阅读说明：本技术 一种带ntc热敏芯片的温度传感器及其制备工艺 (Temperature sensor with NTC thermosensitive chip and preparation process thereof ) 是由 王梅凤 于 2020-12-02 设计创作，主要内容包括：本发明提出了一种带NTC热敏芯片的温度传感器及其制备工艺,该温度传感器包括导热基片、NTC热敏芯片、引线、玻璃绝缘封装层,还包括过渡金属基台、封装引渡机构,过渡金属基台与导热基片均含铜、铝、锡、锰元素,且(铜+铝+锡)元素质量百分含量占比重合率大于50%,锰元素质量百分含量占比大于5%,NTC热敏芯片通过过渡金属基台、玻璃绝缘浆料与导热基片相连；封装引渡机构采用复合金属材料、呈波纹管状,并通过玻璃绝缘浆料烧渗连接于导热基片上,本申请合理设计传感器结构并优化原料选用,制得的温度传感器灵敏度高且稳定性强,有效使用寿命延长了一倍以上。(The invention has proposed a temperature sensor with NTC heat-sensitive chip and its preparation method, this temperature sensor includes heat conduction substrate, NTC heat-sensitive chip, lead wire, glass insulating packaging layer, also include transition metal base station, capsulate and lead the transition mechanism, transition metal base station and heat conduction substrate all contain copper, aluminium, tin, manganese element, and the (copper + aluminium + tin) elemental mass percent of percentage accounts for the coincidence rate to be greater than 50%, manganese element mass percent accounts for greater than 5%, NTC heat-sensitive chip couples to heat conduction substrate through transition metal base station, glass insulating slurry; encapsulation ferry mechanism adopts composite metal material, is the bellows form to burn to ooze through glass insulation paste and connect on the heat conduction substrate, this application rational design sensor structure and optimization raw materials choose for use, the temperature sensor sensitivity that makes is high and stability is strong, effective life has prolonged more than one time.)

1. The utility model provides a take temperature sensor of NTC heat-sensitive chip, includes heat conduction substrate, NTC heat-sensitive chip, lead wire, glass insulation packaging layer, its characterized in that: the NTC heat-sensitive chip is connected with the heat-conducting substrate through the transition metal base station and glass insulation slurry; the packaging and guiding mechanism is made of composite metal materials and is in a corrugated pipe shape, and is connected to the heat conducting substrate through glass insulation slurry sintering and infiltration.

2. The temperature sensor with the NTC thermal chip of claim 1, wherein: the heat-conducting substrate forming raw materials are an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot in a mass ratio of 1:0.1-0.3, the chemical composition of the aluminum-tin-copper alloy ingot meets the GB/T20975 standard, and the chemical composition of the aluminum-manganese alloy ingot meets the GB/T3190-2008 standard.

3. The temperature sensor with the NTC thermal chip of claim 1, wherein: the transition metal base is formed by melting and casting brass, bronze, titanium-aluminum alloy and zinc-manganese alloy, wherein the mass percentage of (copper + aluminum + tin) elements is more than 70%.

4. The temperature sensor with the NTC thermal chip of claim 1, wherein: the packaging and guiding mechanism comprises the following element components, by mass, 4.5-6.3% of Mg, 2.6-3.8% of Si, 1.2-3.3% of Cu, 0.8-1.2% of Mn, 0.3-0.45% of Ni, 0.2-0.4% of RE, less than or equal to 0.06% of Fe, and the balance of Al and inevitable impurities.

5. The temperature sensor with the NTC thermal chip of claim 4, wherein: the RE is a composition of La, Ce and Y, and the mass percentage of La and (Ce + Y) is 60-75% and 25-40%.

6. The temperature sensor with the NTC thermal chip of claim 1, wherein: the inner wall and the outer wall of the packaging guiding mechanism are sprayed with conductive slurry layers, and the thickness of the coating is 0.1-0.5 mm.

7. The temperature sensor with the NTC thermal chip of claim 6, wherein: the conductive paste adopts any one or a composition of silver electronic paste and copper electronic paste, and the composition is selected and mixed according to the volume ratio of 1:1 for application.

