阅读说明：本技术 微图形结构转印方法及微图形结构基板 (Micro-pattern structure transfer printing method and micro-pattern structure substrate ) 是由 冯雪 傅棋琪 邓雨平 于 2020-12-09 设计创作，主要内容包括：本申请涉及一种微结构图形转印方法,包括：提供一基板组件,基板组件包括施主基板及可剥离地设置在施主基板一侧表面的组合体,组合体包括依次层叠的微图形结构、第一牺牲层、第二牺牲层,微图形结构位于组合体的朝向施主基板的一侧；将组合体从施主基板上剥离；将组合体的具有微图形结构的一侧贴附在受主基板的表面；除去第一牺牲层与第二牺牲层,使微图形结构转印到受主基板的表面。本申请的转印方法通过第一牺牲层与第二牺牲层的设计,既保护了微图形结构,降低了转印过程中的应力失配,减少剥离次数,可以实现对多种基底间、不同微图形结构高质量、低损失的转印,通用性好。(The application relates to a microstructure pattern transfer printing method, which comprises the following steps: providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combination body which is arranged on the surface of one side of the donor substrate in a strippable manner, the combination body comprises a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the micro-pattern structure is positioned on the side, facing the donor substrate, of the combination body; peeling the assembly from the donor substrate; attaching one side of the assembly having the micropattern structure to a surface of a receptor substrate; and removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate. According to the transfer printing method, the micro-pattern structure is protected through the design of the first sacrificial layer and the second sacrificial layer, the stress mismatch in the transfer printing process is reduced, the stripping times are reduced, the transfer printing with high quality and low loss of different micro-pattern structures among various substrates can be realized, and the universality is good.)

1. A method of micro-feature structure transfer printing, comprising:

a. providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combined body which is arranged on one side surface of the donor substrate in a strippable manner, the combined body comprises a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the micro-pattern structure is positioned on one side of the combined body facing the donor substrate;

b. peeling the assembly from the donor substrate;

c. attaching the side of the assembly having the micropattern structure to a surface of a receptor substrate;

d. and removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate.

2. The method for transferring a micro graphic structure according to claim 1, wherein step a comprises:

a1. forming a release layer on one side surface of the donor substrate;

a2. sequentially forming the micro-pattern structure and the first sacrificial layer on the release layer;

a3. attaching the second sacrificial layer to a surface of the first sacrificial layer, and treating the release layer to reduce a bonding force between the donor substrate and the micropattern structure.

3. The method of transferring a micro graphic structure according to claim 2, wherein the release layer is at least one of polymethylmethacrylate, chitosan, and a metal film; and/or the thickness of the release layer is 0.5-1 μm.

4. The method for transferring a micro graphic structure according to claim 2, wherein step a2 comprises:

and forming the first sacrificial layer on the surface of the micro-pattern structure by dropping coating or spin coating.

5. The method for transferring a micropattern structure of claim 3 wherein the release layer is polymethylmethacrylate, and step a3 comprises:

attaching the second sacrificial layer to a surface of the first sacrificial layer;

and removing the release layer by using an acetone solution for corrosion.

6. The method of claim 1, wherein the first sacrificial layer and the second sacrificial layer are soluble materials.

7. The method of transferring a micropattern structure of claim 6 wherein step d comprises:

and utilizing steam fumigation to dissolve the first sacrificial layer and the second sacrificial layer and expose the micro-pattern structure.

8. The method of transferring a micropattern structure of claim 6 wherein the second sacrificial layer is a water soluble tape; and/or the first sacrificial layer is at least one of polyvinyl alcohol and polyacrylic acid, and the thickness of the first sacrificial layer is 100-300 mu m.

9. The method for transferring a micro graphic structure according to claim 1, wherein step b comprises:

mechanically peeling the combination of the second sacrificial layer, the first sacrificial layer and the micropattern structure from the donor substrate.

10. A substrate structure comprising a substrate and a micropattern structure transferred to at least one side surface of the substrate by the method of any of claims 1-9.

Technical Field

The application relates to the technical field of transfer printing, in particular to a micro-pattern structure transfer printing method and a micro-pattern structure substrate.

Background

Transfer printing technology has great application potential and is currently the most common processing method for flexible electronic manufacturing. The main process of transfer printing is as follows: attaching the flexible stamp to the surface of the donor substrate, then peeling the flexible stamp from the surface of the donor substrate, and transferring the micro-pattern structure from the surface of the donor substrate to the surface of the flexible stamp when the bonding force between the flexible stamp and the micro-pattern structure is greater than the bonding force between the micro-pattern structure and the donor substrate; and then, attaching the flexible stamp to the surface of the receptor substrate, and transferring the surface of the flexible stamp with the micro-pattern structure to the surface of the receptor substrate when the bonding force between the flexible stamp and the micro-pattern structure is smaller than the bonding force between the micro-pattern structure and the receptor substrate. The transfer printing process involves adsorption and desorption processes among various different interfaces, at present, the transfer printing effect can be improved by methods of controlling separation speed, surface modification, introducing a release layer and the like, but the methods still have the defects of micro-graph structure damage, more stripping times, poorer universality and the like caused by stress mismatch.

