阅读说明：本技术 功率半导体模块、缓冲电路以及感应加热电源装置 (Power semiconductor module, buffer circuit, and induction heating power supply device ) 是由 金井隆彦 杉本真人 吉田春树 于 2017-08-16 设计创作，主要内容包括：提供一种功率半导体模块、一种用于功率半导体模块的缓冲电路以及具有功率半导体模块的感应加热电源装置。功率半导体模块包括：功率半导体器件,其被配置为进行切换操作；壳体,功率半导体器件设置在该壳体内部；控制电路板,该控制电路板设置在壳体的上表面之上,用于所述功率半导体器件的控制端子设置于壳体的上表面并且连接至控制电路板；以及屏蔽板,该屏蔽板布置于控制电路板和壳体的上表面之间,以覆盖壳体的上表面并且覆盖壳体的至少一个侧表面。(Provided are a power semiconductor module, a snubber circuit for the power semiconductor module, and an induction heating power supply device having the power semiconductor module. The power semiconductor module includes: a power semiconductor device configured to perform a switching operation; a housing inside which the power semiconductor device is disposed; a control circuit board disposed above the upper surface of the case, control terminals for the power semiconductor devices being disposed on the upper surface of the case and connected to the control circuit board; and a shielding plate disposed between the control circuit board and the upper surface of the case to cover the upper surface of the case and to cover at least one side surface of the case.)

1. A snubber circuit for a power semiconductor module having an arm including two power semiconductor devices capable of switching operation and connected in series,

wherein the power semiconductor module has a pair of positive and negative side direct current input terminals electrically connected to the arm and an output terminal, the pair of positive and negative side direct current input terminals being provided to a first side surface of the power semiconductor module, and the output terminal being provided to a second side surface of the power semiconductor module at an opposite side of the first side surface,

wherein the buffer circuit includes:

a circuit board having an insulating base portion extending along a side surface of the power semiconductor module and bridging between a corresponding one of the direct current input terminals and a corresponding one of the output terminals, and a conductor layer provided on at least one of an upper surface and a lower surface of the insulating base portion and forming a circuit pattern connected to the corresponding direct current input terminal and the corresponding output terminal, respectively; and

an electronic component mounted on the circuit board in an exposed manner.

2. The buffer circuit according to claim 1, wherein the conductor layer is provided on each of an upper surface and a lower surface of the insulating base portion, and the conductor layer on the upper surface side of the insulating base portion and the conductor layer on the lower surface side of the insulating base portion each form the same circuit pattern, and

wherein the electronic component mounting part of the circuit board is configured as a through hole such that the conductor layer on the upper surface side of the insulating base part and the conductor layer on the lower surface side of the insulating base part are electrically and thermally connected to each other via the through hole.

3. The buffer circuit according to claim 1 or 2, wherein the total thickness of the conductor layer is equal to or greater than 0.1mm and less than 2.0 mm.

4. The snubber circuit of any one of claims 1-3, wherein the electronic component comprises a soldered component, and

wherein a solder resist film is formed on a front surface of the conductor layer and around the electronic component mounting part of the circuit board to which the soldered component is soldered.

5. The buffer circuit according to claim 4, wherein the solder resist film is formed on a front surface of the conductor layer other than the electronic component mounting part of the circuit board.

6. A power semiconductor module, comprising:

an arm including two power semiconductor devices capable of a switching operation and connected in series;

a pair of positive and negative side dc input terminals and an output terminal, the pair of positive and negative side dc input terminals and the output terminal being electrically connected to the arm; and

buffer circuits connected between the DC input terminals and the output terminals, respectively,

wherein the pair of positive-side and negative-side direct-current input terminals are provided on a first side surface of the power semiconductor module, and the output terminal is provided on a second side surface of the power semiconductor module at an opposite side of the first side surface, and

wherein each of the snubber circuits includes a circuit board having an insulating base portion extending along a side surface of the power semiconductor module and bridging between a corresponding one of the dc input terminals and a corresponding one of the output terminals, and an electronic component, the conductor layer being provided on at least one of an upper surface and a lower surface of the insulating base portion and forming a circuit pattern connected to the corresponding dc input terminal and the corresponding output terminal, respectively, and the electronic component being mounted on the circuit board in an exposed manner.

7. An induction heating power supply apparatus includes an inverter configured to convert direct current into alternating current,

wherein the inverter is configured as a bridge circuit having a plurality of power semiconductor modules according to claim 6 connected in parallel.

Technical Field

The present invention relates to a power semiconductor module, a snubber circuit used for the power semiconductor module, and an induction heating power supply device.

Background

In heat treatment of steelworks, induction heating has been used as a workpiece heating method. In induction heating, an alternating current is supplied to a heating coil, and a workpiece is heated by an induction current induced by the workpiece placed in a magnetic field formed by the heating coil.

A power supply device for supplying alternating current to a heating coil generally converts alternating current of a commercial power supply into direct current by a converter, smoothes pulsating current of the direct current by a capacitor, converts the smoothed direct current into alternating current by an inverter, and generates high-frequency alternating current to be supplied to the heating coil (see, for example, JP 2009-.

The inverter is generally configured as a full bridge circuit having a plurality of arms connected in parallel, each arm having two power semiconductor devices capable of switching operation and connected in series. The inverter generates high-frequency alternating current by a high-speed switching operation of the power semiconductor device. Typically, each arm forming the bridge circuit is individually constructed as a module.

According to the related art, a pair of positive and negative direct current input terminals electrically connected to an arm are adjacently disposed on an upper surface of a power semiconductor module (an upper surface of a case in which a power semiconductor device is disposed inside), and output terminals are also disposed on the upper surface of the module (see, for example, JPH8-33346 a). In a power semiconductor module according to another related art, a pair of direct-current input terminals are adjacently disposed to one side surface of the module (one side surface of the case), and output terminals are disposed to the opposite side surface of the module (the opposite side surface of the case) (see, for example, JP 2004-.

