阅读说明：本技术 一种用于印刷Miniled背光阻焊油墨的稀释剂及其应用 (Diluent for printing minified backlight solder resist ink and application thereof ) 是由 易伟华 张迅 刘明礼 邱晓宇 周文志 洪华俊 成育凯 周成 于 2020-12-14 设计创作，主要内容包括：本发明提供了一种用于印刷Miniled背光阻焊油墨的稀释剂,包括：丁酮25～35wt％；白电油20～30wt％；异丙醇20～25wt％；醋酸乙酯10～20wt％；乙二醇单丁醚3～5wt％；萘3～5wt％。本发明提供的稀释剂中丁酮,白电油,醋酸乙酯均为极易挥发液体,加入油墨内能加速油墨挥发速度快速干燥。本发明提供的用于印刷Miniled背光阻焊油墨稀释剂能够提高油墨韧性、降低粘度,油墨快干,改善适用性；减少非曝光区域感光,进而减少毛边,提高解析度；改善产品性能,降低成本。本发明还提供了一种于印刷Miniled背光阻焊油墨和Miniled背光板的制备方法。(The invention provides a diluent for printing minified backlight solder resist ink, which comprises the following components: 25-35 wt% of butanone; 20-30 wt% of white kerosene; 20-25 wt% of isopropanol; 10-20 wt% of ethyl acetate; 3-5 wt% of ethylene glycol monobutyl ether; 3-5 wt% of naphthalene. In the diluent provided by the invention, butanone, white kerosene and ethyl acetate are extremely volatile liquids, and the addition of the methyl butanone, white kerosene and ethyl acetate into the ink can accelerate the volatilization speed of the ink and realize rapid drying. The diluent for printing the miniature backlight solder resist ink provided by the invention can improve the toughness of the ink, reduce the viscosity, dry the ink quickly and improve the applicability; the light sensitivity of a non-exposure area is reduced, so that burrs are reduced, and the resolution is improved; improve the product performance and reduce the cost. The invention also provides a preparation method for printing the miniature backlight solder resist ink and the miniature backlight plate.)

1. A diluent for printing miniiled back light solder mask ink comprising:

2. the thinner for printing minified backlight solder resist ink as claimed in claim 1, wherein the butanone is 30% by mass.

3. The thinner for printing minified backlight solder resist ink as claimed in claim 1, wherein the white dielectric oil is present in an amount of 25% by mass.

4. The thinner for printing minified backlight solder mask ink as claimed in claim 1, wherein the isopropyl alcohol is 22% by mass.

5. The thinner for printing minified backlight solder mask ink as claimed in claim 1, wherein the ethyl acetate is 15% by mass.

6. The diluent for printing a minified backlight solder resist ink as set forth in claim 1, wherein the mass content of the ethylene glycol monobutyl ether is 4%.

7. The thinner for printing a miniiled back solder mask ink as claimed in claim 1, wherein the naphthalene is present in an amount of 4% by mass.

8. A back light solder resist ink for printing minified comprises the following components in parts by weight:

70-80 parts of crude oil;

20-30 parts of a hardening agent;

5-15 parts of the diluent for printing the minified backlight solder mask ink as set forth in claim 1.

9. A method for preparing a Miniled backlight plate comprises the following steps:

stirring the minified backlight solder resist ink for printing of claim 8, then printing the minified substrate on line, printing the front side, then pre-curing, and then cooling and printing the back side; and carrying out exposure and development treatment after the double-sided printing is finished.

10. The method of claim 9, wherein the pre-curing temperature is 75-85 ℃; the pre-curing time is 10-20 min.

Technical Field

The invention belongs to the technical field of printing ink, and particularly relates to a diluent for printing minified backlight solder resist printing ink and application thereof.