8. The temperature sensor with the NTC thermal chip of any one of claims 1-7, wherein the preparation process is as follows:

taking materials, smelting an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot, preparing a heat conduction substrate blank, and slicing to obtain a heat conduction substrate;

stacking the heat-conducting substrate, the transition metal base station and the NTC heat-sensitive chip in sequence, and realizing interlayer printing and sintering by using glass insulation slurry;

a lead is arranged on an NTC thermosensitive chip electrode, a packaging transition mechanism is sleeved on the outer side of the lead, and the lead and the packaging transition mechanism are brushed and sintered by glass insulating slurry;

and (3) adopting a dispenser to dispense glass insulating slurry on the NTC thermosensitive chip, completely covering the thermosensitive resistor chip, the lead and the root of the packaging guiding and crossing mechanism, and sintering to form a glass insulating packaging layer.

9. The temperature sensor with the NTC thermal chip of claim 8, wherein: the transition metal base station is of a metal mesh structure, the outer diameter of a metal mesh wire is 0.02 +/-0.002 mm, and the thickness ratio of the heat-conducting substrate to the transition metal base station to the NTC heat-sensitive chip is 0.5:0.5: 5.

10. The temperature sensor with the NTC thermal chip of claim 8, wherein: the root covering thickness of the lead and the packaging transition mechanism is more than 0.05 mm.

Technical Field

The invention relates to the technical field of sensors, in particular to a temperature sensor with an NTC thermosensitive chip and a preparation process thereof.

Background

The NTC heat-sensitive chip is used as a core component, and the thermistor and the temperature sensor which are formed by adopting different packaging forms are widely applied to various temperature detection, temperature compensation and temperature control circuits, and play a core role in converting temperature variables into required electronic signals in the circuits.

With the development of electronic technology, various kinds of electronics are further multifunctional and intelligent, and the application of the NTC thermosensitive chip to various occasions requiring temperature detection, control, compensation and the like is increasing day by day.

Due to the requirement of sensitivity of detection temperature, the requirement of increasingly fast response speed of the NTC temperature sensor is provided, so that the NTC temperature sensor is required to have the thermal time constant as small as possible and the response speed to be fast.

Currently, an NTC temperature sensor generally comprises an NTC thermosensitive chip, a lead and an outer insulating encapsulating layer 3', and the manufacturing method comprises the following steps:

(1) preparing an NTC heat-sensitive chip;

(2) leading wires on the NTC thermosensitive chip;

(3) encapsulating the NTC thermosensitive chip by an outer insulating layer to form an NTC thermosensitive resistor;

(4) and (5) carrying out electrical performance test on the NTC thermistor.

The inner NTC heat-sensitive chip of the manufactured NTC temperature sensor is in a circular sheet type or a square sheet type. The NTC temperature sensor manufactured by the prior art is thick (0.3-3mm) due to the thick chip, and the thick and poor thermal conductivity of the outer layer of insulating encapsulating substance (generally epoxy resin, phenolic resin and silicon resin). Namely, the NTC temperature sensor transfers heat through a plurality of layers in the temperature sensing process, the heat is firstly transferred to the insulating encapsulating layer and then is gradually transferred to the NTC heat-sensitive chip in the temperature sensing process, a long time is needed when the core of the NTC heat-sensitive chip completely reaches the external temperature, and the thermal time constant is generally 5-15-seconds. Such a reaction speed cannot satisfy the requirement of high sensitivity for temperature detection.

Disclosure of Invention

In view of the above, the present invention aims to provide a temperature sensor with an NTC thermal sensitive chip and a manufacturing process thereof, wherein the sensor structure is reasonably designed, raw material selection is optimized, and the manufactured temperature sensor has high sensitivity and strong stability, and the effective service life is prolonged by more than one time.

In order to achieve the purpose, the invention provides the following technical scheme:

a temperature sensor with an NTC heat-sensitive chip comprises a heat-conducting substrate, the NTC heat-sensitive chip, a lead wire, a glass insulation packaging layer, a transition metal base station and a packaging transition mechanism, wherein the transition metal base station and the heat-conducting substrate both contain copper, aluminum, tin and manganese, the mass percentage of the (copper, aluminum and tin) elements accounts for more than 50% of the overlapping rate, the mass percentage of the manganese element accounts for more than 5%, and the NTC heat-sensitive chip is connected with the heat-conducting substrate through the transition metal base station and glass insulation slurry; the packaging and guiding mechanism is made of composite metal materials and is in a corrugated pipe shape, and is connected to the heat conducting substrate through glass insulation slurry sintering and infiltration.