Disclosure of Invention

In view of the above technical problems, the present application provides a method for transferring a micro pattern structure, which can reduce the stress mismatch during the transfer process, reduce the peeling frequency, realize the high-quality and low-loss transfer of different micro pattern structures between various substrates, and have good versatility.

In order to solve the above technical problem, the present application provides a method for transferring a micro pattern structure, including:

a. providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combined body which is arranged on one side surface of the donor substrate in a strippable manner, the combined body comprises a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the micro-pattern structure is positioned on one side of the combined body facing the donor substrate;

b. peeling the assembly from the donor substrate;

c. attaching the side of the assembly having the micropattern structure to a surface of a receptor substrate;

d. and removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate.

Optionally, step a, comprises:

a1. forming a release layer on one side surface of the donor substrate;

a2. sequentially forming the micro-pattern structure and the first sacrificial layer on the release layer;

a3. attaching the second sacrificial layer to a surface of the first sacrificial layer, and treating the release layer to reduce a bonding force between the donor substrate and the micropattern structure.

Optionally, the release layer is at least one of polymethyl methacrylate, chitosan and a metal film; and/or the thickness of the release layer is 0.5-1 μm.

Optionally, step a2, comprising:

and forming the first sacrificial layer on the surface of the micro-pattern structure by dropping coating or spin coating.

Optionally, the release layer is polymethyl methacrylate, and step a3 includes:

attaching the second sacrificial layer to a surface of the first sacrificial layer;

and removing the release layer by using an acetone solution for corrosion.

Optionally, the first sacrificial layer and the second sacrificial layer are soluble materials.

Optionally, step d, comprises:

and utilizing steam fumigation to dissolve the first sacrificial layer and the second sacrificial layer and expose the micro-pattern structure.

Optionally, the second sacrificial layer is a water-soluble adhesive tape; and/or the first sacrificial layer is at least one of polyvinyl alcohol and polyacrylic acid, and the thickness of the first sacrificial layer is 100-300 mu m.

Optionally, step b, comprises:

mechanically peeling the combination of the second sacrificial layer, the first sacrificial layer and the micropattern structure from the donor substrate.

Optionally, the first sacrificial layer is polyvinyl alcohol, the polyvinyl alcohol is of a low viscosity type, the alcoholysis degree is 87.0-89.0%, and the viscosity is 4.6-5.4.

The application also provides a substrate structure, which comprises a substrate and a micro-pattern structure, wherein the micro-pattern structure is transferred to at least one side surface of the substrate by the method.

The microstructure pattern transfer printing method comprises the following steps: providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combination body which is arranged on the surface of one side of the donor substrate in a strippable manner, the combination body comprises a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the micro-pattern structure is positioned on the side, facing the donor substrate, of the combination body; peeling the assembly from the donor substrate; attaching one side of the assembly having the micropattern structure to a surface of a receptor substrate; and removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate. According to the transfer printing method, the micro-pattern structure is protected through the design of the first sacrificial layer and the second sacrificial layer, the stress mismatch in the transfer printing process is reduced, the stripping times are reduced, the transfer printing with high quality and low loss of different micro-pattern structures among various substrates can be realized, and the universality is good.

According to the substrate with the micro-graph structure, the micro-graph structure is transferred to at least one side surface of the substrate through the method, the graph quality is good, and the loss is less.

Drawings

FIG. 1 is a schematic flow diagram illustrating a method for transferring a micro-graphic structure according to one embodiment;

fig. 2(a) to 2(f) are process diagrams illustrating a micro pattern structure transfer method according to an embodiment.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description is not to be taken in a limiting sense, and the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

FIG. 1 is a schematic flow diagram illustrating a method for transferring a micro-feature structure, according to one embodiment. As shown in fig. 1, the method for transferring a micro pattern structure of the present embodiment includes the following steps:

step 110, providing a substrate assembly, wherein the substrate assembly includes a donor substrate and a composition releasably disposed on a surface of one side of the donor substrate, the composition includes a micro-pattern structure, a first sacrificial layer, and a second sacrificial layer, which are sequentially stacked, and the micro-pattern structure is located on a side of the composition facing the donor substrate.