Background

The Mini LED backlight is used as a new display industry focus, Cu is electroplated and sputtered on the front surface and the back surface of a glass substrate through a coating technology, then a circuit and a non-circuit are exposed and developed, the non-circuit area is etched through an etching process, and the substrate with the two dense Cu circuits is obtained; in order to prevent the Cu circuit from being exposed to oxidation, a two-liquid imaging type solder resist ink protective film layer with the thickness of 30 +/-3 microns is required to be printed on the front side and the back side, the film thickness is made to be 30 +/-3 microns, the diffuse reflectance is more than 85% after exposure and development, the subsequent higher imaging performance is ensured, a metal layer required to be exposed is prevented from being exposed by oxidation and subsequent development of the Cu circuit, and an insulating effect is achieved; the maximum limit of the pre-curing condition of the two-liquid development type solder mask ink is 80 ℃ and 60min, the curing condition is 150 ℃ and 60min, and the viscosity of the main agent mixed with the hardening agent is 150 +/-20 dPa.s. The prior art comprises pre-curing at 80 deg.C for 15min, exposing and developing after pre-curing, and final curing at 150 deg.C for 60 min; after the front-side two-liquid-development type solder resist ink is printed, the back-side Cu surface is printed after the front-side two-liquid-development type solder resist ink is pre-cured at the temperature of 80 ℃ for 15min, and in the stage, the back-side Cu surface cannot be directly baked under the baking and fixing condition due to the constraint of the subsequent exposure and development conditions, and the ink is not dried after the thickness of the ink reaches 30 +/-3 microns and the ink viscosity is too large to stick to a printing and printing platform and a baking carrier when the back side is printed because the ink has; meanwhile, the low volatilization speed of the ink solvent causes low pattern resolution and diffuse reflectance, poor heat resistance and reduced gold plating resistance in the subsequent process.

Disclosure of Invention

In view of the above, the present invention provides a thinner for printing a minimum backlight solder mask ink and an application thereof, and the thinner provided by the present invention can adjust a volatilization speed of the minimum backlight solder mask ink for printing, accelerate the volatilization of the minimum backlight solder mask ink, and solve the problems of the prior art.

The invention provides a diluent for printing minified backlight solder resist ink, which comprises the following components:

preferably, the butanone accounts for 30% by mass.

Preferably, the white electric oil is 25% by mass.

Preferably, the isopropanol accounts for 22% by mass.

Preferably, the mass content of the ethyl acetate is 15%.

Preferably, the mass content of the ethylene glycol monobutyl ether is 4%.

Preferably, the naphthalene content is 4% by mass.

The invention provides a back light solder resist ink for printing minified, which comprises the following components in parts by weight:

70-80 parts of crude oil;

20-30 parts of a hardening agent;

5-15 parts of the diluent for printing the minified backlight solder resist ink.

The invention provides a preparation method of a Miniled backlight board, which comprises the following steps:

stirring the solder resist ink for printing the miniature backlight in the technical scheme, printing the miniature substrate on line, pre-curing the printed miniature substrate on the front side, and cooling the printed back side; and carrying out exposure and development treatment after the double-sided printing is finished.

Preferably, the temperature of the pre-curing is 75-85 ℃; the pre-curing time is 10-20 min.

In the diluent provided by the invention, butanone, white kerosene and ethyl acetate are extremely volatile liquids, and the addition of the diluent into ink can accelerate the volatilization speed of the ink to dry quickly. The diluent for printing the miniature backlight solder resist ink provided by the invention can improve the toughness of the ink, reduce the viscosity, dry the ink quickly and improve the applicability; the light sensitivity of a non-exposure area is reduced, so that burrs are reduced, and the resolution is improved; improve the product performance and reduce the cost.

Drawings

FIG. 1 is a schematic view of a Miniled backlight board according to an embodiment of the present invention;

FIG. 2 is a schematic view of exposure and development of a Miniled backlight board in an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other examples, which may be modified or appreciated by those of ordinary skill in the art based on the description of the embodiments, are within the scope of the present invention. It should be understood that the embodiments of the present invention are only for illustrating the technical effects of the present invention, and are not intended to limit the scope of the present invention. In the examples, the methods used were all conventional methods unless otherwise specified.

The invention provides a diluent for printing minified backlight solder resist ink, which comprises the following components:

in the invention, the mass content of the butanone is preferably 28-32%, and more preferably 30%.

In the invention, the mass content of the white gasoline is preferably 22-28%, more preferably 24-26%, and most preferably 25%.

In the present invention, the content of isopropyl alcohol is preferably 21 to 24% by mass, more preferably 22 to 23% by mass, and most preferably 22% by mass.

In the present invention, the mass content of the ethyl acetate is preferably 12 to 18%, more preferably 14 to 16%, and most preferably 15%.

In the invention, the mass content of the ethylene glycol monobutyl ether is preferably 3.5-4.5%, and more preferably 4%.

In the present invention, the naphthalene is preferably 3.5 to 4.5% by mass, and more preferably 4% by mass.

The butanone, the white kerosene and the ethyl acetate are extremely volatile liquids, and can accelerate the volatilization speed of the ink and dry quickly when being added into the ink.

In the present invention, the preparation method of the diluent for printing minified backlight solder mask ink preferably comprises:

mixing butanone, white spirit, isopropanol, ethyl acetate, ethylene glycol monobutyl ether and naphthalene to obtain the diluent for printing the Miniled backlight solder resist ink.

