阅读说明：本技术 导电布及其制备方法与应用 (Conductive cloth and preparation method and application thereof ) 是由 刘芳荣 钟信男 吴孟岳 于 2019-10-18 设计创作，主要内容包括：本发明提供导电布及其制备方法与应用,所述导电布包括：基布以及形成于该基布表面的金属导电线路结构,该金属导电线路结构包括至少一金属种子层以及至少一化学镀层,该金属种子层形成于该基布表面的蒸镀层或溅镀层,其具有导电线路的图案,该化学镀层镀覆于该金属种子层表面。本发明导电布具有提高的导电性与发热效率。(The invention provides a conductive fabric and a preparation method and application thereof, wherein the conductive fabric comprises the following components: the metal conductive circuit structure comprises at least one metal seed layer and at least one chemical plating layer, wherein the metal seed layer is formed on an evaporation coating or sputtering coating on the surface of the base cloth and is provided with a pattern of a conductive circuit, and the chemical plating layer is plated on the surface of the metal seed layer. The conductive cloth has improved conductivity and heating efficiency.)

1. A conductive cloth, comprising:

a base fabric, and

the metal conducting circuit structure is formed on the surface of the base cloth and comprises at least one metal seed layer and at least one chemical plating layer; wherein:

the at least one metal seed layer is formed on the evaporation coating or sputtering coating on the surface of the base cloth and is provided with a pattern of a conductive line; and

the at least one chemical plating layer is plated on the surface of the metal seed layer.

2. The conductive fabric as recited in claim 1, further comprising at least one carbon layer overlying at least a portion of the substrate and at least a portion of the metal conductive trace structure.

3. The conductive fabric as recited in claim 2, wherein the carbon layer has a resistance of about 0.01 to about 50 ohms/square (ohms/sq).

4. The conductive fabric as claimed in any one of claims 1 to 3, wherein the pattern of the conductive line is a pattern of a continuous loop or a pattern of a discontinuous loop.

5. The conductive cloth according to claim 4, wherein the pattern of the continuous loop has one or more hollowed-out portions not covered by metal.

6. The conductive cloth of any of claims 1 to 3, wherein the metal seed layer comprises a conductive metal selected from the group consisting of stainless steel, nickel, copper, silver, titanium, nickel vanadium alloy, aluminum, cobalt, palladium, or combinations thereof; the electroless plating layer comprises a conductive metal selected from the group consisting of copper, nickel, silver, gold, or an alloy containing the same.

7. The conductive fabric of any of claims 1-3, wherein the metal seed layer has a thickness of about 20 μm to about 200 μm; each electroless plating has a thickness of about 10 to about 100 μm.

8. The conductive cloth according to any one of claims 1 to 3, wherein the conductivity of the metal conductive trace structure is about 20 Ω or less.

9. A preparation method of conductive cloth comprises the following steps:

providing a base cloth;

forming at least one metal seed layer on the substrate by vapor deposition or sputtering, wherein the metal seed layer has a predetermined pattern; and

plating at least one chemical plating layer on the surface of the metal seed layer in a chemical plating mode, so that the metal seed layer and the at least one chemical plating layer form a metal conducting circuit structure.

10. The method of claim 9, further comprising applying at least one carbon layer overlying at least a portion of the substrate and at least a portion of the metal conductive trace structures.

11. The method of claim 10, wherein the carbon paste comprises 100 parts by weight of resin, about 10 to about 50 parts by weight of carbon component, about 10 to about 50 parts by weight of organic solvent, and 0 to about 10 parts by weight of cross-linking agent.

12. The method of claim 10, wherein the carbon layer has a resistance of about 0.01 to about 50 ohms/square (ohms/sq).

13. The method according to any of claims 9-12, wherein the metal conductive line structure is a continuous loop or a discontinuous loop.

14. The method of claim 13, wherein the continuous loop has one or more openings that are not covered by metal.

15. The method of any of claims 9-12, wherein the metal seed layer comprises a conductive metal selected from the group consisting of stainless steel, nickel, copper, silver, titanium, nickel vanadium alloy, aluminum, cobalt, palladium, or combinations thereof; the electroless plating layer comprises a conductive metal selected from the group consisting of copper, nickel, silver, gold, or an alloy containing the same.

