 2013-079602

Disclosure of Invention

[ problems to be solved by the invention ]

In a turbomolecular pump, a connection plate may be provided in a pump main body in order to connect the pump main body to a water cooling device. In this structure, a heat insulating plate is provided between the connection plate and the water cooling device in order to suppress heat transfer between the pump body and the water cooling device.

However, even when the heat insulating plate is provided, heat may be transferred between the pump body and the water cooling device via the connecting plate and the heat insulating plate. As a result, the temperature of the pump main body is difficult to rise to a desired temperature.

The purpose of the present invention is to provide a vacuum pump capable of raising the temperature of a pump body to a desired temperature in a short time.

[ means for solving problems ]

A vacuum pump according to an aspect of the present invention includes: a pump body; a heater provided to the pump main body; a power supply device that supplies power to the pump main body; a cooler provided between the pump main body and the power supply device; a connection plate provided between the pump main body and the cooler; a first heat shield disposed between the cooler and the connection plate; and a second heat insulating plate disposed between the pump main body and the connecting plate.

A vacuum pump according to another aspect of the present invention includes: a pump body; a heater provided to the pump main body; a power supply device that supplies power to the pump main body; a cooler provided between the pump main body and the power supply device; a connection plate provided between the pump main body and the cooler; and a first heat insulating plate disposed between the cooler and the connection plate, and at least one of the cooler and the connection plate has a first embedding region in which the first heat insulating plate is embedded, and a first gap is formed between the cooler and the connection plate, a thickness of the first heat insulating plate being greater than a thickness of the first gap.

[ Effect of the invention ]

According to the present invention, in a vacuum pump, the temperature of the pump main body can be raised to a desired temperature in a short time.

Drawings

Fig. 1 is a schematic front view of a turbomolecular pump according to a first embodiment.

Fig. 2 is a sectional view of the turbomolecular pump of fig. 1 taken along line a-a.

Fig. 3 is an enlarged cross-sectional view of a portion of the turbomolecular pump of fig. 1.

Fig. 4 is a schematic front view of a turbomolecular pump according to a second embodiment.

Fig. 5 is a sectional view of the turbomolecular pump of fig. 4 taken along line B-B.

Fig. 6 is an enlarged cross-sectional view of a portion of the turbomolecular pump of fig. 4.

Fig. 7 is an enlarged sectional view showing a part of another example of the turbomolecular pump.

Fig. 8 is an enlarged sectional view showing a part of still another example of the turbomolecular pump.

Fig. 9 is an enlarged sectional view of a part of a turbomolecular pump used in a comparative example.

Fig. 10 is a graph showing the results of example 1, example 2 and comparative example.

[ description of symbols ]

1: power supply device

1 a: power supply unit casing

2: cooling device

2 a: water-cooling jacket

2 b: cooling water inlet

2 c: cooling water outlet

2d, 4a, 4b, 6 c: embedded region

2u, 4 u: upper surface of

3: first heat insulation board

3 a: inner peripheral surface

4: connecting plate

4d, 6 d: lower surface

5: second heat insulation board

5 a: inner peripheral surface

6: pump body

6 a: shell body

6 b: peripheral surface

7: heating device

30: heat insulation board

40: projection part

100. 100 a: turbo molecular pump

Detailed Description

Hereinafter, the vacuum pump according to the embodiment will be described in detail with reference to the drawings. In the present embodiment, a turbo-molecular pump is used as an example of the vacuum pump.

(1) First embodiment

Fig. 1 is a schematic front view of a turbomolecular pump according to a first embodiment of the present invention. Fig. 2 is a sectional view of the turbomolecular pump of fig. 1 taken along line a-a. As shown in fig. 1, the turbomolecular pump 100 includes: a power supply device 1, a cooler 2, a first heat insulating plate 3, a connecting plate 4, a second heat insulating plate 5, a pump main body 6, and a heater 7.

The power supply device 1 includes a power supply device housing 1 a. The power supply device housing 1a accommodates a power supply circuit board, a temperature sensor, and the like. The power supply device 1 supplies electric power to the pump body 6 and the heater 7. In the present embodiment, as shown in fig. 2, the power supply unit casing 1a has an octagonal pillar shape.