The invention provides a back light solder resist ink for printing minified, which comprises the following components in parts by weight:

70-80 parts of crude oil;

20-30 parts of a hardening agent;

5-15 parts of the diluent for printing the minified backlight solder resist ink.

In the invention, the weight part of the crude oil is preferably 72 to 78 parts, more preferably 74 to 76 parts, and most preferably 75 parts.

In the invention, the crude oil is white solder resist ink. The type and source of the crude oil are not particularly limited, and the crude oil can be obtained by using solder resist ink well known to those skilled in the art, and can be obtained commercially, for example, by using commercially available products. In the present invention, the components of the crude oil preferably include:

10-20 wt% of acrylate;

45-55 wt% of an inorganic pigment;

0.5 to 1.5 wt% of silica;

0.5 to 1.5 wt% of barium sulfide;

10-15 wt% of dipropylene glycol monomethyl ether;

10-15 wt% of diethylene glycol ethyl ether acetate;

10 to 15 wt% of a dibasic acid ester.

In the present invention, the mass content of the acrylate is preferably 12 to 18%, more preferably 14 to 16%, and most preferably 14%.

In the invention, the mass content of the inorganic pigment is preferably 46-50%, and more preferably 48%; the present invention is not particularly limited in kind and source of the inorganic pigment, and inorganic white pigments well known to those skilled in the art may be used.

In the present invention, the mass of the silica (7631-86-9(CAS No.)) is preferably 0.8 to 1.2%, and more preferably 1%.

In the present invention, the mass content of the barium sulfide (7727-43-7(CAS No.)) is preferably 0.8 to 1.2%, and more preferably 1%.

In the present invention, the dipropylene glycol monomethyl ether (34590-94-8(CAS No.)) preferably has a mass content of 11 to 14%, more preferably 12 to 13%, and most preferably 12%.

In the present invention, the diethylene glycol monoethyl ether acetate (112-15-2(CAS No.)) preferably has a mass content of 11 to 14%, more preferably 12 to 13%, and most preferably 12%.

In the present invention, the content by mass of the dibasic ester (dimethyl glutarate, 1119-40-0(CAS No.)) is preferably 11 to 15%, more preferably 12 to 14%, and most preferably 12%.

In the invention, the weight part of the hardening agent is preferably 22 to 28 parts, more preferably 24 to 26 parts, and most preferably 25 parts.

In the invention, the hardening agent is a colorless transparent auxiliary agent which is matched with the crude oil (solder resist ink) to play a curing role. The invention has no special limitation on the type and source of the hardener, and the hardener which is well known to those skilled in the art and used together with the solder resist ink can be adopted and can be obtained by market. In the present invention, the hardener preferably includes:

40-50 wt% of an acrylate;

45-55% of epoxy resin;

2-8 wt% of diethylene glycol ethyl ether acetate.

In the present invention, the mass content of the acrylate is preferably 42 to 48%, more preferably 44 to 46%, and most preferably 45%.

In the present invention, the mass content of the epoxy resin is preferably 48 to 52%, and more preferably 50%.

In the present invention, the diethylene glycol monoethyl ether acetate (112-15-2(CAS No.)) preferably has a mass content of 3 to 6%, more preferably 4 to 5%, and most preferably 5%.

In the invention, the weight part of the diluent for printing the minified backlight solder mask ink is preferably 8-12 parts, and more preferably 10 parts.

The preparation method for printing the miniature backlight solder mask ink is not specially limited, and the raw materials are mixed according to the raw material components and the dosage proportion for printing the miniature backlight solder mask ink in the technical scheme.

The invention provides a preparation method of a Miniled backlight board, which comprises the following steps:

stirring the ink for printing the miniature backlight solder resist in the technical scheme, then printing the miniature substrate on line, printing the front side of the substrate, pre-curing the substrate, and then cooling and printing the back side of the substrate; and carrying out exposure and development treatment after double-sided printing is finished.

In the present invention, the stirring is preferably performed by performing manual stirring and then performing high-speed stirring.

In the invention, the time for manual stirring is preferably 2-3 min; the high-speed stirring speed is preferably 550-650 rpm, more preferably 580-620 rpm, and most preferably 600 rpm; the high-speed stirring time is preferably 10 to 20 minutes, and more preferably 15 minutes.

The Miniled substrate is not particularly limited, and a Miniled backlight substrate known to those skilled in the art can be adopted, that is, Cu is electroplated and sputtered on the front and back sides of the glass substrate by a coating technology.

In the invention, the thickness of the front printing is preferably 27-33 micrometers, more preferably 28-32 micrometers, and most preferably 30 micrometers.