16. The method of any of claims 9-12, wherein the metal seed layer has a thickness of about 20 μ ι η to about 200 μ ι η; each electroless plating has a thickness of about 10 to about 100 μm.

17. The method of any of claims 9 to 12, wherein the conductivity of the metal conductive line structure is about 20 Ω or less.

18. An article comprising the conductive fabric of any one of claims 1 to 8 or the conductive fabric produced by the production method of any one of claims 9 to 17.

19. The article of claim 18, further comprising a light emitting component, a temperature control device, a positioning device, an audio-visual transmission component, a sensor, an intelligent control device, and/or a current and/or voltage control module.

Technical Field

The present invention relates to a conductive fabric, and more particularly, to a conductive fabric with improved conductivity while reducing costs.

Background

The conventional method of forming a conductive circuit on a fabric generally includes printing a conductive paste on the fabric, weaving (or knitting) a metal fiber, and the like. The conductive paste is printed by mixing a high molecular polymer with metal or other conductive powder and then directly printing patterns on the surface of the cloth by screen printing or other printing methods. The weaving (or knitting) method of metal fiber is to weave the conductive fiber into the cloth according to the pre-designed pattern by the weaving (or knitting) process, so that the conductive fiber is combined with the general fiber to form the cloth with the conductive circuit characteristic.

However, the existing conductive paste uses expensive silver paste, and the cost is high; in the metal conductive circuit structure made by spinning (or weaving) metal fibers, if the soft characteristic of the fiber fabric is to be maintained, the amount of the metal fibers cannot be too high, but the conductivity is insufficient, and the heating efficiency is affected, in other words, if the conductivity (for example, 5 Ω) which can be achieved by the conductive slurry is to be achieved, the amount of the metal fibers needs to be increased, but the fabric flexibility is affected. Therefore, there is still a need to develop a conductive fabric that can improve the conductivity and the heat generation efficiency while reducing the cost, in the prior art, the disadvantages of high cost, insufficient conductivity and/or unable to improve the heat generation efficiency, etc.

Disclosure of Invention

The invention aims to provide a conductive fabric which has the advantages of cost saving and improvement of conductivity and heating efficiency, and a metal circuit and a base fabric have good combination degree.

In order to achieve the above object, the present invention provides a conductive cloth, comprising:

a base fabric, and

a metal conductive circuit structure having a pattern (pattern) of conductive circuit formed on the surface of the substrate and including at least one metal seed layer and at least one chemical plating layer; wherein:

the metal seed layer is an evaporation coating or sputtering coating formed on the surface of the base cloth and provided with a pattern of a conductive circuit; and

the chemical plating layer is plated on the surface of the metal seed layer.

In another aspect of the present invention, the conductive fabric further includes at least one carbon layer covering at least a portion of the base fabric and a portion of the metal conductive trace structure.

The invention also provides a preparation method of the conductive cloth, which comprises the following steps:

providing a base cloth;

forming at least one metal seed layer on the substrate by vapor deposition or sputtering, wherein the metal seed layer has a predetermined conductive circuit pattern; and

and plating at least one chemical plating layer on the surface of the metal seed layer in a chemical plating mode, so that the metal seed layer and the chemical plating layer form a metal conducting circuit structure.

In another aspect of the present invention, the method further comprises applying at least one carbon layer covering at least a portion of the substrate and at least a portion of the metal conductive trace structure.

The invention also provides an article comprising the conductive cloth.

The invention forms a metal seed layer with specific patterns on the base cloth, and forms a metal chemical plating layer on the surface of the metal seed layer in a chemical plating mode to form a metal conductive circuit structure on the base cloth, thereby replacing the existing method for printing conductive slurry (especially silver paste), achieving the purpose of saving cost, and obviously controlling the conductivity and the heating efficiency by finely adjusting the metal consumption of the chemical plating layer, so the method is favorable for adjusting and achieving the desired conductivity and heating efficiency.

Drawings

Fig. 1 is a schematic view of an embodiment of the conductive cloth of the present invention not including a carbon layer.

Fig. 2 is a schematic view of an embodiment of a conductive fabric of the present invention including a carbon layer.

