阅读说明：本技术 一种带有性能参数自动调整结构的蓝牙芯片系统 (Bluetooth chip system with automatic performance parameter adjusting structure ) 是由 徐桂兰 于 2021-07-12 设计创作，主要内容包括：本发明涉及电子通信技术领域,具体为一种带有性能参数自动调整结构的蓝牙芯片系统,包括安装底座和封装顶盖,所述安装底座和封装顶盖固定连接,且封装顶盖上固定连接有引脚,所述安装底座中固定安装有信号参数自动调整结构,且信号参数自动调节结构与引脚连接,所述封装顶盖上固定安装有具有扩散分摊功能的增强结构,且安装底座中固定安装有具有侧向转移功能的缓冲结构,所述缓冲结构与增强结构固定连接,且缓冲结构与具有外扩功能的散热结构连接；本发明能够利用功率调节模块进行蓝牙收发模块的功率调整,达到降低能耗的作用。(The invention relates to the technical field of electronic communication, in particular to a Bluetooth chip system with an automatic performance parameter adjusting structure, which comprises an installation base and a packaging top cover, wherein the installation base is fixedly connected with the packaging top cover, pins are fixedly connected to the packaging top cover, the installation base is internally and fixedly provided with an automatic signal parameter adjusting structure, the automatic signal parameter adjusting structure is connected with the pins, the packaging top cover is fixedly provided with a reinforcing structure with a diffusion and allocation function, the installation base is internally and fixedly provided with a buffer structure with a lateral transfer function, the buffer structure is fixedly connected with the reinforcing structure, and the buffer structure is connected with a heat dissipation structure with an external expansion function; the invention can utilize the power adjusting module to adjust the power of the Bluetooth transceiving module, thereby achieving the effect of reducing energy consumption.)

1. The utility model provides a bluetooth chip system with performance parameter automatic adjustment structure, includes installation base and encapsulation top cap, its characterized in that: the mounting base is fixedly connected with the encapsulation top cover, pins are fixedly connected on the encapsulation top cover,

a signal parameter automatic adjusting structure is fixedly arranged in the mounting base and connected with the pins, an enhanced structure with a diffusion and sharing function is fixedly arranged on the packaging top cover, a buffer structure with a lateral transfer function is fixedly arranged in the mounting base,

the buffer structure is fixedly connected with the reinforcing structure, the buffer structure is connected with the heat dissipation structure with the outward expansion function, and the heat dissipation structure is installed on the side wall of the installation base.

2. The bluetooth chip system with the automatic adjusting structure of performance parameters according to claim 1, wherein: all be provided with the recess in installation base and the encapsulation top cap, both constitute the module cavity, the pin is connected in the side of encapsulation top cap, signal parameter automatic adjustment structure is including the bluetooth transceiver module of fixed mounting in the installation base, and the last fixedly connected with signal detection module of bluetooth transceiver module, the last fixedly connected with signal processing module of signal detection module, and the last fixedly connected with power adjustment module of signal processing module.

3. The bluetooth chip system with the automatic adjusting structure of performance parameters according to claim 1, wherein: the reinforcing structure comprises a center block fixedly mounted on the packaging top cover, a reinforcing rod is fixedly connected to the center block, the reinforcing rod is fixedly connected to the edge block, a support is fixedly mounted on the edge block, a transmission pressing rod is fixedly mounted on the support, and the reinforcing structure is connected with the buffer structure through the transmission pressing rod.

4. The bluetooth chip system with the automatic adjusting structure of performance parameters according to claim 3, wherein: center block fixed mounting puts at the central point of encapsulation top cap, and the edge piece is provided with four, installs respectively in the four corners position of encapsulation top cap, the reinforcement pole is connected and is constituted triangle-shaped between center block and edge piece, the leg joint is between two edge pieces, and the support transmission depression bar is L type structure.

5. The bluetooth chip system with the automatic adjusting structure of performance parameters according to claim 1, wherein: buffer structure is including vertical to bearing structure and side direction bearing structure, vertical to bearing structure includes the sill bar, and fixed mounting has buffer spring on the sill bar, the last fixedly connected with of buffer spring receives the piece, and receives fixed mounting and have the hangers on the piece, the hangers is connected with side direction bearing structure.

6. The Bluetooth chip system with the automatic performance parameter adjusting structure according to claim 5, wherein: the lateral supporting structure comprises a cooling liquid cylinder fixedly mounted on the inner wall of the mounting base, a piston is slidably mounted in the cooling liquid cylinder, a notch is formed in the piston, a piston rod is fixedly connected onto the piston, an inclined end block is fixedly mounted on the piston rod, and a reset spring is fixedly connected onto the inclined end block.

