阅读说明：本技术 改性烯丙基化合物、双马来酰亚胺预聚物及其应用 (Modified allyl compound, bismaleimide prepolymer and application thereof ) 是由 漆小龙 温文彦 周照毅 张新权 于 2020-12-24 设计创作，主要内容包括：本发明提供一种改性烯丙基化合物、双马来酰亚胺预聚物及其应用,该改性烯丙基化合物如式(1),以R-1为对称中心,存在两个对称的具有高刚性的芳杂环基团,从而使改性双马来酰亚胺预聚物中含有对称的具有高刚性的芳杂环基团,能降低树脂组合物固化后的热膨胀系数,提高阻燃性、具有高模量保持性和高耐热性,使用较低比例的无机填料即可得到具有较低的热膨胀系数的树脂组合物,避免了因过多的填料带来的树脂分散性下降和难以加工的问题。(The invention provides a modified allyl compound, a bismaleimide prepolymer and application thereof, wherein the modified allyl compoundAs shown in formula (1), with R 1 The modified bismaleimide prepolymer contains the symmetrical aromatic heterocyclic groups with high rigidity, so that the thermal expansion coefficient of the resin composition after curing can be reduced, the flame retardance is improved, the high modulus retentivity and the high heat resistance are realized, the resin composition with a lower thermal expansion coefficient can be obtained by using a lower proportion of inorganic filler, and the problems of reduced resin dispersity and difficult processing caused by excessive filler are solved.)

1. A modified allyl compound is characterized in that the modified allyl compound is shown as a formula (1);

A-R₁-A (1)；

a is, for each occurrence, identically selected from the group of formula (2)

Wherein, each occurrence of Ar is selected from aromatic heterocyclic groups with 5-30 ring atoms; indicates the attachment site;

R₁selected from a single bond, or methylene, or-C (CH)₃)₂Or sulfone groups, or a combination of these systems.

2. The modified allyl compound according to claim 1, wherein each occurrence of Ar is identically selected from the group consisting of an aromatic heterocyclic group having 5 to 20 ring atoms, and wherein hetero atoms of the aromatic heterocyclic group are selected from at least one of nitrogen atoms and oxygen atoms.

3. The modified allyl compound of any of claims 1 to 2, wherein Ar is selected from the group consisting of formula (2-a),

wherein denotes the attachment site.

4. The modified allyl compound according to any one of claims 1 to 2, wherein the modified allyl compound is represented by formula (1-1);

5. the modified allyl compound according to any one of claims 1 to 2, wherein the modified allyl compound is selected from the group consisting of compounds represented by formula (1-2);

6. the modified bismaleimide prepolymer is characterized in that the modified bismaleimide prepolymer is prepared from the following raw materials: a bismaleimide resin and the modified allyl compound according to any one of claims 1 to 5.

7. The modified bismaleimide prepolymer of claim 6, wherein the modified bismaleimide prepolymer is prepared from the following raw materials in parts by weight: 100 parts of the bismaleimide resin and 40-100 parts of the modified allyl compound.

8. The modified bismaleimide prepolymer of any one of claims 6 to 7, wherein the modified bismaleimide prepolymer is prepared from raw materials further comprising other allyl compounds, wherein the other allyl compounds are at least one selected from diallyl bisphenol A, diallyl bisphenol S, diallyl bisphenol F and bisphenol A diallyl ether; the mass ratio of the other allyl compounds to the modified allyl compounds is (5-40): 40-80).

9. Use of the modified bismaleimide prepolymer according to any of claims 6 to 8 in the preparation of a resin.

10. A modified resin composition comprising a curing accelerator, an inorganic filler and the modified bismaleimide prepolymer as claimed in any one of claims 6 to 8.

Technical Field

The invention relates to the technical field of resin preparation, in particular to a modified allyl compound, a bismaleimide prepolymer and application thereof.

Background

With the rapid development of the electronic industry, electronic products are being miniaturized, highly functionalized and highly secured, and electronic circuits are being multilayered and highly wired, so that higher requirements are put on the substrate of the electric board, and in addition to higher glass transition temperature and excellent thermal stability, the requirements on the thermal expansion coefficient and flame retardancy of the substrate of the electric board are also increasing.

Bismaleimide resin (BMI) has the characteristics of excellent heat resistance and thermal stability, low curing shrinkage rate and the like, and diamine-modified or allyl-modified bismaleimide resin is commonly used for preparing an electric plate substrate in the traditional technology. Although modifiers such as diallyl bisphenol A (DABPA) and the like, which are commonly used in the prior art, can improve the solubility and compatibility of bismaleimide resin (BMI), the modifier causes the coefficient of thermal expansion of a cured product to be increased. For reducing the Coefficient of Thermal Expansion (CTE) of the base material of the electric plate, a solution commonly adopted in the conventional art is to add a large amount of inorganic fillers such as silica powder in a resin formulation. Although the scheme can effectively reduce the thermal expansion coefficient of the resin, due to the limitation of the self expansion coefficient of inorganic fillers such as the silicon micropowder, when the addition amount of the fillers reaches a certain degree, the proportion of the inorganic fillers such as the silicon micropowder is continuously increased, the thermal expansion coefficient of the plate is difficult to further reduce, and meanwhile, the addition of a large amount of the inorganic fillers such as the silicon micropowder can cause the resin composition to be difficult to disperse, the processing performance of the plate is reduced, and the service life of the drill bit is seriously shortened.