As shown in fig. 1, the cooler 2 is provided on the upper surface of the power supply apparatus casing 1 a. The cooler 2 includes a water-cooled jacket 2 a. A cooling water pipe is provided inside the water-cooling jacket 2 a. Further, a cooling water inlet 2b and a cooling water outlet 2c are formed outside the water-cooling jacket 2 a. When cooling water is supplied to the cooling water inlet 2b, the cooling water is discharged from the cooling water outlet 2c through the cooling water pipe. Thereby, the power supply device 1 is cooled. In the present embodiment, as shown in fig. 2, the cooler 2 has an octagonal pillar shape.

As shown in fig. 1, a connection plate 4 is provided on the upper surface of the cooler 2 via a first heat shield plate 3. The first heat insulating board 3 is formed of, for example, a resin material having a heat insulating effect. In the present embodiment, as shown in fig. 2, the first heat insulation plate 3 has an octagonal outer edge and an octagonal inner edge. The first insulating panel 3 has a certain width w 1. The connection plate 4 is formed of metal, for example. In the present embodiment, the connection plate 4 has an octagonal shape.

The power supply device 1, the cooler 2, the first heat insulating plate 3, and the connecting plate 4 have the same outer shape and the same size in a plan view. Therefore, the side surfaces of the power supply device 1, the cooler 2, the first heat insulating plate 3, and the connection plate 4 are formed to be flush with each other.

As shown in fig. 1, a pump body 6 is provided on the upper surface of the connection plate 4 via a second heat shield plate 5. The second heat insulating board 5 is formed of, for example, a resin material having a heat insulating effect. In addition, as shown in fig. 2, the second heat insulation plate 5 has a circular ring shape with a width w 2. The pump main body 6 of fig. 1 includes a cylindrical housing 6 a. The housing 6a is formed of, for example, metal, and houses a rotor, a motor, and the like. The connecting plate 4 is coupled to the case 6a by bolts or the like. A heater 7 is provided on the outer peripheral surface 6b of the housing 6 a. The heater 7 heats the pump main body 6 so that the product does not adhere to the inside of the casing 6 a.

In the present embodiment, the second heat shield plate 5 and the casing 6a of the pump body 6 have the same outer shape and the same size in plan view. Therefore, the second heat shield plate 5 and the outer peripheral surface 6b of the pump body 6 are formed in the same plane. The minimum length from the center of the connecting plate 4 to the outer edge is longer than the radius of the second heat insulating plate 5 and the housing 6 a. Thus, the connection plate 4 has a protruding portion 40 protruding outward from the outer peripheral surface 6b of the pump body 6 over the entire periphery in a plan view. The minimum value of the length from the outer peripheral surface 6b of the pump body 6 to the outer edge of the connecting plate 4 (the minimum width of the protrusion 40) is w 3.

Fig. 3 is an enlarged cross-sectional view of a portion of turbomolecular pump 100 of fig. 1. The lower surface of the first heat insulating board 3 is in contact with the upper surface 2u of the cooler 2, and the upper surface of the first heat insulating board 3 is in contact with the lower surface 4d of the connecting plate 4. A gap GP1 surrounded by the inner peripheral surface 3a of the first heat shield plate 3 is formed between the upper surface 2u of the cooler 2 and the lower surface 4d of the link plate 4. The gap GP1 has a thickness t 1. The gap GP1 functions as a first air insulation layer.

The lower surface of the second heat insulating plate 5 is in contact with the upper surface 4u of the connecting plate 4, and the upper surface of the second heat insulating plate 5 is in contact with the lower surface 6d of the pump body 6. A gap GP2 surrounded by the inner peripheral surface 5a of the second heat insulating plate 5 is formed between the upper surface 4u of the connecting plate 4 and the lower surface 6d of the pump body 6. The gap GP2 has a thickness t 2. The gap GP2 functions as a second air insulation layer.

In the present embodiment, the distance D1 between the outer peripheral surface 6b of the pump body 6 and the inner edge of the first heat shield plate 3 is 1/2 or more of the minimum width w3 of the protrusion 40. In the example of fig. 3, the inner peripheral surface 3a of the first heat insulating board 3 is located further outside than the middle point C of the minimum width w3 of the protruding portion 40.