7. The Bluetooth chip system with the automatic performance parameter adjusting structure according to claim 6, wherein: the bottom rod is vertically installed on the bottom surface of the installation base, the pressed piece is provided with an L-shaped rod, the hanging lug is of an L-shaped structure and is installed on the side surface of the pressed piece, cooling oil is filled in the cooling oil cylinder, the notch is annularly formed in the edge of the piston, the inclined end block is installed at the end portion of the piston rod, an inclined plane is arranged on the inclined end block, and the inclined end block is in contact connection with the hanging lug.

8. The bluetooth chip system with the automatic adjusting structure of performance parameters according to claim 1, wherein: the heat radiation structure comprises an air inlet pipe and an air outlet pipe which are fixedly connected to the cooling liquid cylinder, the air inlet pipe and the air outlet pipe are fixedly connected to a pipe network, and the pipe network is fixedly installed on the outer wall of the installation base.

Technical Field

The invention relates to the technical field of electronic communication, in particular to a Bluetooth chip system with a performance parameter automatic adjusting structure.

Background

With the development of electronic communication technology, the types of communication modules in electronic equipment are increasing, wherein a bluetooth module is the mainstream collocation of many electronic equipment and can be used for short-distance wireless communication, and modern bluetooth modules are continuously updated and updated, so that a more stable data transmission effect can be achieved.

The signal transmission scope of current bluetooth chip is fixed usually, and the electronic equipment of interconnection is when closely state, still is sending remote signal, causes the extravagant electric quantity of electronic chip, can't reduce the energy consumption, forms the restriction for bluetooth chip's use, and under the condition of high energy consumption, still can cause the heat dissipation of chip more serious, in bluetooth chip's inside amasss heat accumulation volume, and current bluetooth chip compressive capacity and heat-sinking capability all are relatively poor usually, and life is difficult to guarantee. In view of this, we propose a bluetooth chipset system with an automatic performance parameter adjustment structure.

Disclosure of Invention

The present invention is directed to a bluetooth chip system with an automatic performance parameter adjusting structure, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a bluetooth chip system with performance parameter automatic adjustment structure, is including installation base and encapsulation top cap, installation base and encapsulation top cap fixed connection, and fixedly connected with pin on the encapsulation top cap, fixed mounting has signal parameter automatic adjustment structure in the installation base, and signal parameter automatic adjustment structure is connected with the pin, fixed mounting has the reinforcing structure that has the function of spreading share on the encapsulation top cap, and fixed mounting has the buffer structure that has the side direction and shift the function in the installation base, buffer structure and reinforcing structure fixed connection, and buffer structure and the heat radiation structure who has the outer function of expanding are connected, heat radiation structure installs on the lateral wall of installation base.

Preferably, all be provided with the recess in installation base and the encapsulation top cap, both constitute the module cavity, the side at the encapsulation top cap is connected to the pin, signal parameter automatic adjustment structure is including the bluetooth transceiver module of fixed mounting in the installation base, and the last fixedly connected with signal detection module of bluetooth transceiver module, the last fixedly connected with signal processing module of signal detection module, and the last fixedly connected with power adjustment module of signal processing module.

Preferably, the reinforcing structure comprises a center block fixedly mounted on the packaging top cover, a reinforcing rod is fixedly connected to the center block, the reinforcing rod is fixedly connected to the edge block, a support is fixedly mounted on the edge block, a transmission pressing rod is fixedly mounted on the support, and the reinforcing structure is connected with the buffer structure through the transmission pressing rod.

Preferably, center block fixed mounting puts at the central point of encapsulation top cap, and the edge piece is provided with four, installs respectively in the four corners position of encapsulation top cap, the stiffening rod is connected and is constituted triangle-shaped between center block and edge piece, the leg joint is between two edge pieces, and the support transmission depression bar is L type structure.

Preferably, buffer structure is including vertical to bearing structure and side direction bearing structure, vertical to bearing structure includes the sill bar, and fixed mounting has buffer spring on the sill bar, the last fixedly connected with of buffer spring receives the piece, and receives fixed mounting and have the hangers on the piece, the hangers is connected with side direction bearing structure.

Preferably, the lateral support structure comprises a cooling liquid cylinder fixedly mounted on the inner wall of the mounting base, a piston is slidably mounted in the cooling liquid cylinder, a notch is formed in the piston, a piston rod is fixedly connected to the piston, an inclined end block is fixedly mounted on the piston rod, and a return spring is fixedly connected to the inclined end block.