Therefore, it has been difficult for those skilled in the art to obtain a resin having a low thermal expansion coefficient, high heat resistance and a high modulus.

Disclosure of Invention

Based on the above, the present invention provides a modified allyl compound, a bismaleimide prepolymer and applications thereof, which can reduce the coefficient of thermal expansion of a resin and improve the heat resistance and modulus of the resin.

The technical scheme of the invention is as follows.

One aspect of the present invention provides a modified allyl compound, wherein the modified allyl compound is represented by formula (1);

A-R₁-A (1)；

a is, for each occurrence, identically selected from the group of formula (2)

Wherein, each occurrence of Ar is selected from aromatic heterocyclic groups with 5-30 ring atoms; indicates the attachment site;

R₁selected from a single bond, or methylene, or-C (CH)₃)₂Or sulfone groups, or a combination of these systems.

In some of the embodiments, each occurrence of Ar is identically selected from an aromatic heterocyclic group having 5 to 20 ring atoms, and the hetero atom of the aromatic heterocyclic group is selected from at least one of a nitrogen atom and an oxygen atom.

In some of these embodiments, Ar is selected from formula (2-a),

wherein denotes the attachment site.

In some embodiments, the modified allyl compound is selected from the group consisting of compounds represented by formula (1-1);

in some of these embodiments, the modified allyl compound is selected from the group consisting of compounds represented by formula (1-2);

in another aspect of the present invention, a modified bismaleimide prepolymer is provided, where the modified bismaleimide prepolymer is prepared from the following raw materials: bismaleimide resins and modified allyl compounds as described above.

In some embodiments, the modified bismaleimide prepolymer is prepared from the following raw materials in parts by weight: 100 parts of bismaleimide resin and 40 to 100 parts of the modified allyl compound according to any one of claims 1 to 5.

In some of the embodiments, the modified bismaleimide prepolymer is prepared by further including other allyl compounds selected from at least one of diallyl bisphenol a, diallyl bisphenol S, diallyl bisphenol F and bisphenol a diallyl ether; the mass ratio of the other allyl compounds to the modified allyl compounds is (5-40): 40-80).

The invention further provides the use of a modified bismaleimide prepolymer as described above in the preparation of a resin.

The invention also provides a modified resin composition which consists of a curing accelerator, an inorganic filler and the modified bismaleimide prepolymer.

Advantageous effects

The modified allyl compound is shown as a formula (1), and R is₁Two symmetrical aromatic heterocyclic groups with high rigidity exist as a symmetrical center, so that the modified bismaleimide prepolymer contains the symmetrical aromatic heterocyclic groups with high rigidity, the thermal expansion coefficient of the cured resin composition can be reduced, the modulus retentivity and the heat resistance are improved, the resin composition with a lower thermal expansion coefficient can be obtained by using a lower proportion of inorganic filler, and the problems of reduced resin dispersity and difficult processing caused by excessive filler are solved.

Modification of the inventionIn the bismaleimide prepolymer, a modified bismaleimide prepolymer is prepared by adopting a modified allyl compound shown as a formula (1) and bismaleimide, and R is used₁The modified bismaleimide prepolymer contains the symmetrical aromatic heterocyclic groups with high rigidity, so that the modified bismaleimide prepolymer has the characteristics of low thermal expansion coefficient, high modulus retentivity and high heat resistance after being cured, the resin composition with low thermal expansion coefficient can be obtained by using a low proportion of inorganic filler, and the problems of low resin dispersibility and difficult processing caused by excessive filler are solved.

Detailed Description

In order that the invention may be more fully understood, a more particular description of the invention will now be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the present invention, "+" indicates a connection site.

In the present invention, when the attachment site is not specified in the group, it means that an optional attachment site in the group is used as the attachment site.

In the context of the present invention, a single bond to which a substituent is attached extends through the corresponding ring, meaning that the substituent may be attached at an optional position on the ring, for exampleWherein R is attached to any substitutable site of the phenyl ring.

In the field of traditional electronic substrate preparation, in order to reduce the Coefficient of Thermal Expansion (CTE) of an electric plate substrate, a commonly adopted solution is to add a large amount of inorganic fillers such as silica powder in a resin formula. However, although this proposal is effective in reducing the coefficient of thermal expansion of the resin, due to the limitation of the coefficient of thermal expansion of the inorganic filler such as silica powder itself, it is difficult to further reduce the coefficient of thermal expansion of the plate material by continuously increasing the proportion of the inorganic filler such as silica powder after the amount of the filler added reaches a certain level, and at the same time, the addition of a large amount of the inorganic filler such as silica powder causes difficulty in dispersion of the resin composition, and the workability of the plate material is lowered, resulting in the disadvantage of seriously shortening the service life of the drill.