In the invention, the pre-curing is preferably performed in a hot air circulation drying oven, and the pre-curing temperature is preferably 75-85 ℃, more preferably 78-82 ℃ and most preferably 80 ℃; the pre-curing time is preferably 10-20 min, more preferably 12-18 min, and most preferably 14-16 min.

In the present invention, the cooling method is preferably blowing to cooling with an ion blower.

In the invention, the thickness of the reverse printing is preferably 27-33 microns, more preferably 28-32 microns, and most preferably 30 microns.

In the invention, the exposure parameter in the exposure and development treatment process is preferably 180-220 mj/cm²More preferably 190 to 210mj/cm²Most preferably 200mj/cm²(ii) a The developing parameters are preferably that the developing solution is preferably Na with the mass concentration of 0.5-1.5 wt%₂CO₃An aqueous solution, more preferably 0.8 to 1.2 wt%, most preferably 1 wt%; the developing temperature is preferably 25-35 ℃, more preferably 28-32 ℃, and most preferably 30 ℃; the cleaning pressure is preferably 0.15-0.25 MPa, more preferably 0.18-0.22 MPa, and most preferably 0.196 MPa; the time is preferably 55 to 65s, more preferably 58 to 62s, and most preferably 60 s.

The minified backlight solder resist ink provided by the invention can improve the toughness of the ink, reduce the viscosity, dry the ink quickly and improve the applicability; the sensitization of a non-exposure area is reduced, so that burrs are reduced, and the resolution is improved; improve the product performance and reduce the cost.

The starting materials used in the following examples of the present invention are all commercially available products.

Example 1

Thinner formulation for printing miniiled back light solder resist ink:

the raw materials are mixed according to the mass percentage to obtain the thinner for printing the minified backlight solder mask ink.

Example 2

Thinner formulation for printing miniiled back light solder resist ink:

the raw materials are mixed according to the mass percentage to obtain the thinner for printing the minified backlight solder mask ink.

Example 3

Thinner formulation for printing miniiled back light solder resist ink:

the raw materials are mixed according to the mass percentage to obtain the thinner for printing the minified backlight solder mask ink.

Example 4

The solder resist ink for printing the minified backlight comprises the following components in parts by weight:

75 parts of crude oil (white solder resist ink) (the components are 14 wt% of acrylate, 48 wt% of inorganic pigment, 1 wt% of silicon dioxide (7631-86-9(CAS No.), 1 wt% of barium sulfate (7727-43-7(CAS No.), 12 wt% of dipropylene glycol monomethyl ether (34590-94-8(CAS No.), 12 wt% of diethylene glycol monoethyl ether acetate (112-15-2(CAS No.), 12 wt% of dimethyl glutarate (1119-40-0(CAS No.));

25 parts of a hardener (a curing agent used in combination with the white solder resist ink) (the components are 45 wt% of acrylate, 50 wt% of epoxy resin and 5 wt% of diethylene glycol ethyl ether acetate (112-15-2(CAS No.)));

10 parts of the diluent for printing minified back light solder mask ink prepared in example 1.

The raw materials are mixed according to the parts by weight to obtain the solder resist ink for printing the miniature backlight.

Example 5

The solder resist ink for printing the minified backlight comprises the following components in parts by weight:

80 parts of crude oil (white solder resist ink, composition same as example 1);

20 parts of a curing agent (curing agent used in combination with white solder resist ink, the composition being the same as in example 1);

11 parts of the diluent for printing minified back light solder resist ink prepared in example 2.

The raw materials are mixed according to the parts by weight to obtain the solder resist ink for printing the miniature backlight.

Example 6

The solder resist ink for printing the minified backlight comprises the following components in parts by weight:

75 parts of crude oil (white solder resist ink, composition same as example 1);

32 parts of a curing agent (curing agent used in combination with white solder resist ink, the composition being the same as in example 1);

12 parts of the diluent for printing minified back light solder mask ink prepared in example 3.

The raw materials are mixed according to the parts by weight to obtain the solder resist ink for printing the miniature backlight.

Performance detection

Manually stirring the minified backlight solder resist ink prepared in the embodiments 4-6 for printing for 2-3 minutes, then stirring the ink for printing for 15 minutes at a speed of 600 revolutions per minute for online printing of a minified substrate, transferring the printed front surface film with the thickness of 30 +/-3 micrometers into a hot air circulation drying oven for pre-curing at the temperature of 80 ℃ after printing, taking out the printed front surface film for 15 minutes, and blowing the printed front surface film with an ion fan to the thickness of 30 +/-3 micrometers of the cooled printed back surface; and (3) completing exposure and development processing by double-sided printing, wherein the exposure parameters are as follows: 200mj/cm²And the developing parameters are as follows: developer 1 wt% Na₂CO₃Aqueous solution, temperature: cleaning pressure at 30 ℃ of 0.196 MPa: and 60S, obtaining the backlight sheet.