Preferably, the bottom rod is vertically installed on the bottom surface of the installation base, the pressed piece is an L-shaped rod, the hanging lug is of an L-shaped structure and is installed on the side surface of the pressed piece, cooling oil is filled in the cooling liquid cylinder, the notch is annularly formed in the edge of the piston, the inclined end block is installed at the end portion of the piston rod, an inclined plane is arranged on the inclined end block, and the inclined end block is in contact connection with the hanging lug.

Preferably, the heat radiation structure comprises an air inlet pipe and an air outlet pipe which are fixedly connected to the cooling liquid cylinder, the air inlet pipe and the air outlet pipe are fixedly connected to a pipe network, and the pipe network is fixedly installed on the outer wall of the installation base.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention forms a main structure by an installation base and a packaging top cover, and the installation of a signal parameter automatic adjustment structure is carried out in the main structure, in the signal parameter automatic adjustment structure, a Bluetooth receiving and transmitting module is taken as a core to transmit Bluetooth signals, and a signal detection module is used for carrying out distance detection on equipment signals interconnected by Bluetooth and inputting the equipment signals into a signal processing module, so that the power adjustment of the Bluetooth receiving and transmitting module is carried out by utilizing a power adjustment module, and the effect of reducing energy consumption is achieved;

2. the reinforcing structure is used for reinforcing the packaging top cover, the compression resistance of the packaging top cover is improved, the central block, the edge block and the reinforcing rod form a triangular main body structure, the three structures are interconnected, and the received pressure can be shared, so that the local pressure intensity is reduced, the packaging top cover is not easy to deform, the integral passive compression resistance is improved, further, the edge block is connected with the transmission compression rod through the support, the deformation can be transferred into the buffer structure, and the buffer structure is used for active compression resistance;

3. the buffer structure is a supplement of a reinforcing structure, and utilizes the vertical support structure and the lateral support structure to carry out combined buffering to respectively buffer transverse and longitudinal pressure, so that energy is quickly absorbed, the packaging top cover is prevented from being damaged, and the lateral support structure conveys the pressure to the side surface to prevent the mounting base from being seriously pressed;

4. the heat dissipation structure can transfer and dissipate heat in the chip structure, the temperature in the chip is guaranteed to be in a healthy state, the cooling liquid cylinder is used as a heat absorption structure, the pipe network with a large heat dissipation area is used as a heat dissipation structure, a cycle is completed, the heat dissipation process is continuously performed, the temperature of the chip is guaranteed to be normal, and the service life of the chip is prolonged.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a cutaway configuration of the present invention;

FIG. 3 is a schematic view of a top plate construction of the present invention;

FIG. 4 is a schematic view of a base structure of the present invention;

FIG. 5 is a schematic view of the compression resistant construction of the present invention;

FIG. 6 is a block diagram of the adjusting module according to the present invention.

In the figure: the device comprises an installation base 1, a packaging top cover 2, pins 3, a Bluetooth transceiving module 4, a signal detection module 5, a signal processing module 6, a power adjusting module 7, a center block 8, a reinforcing rod 9, an edge block 10, a support 11, a transmission compression rod 12, a bottom rod 13, a buffer spring 14, a compression piece 15, a hanging lug 16, a cooling liquid cylinder 17, a piston 18, a notch 19, a piston rod 20, an inclined end block 21, a reset spring 22, an air inlet pipe 23, an air outlet pipe 24 and a pipe network 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 6, the present invention provides a technical solution: the utility model provides a bluetooth chip system with performance parameter automatic adjustment structure, including installation base 1 and encapsulation top cap 2, installation base 1 and encapsulation top cap 2 fixed connection, and fixedly connected with pin 3 on the encapsulation top cap 2, fixed mounting has signal parameter automatic adjustment structure in the installation base 1, and signal parameter automatic adjustment structure is connected with pin 3, fixed mounting has the reinforcing structure that has the diffusion sharing function on the encapsulation top cap 2, and fixed mounting has the buffer structure who has the side direction transfer function in the installation base 1, buffer structure and reinforcing structure fixed connection, and buffer structure is connected with the heat radiation structure who has the outer function that expands, heat radiation structure installs on the lateral wall of installation base 1.