Based on the research experience of the technicians in the field of electronic circuit boards for many years, the technicians break through the inherent technical limitation of adding a higher proportion of inorganic filler in the traditional technology to reduce the thermal expansion coefficient of the resin, and discover the following steps after creative experimental research: two aromatic heterocyclic groups with high rigidity and symmetrical positions are designed in the structure of the allyl compound, so that bismaleimide is modified to obtain a modified bismaleimide prepolymer, and a large number of experiments are carried out to explore the modified bismaleimide prepolymer, so that the technical scheme of the invention is obtained.

One embodiment of the invention provides a modified allyl compound, which is represented by a formula (1);

A-R₁-A (1)；

a is, for each occurrence, identically selected from the group of formula (2)

Wherein, each occurrence of Ar is selected from aromatic heterocyclic groups with 5-30 ring atoms; indicates the attachment site;

R₁selected from a single bond, or methylene, or-C (CH)₃)₂Or sulfone groups, or a combination of these systems.

It can be understood that in the formula (1), when R is₁Selected from single bondsWhen this is the case, the two Ar's are directly connected by a single bond. Meanwhile, in the compound represented by the formula (2), since each of the unsubstituted carbon atoms on the benzene ring has only one hydrogen atom, Ar and the ester group in the formula (2) are not bonded to the same carbon atom on the same benzene ring.

In some of the embodiments, each occurrence of Ar is identically selected from an aromatic heterocyclic group having 5 to 20 ring atoms, and the hetero atom of the aromatic heterocyclic group is selected from at least one of a nitrogen atom and an oxygen atom.

In some of the embodiments, in the compound of formula (1), each occurrence of Ar is identically selected from the group consisting of heteroaromatic groups having 5 to 10 ring atoms which are unsubstituted, and heteroatoms of the heteroaromatic groups include a nitrogen atom and an oxygen atom.

In some of these embodiments, Ar is selected from formula (2-a),

wherein denotes the attachment site.

Specifically, Ar is selected from formula (2-a),

wherein denotes the attachment site.

Further, the method for preparing the allyl compound comprises the following steps S10-S30.

And step S10, performing cyclization reaction on the compound 1 and the compound 2 under the action of a first catalyst to obtain a first intermediate.

In some embodiments, the step S10 includes steps S11-S12.

And step S11, mixing the compound 1, the compound 2 and the first catalyst in a nitrogen atmosphere, stirring and reacting for 5-15 h at 90-150 ℃, then stopping introducing nitrogen, vacuumizing for 20-30 h, introducing nitrogen, heating to 180-250 ℃, and reacting for 8-15 h at constant temperature.

In some embodiments, in step S10, the molar ratio of compound 1 to compound 2 is 1 (1-2).

Step S12, pouring the reaction product of the cyclization reaction in the step S11 into alkali liquor, precipitating to obtain a crude product, and then carrying out recrystallization.

Further, the solvent for recrystallization is isopropanol.

In some embodiments, the mass concentration of the alkali liquor is 30-60 wt%; further, the alkali in the alkali liquor is selected from basic carbonate, specifically at least one of sodium carbonate or potassium carbonate.

In some of these embodiments, the first catalyst is one or more selected from polyphosphoric acid, polyphosphoric acid esters, and sulfonic acids.

In some of these embodiments, compound 2 is selected from any one of 2, 2-bis (3-amino-4-hydroxyphenyl) propane hydrochloride, 2-bis (3-amino-4-hydroxyphenyl) methane hydrochloride, and 2, 2-bis (3-amino-4-hydroxyphenyl) sulfone hydrochloride.

In some of these embodiments, compound 1 is p-hydroxybenzoic acid.

And step S20, carrying out acyl chlorination reaction on the compound 3 and an acyl chlorination reagent to obtain a second intermediate.

In some of these embodiments, the molar ratio of compound 3 to the acid chloride reagent is 1 (1-2).

In some of these embodiments, the above-described acid chlorination reaction is carried out in toluene; further, the conditions of the acyl chlorination reaction are as follows: reacting for 4-8 h at 50-70 ℃.

In some of these embodiments, the acid chlorination reagent is selected from thionyl chloride.

In some of these embodiments, compound 3 is 4-allyloxybenzoic acid.

It should be noted that step S10 and step S20 have no specific sequential steps, and may be performed sequentially or simultaneously.

And step S30, carrying out substitution reaction on the first intermediate obtained in step S10 and the second intermediate obtained in step S20 under the action of a second catalyst to obtain the modified allyl compound.