Fig. 3 is a schematic diagram of an embodiment of the conductive fabric of the present invention having a continuous loop conductive trace pattern.

FIG. 4 is a schematic diagram of an embodiment of the present invention in which the conductive fabric has a continuous loop and a plurality of conductive trace patterns at hollow-outs.

Fig. 5A is a schematic diagram of an embodiment of the conductive fabric of the present invention having a discontinuous loop conductive trace pattern.

Fig. 5B is a schematic diagram of an embodiment of the conductive fabric having a discontinuous loop conductive line pattern and including a carbon layer according to the invention.

Fig. 6A to 6D are schematic flow charts of the method for manufacturing the conductive fabric of the present invention.

Fig. 7 is a schematic diagram of a sputtering process in the method for preparing the conductive cloth of the present invention.

Description of reference numerals:

10 base cloth

20 metal seed layer

30 chemical plating

30a electroless copper/electroless plated layer

30b electroless Nickel/electroless plating

40 carbon layer

50 cathode

60 anode

70 evacuation

80 gas inlet

90 high voltage power supply

H, hollow out.

Detailed Description

The invention may be understood more readily by reference to this embodiment and the examples included herein. Numerous specific details are set forth in order to provide a thorough understanding of the examples described herein. However, it will be understood by those skilled in the art that the examples described herein may be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the primary technical features. Furthermore, the description herein is not intended to limit the scope of the present invention.

As used in this specification and throughout the following claims, the terms "a", "an", "the" and similar referents are to be construed to cover both the singular and the plural, unless otherwise indicated herein. Additionally, the dimensions of the various elements and regions in the figures may be exaggerated and not drawn on scale for clarity.

It should be understood that any numerical range recited in this specification is intended to include all sub-ranges subsumed therein. For example, a range of "1 to 10" includes all subranges between (e.g., from 2 to 8, 3 to 6, or 4 to 9, etc.) the recited minimum value of 1 and the recited maximum value of 10 and includes both values, i.e., ranges including a minimum value equal to or greater than 1 and a maximum value equal to or less than 10. Because the disclosed numerical ranges are continuous, they include every value between the minimum and maximum values. Unless otherwise indicated, all numerical ranges specified in this specification are approximate values.

Numerical values herein can be modified by the term "about," which means an acceptable error for the particular value as determined by one of ordinary skill in the art, which depends in part on how the value is measured or determined.

As used herein, "evaporation" refers to a coating technique in which a material to be evaporated is heated by an electron beam or a resistor to reach a melting temperature of the material in a high vacuum state, so that atoms are evaporated and reach and adhere to a surface of a substrate. During the evaporation process, the substrate temperature has a significant influence on the properties of the evaporated film. The substrate is also heated properly so that the evaporated atoms have enough energy to move freely on the substrate surface, so as to form a uniform thin film. In this context, the substrate is also heated to a suitable temperature, which depends on the material and the degree of vacuum.

As for the "Sputtering" described herein, the metal material is usually (but not limited to) "direct current Sputtering (DC Sputtering Deposition)", and direct current Plasma (DC Plasma) is the simplest Plasma generation method, and when Sputtering a thin film by DC Plasma, the deposited thin film material needs to be an electrical conductor. The cathode plate used in the sputtering process is usually referred to as "target". As the deposition process continues, the thickness of the target material becomes thinner and thinner, and therefore the target material should be replaced as needed.

Another metal sputtering method is "high power impulse magnetron sputtering" which is a magnetron sputtering technique using high power impulse power supply to obtain high density plasma with high electron density by generating high instantaneous impulse current, and the HIPIMS coating system can effectively increase the ionization rate of sputtered particles and can obtain a film with no pores, high density and good crystallinity at low substrate temperature. The key core of the HIPIMS technology is a power supply, and the design of the power supply is mainly to apply a group of direct current power supplies to load capacitors in a pulse module, and then connect the pulse module to a target seat. The electric energy of the DC power supply is accumulated to the pulse module capacitor with charging voltage up to hundreds and thousands of volts, and the transistor is used to control the pulse time and pulse frequency of the discharge to generate high-density plasma.

The above steps are to bombard the surface of the metal target by positive ions of plasma, and to sputter and deposit target atoms on the workpiece by energy transfer, so as to perform thin film deposition.