In the power semiconductor module in which the input terminal and the output terminal are provided on the side surface of the case, the upper surface of the case is not closed by a wiring member such as a bus bar connected to the input terminal and the output terminal. Therefore, a control circuit board in which a control circuit for controlling the switching operation of the power semiconductor device is mounted may be disposed above the upper surface of the housing so that the control terminal electrically connected to the power semiconductor device can be directly connected to the control circuit board (see, for example, JP 2006-.

The high-speed switching operation of each power semiconductor device abruptly changes the voltage applied to the power semiconductor device and the current flowing into the power semiconductor device. Due to the sudden changes in voltage and current, noise is generated at the periphery of the power semiconductor device. When noise occurs on a control circuit mounted in a control circuit board or on a control line extending from the control circuit board, there is a concern that the switching operation of the power semiconductor device may be hindered.

In the case where the control circuit board is disposed on the upper surface of the housing, the control circuit can be shortened. Therefore, the possibility that noise may occur on the control line can be reduced. On the other hand, the control circuit disposed in the vicinity of the power semiconductor device is easily exposed to noise. Therefore, in the power semiconductor module according to JP 2006-.

Here, the noise includes: electrostatic induced noise propagating through stray electrostatic capacitance between adjacent conductors; and electromagnetic induction noise induced by electromagnetic induction between adjacent inductors. The shield plate disposed between the upper surface of the housing and the control circuit board to cover the upper surface of the housing is grounded to enable a relatively high shielding effect against the static induction noise. However, the magnetic flux that generates electromagnetic induction can wander around, so that there are concerns that: a satisfactory shielding effect against electromagnetic induction noise cannot be obtained by the shielding plate covering only the upper surface of the housing.

The current variation di/dt caused by the high speed switching operation of the power semiconductor device generates a surge voltage L x di/dt between the two ends of the power semiconductor device due to the parasitic inductance L of the conductive path between the power semiconductor device and the voltage source. There is a concern that an excessive surge voltage may damage the power semiconductor device. To protect the power semiconductor devices, a snubber circuit for absorbing surge voltage may be added to the power semiconductor module (see, for example, JPH8-33346 a).

The snubber circuit for a power semiconductor module according to JPH8-33346a is a simple package snubber connected between a pair of positive and negative dc input terminals and provided as a package for two power semiconductor devices included in the power semiconductor module. In the snubber circuit, a capacitor and a portion of a pair of terminals connected to the capacitor are molded by resin to form a module, and the pair of terminals are directly connected to a pair of positive and negative direct-current input terminals adjacently provided on an upper surface of the power semiconductor module. In addition to the simple package buffer, it is also possible to use, as the buffer circuit, each buffer connected between the direct current input terminal and the output terminal of the power semiconductor module and provided separately for the power semiconductor device.

In a power semiconductor module in which a pair of positive and negative direct current input terminals are adjacently disposed on one side surface of the module and an output terminal is disposed on the opposite side surface of the module, an existing snubber module in which an electronic component such as a capacitor and a part of terminals are molded by resin cannot be directly connected to the direct current input terminals and the output terminals due to the space between the terminals. The existing buffer modules are not suitable for use as such a separate buffer for power semiconductor modules.

Further, in the snubber circuit, the constant of the electronic component such as the capacitor can be selected in accordance with the switching frequency or the like of each power semiconductor device. However, it is practically impossible to change the electronic components of the existing bumper module in which the electronic components are molded by resin. Therefore, whenever there is a change in the design of the inverter, such as a change in the switching frequency of the power semiconductor device, a bumper module in which electronic components are molded by resin has to be designed and manufactured. When a mold for molding an existing bumper module is used as it is, the degree of freedom of design is limited. When a new mold is manufactured, the cost for manufacturing the mold increases.

Further, in a bumper module in which electronic components are molded by resin, there is a fear that dissipation of heat generated by the electronic components may be hindered. Therefore, deterioration of the electronic component due to heat becomes a problem.

Disclosure of Invention

Exemplary aspects of the present invention provide a power semiconductor module and an induction heating power supply apparatus in which shielding for a control circuit can be enhanced to improve operation stability.

According to an exemplary aspect of the invention, a power semiconductor module includes: a power semiconductor device configured to perform a switching operation; a housing, inside which the power semiconductor device is disposed; a control circuit board disposed over an upper surface of the case, control terminals for the power semiconductor devices being disposed on the upper surface of the case and connected to the control circuit board; and a shield plate disposed between the control circuit board and the upper surface of the case to cover the upper surface of the case and to cover at least one side surface of the case.

The exemplary aspects of the present invention also provide a snubber circuit that can be suitably used for a power semiconductor module having a pair of positive and negative direct-current input terminals provided on a first side surface and an output terminal provided on a second side surface opposite to the first side surface, and that is excellent in versatility and durability, and a power semiconductor module and an induction heating power supply apparatus in which the snubber circuit is used to enhance the protection of a power semiconductor device.

According to an exemplary aspect of the present invention, a snubber circuit is provided for a power semiconductor module having an arm including two power semiconductor devices capable of switching operation and connected in series. The power semiconductor module has a pair of positive and negative side direct current input terminals electrically connected to the arm, which are provided on a first side surface of the power semiconductor module, and an output terminal provided on a second side surface of the power semiconductor module on the opposite side of the first side surface. The buffer circuit includes: a circuit board having an insulating base portion extending along a side surface of the power semiconductor module and bridging between a corresponding one of the direct current input terminals and a corresponding one of the output terminals, and a conductor layer provided on at least one of an upper surface and a lower surface of the insulating base portion and forming a circuit pattern connected to the corresponding direct current input terminal and the corresponding output terminal, respectively; and an electronic component mounted on the circuit board in an exposed manner.