In some embodiments, in step S30, the molar ratio of the first intermediate to the second intermediate is (0.1-1): (1-2).

In some of these embodiments, the substitution reaction in step S30 is performed in tetrahydrofuran. Further, the conditions of the substitution reaction are: reacting for 10 to 30 hours at the temperature of between 50 and 70 ℃.

In some of these embodiments, step S30 further includes the step of recrystallizing the crude product of the substitution reaction; a specific recrystallization solution is tetrahydrofuran.

The compounds 1-3, the first intermediate and the second intermediate are shown in formulas (a) - (e):

wherein R is₁The meaning of (A) is as defined above.

In some of these embodiments, the second catalyst is selected from one or more of triethylamine, diethylamine, triethanolamine, and triethyl phosphate.

In some of these embodiments, step S30 further includes the following steps:

recrystallizing the crude product of the substitution reaction; further, the solvent for recrystallization is tetrahydrofuran.

In some embodiments, the modified allyl compound is represented by formula (1-1):

in some embodiments, the modified allyl compound is represented by formula (1-2);

ar and R₁The meaning of (A) is as defined above.

Specifically, the compound of the above formula (1) is as follows:

an embodiment of the present invention further provides a modified bismaleimide prepolymer, which is prepared from the following raw materials: bismaleimide resins and modified allyl compounds as described above.

In the modified bismaleimide prepolymer, the modified bismaleimide prepolymer is prepared by adopting a modified allyl compound shown in a formula (1) and bismaleimide, and R is used₁The modified bismaleimide prepolymer contains the symmetrical aromatic heterocyclic groups with high rigidity, so that the modified bismaleimide prepolymer has the characteristics of low thermal expansion coefficient, high modulus retentivity and high heat resistance after being cured, the resin composition with low thermal expansion coefficient can be obtained by using a low proportion of inorganic filler, and the problems of low resin dispersibility and difficult processing caused by excessive filler are solved.

In some embodiments, the modified bismaleimide prepolymer is prepared from the following raw materials in parts by weight: 100 parts of bismaleimide resin and 40 to 100 parts of the modified allyl compound.

The modified bismaleimide prepolymer with a specific structure is prepared by adopting the modified allyl compound shown in the formula (1) and bismaleimide according to a specific proportion, so that the thermal expansion coefficient of the modified resin composition after curing is further reduced, and the modulus and the heat resistance are improved.

In some embodiments, the raw material for preparing the modified bismaleimide prepolymer further comprises other allyl compounds, and the other allyl compounds are selected from at least one of diallyl bisphenol a, diallyl bisphenol S, diallyl bisphenol F and bisphenol a diallyl ether; the mass ratio of the other allyl compounds to the modified allyl compounds is (5-40) to (40-80).

It is understood that the modified allyl compound of formula (1) can be used alone or in combination with at least one of diallyl bisphenol A, diallyl bisphenol S, diallyl bisphenol F, and bisphenol A diallyl ether.

Further, the preparation of the above-mentioned modified bismaleimide prepolymer includes the following step S10.

And step S10, carrying out prepolymerization on the modified allyl compound and the bismaleimide resin to obtain the modified bismaleimide prepolymer.

Specifically, the modified allyl compound is heated to a molten state, bismaleimide resin is added, and prepolymerization is carried out at 120-180 ℃ to obtain the modified bismaleimide prepolymer.

Further, the prepolymerization time is 30-120 min.

An embodiment of the present invention further provides an application of the modified bismaleimide prepolymer in preparing a resin.

In one embodiment of the present invention, there is provided a modified resin prepared by using a curing accelerator, an inorganic filler and the modified bismaleimide prepolymer as described above.

Furthermore, in the preparation raw materials of the modified resin, the modified bismaleimide prepolymer is 50-100 parts by weight, the inorganic filler is 10-30 parts by weight, and the curing accelerator is 1-5 parts by weight.

In some of these embodiments, the inorganic filler is selected from silica fume and the cure accelerator is selected from dicumyl peroxide.

In another specific example, a composite resin composition is provided, which comprises the following raw materials in parts by mass:

the above compoundIn the synthetic resin composition, modified bismaleimide prepolymer is prepared by adopting modified allyl compound shown as a formula (1) and bismaleimide, and R is used as the modified bismaleimide prepolymer₁As the center, two symmetrical aromatic heterocyclic groups with high rigidity exist, so that the modified bismaleimide prepolymer contains the symmetrical aromatic heterocyclic groups with high rigidity and has the coordination effect among the components with specific proportion, and further the modified resin composition has the characteristics of lower thermal expansion coefficient, high modulus retentivity and high heat resistance.

In some embodiments, the raw material of the composite resin composition comprises 50 to 80 parts by mass of the modified bismaleimide prepolymer.

In some embodiments, the raw material of the composite resin composition includes 30 to 60 parts by mass of cyanate ester resin.

In some embodiments, the raw materials of the composite resin composition comprise 5 to 10 parts by mass of the flame retardant.

