阅读说明：本技术 一种带表面增强层的无机轻集料保温板及其制备方法 (Inorganic lightweight aggregate insulation board with surface enhancement layer and preparation method thereof ) 是由 李辉 金栋臣 葛伏兴 陈刚 于 2021-07-15 设计创作，主要内容包括：本发明属于建筑材料技术领域,且公开了一种带表面增强层的无机轻集料保温板,包括增强层与保温层,所述增强层的数量为两个且二者结构完全一致,所述保温层位于两个增强层的中部且两个增强层的厚度值之和均小于保温层的厚度值。本发明提出一种表面带有增强层的无机轻集料保温板,其增强层由聚合物改性水泥砂浆材料组成,由于聚合物改性水泥砂浆材料抗压强度可高达15Mpa以上,抗折强度可高达5Mpa以上,因此添加表面增强层能够显著增加保温板表面强度,克服其使用时易被粘结砂浆或粘结胶干燥收缩时剥落表皮的缺点,保证以其作为保温层的薄抹灰保温系统或以其作为保温芯材的保温装饰板粘结牢靠。(The invention belongs to the technical field of building materials, and discloses an inorganic light aggregate insulation board with a surface enhancement layer. The invention provides an inorganic light aggregate insulation board with a reinforcing layer on the surface, wherein the reinforcing layer is composed of a polymer modified cement mortar material, the compressive strength of the polymer modified cement mortar material can be up to more than 15MPa, and the flexural strength of the polymer modified cement mortar material can be up to more than 5MPa, so that the surface strength of the insulation board can be obviously increased by adding the surface reinforcing layer, the defect that the surface is easy to peel off when the inorganic light aggregate insulation board is dried and shrunk by bonding mortar or bonding adhesive when the inorganic light aggregate insulation board is used is overcome, and the thin plastering insulation system using the inorganic light aggregate insulation board as an insulation layer or an insulation decorative board using the inorganic light aggregate insulation board as an insulation core material is ensured to be firmly bonded.)

1. The utility model provides a take inorganic lightweight aggregate heated board of surface enhancement layer, includes enhancement layer and heat preservation, its characterized in that: the heat-insulating layer is positioned in the middle of the two reinforcing layers, and the sum of the thickness values of the two reinforcing layers is smaller than that of the heat-insulating layer.

2. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 1, wherein: the thickness value of the heat-insulating layer can be but is not limited to 20mm, 25mm, 30mm, 35mm, 40mm, 45mm and 50 mm; the thickness value of the enhancement layer is 1mm-5 mm.

3. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 1, wherein: the reinforced layer is made of polymer modified cement mortar material, and the heat insulation layer is a light aggregate heat insulation board.

4. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 3, wherein: the material of the lightweight aggregate insulation board is a mixture formed by combining perlite, ordinary portland cement, a water repellent, emulsion, an early strength agent and a reinforcing agent.

5. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 4, wherein: the perlite is one or a combination of more of closed cell perlite, expanded perlite and vitrified micro bubbles.

6. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 3, wherein: the polymer modified cement mortar material comprises the following material components of ordinary portland cement, rubber powder, dry sand, wood fiber, an expanding agent, cellulose ether and a water repellent.

7. The inorganic lightweight aggregate insulation board with the surface reinforcing layer as claimed in claim 6, wherein: the water repellent comprises one or more of methyltrimethoxysilane, methyl potassium silicate, sodium methyl silicate, zinc stearate and calcium stearate.

8. A preparation method of an inorganic lightweight aggregate insulation board with a surface enhancement layer is characterized by comprising the following steps: the specific operation steps are as follows:

firstly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and flatly paving the half-dry material components at the bottom of the mold to be used as a bottom layer;

secondly, weighing the semi-dry material components of the heat-insulating layer, injecting the semi-dry material components into a mold, and uniformly spreading the semi-dry material components on the bottom layer in the first step to form an intermediate heat-insulating layer;

thirdly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and uniformly spreading the half-dry material components on the middle heat-insulating layer in the second step;

fourthly, slowly pressurizing the three layers of materials in the mold at the pressurizing speed of 120-;

and fifthly, after demoulding, drying the obtained board at the temperature of more than 90 ℃ and the humidity of 100 percent to obtain the inorganic light aggregate insulation board with the surface reinforcing layer.

9. The preparation method of the inorganic lightweight aggregate insulation board with the surface enhancement layer according to claim 8, characterized in that: the inner wall of the die is smooth as a whole and coated with lubricating oil to form a diaphragm layer, the thicknesses of the upper reinforcing layer and the lower reinforcing layer are kept consistent, and the manufactured three layers of materials are slowly pressed by a pressing plate with the area value consistent with the bottom surface of the die.

Technical Field

The invention belongs to the technical field of building materials, and particularly relates to an inorganic lightweight aggregate insulation board with a surface enhancement layer and a preparation method thereof.