According to the turbomolecular pump 100 of the first embodiment, the first heat shield 3 disposed between the cooler 2 and the connection plate 4 suppresses the heat transfer between the cooler 2 and the connection plate 4. Further, the second heat shield plate 5 disposed between the pump body 6 and the connection plate 4 suppresses the movement of heat between the pump body 6 and the connection plate 4. Thereby, the amount of heat that moves from the pump main body 6 heated by the heater 7 to the cooler 2 via the connection plate 4 is reduced.

The gaps GP1 and GP2 function as the first air insulating layer and the second air insulating layer, respectively. Generally, the thermal conductivity of air is smaller than that of a solid material such as resin. Thus, the first air insulation layer serving as the gap GP1 and the second air insulation layer serving as the gap GP2 sufficiently suppress the heat transfer between the cooler 2 and the pump body 6.

Further, since the first heat shield 3 is disposed between the cooler 2 and the protrusion 40 of the connection plate 4, the path from the pump body 6 to the cooler 2 through the second heat shield 5, the connection plate 4, and the first heat shield 3 becomes long. Thereby, the amount of heat moved from the pump main body 6 to the cooler 2 via the first heat insulating plate 3 is further reduced. Further, a gap GP1 is formed between the cooler 2 and the central portion of the web 4 except for the protruding portion 40. Therefore, the movement of heat in the shortest path between the pump main body 6 and the cooler 2 is sufficiently suppressed.

In addition, the width w1 of the first insulation panel 3 is sufficiently smaller than the minimum width w3 of the protrusions 40 of the attachment panel 4. That is, the area of the first insulation board 3 is small. Further, the distance between the first heat shield plate 3 and the outer peripheral surface 6b of the pump body 6 is sufficiently long. Thereby, the movement of heat passing through the first heat insulating board 3 is sufficiently suppressed.

As a result, the temperature of the pump main body 6 can be raised to a desired temperature in a short time.

(2) Second embodiment

Fig. 4 is a schematic front view of a turbomolecular pump 100 according to a second embodiment of the present invention. Fig. 5 is a sectional view of turbomolecular pump 100 of fig. 4 taken along line B-B. The turbomolecular pump 100 of fig. 4 differs from the turbomolecular pump 100 of fig. 1 in the following respects.

The turbomolecular pump 100 of fig. 4 does not have the second heat shield 5 of fig. 1. Thereby, the connection plate 4 is integrated with the housing 6a of the pump body 6. In addition, an embedded region 4a is formed on the lower surface 4d of the connection plate 4 in fig. 4. Details of the embedded region 4a will be described later. In the embedding region 4a, the upper surface of the first insulation board 3 is embedded.

As shown in fig. 5, the embedded region 4a is formed along the outermost periphery of the connection plate 4. The fitting region 4a is an octagonal annular recess whose outer surface is open. The embedded region 4a has the same width w1 as the first insulating board 3.

Fig. 6 is an enlarged cross-sectional view of a portion of the turbomolecular pump 100 of fig. 4. The first insulating panel 3 has a thickness t 3. In a state where the first heat insulating board 3 is fitted into the fitting region 4a of the attachment board 4, the lower surface of the first heat insulating board 3 is in contact with the upper surface 2u of the cooler 2, and the upper surface of the first heat insulating board 3 is in contact with the lower surface of the fitting region 4a of the attachment board 4. Thereby, a gap GP1 surrounded by the inner peripheral surface 3a of the first heat shield plate 3 is formed between the upper surface 2u of the cooler 2 and the lower surface 4d of the link plate 4. The thickness t3 of the first insulating board 3 is greater than the thickness t1 of the gap GP 1.

According to the turbomolecular pump 100 of the second embodiment, the thickness t3 of the first heat insulating plate 3 is greater than the thickness t1 of the gap GP 1. In other words, by providing the embedded region 4a, the thickness t3 of the first heat insulating plate 3 can be increased without increasing the overall height of the turbomolecular pump 100. Thereby, the amount of heat movement between the connection plate 4 and the cooler 2 is sufficiently reduced by the first heat insulating plate 3.