In some embodiments, the raw material of the composite resin composition includes 10 to 30 parts by mass of an inorganic filler.

In some embodiments, the raw material of the composite resin composition includes 1 to 5 parts by mass of a curing accelerator.

Preferably, the composite resin composition comprises the following raw materials in parts by mass:

in some embodiments, the raw materials for preparing the composite resin composition further include other functional resins. Furthermore, the modified resin composition also comprises 0-15 parts of other functional resins by mass.

Other functional resins are exemplified herein and include, but are not limited to, at least one of epoxy resins, benzoxazines, polyphenylene ethers, and hydrocarbon resins.

In some embodiments, the cyanate ester resin is at least one selected from the group consisting of bisphenol a type cyanate ester resin, phenol type cyanate ester resin, bisphenol F type cyanate ester resin, multifunctional type cyanate ester resin, bisphenol M type cyanate ester resin, bisphenol E type cyanate ester resin, and dicyclopentadiene bisphenol type cyanate ester resin.

In some of these embodiments, the inorganic filler is selected from at least one of zirconium vanadate, zirconium tungstate, hafnium tungstate, microcrystalline glass, eucryptite, silica, quartz, mica powder, titanium dioxide, magnesium oxide, magnesium hydroxide, talc, aluminum oxide, silicon carbide, boron nitride, aluminum nitride, molybdenum oxide, barium sulfate, zinc molybdate, zinc borate, zinc stannate, zinc oxide, strontium titanate, barium titanate, calcium titanate, clay, kaolin, and the like.

In some embodiments, the flame retardant is a halogen-free flame retardant.

Halogen-free flame retardants are exemplified herein and include, but are not limited to: phosphorus-containing flame retardants such as phosphorus-containing epoxy resins, phosphorus-containing phenolic resins, phosphazene compounds, phosphate ester compounds, and the like; and silicon-containing flame retardants such as silicone polymers, etc.

In some of these embodiments, the cure accelerator is selected from at least one of tertiary amine accelerators, imidazole accelerators, peroxide accelerators, organophosphate accelerators, and transition metal carboxylate accelerators. For example, at least one of 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, zinc octoate, zinc isooctanoate, stannous octoate, dibutyltin dilaurate, zinc naphthenate, cobalt naphthenate, aluminum acetylacetonate, cobalt acetylacetonate, and copper acetylacetonate.

In some embodiments, the raw materials of the composite resin composition further include other auxiliary agents, such as a coupling agent, a toughening agent, and the like.

It is understood that the above composite resin composition may further include additives commonly used in the art, such as coupling agents, toughening agents, etc., according to practical use. The coupling agent and the toughening agent can be selected from the coupling agents and the toughening agents commonly used in the field.

The invention also provides application of the composite resin composition and/or the modified resin composition in preparing electronic substrates.

The resin composition has the characteristics of low thermal expansion coefficient, high-temperature modulus retentivity and high heat resistance, can be applied to the preparation of electronic base materials, such as film substrate materials for packaging, has low thermal expansion coefficient, high modulus retentivity and high heat resistance, and can effectively solve the problem of substrate warping.

Such electronic substrates include, but are not limited to: packaging films, substrates such as printed wiring boards, and the like.

Further, the present invention also provides a composite resin obtained from a raw material including any one of the composite resin compositions and/or modified resin compositions as described above.

The resin has a low coefficient of thermal expansion, high modulus retention and high heat resistance.

An embodiment of the present invention further provides a prepreg, which includes a reinforcing material and a resin material loaded on a surface and inside a structure of the reinforcing material, where the resin material is the resin described above.

In some of these embodiments, the reinforcing material is selected from inorganic fibrous materials or organic fibrous materials.

Inorganic fiber materials include, but are not limited to, glass fibers, carbon fibers, silicon carbide fibers, asbestos fibers, and the like. Organic fiber materials include, but are not limited to, nylon, ultra-high molecular weight polyethylene fibers, aramid fibers, polyimide fibers, polyester fibers, cotton fibers, and the like.

The glass fiber comprises different types of glass fibers such as E, NE, D, S, T and the like.

Further, the preparation of the prepreg includes the following steps S20 to S30.

And step S20, preparing the composite resin composition or the modified resin composition into resin glue solution.

In some of the embodiments, when the raw material is selected from the composite resin composition, the step S20 includes the following steps S21 to S21.

And step S21, mixing the modified bismaleimide prepolymer and the cyanate ester resin with an organic solvent to obtain a mixture.

If the composite resin composition further contains another functional resin, the modified bismaleimide prepolymer, the cyanate ester resin, and the other functional resin are mixed with an organic solvent.

In some of the embodiments, the organic solvent is at least one selected from butanone, toluene, and propylene glycol methyl ether. Further, the organic solvent is selected from a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1.

And step S22, mixing the mixture, the flame retardant and the inorganic filler to obtain uniform resin glue solution.