In this document, the term "chemical plating", also referred to as autocatalytic plating (autocatalytic plating) or electroless plating (electrolytic plating), refers to a surface treatment technique for metal deposition by the autocatalytic principle, i.e. a technique for reducing metal ions in a plating solution into metal by a suitable reducing agent without applying an external current, and is completely different from conventional plating requiring an external power source.

Taking electroless copper plating as an example, in the plating solution, copper sulfate is a main salt and is a main raw material for providing copper metal; potassium sodium tartrate is a chelating agent and is an important component for keeping the stability of copper ions and controlling the reaction speed; the sodium hydroxide can maintain the pH value of the plating solution and make formaldehyde fully play a reducing role; formaldehyde is a reducing agent for reducing divalent copper ions into metal copper and is an important component for electroless copper plating; the stabilizer is used for preventing the plating solution from being failed due to violent decomposition of the plating solution by properly controlling the reduction speed after the plating solution is catalyzed and the reduction of copper is carried out.

Referring to fig. 1, the present invention relates to a conductive fabric, which includes:

a base fabric 10, which may be various kinds of fabrics including, but not limited to, woven fabric, non-woven fabric, knitted fabric, etc.; and

a metal conductive circuit structure formed on the surface of the base cloth, having a pattern (pattern) of the conductive circuit, and comprising at least one metal seed layer and at least one chemical plating layer; wherein:

the metal seed layer 20 is a vapor deposition layer or a sputtering layer formed on the surface of the base fabric 10, and the metal seed layer comprises a conductive metal, preferably a conductive metal, such as, but not limited to, stainless steel, nickel, copper, silver, titanium, nickel-vanadium alloy, aluminum, cobalt, palladium, or a combination thereof, and the metal seed layer 20 may comprise a single layer or two or more layers; and

the electroless plating layer 30 is plated on the surface of the metal seed layer 20, and the conductive metal suitable for forming the electroless plating layer 30 can be, for example, but not limited to, copper, nickel, silver, gold, or an alloy containing the same, for example, the conductive metal can be a single metal of copper, nickel, silver, gold, or an alloy containing any one or more of the above metals and other metals, and the electroless plating layer 30 can include a single layer, or two or more layers. When the chemical plating layer 30 has two or more layers, the inner layer contacting the surface of the metal seed layer 20 mainly has a conductive function, and the outer layer away from the metal seed layer 20 can be selected from metals having oxidation resistance, abrasion resistance, and the like, so that the entire chemical plating layer 30 has multiple functions of conductivity, oxidation resistance, abrasion resistance, and the like.

In the present invention, the thickness of the metal seed layer 20 may be about 20 μm to about 200 μm, preferably about 50 μm to about 150 μm; more preferably from about 55 μm to about 120 μm. Each electroless plating layer 30 may have a thickness of about 10 to about 100 μm; more preferably from about 15 to about 75 μm; more preferably from about 20 to about 65 μm.

Referring further to fig. 2, the metal conductive trace structure further includes at least one carbon layer 40 covering at least a portion of the substrate 10 and a portion of the metal conductive trace structure. The carbon layer 40 is formed of a carbon paste including a resin, a carbon component, an organic solvent and a crosslinking agent, the carbon component being present in an amount of about 10 to about 50 parts by weight, preferably about 20 to about 40 parts by weight, more preferably about 25 to about 35 parts by weight, based on 100 parts by weight of the resin; the organic solvent is present in an amount of about 10 to about 50 parts by weight, preferably about 20 to about 40 parts by weight, more preferably about 25 to about 35 parts by weight; the crosslinker is present in an amount of 0 to about 10 parts by weight, preferably about 1 to about 8 parts by weight, and more preferably about 2 to about 5 parts by weight. Wherein the resin may be an oil-based resin (also called solvent-based resin) or a water-based resin (water-based resin), including Polyurethane (PU), polymethyl methacrylate (PMMA), or other resins known in the art and suitable. The carbon component in the carbon paste is in the form of carbon spheres, carbon tubes, conductive carbon black, graphite, bamboo carbon or coffee carbon, and the carbon spheres and carbon tubes are preferably in the nanometer grade. The organic solvent may be ethyl acetate, butyl acetate, mixtures thereof or other organic solvents known to those skilled in the art. The crosslinking agent may be an NCO group-containing isocyanurate (isocyanurate) or a non-NCO type carbodiimide (carbodiimide; -N ═ C ═ N-) functional group or other types well known to those skilled in the art.