According to an exemplary aspect of the invention, a power semiconductor module includes: an arm including two power semiconductor devices capable of a switching operation and connected in series; a pair of positive-side and negative-side direct-current input terminals and output terminals electrically connected to the arm; and buffer circuits connected between the dc input terminal and the output terminal, respectively. A pair of positive-side and negative-side direct-current input terminals are provided on a first side surface of the power semiconductor module, and an output terminal is provided on a second side surface of the power semiconductor module on the opposite side of the first side surface. Each of the buffer circuits includes a circuit board having an insulating base portion extending along a side surface of the power semiconductor module and bridging between a corresponding one of the dc input terminals and a corresponding one of the output terminals, and an electronic component, the conductor layer being provided on at least one of an upper surface and a lower surface of the insulating base portion and forming a circuit pattern connected to the corresponding dc input terminal and the corresponding output terminal, respectively, and the electronic component being mounted to the circuit board in an exposed manner.

According to an illustrative aspect of the present invention, an induction heating power supply apparatus includes an inverter configured to convert direct current into alternating current, the inverter being configured as a bridge circuit having a plurality of the above-described power semiconductor modules connected in parallel.

Drawings

Fig. 1 is a circuit diagram showing an example of an induction heating power supply apparatus according to an embodiment of the present invention.

Fig. 2 is a perspective view of an example of a power semiconductor module provided in an inverter of the induction heating power supply apparatus of fig. 1.

Fig. 3 is an exploded perspective view of the power semiconductor module of fig. 2.

Fig. 4 is a circuit diagram showing an example of an induction heating power supply apparatus according to another embodiment of the present invention.

Fig. 5 is a perspective view of an example of a power semiconductor module provided in an inverter of the induction heating power supply apparatus of fig. 4.

Fig. 6 is a cross-sectional view of an example of a snubber circuit of the power semiconductor module of fig. 5.

Fig. 7 is a cross-sectional view of another example of a snubber circuit.

Fig. 8 is a cross-sectional view of another example of a snubber circuit.

Fig. 9 is a cross-sectional view of another example of a snubber circuit.

Detailed Description

Fig. 1 shows an induction heating power supply apparatus 100 according to an embodiment of the present invention.

The induction heating power supply apparatus 100 includes a dc power supply unit 4, a smoothing unit 5, and an inverter 106. The dc power supply unit 4 includes a converter unit 3, and the converter unit 3 converts ac power supplied from the commercial ac power supply 2 into dc power. The smoothing unit 5 smoothes the pulsating current of the dc power output from the dc power supply unit 4. The inverter 106 converts the direct current smoothed by the smoothing unit 5 into a high-frequency alternating current.

The inverter 106 is configured as a full bridge circuit including a first arm and a second arm. The first arm comprises two power semiconductor devices Q1, Q2 connected in series. The second arm comprises two power semiconductor devices Q3, Q4 connected in series. The first and second arms are connected to the smooth portion 5 and the first and second arms are connected in parallel. In the full bridge circuit, a series connection point P1 between the power semiconductor devices Q1, Q2 in the first arm and a series connection point P2 between the power semiconductor devices Q3, Q4 in the second arm serve as output terminals. The heating coil 7 is connected between the series connection points P1 and P2 by a transformer 8. The freewheeling diodes are connected in anti-parallel with the power semiconductor devices, respectively.

For example, various power semiconductor devices capable of switching operation, such as an Insulated Gate Bipolar Transistor (IGBT) and a Metal Oxide Semiconductor Field Effect Transistor (MOSFET), can be used as the respective power semiconductor devices. For example, a material using silicon (Si) and a material using silicon carbide (SiC) can be used as the semiconductor material.

In each of the first and second arms, a side connected to the positive side of the smoothing portion 5 is set to a high side, and a side connected to the negative side of the smoothing portion 5 is set to a low side. The power semiconductor device Q1 on the high side of the first arm turns on and off in synchronization with the power semiconductor device Q4 on the low side of the second arm. The power semiconductor device Q2 on the low side of the first arm turns on and off in synchronization with the power semiconductor device Q3 on the high side of the second arm. When the power semiconductor devices Q1 and Q4 and the power semiconductor devices Q2, Q3 are alternately turned on, high-frequency power is supplied to the heating coil 7.

The power semiconductor devices Q1, Q2 of the first arm and the freewheel diodes for the power semiconductor devices Q1, Q2 are sealed with a molding resin to form a module. The power semiconductor devices Q3, Q4 of the second arm and the freewheel diodes for the power semiconductor devices Q3, Q4 are also sealed with a molding resin to form a module.

The power semiconductor module including the power semiconductor devices Q1, Q2 of the first arm and the power semiconductor module including the power semiconductor devices Q3, Q4 of the second arm have the same configuration. A power semiconductor module including the power semiconductor devices Q1, Q2 of the first arm will be described below with reference to fig. 2 and 3.

Fig. 2 and 3 show configuration examples of the power semiconductor module 110.

The power semiconductor module 110 includes a pair of positive and negative dc input terminals 11a and 11b, output terminals 12a and 12b, and control terminals 13a and 13b as external connection terminals. The external connection terminals are provided to be exposed to the outside of the case 14. The case 14 is made of a molding resin that seals the power semiconductor devices Q1, Q2 and the freewheel diodes for the power semiconductor devices Q1, Q2.

The positive side dc input terminal 11a and the negative side dc input terminal 11b are provided on the first side surface 14a of the case 14. The housing 14 is formed in a substantially rectangular parallelepiped shape. The positive-side dc input terminal 11a is electrically connected to the power semiconductor device Q1-side end portion including the first arm of the power semiconductor devices Q1, Q2. The negative-side dc input terminal 11b is electrically connected to the power semiconductor device Q2-side end portion of the first arm. The positive-side direct-current input terminal 11a is connected to the positive side of the smoothing section 5 using a wiring member made of a bus bar or the like. The negative-side direct-current input terminal 11b is connected to the negative side of the smoothing portion 5 using a wiring member made of a bus bar or the like.