The mounting base 1 and the packaging top cover 2 are both provided with grooves, the mounting base and the packaging top cover form a module cavity, the pins 3 are connected to the side surface of the packaging top cover 2, the signal parameter automatic adjusting structure comprises a Bluetooth transceiving module 4 fixedly mounted in the mounting base 1, a signal detection module 5 is fixedly connected to the Bluetooth transceiving module 4, a signal processing module 6 is fixedly connected to the signal detection module 5, and a power adjusting module 7 is fixedly connected to the signal processing module 6;

firstly, in the structure of bluetooth chip, use installation base 1 and encapsulation top cap 2 to constitute major structure, both merge and constitute the structure of encapsulation formula, wherein carried out the installation of signal parameter automatic adjustment structure, in the signal parameter automatic adjustment structure, use bluetooth transceiver module 4 as the core, carry out the transmission of bluetooth signal, and use signal detection module 5 to carry out distance detection to the equipment signal of bluetooth interconnection, input it into signal processing module 6, thereby utilize power conditioning module 7 to carry out the power adjustment of bluetooth transceiver module 4, reach the effect that reduces the energy consumption.

The reinforcing structure comprises a central block 8 fixedly arranged on the packaging top cover 2, a reinforcing rod 9 is fixedly connected to the central block 8, the reinforcing rod 9 is fixedly connected to an edge block 10, a support 11 is fixedly arranged on the edge block 10, a transmission pressure rod 12 is fixedly arranged on the support 11, and the reinforcing structure is connected with the buffer structure through the transmission pressure rod 12;

when the Bluetooth chip is installed, the installation base 1 is used as an installation part, the encapsulation top cover 2 is used for encapsulation, the pins 3 are used for electrical connection, and the encapsulation top cover 2 is exposed and is most easily pressed by the outside when in use, so that the encapsulation top cover 2 is reinforced by the reinforcing structure, and the pressure resistance of the encapsulation top cover 2 is improved;

the center block 8 is fixedly arranged at the center of the packaging top cover 2, four edge blocks 10 are arranged and are respectively arranged at the four corners of the packaging top cover 2, the reinforcing rods 9 are connected between the center block 8 and the edge blocks 10 to form a triangle, the support 11 is connected between the two edge blocks 10, and the support transmission compression rod 12 is of an L-shaped structure;

in the reinforcing structure, a triangular main body structure is formed by the central block 8, the edge blocks 10 and the reinforcing rods 9, the three structures are interconnected, and the received pressure can be shared, so that the local pressure intensity is reduced, the encapsulation top cover 2 is not easy to deform, the overall passive pressure resistance is improved, furthermore, the edge blocks 10 are connected with transmission pressure rods 12 through supports 11, the deformation can be transferred to a buffer structure, and the buffer structure is used for active pressure resistance;

the buffer structure comprises a vertical support structure and a lateral support structure, the vertical support structure comprises a bottom rod 13, a buffer spring 14 is fixedly arranged on the bottom rod 13, a compression piece 15 is fixedly connected onto the buffer spring 14, a hanging lug 16 is fixedly arranged on the compression piece 15, and the hanging lug 16 is connected with the lateral support structure;

the buffer structure is a supplement of a reinforcing structure, and is combined and buffered by utilizing the vertical support structure and the lateral support structure to respectively buffer transverse and longitudinal pressure, so that energy is quickly absorbed, and the packaging top cover 2 is prevented from being damaged;

wherein, the vertical supporting structure has the same direction with the transmission compression bar 12, the compression piece 15 is connected with the transmission compression bar 12, and the direct buffering is carried out by the buffer spring 14;

the lateral supporting structure comprises a cooling liquid cylinder 17 fixedly installed on the inner wall of the installation base 1, a piston 18 is installed in the cooling liquid cylinder 17 in a sliding mode, a notch 19 is formed in the piston 18, a piston rod 20 is fixedly connected to the piston 18, an inclined end block 21 is fixedly installed on the piston rod 20, and a reset spring 22 is fixedly connected to the inclined end block 21;

the lateral supporting structure conveys pressure to the side, the installation base 1 is prevented from being seriously pressed, when the lateral supporting structure is used, the pressure of a pressed piece 15 acts on an inclined end block 21 through a hanging lug 16, the hanging lug 16 drives a piston rod 20 to move through the guiding action of an inclined plane, a piston 18 connected to the piston rod 20 is positioned in a cooling liquid cylinder 17 and is surrounded by oil liquid and subjected to the damping action of the cooling oil liquid, and a gap 19 is used for the oil liquid to pass through;

the bottom rod 13 is vertically arranged on the bottom surface of the installation base 1, the pressed piece 15 is an L-shaped rod, the hanging lug 16 is an L-shaped structure and is arranged on the side surface of the pressed piece 15, cooling oil is filled in the cooling liquid cylinder 17, the notch 19 is annularly arranged at the edge of the piston 18, the inclined end block 21 is arranged at the end part of the piston rod 20, the inclined surface is arranged on the inclined end block 21, and the inclined end block 21 is in contact connection with the hanging lug 16;