If the modified resin composition further contains other additives, the mixture, the flame retardant, the inorganic filler and other additives are optionally mixed to obtain a uniform resin cement.

And S30, placing the reinforcing material into the resin glue solution obtained in the S20, soaking and heating to obtain a prepreg.

In some embodiments, in step S30, the heating conditions are: heating at 130-250 deg.c for 2-10 min.

The invention also provides a laminated board, and the raw materials for preparing the laminated board comprise at least one prepreg as described above.

It is understood that the amount of the prepreg used in the raw material for preparing the above laminate may be adjusted according to the actual application.

In one embodiment, the laminate is metal foil clad on one or both sides.

It is understood that the metal foil may be a copper foil or an aluminum foil, and the thickness thereof is not particularly limited and may be adaptively adjusted according to the actual application. Specifically, the metal foil is a copper foil, and the thickness of the metal foil is 3 μm to 70 μm.

Further, the preparation of the above laminate includes the following step S40.

And step S40, carrying out hot pressing on the prepregs under the vacuum condition to obtain the laminated board.

In some of these embodiments, the process parameters of the hot pressing are: vacuum degree less than 2kPa, temperature 150-300 ℃, pressure 10kgf/cm²～30kgf/cm²And the time is 200 min-400 min.

It is understood that when the starting material for the laminate is composed of two or more prepregs, the prepregs are stacked and hot-pressed.

The laminated board has low thermal expansion coefficient, high flame retardance, high modulus retentivity and high heat resistance, and is suitable for preparing high-performance electronic circuit boards with high temperature resistance, ageing resistance, integrated circuit packaging, high frequency, high speed and the like, thereby promoting the development of high-end integrated circuits.

While the present invention will be described with respect to particular embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover by the appended claims the scope of the invention, and that certain changes in the embodiments of the invention will be suggested to those skilled in the art and are intended to be covered by the appended claims.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

Synthesis example 1

The structure of the modified allyl compound shown in the formula (1) is shown as A:

the preparation method comprises the following specific steps:

1) under nitrogen atmosphere, 1mol of 2, 2-bis (3-amino-4-hydroxyphenyl) propane hydrochloride and 2mol of p-hydroxybenzoic acid were added to polyphosphoric acid (PPA), and stirred at 110 ℃ until no chloride ion was present, nitrogen was stopped, and vacuum was applied for 24 hours. Introducing nitrogen, slowly heating, reacting at 190 ℃ for 12h, cooling to 100 ℃, pouring the reaction liquid into a 50 wt% sodium carbonate solution, and filtering. And (3) recrystallizing a crude product obtained after centrifugation, filtration and drying in isopropanol, and carrying out vacuum drying on the crystal to obtain an intermediate product A1 for later use.

2) 1mol of 4-allyloxybenzoic acid and 1mol of thionyl chloride are placed in a three-neck flask filled with toluene under a nitrogen atmosphere, and the reaction is performed under reflux at 60 ℃ for 5h until the solution is clear. After the reaction is finished, the excessive toluene and thionyl chloride are removed by reduced pressure distillation, and the light yellow liquid 4-allyloxybenzoyl chloride is obtained. The product is ready for use.

3) Respectively diluting 2mol of 4-allyloxybenzoyl chloride and 1mol of A1 with tetrahydrofuran, then adding triethylamine to the diluent A1, simultaneously slowly dripping the diluent of the 4-allyloxybenzoyl chloride, refluxing at 60 ℃ for 24 hours, carrying out suction filtration on the suspension while the suspension is hot, retaining the filtrate, cooling to separate out white crystals, and recrystallizing with tetrahydrofuran to obtain the modified allyl compound A.

Synthesis example 2

The structure of the modified allyl compound shown in the formula (1) is shown as B:

the preparation method comprises the following specific steps:

1) under nitrogen atmosphere, 1mol of 2, 2-bis (3-amino-4-hydroxyphenyl) methane hydrochloride and 2mol of p-hydroxybenzoic acid were added to polyphosphoric acid (PPA), and stirred at 100 ℃ until no chloride ion was present, the nitrogen was stopped, and vacuum was applied for 28 hours. Introducing nitrogen, slowly heating, reacting at the constant temperature of 200 ℃ for 15 hours, cooling to 90 ℃, pouring the reaction liquid into a 40 wt% sodium carbonate solution, and filtering. And (3) recrystallizing a crude product obtained after centrifugation, filtration and drying in isopropanol, and carrying out vacuum drying on the crystal to obtain a product B1 for later use.

2) 1mol of 4-allyloxybenzoic acid and 1mol of thionyl chloride are placed in a three-neck flask filled with toluene under a nitrogen atmosphere, and the reaction is performed under reflux at 50 ℃ for 6h until the solution is clear. After the reaction is finished, the excessive toluene and thionyl chloride are removed by reduced pressure distillation, and the light yellow liquid 4-allyloxybenzoyl chloride is obtained. The product is ready for use.