The output terminals 12a, 12b are provided to a second side surface 14b of the housing 14 at a side opposite to the first side surface 14 a. Both of the output terminals 12a, 12b are electrically connected to a series connection point P1 (see fig. 1) between the power semiconductor devices Q1, Q2 as the output terminals of the first arm. The output terminals 12a, 12b may be combined into one terminal. The output terminals 12a, 12b are connected to one end of the heating coil 7 using a wiring member made of a bus bar or the like.

The control terminals 13a, 13b are provided on the upper surface 14e of the housing 14. Control terminal 13a is electrically connected to the gate of power semiconductor device Q1. The control terminal 13b is electrically connected to the gate of the power semiconductor device Q2. In the illustrated example, the control terminal 13a is provided at an edge portion of the upper surface 14e connected to the third side surface 14c of the housing 14, and the control terminal 13b is provided at an edge portion of the upper surface 14e connected to the fourth side surface 14d of the housing 14.

The heat sink 18 is provided on the lower surface side of the case 14. The case fixing part 20 fixed to the heat sink 18 is provided to the first and second side surfaces 14a and 14b of the case 14. An insertion hole is formed in the case fixing portion 20 so that a bolt 21 as an example of a fastener for fixing the case fixing portion 20 to the heat sink can be inserted through the insertion hole. The annular washer 22 is fitted into the insertion hole. The case fixing portions 20 are respectively fixed to the heat sink 18 by bolts 21. The heat sink 18 is in close contact with the lower surface of the housing 14.

The heat generated by the power semiconductor devices Q1, Q2 and the freewheel diodes for the power semiconductor devices Q1, Q2 disposed inside the case 14 is transferred to the heat sink 18 through the molding resin forming the case 14. The heat is then dissipated through the heat sink 18. The radiator 18 is grounded through a case frame or the like of the induction heating power supply device 100 supporting the radiator 18 in consideration of noise resistance and safety.

The power semiconductor module 110 also has a control circuit board 16 and a shield board 17.

A control circuit for controlling the switching operation of the power semiconductor devices Q1, Q2 is mounted in the control circuit board 16. Screw holes 24 serving as attachment portions to which the control circuit board 16 is attached are provided at four corners of the upper surface 14e of the housing 14, respectively. A spacer 25 serving as a fitting attached to the control circuit board 16 is screwed into the screw hole 24. The control circuit board 16 is supported on the spacer 25 so that the control circuit board 16 is disposed above the upper surface 14e with a gap formed between the control circuit board 16 and the upper surface 14 e. The control circuit board 16 is screwed to a spacer 25 to be attached to the housing 14.

The control terminals 13a, 13b provided on the upper surface 14e of the housing 14 are soldered to the control circuit board 16 via through holes provided in the control circuit board 16 above the upper surface 14e, respectively.

The shield plate 17 is made of a conductor such as metal. The shield plate 17 is disposed between the upper surface 14e of the housing 14 and the control circuit board 16 disposed above the upper surface 14 e. Thereby, the shielding plate 17 covers the upper surface 14 e. Further, the shield plate 17 covers the third side surface 14c and the fourth side surface 14 d. The third side surface 14c is connected to an edge portion of the upper surface 14e where the control terminal 13a is provided. The fourth side surface 14d is connected to the edge of the upper surface 14e where the control terminal 13b is provided. The control terminals 13a, 13b are exposed through windows 27a and 27b formed at appropriate positions of the shield plate 17, respectively.

The shield plate 17 is fixed to the housing 14 by a spacer 25 serving as a fitting to which the control circuit board 16 is attached. Through holes 28 that respectively overlap the screw holes 24 at the four corners of the upper surface 14e of the housing 14 are formed in the shield plate 17. The spacer 25 is screwed into the threaded hole 24 through the through hole 28. The edge portion of the shield plate 17 surrounding the through hole 28 is interposed between the edge portion of the upper surface 14e surrounding the screw hole 24 and the spacer 25. Thereby, the shield plate 17 is fixed to the housing 14.

The shield plate 17 shields the control circuit mounted in the control circuit board 16 and the control wiring extending from the control circuit board 16 from noise generated around the power semiconductor devices Q1, Q2 provided inside the case 14. The control lines are referred to as control terminals 13a, 13b directly connected to the control circuit board 16.

The control circuit board 16 is disposed on the upper surface 14e of the housing 14. The control terminals 13a, 13b are also provided on the upper surface 14 e. A shield plate 17 covering the upper surface 14e is interposed between the power semiconductor devices Q1, Q2 and the control circuit board 16 with the control terminals 13a, 13 b. Therefore, the static induction noise generated around the power semiconductor devices Q1, Q2 flows into the shield plate 17 through the stray static capacitance between the power semiconductor devices Q1, Q2 and the shield plate 17.

From the viewpoint of enhancing the shielding effect of the shielding plate 17 against the static electricity induction noise, it is preferable that the shielding plate 17 is grounded. In the example, the heat sink 18 in close contact with the lower surface of the housing 14 is grounded, and the shield plate 17 is grounded through the heat sink 18. The shield plate fixing portion 29 is provided in the shield plate 17. The shield plate fixing portions 29 are superposed on a corresponding one of the case fixing portions 20 of the case 14 fixed to the heat sink 18. The shield plate fixing portion 29 is interposed between the corresponding case fixing portion 20 and the corresponding one of the bolts 21 that fixes the corresponding case fixing portion 20 to the heat sink 18. The washer 22 is fitted into an insertion hole through which the bolt 21 of the housing fixing portion 20 is inserted. The shield plate fixing portions 29 are electrically connected to the heat sink 18 through a corresponding one of the washers 22 and a corresponding one of the bolts 21. Thereby, the shield plate 17 is grounded through the heat sink 18. Due to the grounded shield plate 17, the control circuit mounted in the control circuit board 16 and the control terminals 13a, 13b serving as control lines are shielded from static induction noise.