Further, since the gap GP1 functions as the first air insulation layer, the amount of heat transfer between the cooler 2 and the link plate 4 is sufficiently reduced by the first air insulation layer. Thereby, the amount of heat that moves from the pump main body 6 heated by the heater 7 to the cooler 2 via the connection plate 4 is reduced.

In addition, the width w1 of the first insulation panel 3 is sufficiently smaller than the minimum width w3 of the protrusions 40 of the attachment panel 4. That is, the area of the first insulation board 3 is small. Further, the distance between the first heat shield plate 3 and the outer peripheral surface 6b of the pump body 6 is sufficiently long. Thereby, the movement of heat passing through the first heat insulating board 3 is sufficiently suppressed.

As a result, the temperature of the pump main body 6 can be raised to a desired temperature in a short time.

(3) Other embodiments

(a) Fig. 7 is an enlarged sectional view showing a part of another example of the turbomolecular pump 100. The turbomolecular pump 100 of fig. 7 differs from the turbomolecular pump 100 of fig. 3 in the following respects. In the turbomolecular pump 100 of fig. 7, an embedded region 2d (annular recess) is formed on the upper surface 2u of the cooler 2. The lower surface of the first insulation board 3 is embedded in the embedding region 2 d. Further, a fitting region 6c (annular recess) is formed in the lower surface 6d of the pump body 6. The upper surface of the second insulation board 5 is embedded in the embedding region 6 c.

The first insulating panel 3 has a thickness t 3. In a state where the first heat insulating board 3 is fitted into the fitting region 2d of the cooler 2, the lower surface of the first heat insulating board 3 is in contact with the upper surface of the fitting region 2d of the cooler 2, and the upper surface of the first heat insulating board 3 is in contact with the lower surface 4d of the connection plate 4. Thereby, a gap GP1 surrounded by the inner peripheral surface 3a of the first heat shield plate 3 is formed between the upper surface 2u of the cooler 2 and the lower surface 4d of the link plate 4. The thickness t3 of the first insulating board 3 is greater than the thickness t1 of the gap GP 1.

In addition, the second heat insulation board 5 has a thickness t 4. In a state where the second heat insulating board 5 is fitted to the fitting region 6c of the pump body 6, the lower surface of the second heat insulating board 5 is in contact with the upper surface 4u of the connection plate 4, and the upper surface of the second heat insulating board 5 is in contact with the lower surface of the fitting region 6c of the pump body 6. Thereby, a gap GP2 surrounded by the inner peripheral surface 5a of the second heat shield plate 5 is formed between the upper surface 4u of the connection plate 4 and the lower surface 6d of the pump body 6. The thickness t4 of the second heat shield 5 is greater than the thickness t2 of the gap GP 2.

According to the turbomolecular pump 100 of fig. 7, the gap GP1 functions as a first air insulation layer. Thereby, the amount of heat movement between the cooler 2 and the connection plate 4 is reduced. The gap GP2 functions as a second air insulation layer. Thereby, the amount of heat movement between the connection plate 4 and the pump main body 6 is reduced.

In addition, by embedding the first insulation board 3 to the embedding region 2d, the thickness t3 of the first insulation board 3 is greater than the thickness t1 of the first air insulation layer of the gap GP 1. In other words, by providing the embedded region 2d, the thickness t3 of the first heat insulating plate 3 can be increased without increasing the overall height of the turbomolecular pump 100. Thereby, the amount of heat movement between the cooler 2 and the connection plate 4 is further reduced.

In addition, by embedding the second heat insulation board 5 to the embedding region 6c, the thickness t4 of the second heat insulation board 5 is greater than the thickness t2 of the second air insulation layer of the gap GP 2. In other words, by providing the embedded region 6c, the thickness t4 of the second heat insulating plate 5 can be increased without increasing the overall height of the turbomolecular pump 100. Thereby, the amount of heat movement between the connection plate 4 and the pump main body 6 is further reduced.