Optionally, the step of providing the substrate assembly may specifically include:

forming a release layer on one side surface of the donor substrate;

sequentially forming a micro-pattern structure and a first sacrificial layer on the release layer;

attaching a second sacrificial layer to a surface of the first sacrificial layer, and treating the release layer to reduce bonding forces between the donor substrate and the micropattern structure.

Alternatively, as shown in fig. 2(a), a release layer 22 and a micropattern structure 23 stacked in this order are formed on a surface of the donor substrate 21, the micropattern structure 23 includes a flexible substrate 231 and a micropattern circuit 232, and the micropattern circuit 232 is provided on a side of the flexible substrate 231 facing away from the release layer 22. Next, as shown in fig. 2(b), a first sacrificial layer 24 is formed on the surface of the micropattern circuit 232.

The donor substrate 21 is preferably a general rigid substrate, including a silicon wafer, a glass plate, etc., for providing a certain mechanical support. The flexible substrate 231 is a commonly used high-flexibility elastic polymer, and includes Polyimide (PI), polyethylene terephthalate (PET), Polydimethylsiloxane (PDMS), etc. the micro-pattern structure 23 is a pattern structure to be transferred, the micro-pattern circuit 232 is an electrode pattern, a circuit pattern including a microelectronic device, etc., the micro-pattern circuit 232 can be formed on the flexible substrate 231 by photolithography or electrospray printing, the flexible substrate 231 and the micro-pattern circuit 232 are sequentially stacked, the number of stacked layers of the flexible substrate 231 and the micro-pattern circuit 232 is not limited, the bottom layer of the stacked layer structure of the flexible substrate 231 and the micro-pattern circuit 232 is a flexible substrate, for example, a layer of the flexible substrate 231 and a layer of the micro-pattern circuit 232 can be sequentially stacked on the donor substrate 21, or a first layer of the flexible substrate 231, a second layer of the micro-pattern circuit 232, and a second layer of the flexible substrate 231, a second layer of the micro-pattern circuit 232 can be sequentially stacked on the donor substrate 21, The first layer of micropattern circuit 232, the second layer of flexible substrate 231, and the second layer of micropattern circuit 232 may also comprise other structures such as intervening layers, etc., in actual implementation. The release layer 22 is a material having weak adhesion, including but not limited to at least one of polymethyl methacrylate (PMMA), chitosan, and a metal thin film. The thickness of the release layer 22 is 0.5 μm to 1 μm.

The first sacrificial layer 24 can be formed by a dropping method, and there is no requirement for uniformity when the first sacrificial layer 24 is dropped, so that the first sacrificial layer 24 can cover the micro-pattern structure 23 without contacting the second sacrificial layer 25 used subsequently, and the first sacrificial layer 24 is simple and easy to manufacture. After the dripping coating, the film is dried in an oven to form a film, so that the film with certain tensile property can be formed, the stress mismatch in the transfer printing process can be reduced, and the loss and the wrinkle of the micro-pattern circuit 232 can be prevented. In practical implementation, the first sacrificial layer 24 may be formed by spin coating, so that the uniformity and the film thickness of the first sacrificial layer 24 can be controlled by controlling the spin coating speed and the film forming temperature. The first sacrificial layer 24 is a soluble film, optionally, the first sacrificial layer 24 is at least one of polyvinyl alcohol (PVA) and Polyacrylic acid (PAA), and the thickness of the first sacrificial layer 24 is 100 μm to 300 μm. Preferably, the first sacrificial layer 24 is polyvinyl alcohol, the polyvinyl alcohol is low-viscosity type, the alcoholysis degree is 87.0-89.0%, and the viscosity is 4.6-5.4.

Referring to fig. 2(b) and 2(c), the release layer 22 may be removed before the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, or after the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, so that the micropattern structure 23, the first sacrificial layer 24, and the second sacrificial layer 25 may be peeled off from the donor substrate 21 as a combined body. The release layer 22 may be partially removed or completely removed, wherein when the release layer 22 is removed before the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, only partial etching removal is performed on the release layer 22 to ensure that the micropattern structure 23 does not completely detach from the donor substrate 21, thereby ensuring normal transfer; when the release layer 22 is removed after the second sacrificial layer 25 is attached to the surface of the first sacrificial layer 24, the release layer 22 may be entirely etched away for better peeling.

After removing the release layer 22 by etching, the adhesion between the flexible substrate 231 and the donor substrate 21, i.e. the bonding force between the donor substrate 2 and the micro-pattern structure 23, can be reduced, which facilitates subsequent mechanical peeling. Alternatively, when the release layer 22 is PMMA, the release layer 22 is removed by etching with an acetone solution. For example, the device is placed in an acetone solution to be soaked for 5-10 min, and PMMA is dissolved through acetone.