Further, the control circuit mounted in the control circuit board 16 and the control terminals 13a, 13b serving as control lines are also shielded from electromagnetic induction noise generated around the power semiconductor devices Q1, Q2 provided inside the case 14 by the shield plate 17.

The magnetic flux that generates electromagnetic induction radiates not only from the upper surface 14e of the housing 14 but also from the side surfaces of the housing 14. The magnetic flux radiated from the side surface is distributed to wander around. As a result, the magnetic flux is interconnected with the control circuit and the control terminals 13a, 13b to thereby generate electromagnetic induction. Therefore, in order to resist the magnetic flux radiated from the side surface of the housing 14 and traveling around, the shielding plate 17 covers not only the upper surface 14e of the housing 14 but also the third side surface 14c and the fourth side surface 14 d. In addition to the magnetic flux radiated from the upper surface 14e, the magnetic flux radiated from the third side surface 14c and the fourth side surface 14d is also blocked by the shielding plate 17. Therefore, electromagnetic induction noise induced by the control circuit and the control terminals 13a, 13b can be reduced.

In particular, in the example, the control terminals 13a, 13b are provided to the edge portion of the upper surface 14e of the housing 14, and the third side surface 14c and the fourth side surface 14d of the housing 14 connected to the edge portion are covered with the shield plate 17. Therefore, the electromagnetic induction noise induced by the control terminals 13a, 13b can be effectively reduced.

The plate thickness of the shield plate 17 can be set based on the penetration depth of eddy current flowing into the shield plate 17 due to electromagnetic induction. Eddy currents flowing in a conductor placed in an alternating magnetic field are converted into heat due to the resistance of the conductor. The energy of the alternating magnetic field is converted into heat and consumed by the shielding plate 17 to thereby produce a shielding effect of the shielding plate 17 against electromagnetic induction noise. The major part of the eddy currents flows into the front side of the conductor due to the skin effect. The penetration depth refers to a depth from the front face at which the current density decreases by a factor of 0.37 at the front face. The depth of penetration can be expressed by the following formula.

δ＝503√(ρ/μf)

Wherein, δ: penetration depth (m), ρ: volume resistivity of conductor (x 10)^-8Ω m), μ: relative permeability of the conductor, f: frequency (Hz)

For example, it is assumed that the shield plate 17 is made of copper (volume resistivity ρ of 1.55, relative permeability μ of 1), and the frequency of the switching operation of each of the power semiconductor devices Q1, Q2fIs 200 kHz. In this case, the penetration depth δ is equal to 0.14mm based on the above formula. The field strength reduction is known to be 26db (95%) at a plate thickness three times the penetration depth delta. Therefore, the plate thickness of the shielding plate 17 can be set to 0.42mm to 0.70mm, and three to five times as large as the penetration depth δ.

In this way, not only the upper surface 14e of the housing 14, on which the control circuit board 16 is placed and on which the control terminals 13a, 13b are provided, is covered by the shielding plate 17, but also at least some of the side surfaces of the housing 14 are covered by the shielding plate 17. Therefore, shielding of the control terminals 13a, 13b for the control circuit and serving as the control line can be improved, so that stability of the power semiconductor module 110 and the induction heating power supply device 100 can be improved.

Fig. 4 shows an induction heating power supply apparatus 200 according to another embodiment of the present invention. In the following description, the configurations similar to or the same as those of the induction heating power supply apparatus 100 of fig. 1 will be correspondingly identified by the same reference numerals, respectively, and a repetitive description thereof will be omitted.

The induction heating power supply apparatus 200 has an inverter 206 different from the inverter 106 of the induction heating power supply apparatus 100.

The high-speed switching operation of the respective power semiconductor devices Q1, Q2, Q3, Q4 abruptly changes the currents flowing into the power semiconductor devices Q1, Q2, Q3, Q4. Due to the parasitic inductance of the conduction path between the power semiconductor devices Q1, Q2, Q3, Q4 and the smoothing section 5 serving as a voltage source, a surge voltage is generated between both ends of the power semiconductor devices Q1, Q2, Q3, Q4. In order to absorb the surge voltage, corresponding snubber circuits SC1, SC2, SC3, SC4 are provided for the power semiconductor devices Q1, Q2, Q3, Q4 of the inverter 206, respectively.

In the example shown in fig. 4, the snubber circuits SC1, SC2, SC3, SC4 are so-called non-discharge type RCD snubber circuits configured to include a resistor R, a capacitor C, and a diode D.

In the snubber circuit SC1 for the power semiconductor device Q1 on the high side of the first arm, the capacitor C and the diode D are connected in series between both ends of the power semiconductor device Q1 (between the collector and the emitter in the case where the power semiconductor device Q1 is an IGBT or between the drain and the source in the case where the power semiconductor device Q1 is a MOSFET), and the resistor R is connected between the series connection point between the capacitor C and the diode D and the negative side of the smoothing section 5.

Further, in the snubber circuit SC2 for the power semiconductor device Q2 on the low side of the first arm, the capacitor C and the diode D are connected in series between both ends of the power semiconductor device Q2, and the resistor R is connected between the series connection point between the capacitor C and the diode D and the positive side of the smoothing section 5.

The snubber circuit SC3 for the power semiconductor device Q3 on the high side of the second arm is configured similarly to the snubber circuit SC 1. The snubber circuit SC4 for the power semiconductor device Q4 on the low side of the second arm is configured similarly to the snubber circuit SC 2.