(b) Fig. 8 is an enlarged sectional view showing a part of still another example of the turbomolecular pump 100. The turbomolecular pump 100 of fig. 8 differs from the turbomolecular pump 100 of fig. 7 in the following respects. In the turbomolecular pump 100 of fig. 8, the first fit-in region 2d is not formed on the upper surface 2u of the cooler 2, but the fit-in region 4a (annular recess) is formed on the lower surface 4d of the connecting plate 4. The upper surface of the first insulation board 3 is embedded in the embedding region 4 a. In addition, the second fitting region 6c is not formed on the lower surface 6d of the pump body 6, but the fitting region 4b (annular recess) is formed on the upper surface 4u of the connection plate 4. The lower surface of the second insulation board 5 is embedded in the embedding region 4 b. The structure of the other parts of the turbomolecular pump 100 of fig. 8 is the same as that of the turbomolecular pump 100 of fig. 7.

According to the turbomolecular pump 100 of fig. 8, the same effects as those of the turbomolecular pump 100 of fig. 7 can be obtained. In addition, according to the turbomolecular pump 100 of fig. 8, since both the fitting region 4a and the fitting region 4b are formed in the connecting plate 4, the number of manufacturing steps of the turbomolecular pump 100 is reduced.

(c) In the above embodiment, the first embedded region is formed on either the upper surface 2u of the cooler 2 or the lower surface 4d of the connecting plate 4, but the present invention is not limited thereto. The first embedded region may also be formed on both the upper surface 2u of the cooler 2 and the lower surface 4d of the connecting plate 4.

(d) In the above embodiment, the second fitting region is formed on either the upper surface 4u of the connection plate 4 or the lower surface 6d of the pump body 6, but the present invention is not limited to this. The second embedding region may also be formed on both the upper surface 4u of the connecting plate 4 or the lower surface 6d of the pump body 6.

(e) In the above embodiment, the first heat insulating board 3 and the second heat insulating board 5 are formed of a resin material, but the present invention is not limited thereto. The first heat insulating plate 3 and the second heat insulating plate 5 may be formed of other materials such as a rubber material having a heat insulating effect.

(f) In the above embodiment, the power supply device 1, the cooler 2, the first heat shield 3, and the connection plate 4 have the same octagonal shape in a plan view, but the present invention is not limited thereto. The power supply device 1, the cooler 2, the first heat shield plate 3, and the connection plate 4 may have the same or different shapes such as an elliptical shape and a quadrangular shape in plan view.

(g) In the above embodiment, the first heat insulating board 3 is disposed along the outermost periphery of the connecting board 4, but the first heat insulating board 3 may be disposed at a position further inside than the outermost periphery of the connecting board 4. In this case, the fitting region 4a and the fitting region 2d may be annular recesses having side surfaces on the outer edge and the inner edge.

(h) In the above embodiment, the fitting region 4a and the fitting region 2d are provided continuously over the entire circumference of the housing 6a so as to surround the outer circumferential surface 6b of the pump body 6 in a plan view, but the fitting region 4a and the fitting region 2d may be provided intermittently. The fitting region 6c and the fitting region 4b are provided continuously along the outer peripheral surface 6b of the pump body 6, but the fitting region 6c and the fitting region 4b may be provided intermittently.

(i) In the above embodiment, the vacuum pump is the turbomolecular pump 100, but the present invention is not limited to this. For example, the present invention can also be applied to a vacuum pump including only a drag pump (screw-groove pump), such as a sigma-delta pump (Siegbahn pump) or a Holweck pump (Holweck pump), or a vacuum pump including a combination of a turbo-molecular pump and a drag pump.

(4) Examples and comparative examples

In order to compare the temperature change of the outer peripheral surface 6b of the pump main body 6 of the turbomolecular pump 100, the following simulation and actual machine test were performed. In example 1, the turbomolecular pump 100 of fig. 6 was used. In example 2, the turbomolecular pump 100 of fig. 7 was used.

The thickness t1 of the gap GP1 of the pump body 6 of example 1 and example 2 was 3mm, and the thickness t3 of the first heat insulating plate 3 was 5 mm. In addition, the thickness t2 of the gap GP2 of the pump body 6 of example 2 was 3mm, and the thickness t4 of the second heat insulating plate 5 was 5 mm.