In the present invention, the pattern of the conductive traces may be a continuous circuit pattern (as shown in fig. 3 and 4) or a discontinuous circuit pattern (as shown in fig. 5A and 5B), and the shape, size, specification, ratio, etc. of the pattern are designed according to actual requirements.

Referring to FIG. 3, one aspect of the pattern of the continuous loop may be in the form of a general line, but is not limited to a straight line or a curved line; in another aspect, as shown in fig. 4, one or more openings H not covered by the conductive metal are formed in the continuous line, and the design of the openings H can increase the resistance of the metal conductive line structure to a resistance value of about 1.0 ohm/square (ohms/sq) to about 5 ohms/sq, preferably about 1.2 ohms/sq to about 4.5 ohms/sq, and more preferably about 1.5 ohms/sq to about 4 ohms/sq, thereby providing a heat generating function without applying an additional carbon layer. But a carbon layer may be applied at this time to further improve the heat generation efficiency. The shape, size, distribution position and the like of the hollow part H can be adjusted according to actual requirements, so that the heating temperature of the metal conducting circuit can be adjusted.

Referring to fig. 5A, the conductive line pattern is a discontinuous circuit pattern, and in the discontinuous circuit pattern, as shown in fig. 5B, the metal conductive line structure preferably includes a carbon layer 40 to generate heat.

Referring to fig. 6A to 6D, the present invention also provides a method for manufacturing a conductive fabric, which includes:

providing a base fabric, which can be various fabrics including, but not limited to, woven fabric, non-woven fabric, knitted fabric, etc.;

forming at least one metal seed layer 20 by plating a conductive metal (such as, but not limited to, stainless steel, nickel, copper, silver, titanium, nickel-vanadium alloy, aluminum, cobalt, palladium, or a combination thereof) on the substrate through a fine mask (fine mask) formed with a predetermined specific pattern by evaporation or sputtering, so that the metal seed layer 20 has the predetermined specific pattern (as shown in fig. 6A), which is a pattern of a conductive circuit, which may be a continuous loop pattern (as shown in fig. 3 and 4) or a discontinuous loop pattern (as shown in fig. 6A to 6D), and when the predetermined specific pattern is a continuous loop pattern, it may include one or more hollow portions that are not covered by the metal;

at least one electroless plating layer is formed by plating a metal such as copper, nickel, silver, gold, or an alloy containing the same on the surface of the metal seed layer 20 by electroless plating. In one embodiment, at least one electroless copper plating layer 30a is formed by electroless plating (as shown in fig. 6B), and at least one electroless nickel plating layer 30B is electroless plated on the electroless copper plating layer 30a (as shown in fig. 6C);

optionally, at least one carbon layer 40 is formed to cover at least a portion of the substrate 10 and portions of the electroless plating layers 30a, 30b (as shown in fig. 6D). In one embodiment, the carbon layer 40 is formed by applying a carbon paste to at least cover a portion of the substrate 10 and a portion of the electroless plating layers 30a and 30b, so that the carbon layer 40 can generate heat at a constant temperature.

In the present embodiment, the carbon layer 40 has a resistance of about 0.01 to about 50 ohms/sq (ohms/sq), more preferably about 0.02 to about 20 ohms/sq, and still more preferably about 0.02 to about 5 ohms/sq.

In the present invention, the metal seed layer and the chemical plating layer both comprise conductive metal, so the main function is conductive, and the metal seed layer and the chemical plating layer can also have a heating function through the design of the pattern of the conductive circuit, and the carbon layer has the functions of constant temperature and heating. Since the carbon layer has a higher resistance than the conductive metal, electricity is converted into heat (temperature rise) in a circuit having a large difference in resistance. The resistance of the carbon layer is generally designed according to the required heat or heat-generating area. That is, the resistance value of the carbon layer varies depending on the area of the conductive line, and the resistance value is inversely proportional to the carbon content in the carbon layer and the coating amount (number of times), for example, the resistance value is low as the carbon content is higher, and the heat generation temperature is higher.