Background

The inorganic lightweight aggregate insulation board (or called inorganic lightweight aggregate fireproof insulation board) is a board produced by taking inorganic materials such as expanded perlite, expanded vitrified micro bubbles and the like as lightweight aggregate, taking cement or other inorganic cementing materials as cementing materials and doping functional additives, and through the procedures of proportioning, molding, maintenance and the like in a factory, the technical index of the board meets the requirement of JG/T435-2014, and the insulation board overcomes the defects of inorganic lightweight aggregate thermal insulation mortar: the heat-insulating performance of the heat-insulating layer is improved, the strength potential of cement can be fully exerted, a plurality of uncertain factors in the field construction of the heat-insulating mortar are avoided, the thickness and the quality of the heat-insulating layer are controllable, and meanwhile, the heat-insulating layer is non-combustible and stable in shape and is an ideal material for manufacturing a heat-insulating decorative plate as a heat-insulating core material.

However, the material can not avoid the common diseases of perlite products: the surface of the heat preservation plate is easy to loosen and get powder due to slight fluctuation of process parameters, so that the surface of the heat preservation plate is easy to peel off when the bonding mortar, the plastering mortar or the composite bonding glue is dried and shrunk, the bonding is ineffective, and the hidden danger of integral falling exists.

Disclosure of Invention

Aiming at the defects that the conventional inorganic lightweight aggregate insulation board is loose and fragile and the skin is easy to peel off, the invention provides the inorganic lightweight aggregate insulation board with the reinforced layer on the surface, which increases the surface strength and overcomes the defect that the skin is easy to peel off, so that the inorganic lightweight aggregate insulation board can be used as an insulation layer material in a thin-plastered insulation system or as an insulation core material and a decorative panel to be compounded into an insulation decorative board, and the firm bonding of the insulation system can be ensured.

In order to achieve the purpose, the invention provides the following technical scheme: the inorganic lightweight aggregate insulation board with the surface enhancement layers comprises two enhancement layers and an insulation layer, wherein the two enhancement layers are completely consistent in structure, the insulation layer is positioned in the middle of the two enhancement layers, and the sum of the thickness values of the two enhancement layers is smaller than that of the insulation layer.

As a preferred technical solution of the present invention, the thickness of the insulation layer may be, but not limited to, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm and 50 mm; the thickness value of the enhancement layer is 1mm-5mm, the enhancement layer is set to different sizes mainly to meet different requirements, the situation changes in normal work are various, and materials also need to be correspondingly changed.

As a preferred technical scheme of the invention, the reinforced layer is a polymer modified cement mortar material, and the heat insulation layer is a light aggregate heat insulation board.

As a preferred technical scheme of the invention, the material of the lightweight aggregate insulation board is a mixture formed by combining perlite, ordinary portland cement, a water repellent, emulsion, an early strength agent and a reinforcing agent.

As a preferred technical scheme of the invention, the perlite is one or a combination of more of closed-cell perlite, expanded perlite and vitrified micro bubbles.

As a preferred technical scheme of the invention, the material components of the polymer modified cement mortar material are a mixture of ordinary portland cement, rubber powder, dry sand, wood fiber, an expanding agent, cellulose ether and a water repellent.

As a preferable technical scheme of the invention, the water repellent comprises one or more of methyltrimethoxysilane, potassium methylsilicate, sodium methylsilicate, zinc stearate and calcium stearate.

According to another aspect of the invention, the invention also provides a preparation method of the inorganic lightweight aggregate insulation board with the surface enhancement layer, which comprises the following specific operation steps:

firstly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and flatly paving the half-dry material components at the bottom of the mold to be used as a bottom layer;

secondly, weighing the semi-dry material components of the heat-insulating layer, injecting the semi-dry material components into a mold, and uniformly spreading the semi-dry material components on the bottom layer in the first step to form an intermediate heat-insulating layer;

thirdly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and uniformly spreading the half-dry material components on the middle heat-insulating layer in the second step;

fourthly, slowly pressurizing the three layers of materials in the mold at the pressurizing speed of 120-;

and fifthly, after demoulding, drying the obtained board at the temperature of more than 90 ℃ and the humidity of 100 percent to obtain the inorganic light aggregate insulation board with the surface reinforcing layer.

As a preferred technical scheme of the invention, the inner wall of the die is entirely smooth and coated with lubricating oil to form a diaphragm layer, the thicknesses of the upper reinforcing layer and the lower reinforcing layer are kept consistent, the three layers of materials are slowly pressed by a pressing plate with the area value consistent with the bottom surface of the die to form the diaphragm layer which is a simple oil film layer, the subsequent demoulding operation is facilitated, a small amount of materials on the outer wall are prevented from being adhered to the inner wall of a grinding tool when the material plate is extruded by external force, and the attractiveness, elegance and no defect in template manufacturing are ensured.

Compared with the prior art, the invention has the following beneficial effects:

the invention provides an inorganic light aggregate insulation board with a reinforcing layer on the surface, wherein the reinforcing layer is composed of a polymer modified cement mortar material, the compressive strength of the polymer modified cement mortar material can be up to more than 15MPa, and the flexural strength of the polymer modified cement mortar material can be up to more than 5MPa, so that the surface strength of the insulation board can be obviously increased by adding the surface reinforcing layer, the defect that the surface is easy to peel off when the inorganic light aggregate insulation board is dried and shrunk by bonding mortar or bonding adhesive when the inorganic light aggregate insulation board is used is overcome, and the thin plastering insulation system using the inorganic light aggregate insulation board as an insulation layer or an insulation decorative board using the inorganic light aggregate insulation board as an insulation core material is ensured to be firmly bonded.