Fig. 9 is an enlarged cross-sectional view of a part of a turbomolecular pump 100a used in a comparative example. As shown in fig. 9, the connection plate 4 is provided on the upper surface of the cooler 2 via a heat insulating plate 30 having a thickness t 5. The pump body 6 is provided on the upper surface of the connection plate 4. The width w4 of the heat shield 30 is greater than 1/2 of the minimum width w3 of the tabs 40. Specifically, the areas of the upper and lower surfaces of the heat-insulating board 30 of the comparative example were about 3 times larger than the areas of the upper and lower surfaces of the first heat-insulating board 3 of examples 1 and 2.

The lower surface of the heat-insulating plate 30 is in contact with the upper surface 2u of the cooler 2, and the upper surface of the heat-insulating plate 30 is in contact with the lower surface 4d of the attachment plate 4. Thereby, a gap GP1 surrounded by the inner peripheral surface 3a of the heat insulating plate 30 is formed between the upper surface 2u of the cooler 2 and the lower surface 4d of the link plate 4. The thickness of the gap GP1 is t 5. The thickness t5 of the gap GP1 and the thickness t5 of the heat insulating plate 30 of the turbomolecular pump 100a of the comparative example were 3 mm. The structure of the other parts of the turbomolecular pump 100a of the comparative example is the same as that of the turbomolecular pump 100 of example 1.

In the simulation, the temperature of the housing 6a of the pump body 6 was calculated under the following analysis conditions using design software. In the actual machine test, the turbomolecular pump 100 and the turbomolecular pump 100a having the above-described structures were used to measure the temperature of the casing 6a of the pump main body 6.

As analysis conditions, the amount of heat generated by the heater 7 was 300W, and the amount of heat released was 13W/m²K is convection in appearance (that is, thermal analysis under a condition that heat is released by convection by sending wind to the surface of the pump member). The temperature of the water-cooling jacket 2a of the cooler 2 was fixed at 25 ℃. The actual machine test was performed under almost the same conditions as the analysis conditions. In the actual machine test, the heater 7 was controlled so that the temperature of the casing 6a of the pump main body 6 did not exceed 90 ℃.

Fig. 10 is a graph showing the results of example 1, example 2 and comparative example. In the simulation of the comparative example, the temperature of the housing 6a of the pump main body 6 was 71.3 ℃. In the actual machine test of the comparative example, the temperature of the casing 6a of the pump body 6 was 70.0 ℃.

In contrast, in the simulation of example 1, the temperature of the casing 6a of the pump main body 6 was 84.7 ℃. In the actual machine test of example 1, the temperature of the casing 6a of the pump body 6 was 85.0 ℃. In the simulation of example 2, the temperature of the housing 6a of the pump main body 6 was 95.0 ℃. In the actual machine test of example 2, the temperature of the casing 6a of the pump body 6 was 90.0 ℃.

From the results of example 1 and comparative example, it was confirmed that: by increasing the thickness t3 of the first heat insulating board 3 and reducing the area of the first heat insulating board 3, the temperature of the casing 6a of the pump main body 6 can be raised to a higher temperature.

From the results of example 2 and comparative example, it was confirmed that: by increasing the thickness t3 of the first heat insulating board 3 and reducing the area of the first heat insulating board 3 and providing the second heat insulating board 5 between the pump main body 6 and the connecting board 4, the casing 6a of the pump main body 6 can be raised to a further high temperature.

(5) Correspondence between each component of claims and each element of embodiments

Hereinafter, an example of correspondence between each component of the claims and each element of the embodiments will be described. In the above-described embodiment, the turbomolecular pump 100 is an example of a vacuum pump, the fitting region 2d and the fitting region 4a are examples of a first fitting region, the fitting region 6c and the fitting region 4b are examples of a second fitting region, the gap GP1 is an example of a first gap, the gap GP2 is an example of a second gap, the lower surface 6d of the pump body 6 is an example of a first surface, the upper surface 2u of the cooler 2 is an example of an opposing surface or a second surface, and a plan view thereof is an example of a first direction.

(6) Form of the composition

Those skilled in the art will appreciate that the various exemplary embodiments are specific examples of the following embodiments.

The vacuum pump according to (item 1) above may include:

a pump body;

a heater provided to the pump main body;

a power supply device that supplies power to the pump main body;

a cooler provided between the pump main body and the power supply device;

a connection plate provided between the pump main body and the cooler;

a first heat shield disposed between the cooler and the connection plate; and

and a second heat insulation plate disposed between the pump body and the connection plate.