In the present invention, the ratio of the area of the metal conductive line structure to the area of the carbon layer is about 1:3 to about 1: 30, preferably from about 1:5 to about 1: 20, more preferably from about 1:8 to about 1: 15, or more.

In terms of the characteristics of the carbon paste, the resistance of the carbon paste itself increases (current decreases) when the temperature increases; the output work P-IV also decreases at the same time, so that the temperature does not rise any more and a constant temperature (thermo) effect is achieved.

In the present invention, a metal is deposited on a base fabric by vapor deposition or sputtering to provide a primary conductivity, but the primary conductivity is not yet satisfactory (conductivity level) (about 20 Ω or less, preferably about 10 Ω or less), and then the metal is deposited by an autocatalytic principle by electroless plating, thereby improving the conductivity (conductivity: about 0.5 to about 5 Ω), the rubbing fastness (according to the standard: JIS L0849; 200-3 (inclusive)), and the salt spray resistance.

The invention also provides an article comprising the conductive cloth, which can be a wearing device (including but not limited to clothes, caps, gloves, socks, shoes, scarves and the like) or even a seat, a sofa and the like, and the article can further comprise electronic components of a light-emitting component (such as an LED), a temperature control device, a positioning device (such as a GPS), a video transmission component (such as a micro-electromechanical microphone), and various sensors (such as a temperature sensor, a heart rate monitor and the like), so that the conductive module has the functions of electric conduction and/or heat conduction, sound and/or light warning effect, warm keeping and constant temperature, positioning search, video transmission, body condition monitoring and the like.

In the invention, the object can generate heat preservation and constant temperature effects by the metal conducting circuit and/or the carbon layer, or further comprises a temperature control device, so as to adjust the temperature of the object.

In the present invention, the object may further comprise an intelligent control device, which may be a smart phone, tablet, watch, etc. combined with a compiling software (such as APP), or a wireless electronic system based on a microcomputer system.

In the present invention, the article may further include a current and/or voltage control module, which is connected to the conductive fabric and/or the electronic components, and is connected to a power source (such as an external mobile power source or a built-in battery), and may further include a built-in wireless transmission component for respectively regulating and controlling current and/or voltage output of the metal conductive circuit on the conductive fabric, wherein the wireless transmission component may use bluetooth, infrared, WIFI, NFC, or other communication methods.

Examples of the invention

Test item and method

Conductivity (Ω): the test instrument was a YF-508MilliOHM Meter resistance Meter.

Resistance of carbon layer (Ω/sq): the test instrument was MITSUBISHI Loresta-GP (MCP-T600).

Sheet resistance value change rate: the JISK 7194 initial sheet resistance test resistance change rate.

Rubbing fastness: according to the standard, JIS L0849.

Salt fog resistance: the conductive fabric was tested by spraying neutral saline by a neutral saline spray tester in accordance with the test method of JIS Z2371.

Example 1

Sputtering/evaporation step: providing polyamide (nylon) cloth as a base material, and enabling stainless steel to be attached to the surface of the polyamide (nylon) cloth through a precision shield with a predetermined specific pattern by a direct current sputtering mode to form a metal seed layer. Please refer toFIG. 7 shows the principle of using a metal thin film material (stainless steel target) as a cathode (50), a substrate (polyamide (nylon)) as an anode (60), and evacuating (70) to 10 deg.C^-3Pa or more, introducing inert gas (argon, Ar) from a gas inlet (80) to several Pa (Pa), and applying a high voltage of 300 volts (V) or more from a high-voltage power supply (90) to generate positive ions (Ar)⁺) Glow discharge to form plasma. At this time, positive ions in the plasma are accelerated at a voltage of several hundred volts and collide with the target, and metal atoms are ejected by momentum transfer and deposited on the surface of the substrate (polyamide (nylon)) to be plated of the anode (60).