And (3) carrying out performance detection on the prepared backlight sheet:

and (3) testing the adhesion:

using a hundred grid knife to scratch 100 (10 × 10) grids of 1mm × 1mm on the surface of the ink of the backlight piece prepared from the backlight solder resist ink prepared in the examples 4-6, firstly using 3M adhesive paper to press with fingers to firmly adhere the adhesive paper to the grid area, then grasping the other end of the adhesive tape, quickly pulling off the adhesive paper in the vertical direction (90 ℃), and repeating for 3 times to obtain a detection result; the detection result shows that the adhesiveness of the backlight solder resist ink prepared in example 4 is not less than 4B; the adhesion of the backlight solder resist ink prepared in example 5 is not less than 4B; the adhesion of the backlight solder resist ink prepared in example 6 was 4B or more. (Dry hundred method: the amount of ink stuck off the edges of the grid by the tape is according to the hundred percent ASTM rating: 5B: the edges of the cuts are completely smooth without any peeling off; ASTM rating: 4B: there is a small chip peeling off at the intersection of the cuts, actual breakage in the cross-cut area is ≦ 5%)

Boiling water to 100 ℃, then putting the back light sheet printed with the ink prepared by the back light solder resist ink prepared in the embodiment 4-6 into the water to be boiled for 30min, taking out the back light sheet, using a hundred grid knife to scratch 100 grids (10 x 10) with 1mm by 1mm on the surface of the ink, firstly using 3M gummed paper to press with fingers to firmly stick the gummed paper to a grid area, then grabbing the other end of the adhesive tape, rapidly pulling the gummed paper in the vertical direction (90 ℃), and repeating for 3 times to obtain a detection result; the detection result shows that the adhesiveness of the backlight solder resist ink prepared in example 4 is not less than 4B; the adhesion of the backlight solder resist ink prepared in example 5 is not less than 4B; the adhesion of the backlight solder resist ink prepared in example 6 was 4B or more. (Water boiling hundred method: the amount of ink stuck by the tape at the edge of the grid is according to the hundred grid percentage ASTM grade: 5B: the edge of the cut is completely smooth and the edge of the grid does not have any peeling; ASTM grade: 4B: there is a small piece peeling at the intersection of the cut and the actual breakage in the cut area is less than or equal to 5%)

And (3) measuring the thickness of the ink film:

the data are measured and recorded at the upper, lower, left and right 4 points of the backlight sheet prepared by the backlight solder resist ink prepared in the embodiments 4-6 by using a micrometer, and the detection result is that the thickness of the ink film of the backlight sheet prepared by the backlight solder resist ink prepared in the embodiment 4 is as follows: 32.2 microns, below: 32.8 μm, left: 33.3 microns, right: 33.2 microns; the ink film thickness of the backlight sheet prepared from the backlight solder resist ink prepared in example 5 is as follows: 31.5 microns, below: 31.8 micron, left: 33 μm, right: 32.2 microns; backlight ink prepared from backlight solder resist ink prepared in example 6 on film thickness: 32.7 microns, below: 32.8 μm, left: 33.9 μm, right: 33.2 microns.

And (3) reflectance measurement:

the data are measured and recorded at the upper, lower, left and right 4 points of the backlight sheet prepared by the backlight solder resist ink prepared in the embodiments 4-6 by using a reflectivity tester, and the detection result is that the reflectivity of the backlight sheet prepared by the backlight solder resist ink prepared in the embodiment 4 is as follows: 88%, the following: 88.2%, left: 88.8%, right: 88.7 percent; the reflectance of the backlight sheet prepared from the backlight solder resist ink prepared in example 5 was as follows: 87.8%, below: 87.9%, left: 88.8%, right: 88.7 percent; the reflectance of the backlight sheet prepared from the backlight solder resist ink prepared in example 6 was as follows: 88.5%, the following: 88.2%, left: 89.1%, right: 88.7 percent.

In the diluent provided by the invention, butanone, white kerosene and ethyl acetate are extremely volatile liquids, and the addition of the diluent into ink can accelerate the volatilization speed of the ink to dry quickly. The diluent for printing the miniature backlight solder resist ink provided by the invention can improve the toughness of the ink, reduce the viscosity, dry the ink quickly and improve the applicability; the light sensitivity of a non-exposure area is reduced, so that burrs are reduced, and the resolution is improved; improve the product performance and reduce the cost.

While only the preferred embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.