Drawings

FIG. 1 is a schematic view of the structure of the insulation board of the present invention;

FIG. 2 is a schematic view of a process for preparing the insulation board of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 2, the invention provides an inorganic lightweight aggregate insulation board with a surface enhancement layer, which comprises two enhancement layers and an insulation layer, wherein the two enhancement layers have completely the same structure, the insulation layer is positioned in the middle of the two enhancement layers, and the sum of the thickness values of the two enhancement layers is smaller than that of the insulation layer.

Wherein, the thickness value of the heat-insulating layer can be but is not limited to 20mm, 25mm, 30mm, 35mm, 40mm, 45mm and 50 mm; the thickness value of the reinforced layer is 1mm-5mm, the reinforced layer is set to different sizes mainly to meet different requirements, the conditions are variable in normal work, and materials also need to be correspondingly changed.

Wherein, the reinforced layer is made of polymer modified cement mortar material, and the heat insulation layer is a light aggregate heat insulation board.

Wherein the material of the lightweight aggregate insulation board is a mixture of perlite, ordinary portland cement, a water repellent, emulsion, an early strength agent and a reinforcing agent.

Wherein, the perlite is one or a combination of more of closed cell perlite, expanded perlite and vitrified micro bubbles.

The polymer modified cement mortar material comprises the following components of ordinary portland cement, rubber powder, dry sand, wood fiber, an expanding agent, cellulose ether and a water repellent.

Wherein the water repellent comprises one or more of methyltrimethoxysilane, potassium methylsilicate, sodium methylsilicate, zinc stearate and calcium stearate.

According to another aspect of the invention, the invention also provides a preparation method of the inorganic lightweight aggregate insulation board with the surface enhancement layer, which comprises the following specific operation steps:

firstly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and flatly paving the half-dry material components at the bottom of the mold to be used as a bottom layer;

secondly, weighing the half-dry material components of the heat-insulating layer, injecting the half-dry material components into a mold, and uniformly spreading the half-dry material components on the bottom layer of the first step to form an intermediate heat-insulating layer;

thirdly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into the mold, and uniformly spreading the half-dry material components on the middle heat-insulating layer in the second step;

fourthly, slowly pressurizing the three layers of materials in the mold at the pressurizing speed of 120-;

and fifthly, after demoulding, drying the obtained board at the temperature of more than 90 ℃ and the humidity of 100 percent to obtain the inorganic light aggregate insulation board with the surface enhancement layer.

Wherein, the mould inner wall is whole smooth and is smeared lubricating oil and forms the diaphragm layer, and the thickness of two upper and lower enhancement layers keeps unanimous, and the three-layer material of making is exerted pressure slowly by the consistent pressing plate of area value and mould bottom surface, forms the diaphragm layer really be a simple oil film layer, mainly makes things convenient for subsequent drawing of patterns work, and a small amount of material adhesion of outer wall is on the grinding apparatus inner wall when avoiding the material board to receive external force extrusion, also is simultaneously in order to ensure the elegant appearance flaw-free of template preparation.

Example one

The embodiment provides an inorganic lightweight aggregate insulation board with a surface enhancement layer, which has a structure shown in figure 1 and consists of an upper enhancement layer, a lower enhancement layer and a middle insulation layer, wherein the thicknesses of the insulation layer and the enhancement layer are respectively 30mm and 5 mm; wherein the material components of the heat-insulating layer are 0.9504kg of closed-cell perlite, 0.432kg of ordinary portland cement, 0.0108kg of emulsion, 0.0001242kg of early strength agent and 0.01621kg of reinforcing agent; the material components of the reinforced layer are 0.27kg of ordinary portland cement, 0.54kg of dry sand, 0.00153kg of cellulose ether, 0.009kg of rubber powder, 0.00225kg of wood fiber, 0.00027kg of water repellent and 0.0162kg of expanding agent;

the preparation method comprises the following steps:

firstly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into a mold, and flatly paving the half-dry material components at the bottom of the mold to be used as a bottom layer;

secondly, weighing the half-dry material components of the heat-insulating layer, injecting the half-dry material components into a mold, and uniformly spreading the half-dry material components on the bottom layer of the first step to form an intermediate heat-insulating layer;

thirdly, weighing the half-dry material components of the reinforcing layer, injecting the half-dry material components into the mold, and uniformly spreading the half-dry material components on the middle heat-insulating layer in the second step;

fourthly, slowly pressurizing the three layers of materials in the mold at the pressurizing speed of 120-;

and fifthly, after demoulding, drying the obtained board at the temperature of more than 90 ℃ and the humidity of 100 percent to obtain the inorganic light aggregate insulation board with the surface enhancement layer.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.