The vacuum pump according to claim 1, wherein the power supply device is cooled by a cooler, and the pump body is heated by a heater. In this case, the first heat insulating plate disposed between the cooler and the connection plate suppresses heat transfer between the cooler and the connection plate. In addition, the second heat insulating plate disposed between the pump body and the connecting plate suppresses the movement of heat between the pump body and the connecting plate. Thereby, the amount of heat that moves from the pump main body heated by the heater to the cooler via the connection plate is reduced. As a result, the temperature of the pump main body can be raised to a desired temperature in a short time.

(item 2) the vacuum pump according to item 1, wherein

At least one of the cooler and the connecting plate has a first embedding region in which the first heat insulating plate is embedded, and

a first gap is formed between the cooler and the connection plate,

the thickness of the first heat insulation plate is larger than that of the first gap.

According to the vacuum pump described in claim 2, the first gap formed between the cooler and the connecting plate functions as a first air insulation layer. Typically, the thermal conductivity of air is less than the thermal conductivity of solid materials. Thus, the amount of heat transfer between the cooler and the connecting plate is sufficiently reduced by the first air insulation layer. In addition, by embedding the first insulation board to the first embedding region, the thickness of the first insulation board is greater than that of the first gap. Thus, the amount of heat transfer between the cooler and the connection plate is sufficiently reduced by the first heat insulating plate.

(item 3) the vacuum pump according to item 1 or 2, wherein

At least one of the pump body and the connection plate has a second embedding region in which the second heat insulating plate is embedded, and

a second gap is formed between the pump body and the connecting plate,

the thickness of the second insulating plate is greater than that of the second gap.

The vacuum pump according to claim 3, wherein the second gap formed between the pump body and the connecting plate functions as a second air insulation layer. Thus, the amount of heat transfer between the cooler and the connecting plate is sufficiently reduced by the second air insulation layer. In addition, by embedding the second insulation board to the second embedding region, the thickness of the second insulation board is greater than that of the second gap. Thus, the amount of heat transfer between the pump body and the connection plate is sufficiently reduced by the second heat insulating plate.

(4) the vacuum pump according to any one of items 1 to 3, wherein

The pump main body has a first face opposed to the connection plate and has an outer peripheral face,

the cooler has a second face opposed to the connection plate,

the connecting plate has a protruding portion protruding outward from the outer peripheral surface of the pump body when viewed in a first direction perpendicular to the first surface,

the first heat insulating plate is disposed between the protrusion and the second surface of the cooler.

According to the vacuum pump described in item 4, since the first heat insulating plate is disposed between the cooler and the protruding portion of the connecting plate, the path from the pump main body to the cooler through the second heat insulating plate, the connecting plate, and the first heat insulating plate becomes long. Thereby, the amount of heat that moves from the pump main body to the cooler via the first heat insulating plate is further reduced. Further, a gap is formed between the cooler and the central portion of the connection plate except the protruding portion. According to the above configuration, since the gap between the cooler and the central portion of the connection plate functions as an air insulation layer, the amount of heat transfer between the cooler and the connection plate is sufficiently reduced. Therefore, the movement of heat in the shortest path between the pump main body and the cooler is sufficiently suppressed.

(5 th) 4 th vacuum pump, can also

The protrusion is formed so as to at least partially surround the outer peripheral surface of the pump main body when viewed in the first direction,

the first heat insulating plate is provided continuously or intermittently so as to at least partially surround the outer peripheral surface of the pump main body as viewed in the first direction,

the second heat insulating plate is continuously or intermittently provided along the outer circumferential surface of the pump main body as viewed in the first direction.

According to the vacuum pump described in claim 5, a gap is formed between the cooler and the central portion of the connection plate, and a gap is formed between the pump main body and the central portion of the connection plate. The gap between the cooler and the central portion of the connection plate functions as a first air insulation layer, and the gap between the pump body and the central portion of the connection plate functions as a second air insulation layer. Thus, the first air insulation layer and the second air insulation layer sufficiently suppress heat transfer in the shortest path between the pump body and the cooler. In addition, in the circumferential direction of the pump main body, the first heat insulating plate and the second heat insulating plate sufficiently and uniformly suppress the movement of heat between the pump main body and the cooler.