The respective buffer circuits SC1, SC2, SC3, SC4 are not limited to the above configuration. For example, each snubber circuit SC1, SC2, SC3, SC4 may be a so-called charge-discharge type RCD snubber circuit in which the arrangement of the capacitor C and the diode D with respect to the power semiconductor device is opposite to that in the illustrated example and the resistance R is connected in parallel with the diode D, or each snubber circuit SC1, SC2, SC3, SC4 may be a so-called RC snubber circuit in which the resistance R and the capacitor C are connected in series between both ends of the power semiconductor device.

The power semiconductor devices Q1, Q2 of the first arm and the freewheeling diodes for the power semiconductor devices Q1, Q2 are arranged inside the housing to be formed as a module. The buffer circuits SC1, SC2 are connected to the external connection terminals and are arranged outside the case. The external connection terminal is exposed to the outside of the case. The case in which the power semiconductor devices Q1, Q2 and the freewheel diodes for the power semiconductor devices Q1, Q2 are provided may be filled with a molding resin, so that the power semiconductor devices Q1, Q2 and the freewheel diodes for the power semiconductor devices Q1, Q2 can be sealed with the molding resin. Similarly, the power semiconductor devices Q3, Q4 of the second arm and the freewheel diodes for the power semiconductor devices Q3, Q4 are also provided inside the case to form a module. The buffer circuits SC3, SC4 are connected to the external connection terminals and are arranged outside the case. The external connection terminal is exposed to the outside of the case.

Fig. 5 shows a configuration example of the power semiconductor module 210 including the power semiconductor devices Q1, Q2 of the first arm. In the following description, the configurations similar to or the same as those of the power semiconductor module 110 of fig. 3 will be correspondingly identified by the same reference numerals, respectively, and a repetitive description thereof will be omitted.

Similar to the power semiconductor module 110, the power semiconductor module 210 has input terminals 11a, 11b, output terminals 12a, 12b, and a plurality of control terminals 13.

The input terminals 11a, 11b are arranged at the first side surface 14a of the power semiconductor module 210. The positive-side direct-current input terminal 11a is connected to the positive side of the smoothing section 5 using a wiring member 15a made of a bus bar or the like. The negative-side direct-current input terminal 11b is connected to the negative side of the smoothing section 5 using a wiring member 15 b.

The output terminals 12a, 12b are arranged at a second side surface 14b of the power semiconductor module 210 at a side opposite to the first side surface 14 a. The output terminals 12a, 12b are connected to the transformer 8 using a wiring member 15 (see fig. 4).

A plurality of control terminals 13 are arranged on the upper surface 14e of the power semiconductor module 210. A portion of control terminal 13 is electrically connected to the gate of power semiconductor device Q1, and the other portion of control terminal 13 is electrically connected to the gate of power semiconductor device Q2. The control terminal 13 is connected to a control circuit 16a that controls the switching operation of the power semiconductor devices Q1, Q2. In the example, the control circuit 16a is placed and arranged on the upper surface 14e of the power semiconductor module 210, and the control terminal 13 is soldered to the control circuit 16a through hole formed in a circuit board of the control circuit 16 a.

The snubber circuit SC1 for the power semiconductor device Q1 has a resistor R, a capacitor C, and a diode D, as described above. Further, the buffer circuit SC1 has a circuit board 30, and an electronic component R, C, D is mounted on the circuit board 30 in an exposed manner. The circuit board 30 has an insulating base 31 and a conductor layer 32.

The insulating base 31 extends along the first side surface 14a of the power semiconductor module 210, the second side surface 14b of the power semiconductor module 210, and the third side surface 14c of the power semiconductor module 210, and bridges between the positive-side direct-current input terminal 11a and the output terminal 12 a. A pair of positive side dc input terminal 11a and negative side dc input terminal 11b are provided on the first side surface 14 a. Two output terminals 12a, 12b are provided on the second side surface 14 b. The third side surface 14c is disposed between the first side surface 14a and the second side surface 14 b.

The conductor layer 32 is provided on the upper surface of the insulating base 31 where the resistor R, the capacitor C, and the diode D are arranged. The conductor layer 32 forms circuit patterns connected to the positive-side direct-current input terminal 11a and the output terminal 12a, respectively.

The conductor layer 32 is typically formed of copper foil. For example, various materials such as bakelite, phenolic paper cured with phenolic resin, and epoxy glass cured with epoxy resin glass fiber can be used as the insulating base 31. However, a material having a higher flexural rigidity per unit thickness than copper is preferred. Among the listed materials, epoxy glass is suitable.

Electronic component mounting portions to which the resistor R, the capacitor C, and the diode D are respectively mounted are provided at appropriate positions of the circuit board 30 according to a circuit pattern. Each electronic component mounting portion can be formed in accordance with the form of the corresponding electronic component.

Fig. 6 shows the configuration of the buffer circuit SC 1.

In the example shown in fig. 6, the capacitor C is a wire type capacitor. The electronic component mounting parts 33a, 33b corresponding to the capacitor C are formed as through holes. Two lead wires 34a, 34b of the capacitor C are inserted into the electronic component mounting parts 33a, 33b, respectively, and soldered to pads made of the conductor layer 32.

The resistor R is also a wire type resistor. The electronic component mounting part 35 corresponding to the resistance R is formed as a through hole. One lead wire 36a of the resistor R is inserted into the electronic component mounting portion 35 and soldered to a pad made of the conductor layer 32.

The diode D has pins 37a, 37b and a frame 37 c. The pins 37a, 37b are electrically connected to the ends of the diode chips sealed by the molding resin. The frame 37c is electrically connected to the other end of the diode chip and exposed at the back surface of the package. The electronic component mounting parts 38a, 38b corresponding to the pins 37a, 37b are formed as through holes. The pins 37a, 37b are inserted into the electronic component mounting parts 38a, 38b, respectively, and soldered to pads made of the conductor layer 32. Further, the electronic component mounting part 38c corresponding to the frame 37c is also formed as a through hole. However, the frame 37c, which is in contact with the pad made of the conductor layer 32, is screwed into the electronic component mounting part 38 c.