Alternatively, the soluble second sacrificial layer 25 is a soluble film, preferably a water-soluble film, such as a water-soluble adhesive tape generally commercially available, which may lose its adhesiveness upon contact with water.

Step 120, the assembly is peeled from the donor substrate.

Referring to fig. 2(d), the second sacrificial layer 25, the first sacrificial layer 24 and the micro-pattern structure 23 are mechanically stripped from the donor substrate 21 as a combined body, so that the first sacrificial layer 24 and the micro-pattern structure 23 are transferred to the surface of the second sacrificial layer 25. Since the first sacrificial layer 24 having a good tensile property is provided between the micro pattern structure 23 and the second sacrificial layer 25, and the release layer 22 is completely or partially removed by etching, it is easy to peel off, and stress mismatch can be reduced during peeling, thereby preventing the micro pattern circuit 232 from being lost or wrinkled.

Step 130, attaching the side of the assembly having the micropattern structure to the surface of the receptor substrate.

The assembly of the second sacrificial layer 25, the first sacrificial layer 24 and the micropattern structure 23 is attached to the receptor substrate 26 by means of non-covalent forces such as electrostatic force, capillary force, van der waals force, and the like between the micropattern structure 23 and the receptor substrate 26, and the receptor substrate 26 may be a rigid substrate or a flexible substrate, which is specifically selected according to the deformation characteristics of the product. Preferably, the receptor substrate 26 is a flexible substrate, such as Polydimethylsiloxane (PDMS).

Step 140, the first sacrificial layer and the second sacrificial layer are removed to transfer the micro-pattern structure to the surface of the receiver substrate.

Alternatively, as shown in fig. 2(e), the structure obtained in the step 130 is fumigated with steam to dissolve the second sacrificial layer 25 and the first sacrificial layer 24 and expose the micro pattern structure 23, so as to obtain a micro pattern structure substrate as shown in fig. 2(f), which includes the receptor substrate 26, the flexible substrate 231, and the micro pattern circuit 232 arranged in this order.

When the second sacrificial layer 25 and the first sacrificial layer 24 are made of water-soluble materials, the structure obtained in step 130 is placed in a culture dish upside down, another culture dish containing deionized water is placed below the culture dish, water vapor is obtained by heating, the water vapor firstly acts on the second sacrificial layer 25, the second sacrificial layer 25 drops after losing viscosity or is gradually dissolved by the water vapor, the first sacrificial layer 24 is exposed, and then the first sacrificial layer 24 is dissolved, and the micro-pattern structure 23 is exposed. By using the steam fumigation method, the dissolving speed of the first sacrificial layer 24 can be effectively controlled, the micro-pattern structure 23 is prevented from falling and being damaged due to the rapid dissolution of the first sacrificial layer 24, and the transfer success rate is improved.

Aiming at the defect that the micro-pattern (particularly the metal pattern) is wrinkled and deformed due to large stress mismatch in the traditional transfer printing method, the first sacrificial layer is introduced as the protective layer, so that the stress mismatch degree between the second sacrificial layer and the micro-pattern structure can be reduced, and the damage to the micro-pattern in the transfer printing process can be reduced. In addition, aiming at the defects of complex process and poor universality in the traditional transfer printing method, the stripping process of a plurality of interfaces is simplified into the dissolving process of the soluble first sacrificial layer and the soluble second sacrificial layer by the method of the double sacrificial layers, so that the universality and the repeatability of the transfer printing are expanded. Meanwhile, the transfer printing method of the embodiment does not need surface processing and surface chemical treatment, can reduce the times of desorption and stripping, has simple process and ensures the quality and performance of the transferred pattern.

The microstructure pattern transfer printing method comprises the following steps: providing a substrate assembly, wherein the substrate assembly comprises a donor substrate and a combination body which is arranged on the surface of one side of the donor substrate in a strippable manner, the combination body comprises a micro-pattern structure, a first sacrificial layer and a second sacrificial layer which are sequentially stacked, and the micro-pattern structure is positioned on the side, facing the donor substrate, of the combination body; peeling the assembly from the donor substrate; attaching one side of the assembly having the micropattern structure to a surface of a receptor substrate; and removing the first sacrificial layer and the second sacrificial layer to transfer the micro-pattern structure to the surface of the receiver substrate. According to the transfer printing method, the micro-pattern structure is protected through the design of the first sacrificial layer and the second sacrificial layer, the stress mismatch in the transfer printing process is reduced, the stripping times are reduced, the transfer printing with high quality and low loss of different micro-pattern structures among various substrates can be realized, and the universality is good.

The application also provides a micro-pattern structure substrate, which comprises a substrate and a micro-pattern structure, wherein the micro-pattern structure is transferred to at least one side surface of the substrate by the method, and the pattern quality is good and the loss is less.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.