the heat dissipation structure comprises an air inlet pipe 23 and an air outlet pipe 24 which are fixedly connected to the cooling liquid cylinder 17, the air inlet pipe 23 and the air outlet pipe 24 are fixedly connected to a pipe network 25, and the pipe network 25 is fixedly arranged on the outer wall of the mounting base 1;

the heat dissipation structure can transfer and dissipate heat in the chip structure, so that the temperature in the chip is ensured to be in a healthy state;

the cooling liquid cylinder 17 is used as a heat absorption structure, cooling oil can be gasified after heat absorption is finished, and enters a pipe network 25 through an air inlet pipe 23, the pipe network 25 is distributed on the surface of the installation base 1 and has a large heat dissipation area, so that heat of the gasified cooling oil can be dissipated, and then the gasified cooling oil is liquefied and flows back to the cooling liquid cylinder 17 through an air outlet pipe 24, a cycle is finished, and a heat dissipation process is continuously performed;

the working principle is as follows: firstly, in the structure of the bluetooth chip, a main body structure is formed by using a mounting base 1 and a packaging top cover 2, the two structures are combined to form a packaging type structure, in the structure, a signal parameter automatic adjusting structure is mounted, in the signal parameter automatic adjusting structure, a bluetooth transceiving module 4 is taken as a core to transmit bluetooth signals, a signal detection module 5 is used to detect the distance of equipment signals interconnected by bluetooth and input the equipment signals into a signal processing module 6, so that the power adjusting module 7 is used to adjust the power of the bluetooth transceiving module 4 to achieve the effect of reducing energy consumption, when the bluetooth chip is mounted, the mounting base 1 is taken as a mounting part, the packaging top cover 2 is packaged and electrically connected by pins 3, when the packaging top cover 2 is used, the packaging top cover 2 is an exposed part and is most easily pressed by the outside, therefore, the packaging top cover 2 is reinforced by using a reinforcing structure, the compression resistance of the encapsulation top cover 2 is improved, in the reinforcing structure, a triangular main body structure is formed by a center block 8, an edge block 10 and a reinforcing rod 9, the three structures are interconnected and can share the received pressure, so that the local pressure intensity is reduced, the encapsulation top cover 2 is not easy to deform, the overall passive compression resistance is increased, furthermore, the edge block 10 is connected with a transmission compression rod 12 through a support 11 and can transfer the deformation to a buffer structure, the buffer structure is used for active compression resistance, the buffer structure is the supplement of the reinforcing structure, the buffer structure utilizes a vertical support structure and a lateral support structure to carry out combined buffering, the transverse pressure and the longitudinal pressure are buffered respectively, the energy is quickly absorbed, the encapsulation top cover 2 is prevented from being damaged, wherein the vertical support structure is the same as the transmission compression rod 12 in direction, the pressed piece 15 is connected with the transmission compression bar 12, direct buffering is carried out by using the buffer spring 14, the lateral supporting structure conveys pressure to the side face to prevent the installation base 1 from being pressed seriously, when in use, the pressure of the pressed piece 15 acts on the inclined end block 21 through the hanging lug 16, through the guide effect of an inclined face, the hanging lug 16 drives the piston rod 20 to move, the piston 18 connected with the piston rod 20 is positioned in the cooling liquid cylinder 17 and is surrounded by oil liquid to be subjected to the damping effect of the cooling oil liquid, and the notch 19 is used for the oil liquid to pass through, in the process, the damping of the oil liquid is utilized to play a buffering effect, the piston 18 is used for stirring the cooling oil liquid to ensure that the temperature of the cooling liquid is more uniform, the cooling liquid cylinder 17 can efficiently absorb heat in a chip structure, the heat dissipation structure can carry out heat transfer in the chip structure, and ensure that the temperature in the chip is in a healthy state, use coolant liquid section of thick bamboo 17 as heat absorbing structure, after cooling fluid accomplishes the heat absorption, can take place the gasification, enter into pipe network 25 through intake pipe 23, and pipe network 25 distributes on the surface of installation base 1, great heat radiating area has, can make gasified cooling fluid heat distribute away, the liquefaction flows back to coolant liquid section of thick bamboo 17 through outlet duct 24 afterwards, accomplish a circulation, the continuous radiating process that has carried out, guarantee that the temperature is normal, the life of extension chip.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.