And (3) electroless copper plating: washing (water) the polyamide (nylon) with the metal seed layer to clean the surface, and forming a chemical copper plating layer on the surface of the metal seed layer by a chemical plating process, wherein copper sulfate is a main salt, formaldehyde is a reducing agent, and the chemical reaction formula is as follows:

HCHO+OH^-→HCOOH+H^-

HCHO+OH^-→[HCHOOH]^-

chemical nickel plating step: washing polyamide (nylon) cloth with water again to clean the surface, and then closely adhering nickel metal to the surface of the chemical copper plating layer by a chemical plating process to form a chemical nickel plating layer, wherein nickel sulfate is used as a main salt, sodium hypophosphite is used as a reducing agent, and the chemical reaction formula is as follows:

H₂PO₂ ^-+H₂O→HPO₃ ^-+H₂↑

thereby forming a metal conductive circuit structure with the predetermined specific pattern on the polyamide (nylon) cloth.

Coating a carbon layer: applying carbon glue on the surface of the cloth with the metal conductive circuit structure to cover at least part of polyamide (nylon) cloth and part of the electroless nickel plating layer to form a carbon layer, wherein the area ratio of the metal conductive circuit structure to the carbon layer is 1:3, the carbon glue comprises 100 parts by weight of PU resin, 30 parts by weight of graphite carbon powder, 2 parts by weight of cross-linking agent (isocyanuric acid, model CL-325) and 30 parts by weight of organic solvent (a mixture of ethyl acetate and butyl acetate in a weight ratio of 4: 6), and the resistance of the carbon layer is about 0.25 ohm/square.

Measured, the properties of the polyamide (nylon) cloth having the metal conductive line structure of example 1 are shown in table 1 below:

TABLE 1

Example 2

The method comprises the steps of sputtering stainless steel metal on the surface of polyester woven fabric (30 denier) to serve as a metal seed layer, carrying out chemical copper plating and chemical nickel plating to form a chemical plating layer, wherein the total thickness of the two chemical plating layers is 28 microns, measuring a metal conducting circuit structure consisting of the stainless steel layer, the chemical copper plating layer and the chemical nickel plating layer, the conductivity of the metal conducting circuit structure is 5 omega, and finally covering the two carbon adhesive layers, wherein the resistance of the measured carbon layer is 0.35 omega/square, and the constant-temperature heating effect can be achieved.

Measured, the properties of the polyester woven fabric having the metal conductive line structure of example 2 are shown in the following table 2:

TABLE 2

Degree of electrical conductivity	5Ω
		Resistance of metal conductive circuit structure before carbon layer is not applied	0.3 ohm/square
Resistance of carbon layer	0.35 ohm/square
		Rate of change of sheet resistance	≤20％
Maximum temperature of electric heat test	≥40℃
		Rate of temperature rise	5 ℃/min or more
Fastness to rubbing	Grade not less than 3
		Resistance to salt fog	The change rate of the conductivity is less than or equal to 20 percent

Example 3

The method comprises the steps of sputtering stainless steel metal on the surface of polyester woven fabric (30 denier) to serve as a metal seed layer, wherein a conductive circuit is required to be continuous, the width of the conductive circuit is 10mm, the conductive circuit is uniformly hollowed into a circular or oval shape (without limitation, as shown in figure 4), the oval shape in the embodiment is 4mm in long diameter and 3mm in short diameter (without limitation), the thickness of the stainless steel layer is about 55 mu m, electroless copper plating and electroless nickel plating are carried out to form an electroless plating layer, the total thickness of the two layers of the electroless plating layer is 30 mu m, the continuous metal conductive circuit structure consisting of the stainless steel layer, the electroless copper plating layer and the electroless nickel plating layer is measured, the conductivity of the metal conductive circuit structure is 2.8 omega, the resistance is 1.5 ohm/square, and the constant-temperature heating effect can be achieved.

Measured, the properties of the polyester woven fabric having the metal conductive line structure of example 3 are shown in the following table 3:

TABLE 3

Degree of electrical conductivity	2.8Ω
		Resistor of metal conducting circuit structure	1.5 ohm/square
Rate of change of sheet resistance	≤20％
		Maximum temperature of electric heat test	≥45℃
Rate of temperature rise	5 ℃/min or more
		Fastness to rubbing	Grade not less than 3
Resistance to salt fog	The change rate of the conductivity is less than or equal to 20 percent

The foregoing has outlined rather broadly the features and advantages of the present disclosure in order that the present disclosure may be better understood. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions and methods nevertheless fall within the spirit and scope of the invention as defined by the appended claims.