3) Respectively diluting 2mol of 4-allyloxybenzoyl chloride and 1mol of B1 with tetrahydrofuran, then adding diethylamine into the diluent of B1, meanwhile, slowly dripping the diluent of the 4-allyloxybenzoyl chloride, refluxing for 20 hours at 70 ℃, filtering the suspension while hot, retaining the filtrate, cooling to separate out white crystals, and recrystallizing with tetrahydrofuran to obtain the allyl compound B.

The allyl compounds A and B are used in the examples

Example 1

1) And heating 80 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer A.

2) And dissolving 50 parts of the modified bismaleimide prepolymer A, 30 parts of bisphenol A cyanate ester resin and 5 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the condition of stirring, adding 10 parts of spherical silicon dioxide and 1 part of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 50 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Hot-pressing and curing the mixture according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2h under the pressure of (3) to obtain the copper-clad laminate with the thickness of 0.6 mm.

Example 2

1) And heating 80 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer A.

2) And dissolving 80 parts of the modified bismaleimide prepolymer A, 60 parts of bisphenol A cyanate ester resin and 10 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. And under the stirring condition, adding 30 parts of spherical silicon dioxide and 5 parts of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 55 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Example 3

1) And heating 80 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer A.

2) 65 parts of the modified bismaleimide prepolymer A, 45 parts of bisphenol A cyanate ester resin and 7.5 parts of flame retardant are dissolved in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the stirring condition, 20 parts of spherical silicon dioxide and 3 parts of 2-methylimidazole are added, and stirring is continued to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

5) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) placing the glue solution dipped in the modified bismaleimide prepolymer resin composition into a hot air circulation oven to bake for 3min at 180 ℃ to obtain a prepreg with the resin content of 52 wt%.

6) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Example 4

1) And heating 80 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer A.

2) And dissolving 100 parts of the modified bismaleimide prepolymer A, 70 parts of bisphenol A cyanate ester resin and 20 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. And under the stirring condition, adding 40 parts of spherical silicon dioxide and 8 parts of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 57 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Example 5

1) Heating 40 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain modified bismaleimide prepolymer B.

2) And dissolving 80 parts of the modified bismaleimide prepolymer B, 60 parts of bisphenol A cyanate ester resin and 10 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. And under the stirring condition, adding 30 parts of spherical silicon dioxide and 5 parts of 2-methylimidazole, and continuously stirring to obtain the modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 55 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Example 6:

1) and heating 80 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer A.

2) And dissolving 80 parts of the modified bismaleimide prepolymer A, 60 parts of bisphenol A type cyanate ester resin, 10 parts of bisphenol A type benzoxazine and 10 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. And under the stirring condition, adding 30 parts of spherical silicon dioxide and 5 parts of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) Soaking in the modified bismaleimide prepolymer resin composition glue solution, placing in a hot air circulation oven, and baking at 180 deg.C for 3min to obtain the final product with resin content of 55wt% of prepreg.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Comparative example 1

1) Heating 80 parts of 2, 2-diallyl bisphenol A to a molten state, adding 100 parts of bismaleimide resin, reacting at 150 ℃, pre-polymerizing for 60min, and cooling to room temperature to obtain modified bismaleimide prepolymer C.

2) And dissolving 50 parts of the modified bismaleimide prepolymer C, 30 parts of bisphenol A cyanate ester resin and 5 parts of flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the condition of stirring, adding 10 parts of spherical silicon dioxide and 1 part of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) placing the glue solution impregnated in the modified bismaleimide prepolymer resin composition in a hot air circulation oven, and baking at 180 ℃ for 3min to obtain a prepreg with the resin content of 50 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Under the pressure of (3), the copper clad laminate with the thickness of 0.6mm is prepared after hot pressing and curing according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2 h.

Comparative example 2:

1) 50 parts of bismaleimide resin, 30 parts of bisphenol A cyanate ester resin and 5 parts of flame retardant are dissolved in a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the condition of stirring, 10 parts of spherical silica and 1 part of 2-methylimidazole are added, and stirring is continued to obtain a uniform glue solution, namely the bismaleimide resin composition.

2) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the bismaleimide resin composition glue solution in a hot air circulation oven, and baking at 180 ℃ for 3min to obtain a prepreg with the resin content of 50 wt%.

3) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²And (3) hot-pressing and curing at 180 ℃ 1h +200 ℃ 2h +240 ℃ 2h +260 ℃ 2h to obtain the copper-clad laminate with the thickness of 0.6 mm.