The configurations of the resistor R, the capacitor C, and the diode D and the above-described respective electronic component mounting portions are merely examples and may be appropriately changed. For example, a spiral clamp resistor may be used as the resistor R and a spiral clamp capacitor may be used as the capacitor C. Further, a full-mold package type diode in which all electrical connections are provided by pins or a wire type diode may be used as the diode D. Further, a surface-mount resistor R, a capacitor C, or a diode D may be used as the resistor R, the capacitor C, or the diode D. In this case, the through-holes may be replaced with pads as electronic component mounting portions of the circuit board 30. Further, in the illustrated example, the resistor R, the capacitor C, or the diode D is directly attached and mounted to the circuit board 30 by soldering, screwing, or the like. However, the resistor R, the capacitor C, or the diode D may be electrically connected to the circuit board 30 or mounted to the circuit board 30 through a connection terminal or a wiring material. For example, the resistor R may be mounted to the circuit board 30 as follows. That is, the connection terminals are crimped to the lead 36a of the resistor R, and the connection terminals are also crimped to both ends of the wiring material. One of the connection terminals of the wiring material is connected to the connection terminal of the resistor R, and the other connection terminal of the wiring material is screwed into the electronic component mounting part 35. Thereby, the resistor R is mounted on the circuit board 30.

In the snubber circuit SC1 configured as described above, one end portion of the circuit board 30 is commonly fastened to the positive-side direct-current input terminal 11a together with the wiring member 15a by a bolt, and the other end portion of the circuit board 30 is commonly fastened to the output terminal 12a together with the wiring member 15a by a bolt. Further, the lead 36b of the resistor R is electrically connected to the negative-side dc input terminal 11b and mounted on the power semiconductor module 210.

Reference is again made to fig. 5. The snubber circuit SC2 for the power semiconductor device Q2 has a resistor R, a capacitor C, and a diode D, as described above. Further, the buffer circuit SC2 has a circuit board 40, and an electronic component R, C, D is mounted on the circuit board 40.

The circuit board 40 has an insulating base 41 and a conductor layer 42, similar to the circuit board 30 of the snubber circuit SC 1. The insulating base 41 extends along the first side surface 14a, the second side surface 14b, and the fourth side surface 14d of the power semiconductor module 210, bridging between the negative-side direct-current input terminal 11b and the output terminal 12 b. The fourth side surface 14d is arranged between the first side surface 14a and the second side surface 14 b.

The conductor layer 42 is provided on the upper surface of the insulating base 41. The conductor layer 42 forms circuit patterns connected to the negative-side direct-current input terminal 11b and the output terminal 12b, respectively. Electronic component mounting portions to which the resistor R, the capacitor C, and the diode D are respectively mounted are provided at appropriate positions of the circuit board 40 according to a circuit pattern.

In the snubber circuit SC2 configured as described above, one end portion of the circuit board 40 is commonly fastened to the negative-side direct-current input terminal 11b together with the wiring member 15b by a bolt, and the other end portion of the circuit board 40 is commonly fastened to the output terminal 12b together with the wiring member 15 by a bolt. Further, one lead of the resistor R is electrically connected to the positive-side direct-current input terminal 11a and mounted on the power semiconductor module 210.

According to the above power semiconductor module 210, surge voltages occurring between both ends of the power semiconductor devices Q1, Q2 corresponding to the switching operations of the power semiconductor devices Q1, Q2 are absorbed by the snubber circuits SC1, SC2 provided individually for the power semiconductor devices Q1, Q2, respectively. This can suppress the breakdown of the power semiconductor devices Q1 and Q2 due to the surge voltage.

The resistor R, the capacitor C, and the diode D included in the snubber circuit SC1 are mounted in an exposed manner on the circuit board 30. The resistor R, the capacitor C, and the diode D included in the snubber circuit SC2 are also mounted to the circuit board 40 in an exposed manner. The electronic component R, C, D can be easily changed. Thereby, the circuit boards 30, 40 can be generalized for design changes of the inverter 206, such as changes in switching frequency of the power semiconductor devices Q1, Q2, and electronic components having appropriate constants can be used as the electronic components R, C, D mounted on the circuit boards 30, 40 to effectively absorb surge voltage.

The resistor R, the capacitor C, and the diode D are mounted to the circuit boards 30, 40 in an exposed manner. Therefore, the buffer circuit is excellent in dissipation of heat generated by the electronic element R, C, D, so that deterioration of the electronic element R, C, D due to the heat can be suppressed. This can improve the durability of the snubber circuit.

Further, the snubber circuit itself also has wiring inductance. The circuit board 30 of the snubber circuit SC1 is provided to extend along the first side surface 14a, the third side surface 14c, and the second side surface 14b of the power semiconductor module 210. The circuit board 30 is directly connected to the positive-side direct-current input terminal 11a provided on the first side surface 14a and the output terminal 12a provided on the second side surface 14b opposite to the first side surface 14 a. This can shorten the length of the conductive path of the buffer circuit SC1 as much as possible. Thereby, the inductance of the snubber circuit SC1 can be reduced to suppress the surge voltage, so that noise radiated due to the surge current flowing into the snubber circuit SC1 can be suppressed.

The circuit board 30 of the snubber circuit SC1 extends along the first side surface 14a, the third side surface 14c, and the second side surface 14b of the power semiconductor module 210. Therefore, the circuit board 30 is shaped into a flat plate shape having no bent portion in the thickness direction. This allows the conductor layer 32 to be easily formed on the insulating base 31.

