阅读说明：本技术 可折叠电子装置 (Foldable electronic device ) 是由 刘景� 于 2018-09-14 设计创作，主要内容包括：一种可折叠电子装置(100),其包括柔性导热件(10)、中框组件(20)、电路板组件(30)与后盖组件(40)。中框组件(20)包括第一子中框(22)和第二子中框(26)。后盖组件(40)包括分别覆盖第一子中框(22)和第二子中框(26)的第一子后盖(42)和第二子后盖(46)。电路板组件(30)位于第一子中框(22)与第一子后盖(42)之间。柔性导热件(10)导热地连接电路板组件(30)、第一子后盖(42)和第二子后盖(46)。(A foldable electronic device (100) comprises a flexible heat-conducting member (10), a middle frame assembly (20), a circuit board assembly (30) and a rear cover assembly (40). The middle frame assembly (20) comprises a first sub-middle frame (22) and a second sub-middle frame (26). The rear cover assembly (40) includes a first sub rear cover (42) and a second sub rear cover (46) covering the first sub middle frame (22) and the second sub middle frame (26), respectively. The circuit board assembly (30) is located between the first sub-middle frame (22) and the first sub-rear cover (42). The flexible heat-conducting member (10) is thermally conductively connected to the circuit board assembly (30), the first sub rear cover (42) and the second sub rear cover (46).)

A foldable electronic device, comprising:

the middle frame assembly comprises a first sub middle frame and a second sub middle frame;

a rear cover assembly including first and second sub rear covers covering the first and second sub middle frames, respectively;

a circuit board assembly located between the first sub-middle frame and the first sub-rear cover; and

a flexible thermally conductive member thermally conductively connecting the circuit board assembly, the first sub rear cover, and the second sub rear cover.

The foldable electronic device of claim 1, wherein the middle frame assembly comprises a connecting member connecting the first sub-middle frame and the second sub-middle frame, and the flexible heat conducting member is in heat conducting connection with the connecting member and covers the connecting member.

The foldable electronic device of claim 2, wherein the flexible heat conducting member comprises a first heat conducting layer and a second heat conducting layer arranged in a stack, the second heat conducting layer being disposed on the back cover assembly, the first heat conducting layer being disposed on a side of the second heat conducting layer remote from the back cover assembly.

The foldable electronic device of claim 3, wherein the first thermally conductive layer is attached to the connection member and the circuit board assembly, and the second thermally conductive layer is attached to the first sub-rear cover and the second sub-rear cover.

The foldable electronic device of claim 3, wherein the first thermally conductive layer has a lower thermal conductivity than the second thermally conductive layer, and wherein the first thermally conductive layer has a hardness greater than the second thermally conductive layer.

The foldable electronic device of claim 3, wherein the first thermally conductive layer is made of a metal material and the second thermally conductive layer is made of a graphene material or a graphite material.

The foldable electronic device of claim 1, wherein the first sub-middle frame and the second sub-middle frame are adjacent to each other when the foldable electronic device is folded; when the foldable electronic device is unfolded, the first sub-middle frame and the second sub-middle frame are away from each other.

The foldable electronic device of claim 7, wherein a distance between the first sub back cover and the second sub back cover is greater than a distance between the first sub middle frame and the second sub middle frame when the foldable electronic device is folded.

The foldable electronic device of claim 1, wherein the first sub-rear cover comprises a first inner surface attached to the flexible thermal conductor, the second sub-rear cover comprises a second inner surface attached to the flexible thermal conductor, the flexible thermal conductor is attached to the first inner surface over an area greater than two-thirds of a total area of the first inner surface, and the flexible thermal conductor is attached to the second inner surface over an area greater than two-thirds of a total area of the second inner surface.

The foldable electronic device of claim 1, wherein the circuit board assembly comprises:

a main board;

the first chip is arranged on the mainboard; and

the first shielding cover covers the first chip, and one side, far away from the main board, of the first shielding cover is connected with the flexible heat conducting piece in a heat conduction mode.

The foldable electronic device of claim 10, wherein the circuit board assembly comprises a thermal conductor received within the first shield can and thermally coupling the first shield can and the first die.

The foldable electronic device of claim 10, wherein the circuit board assembly further comprises:

the second chip and the first chip are respectively arranged on two sides of the mainboard, which are opposite to each other; and

the second shielding cover covers the second chip, and one side of the second shielding cover, which is far away from the main board, is connected with the first sub-middle frame in a heat conduction mode.

The foldable electronic device of claim 12, further comprising a thermal conductor housed within the second shield can and thermally coupling the second shield can and the second chip.

The foldable electronic device of claim 11 or 13, wherein the thermal conductor comprises thermally conductive silicone.

The foldable electronic device of claim 1, wherein the foldable electronic device comprises a battery disposed between the second sub-center frame and the second sub-back cover, the battery being thermally conductively coupled to the flexible thermal conductor.

The foldable electronic device of claim 15, wherein the first sub-middle frame and the first sub-rear cover are connected to form a first accommodating space, and the circuit board assembly is accommodated in the first accommodating space; the second sub-middle frame and the second sub-rear cover are connected to form a second accommodating space, and the battery is accommodated in the second accommodating space.

The foldable electronic device of claim 1, wherein the foldable electronic device comprises a flexible support assembly and a flexible display disposed on the flexible support assembly, the flexible display being disposed on the center frame assembly through the flexible support assembly.

The foldable electronic device of claim 17, wherein the flexible support member comprises a first support plate and a second support plate arranged in a stacked manner, the first support plate is fixedly arranged on the middle frame member, the second support plate is arranged on a side of the first support plate away from the middle frame member, and the flexible display screen is arranged on the second support plate.

The foldable electronic device of claim 2, wherein the rear cover assembly further comprises a cover member connecting the first sub-rear cover and the second sub-rear cover, the cover member covering a portion of the flexible heat conducting member corresponding to the connecting member.

The foldable electronic device of claim 19, wherein the cover is made of a silicone material or a graphene silicone material.