Comparative example 3

1) Heating 80 parts of 4, 4-bis (4-allylbenzoic acid) biphenyl ester to a molten state, adding 100 parts of bismaleimide resin, reacting at 150 ℃, pre-polymerizing for 60min, and cooling to room temperature to obtain a modified bismaleimide prepolymer D;

2) and dissolving 50 parts of the modified bismaleimide prepolymer D, 30 parts of bisphenol A cyanate ester resin and 5 parts of a flame retardant in a mixed solvent of butanone, toluene and propylene glycol methyl ether in sequence, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the condition of stirring, adding 10 parts of spherical silicon dioxide and 1 part of 2-methylimidazole, and continuously stirring to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 50 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²Hot-pressing and curing the mixture according to the program of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2h under the pressure of (3) to obtain the copper-clad laminate with the thickness of 0.6 mm.

The raw materials of examples 1 to 6 and comparative examples 1 to 3 are shown in Table 1

TABLE 1

Performance testing

The copper clad laminates manufactured in examples 1 to 6 and comparative examples 1 to 3 were subjected to performance tests, and the results are shown in table 2 below:

TABLE 2

Example 7

1) Heating 70 parts of allyl compound A to a molten state, adding 100 parts of bismaleimide resin, carrying out reaction and prepolymerization at 150 ℃ for 60min, and cooling to room temperature to obtain the modified bismaleimide prepolymer. And then dissolving the modified bismaleimide prepolymer in a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein the mass ratio of the butanone, the toluene and the propylene glycol methyl ether is 1:1: 1. Under the stirring condition, 5 parts of dicumyl peroxide (DCP) and 30 parts of silica powder are added, and stirring is continued to obtain a uniform modified bismaleimide prepolymer resin composition glue solution.

3) A 2116 type glass fiber cloth (basis weight 105 g/m)²) And (3) soaking the prepreg in the modified bismaleimide prepolymer resin composition glue solution, placing the prepreg in a hot air circulation oven, and baking the prepreg at 180 ℃ for 3min to obtain the prepreg with the resin content of 55 wt%.

4) Laminating 6 prepregs, covering a sheet of electrolytic copper foil with a thickness of 12 μm on each of the upper and lower surfaces of the laminate, placing in a vacuum press with programmable temperature and pressure control, and vacuum-processing at 20kgf/cm²At a pressure of 180 ℃ 1h +200 ℃ 2h +240 ℃ 2hAnd forming to obtain the copper clad laminate with the thickness of 0.6 mm.

Example 8

Example 8 is essentially the same as example 7, except that: in step 1) of example 8, the modified polypropylene compound a was replaced with the modified polypropylene compound B, and in step 2) a prepreg was obtained with a content of 50 wt%.

The remaining steps and conditions were the same as in example 7.

Example 9

Example 9 is essentially the same as example 7, except that: in step 1) of example 9, 70 parts of the modified polypropylene compound a was replaced with 50 parts of the modified polypropylene compound a, and a prepreg having a content of 50 wt% was obtained in step 2).

The remaining steps and conditions were the same as in example 7.

Example 10

Example 10 is essentially the same as example 7, except that: in step 1) of example 10, 70 parts of the modified polypropylene compound a was replaced with 60 parts of the modified polypropylene compound B, and a prepreg having a content of 50 wt% was obtained in step 2).

The remaining steps and conditions were the same as in example 7.

Comparative example 4

Comparative example 4 is essentially the same as example 7 except that in step 1), modified allyl compound a is replaced with 2, 2-diallylbisphenol a (dabpa). The prepreg with the content of 50 wt% is obtained in step 2).

The remaining steps and conditions were the same as in example 7.

Comparative example 5

Comparative example 5 is substantially the same as example 7 except that in step 1), the modified allyl compound a was not added and that in step 2), a prepreg was obtained in an amount of 50 wt%.

The remaining steps and conditions were the same as in example 7.

The raw materials in examples 7 to 10 and comparative examples 4 to 5 are shown in Table 3

TABLE 3

Performance testing

The copper clad laminates manufactured in examples 7 to 10 and comparative examples 4 to 5 were subjected to performance tests, and the results were as follows

Shown in Table 4: TABLE 4

The above raw materials are all available from commercial products:

bisphenol A benzoxazines are available from Hensman as LZ 8290H 62.

Bismaleimide resins are available from Honghu bismaleimide resin works under the model BMI-01.

Bisphenol a cyanate ester was purchased from tianqi nova, model C01 MO.

The flame retardant is available from tsukamur chemical japan, model number SPB-100.

Spherical silica is available from Yadu code under the type SO-C2.

Diallyl bisphenol a is available from Honghu Bimama resin works.

2-methylimidazole is commercially available from four countries.

The test method is as follows:

1) peel strength: the test method was performed according to IPC-TM-6502.4.8;

2) glass transition temperature (Tg): testing according to IPC-TM6502.4.25D;

3) thermal decomposition temperature (Td): testing according to IPC-TM6502.4.24.6;

4) modulus of elasticity: testing according to GB/T22315-;

5) CTE thermal expansion performance test: testing according to IPC-TM6502.4.24;

6) flame retardant rating: testing according to IPC-TM6502.3.10

7) Resin compatibility test: and (3) placing the resin in a normal temperature environment, standing and observing whether a substance is separated out.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.