(item 6) the vacuum pump of another aspect may include: a pump body;

a heater provided to the pump main body;

a power supply device that supplies power to the pump main body;

a cooler provided between the pump main body and the power supply device;

a connection plate provided between the pump main body and the cooler; and

a first heat shield disposed between the cooler and the connection plate and having a first heat-shielding surface

At least one of the cooler and the connecting plate has a first embedding region in which the first heat insulating plate is embedded, and

a first gap is formed between the cooler and the connection plate,

the thickness of the first heat insulation plate is larger than that of the first gap.

The vacuum pump according to claim 6, wherein the power supply device is cooled by a cooler, and the pump body is heated by a heater. A first heat shield plate is embedded in the first embedding region, and a first gap is formed between the cooler and the connection plate. In the structure, the first insulating plate has a thickness greater than that of the first gap. Thus, the amount of heat transfer between the connection plate and the cooler is sufficiently reduced by the first heat insulating plate. Further, since the first gap functions as the first air insulating layer, the amount of heat transfer between the cooler and the connecting plate is sufficiently reduced by the first air insulating layer. Thereby, the amount of heat that moves from the pump main body heated by the heater to the cooler via the connection plate is reduced. As a result, the temperature of the pump main body can be raised to a desired temperature in a short time.

(7 th) the vacuum pump according to claim 6, wherein

The pump body has an outer circumferential surface,

the cooler has an opposing face opposing the connecting plate,

the connecting plate has a protruding portion formed to protrude outward from the outer peripheral surface of the pump body when viewed in a first direction perpendicular to the facing surface,

the first embedding region is provided to at least one of the cooler and the protrusion,

the first heat insulating plate is disposed between the cooler and the protruding portion so as to be embedded in the first embedding region.

According to the vacuum pump described in claim 7, since the first heat insulating plate is disposed between the cooler and the protruding portion of the connecting plate, a path from the pump main body to the cooler through the connecting plate and the first heat insulating plate becomes long. Thereby, the amount of heat that moves from the pump main body to the cooler via the first heat insulating plate is further reduced. In addition, a first gap is formed between the cooler and a central portion of the connection plate except the protruding portion. Thus, the first gap between the cooler and the central portion of the connecting plate functions as an air insulating layer, and therefore the amount of heat transfer between the central portion of the connecting plate and the cooler is sufficiently reduced. Therefore, the movement of heat in the shortest path between the pump main body and the cooler is sufficiently suppressed.

(8 th) 7 th vacuum pump, can also

The protrusion is formed so as to at least partially surround the outer peripheral surface of the pump main body when viewed in the first direction,

the first fitting region is provided continuously or intermittently in at least one of the cooler and the protruding portion so as to at least partially surround the outer peripheral surface of the pump body when viewed in the first direction,

the first heat insulating plate is disposed between the cooler and the protruding portion so as to be embedded in the first embedding region.

According to the vacuum pump as set forth in claim 8, the first heat insulating plate sufficiently and uniformly suppresses the heat transfer between the pump body and the cooler in the circumferential direction of the pump body.

(9) the vacuum pump according to any one of items 4, 5, 7 and 8

The width of the first heat insulating plate is equal to or less than one-half of the minimum width of the protrusion when viewed in the first direction.

According to the vacuum pump described in item 9, since the width of the first heat insulating plate disposed between the cooler and the protruding portion of the connecting plate is sufficiently smaller than that of the protruding portion, the movement of heat passing through the first heat insulating plate between the cooler and the connecting plate is sufficiently suppressed.

(item 10) the vacuum pump according to item 9, wherein

A distance between an inner edge portion of the first heat insulating plate and the outer peripheral surface of the pump main body is at least one-half of the minimum width of the protruding portion when viewed in the first direction.

According to the vacuum pump described in item 10, since the distance between the first heat insulating plate and the outer peripheral surface of the pump main body is sufficiently long, the amount of heat transferred from the pump main body to the cooler via the connecting plate and the first heat insulating plate is sufficiently reduced.