Similarly, the circuit board 40 of the snubber circuit SC2 is also provided to extend along the first side surface 14a, the fourth side surface 14d, and the second side surface 14b of the power semiconductor module 210. The circuit board 40 is directly connected to the negative side direct current input terminal 11b provided on the first side surface 14a and the output terminal 12b provided on the second side surface 14b opposite to the first side surface 14 a. The length of the conductive path of the snubber circuit SC2 can be made as short as possible to enable a reduction in inductance. Further, the circuit board 40 is formed in a flat plate shape so that the conductor layer 42 can be easily formed on the insulating base portion 41.

From the viewpoint of reducing the inductance of the snubber circuits SC1, SC2, the thicknesses of the conductor layers 32, 42 of the circuit boards 30, 40 may be increased, or the conductor layers may be provided on the respective opposite upper and lower surfaces of the insulating base portions 31, 41 of the circuit boards 30, 40.

Fig. 7 shows another example of the buffer circuit SC 1.

In the example shown in fig. 7, the conductor layers 32a, 32b are provided on the opposite upper and lower surfaces of the insulating base 31, respectively. Mutually identical circuit patterns are formed in the conductor layer 32a on the upper surface side of the insulating base 31 and the conductor layer 32b on the lower surface side of the insulating base 31. An electronic component such as a capacitor C is arranged at the conductor layer 32 a.

The conductor layer 32a on the upper surface side of the insulating base 31 and the conductor layer 32b on the lower surface side of the insulating base 31 are electrically and thermally connected to each other by electronic component mounting portions 33a, 33b, 35, 38a, 38b, 38c formed as through holes.

By providing the conductor layers 32a, 32b having the same pattern on the opposite upper and lower surfaces of the insulating base 31 and electrically connected to each other through the through-holes, the sectional area of the conductive path of the circuit board 30 can be made larger and the inductance of the snubber circuit SC1 can be made smaller than in the case where the conductor layer 32 is provided only on the upper surface of the insulating base 31. Further, the conductor layers 32a, 32b are also thermally connected to each other through the via holes. Therefore, the area of heat radiation can be made larger than in the case where the conductor layer 32 is provided only on the upper surface of the insulating base 31. Therefore, dissipation of heat generated by the electronic component such as the capacitor C can be accelerated, so that heat-induced degradation of the electronic component can be suppressed. This can greatly improve the durability of the buffer circuit SC 1.

From the viewpoint of reducing the inductance of the snubber circuit SC1, it is preferable that the total thickness of the conductor layers, that is, the thickness of the conductor layer 32 in the case where the conductor layer 32 is provided only on the upper surface of the insulating base 31 or the total thickness of the conductor layers 32a, 32b in the case where the conductor layers 32a, 32b are provided on the opposite upper and lower surfaces of the insulating base 31 be equal to or greater than 0.1 mm. Since the circuit board 30 is formed in a flat plate shape, a conductor layer can be easily formed on the insulating base portion 31 even when the conductor layer is relatively thick.

Further, it is assumed that the wires 34a, 34b, etc. of the capacitor C are manually soldered to the pads made of the conductor layer. In this case, when the total thickness of the conductor layer is excessively large, it takes time to raise the temperature of each pad to a solder melting temperature by a soldering iron. Therefore, the total thickness of the conductor layer is preferably less than 2.0mm in view of soldering workability.

Fig. 8 shows another example of the buffer circuit SC 1.

In the example shown in fig. 8, the solder resist 39 is formed on the front surface of the conductor layer 32 and around the electronic component mounting sections 33a, 33b, 35, 38a, 38b to which components such as the capacitor C are to be soldered in the circuit board 30.

As described above, the lead wires 34a, 34b of the capacitor C are inserted into the electronic component mounting parts 33a, 33b, respectively, and soldered to the pads made of the conductor layer 32. The respective electronic component mounting portions 33a, 33b are formed as through holes. A corresponding solder resist 39 is annularly formed on the front surface of the conductor layer 32 to surround the pads to which the wires 34a, 34b are soldered.

Similarly, a corresponding annular solder resist 39 is formed on the front surface of the conductor layer 32, and is formed on the periphery of the electronic component mounting part 35 to which the lead 36a of the resistor R is soldered, and around the electronic component mounting parts 38a, 38b to which the pins 37a, 37b of the diode D are soldered.

In this way, the solder resist 39 is formed in advance on the front surface of the conductor layer 32 and around the electronic component mounting parts 33a, 33b, 35, 38a, 38b to which the components are to be soldered. Therefore, radiation of heat from the front surface of the conductor layer 32 around the electronic component mounting portion can be suppressed. Thereby, even when the thickness of the conductor layer 32 is increased, the temperature of the pads for the respective electronic component mounting parts 33a, 33b, 35, 38a, 38b can be effectively increased by the soldering iron, so that the efficiency of the manual soldering operation can be improved.

In the example shown in fig. 8, the conductor layer 32 is provided only on the upper surface of the insulating base 31. However, when the conductor layers 32a, 32b are provided on the opposite upper and lower surfaces of the insulating base 31 as shown in fig. 7, solder resists 39 may be formed on the front surface of the conductor layer 32a on the upper surface side of the insulating base 31 and the front surface of the conductor layer 32b on the lower surface side of the insulating base 31 and around the electronic component mounting parts 33a, 33b, 35, 38a, 38b, respectively.

Fig. 9 shows another example of the buffer circuit SC 1.

In the example shown in fig. 9, the solder resist 39 is formed on all the front surfaces of the conductor layer 32 except the electronic component mounting parts 33a, 33b, 35, 38a, 38b to which the electronic components such as the capacitor C of the circuit board 30 are mounted. In this case, the circuit board 30 on which the parts to be soldered, such as the capacitor C, are mounted can be immersed in the solder pot instead of manual soldering and the parts can be soldered integrally. This can improve the productivity of the buffer circuit SC 1.

The present application is based on Japanese patent application No.2016-161885, filed 2016, 8, 22, and Japanese patent application No.2016-190345, filed 2016, 9, 28, 9, 2016, which are incorporated herein by reference in their entirety.