As further preferred in the invention, the raw materials for forming the heat-conducting substrate are an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot in a mass ratio of 1:0.1-0.3, the chemical components of the aluminum-tin-copper alloy ingot meet the GB/T20975 standard, and the chemical components of the aluminum-manganese alloy ingot meet the GB/T3190-2008 standard.

As further preferred in the invention, the transition metal base is formed by melting and casting brass, bronze, titanium-aluminum alloy and zinc-manganese alloy, wherein the mass percentage of (copper + aluminum + tin) elements is more than 70%.

As a further preferred aspect of the present invention, the package ferry mechanism comprises, by mass, 4.5 to 6.3% of Mg, 2.6 to 3.8% of Si, 1.2 to 3.3% of Cu, 0.8 to 1.2% of Mn, 0.3 to 0.45% of Ni, 0.2 to 0.4% of RE, 0.06% or less of Fe, and the balance Al and unavoidable impurities.

As the invention is further preferable, RE is a composition of La, Ce and Y, and the mass percentage of La and (Ce + Y) is 60-75% and 25-40%.

As a further optimization of the invention, the inner wall and the outer wall of the packaging ferry mechanism are sprayed with conductive slurry layers, and the thickness of the coating is 0.1-0.5 mm.

In a further preferred embodiment of the present invention, the conductive paste is any one or a combination of silver electronic paste and copper electronic paste, and the combination is selected and mixed according to a volume ratio of 1: 1.

As a further preferred aspect of the present invention, the temperature sensor with an NTC thermosensitive chip is prepared by the following steps:

1) taking materials, smelting an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot, preparing a heat conduction substrate blank, and slicing to obtain a heat conduction substrate;

2) stacking the heat-conducting substrate, the transition metal base station and the NTC heat-sensitive chip in sequence, and realizing interlayer printing and sintering by using glass insulation slurry;

3) a lead is arranged on an NTC thermosensitive chip electrode, a packaging transition mechanism is sleeved on the outer side of the lead, and the lead and the packaging transition mechanism are brushed and sintered by glass insulating slurry;

4) and (3) adopting a dispenser to dispense glass insulating slurry on the NTC thermosensitive chip, completely covering the thermosensitive resistor chip, the lead and the root of the packaging guiding and crossing mechanism, and sintering to form a glass insulating packaging layer.

Further preferably, the transition metal base is of a metal mesh structure, the outer diameter of the metal mesh is 0.02 +/-0.002 mm, and the thickness ratio of the heat conducting substrate to the transition metal base to the NTC heat-sensitive chip is 0.5:0.5: 5.

Further preferably, the thickness of the root cover of the lead and the packaging transition mechanism is more than 0.05 mm.

The invention has the beneficial effects that: the invention reasonably designs the sensor structure and optimizes the selection of raw materials, and the prepared temperature sensor has high sensitivity and strong stability, and the effective service life is prolonged by more than one time.

The invention is provided with the transition metal base station and the packaging transition mechanism, and the flexible heat conduction framework is formed in the sensor, so that the mechanical stability is improved, the heat conduction effect is excellent, the corrugated-pipe-shaped packaging transition mechanism is sleeved outside the lead wire, the good protection effect is achieved, the auxiliary reinforcement is provided for heat conduction, the heat gathering and transfer effect is good, the integral supporting and fixing performance is good, the glass insulation packaging layer is also provided with excellent auxiliary reinforcement performance, the performance of reducing the soft vibration sense is good in the use process, the waterproof and anti-corrosion performance is excellent, and the comprehensive sensitivity and the service life are obviously improved.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.

Example 1:

the utility model provides a take temperature sensor of NTC heat sensitive chip, including the heat conduction substrate, NTC heat sensitive chip, the lead wire, glass insulation packaging layer, above-mentioned structure is current sensor conventional structure, do not restrict here, design according to prior art demand can, furthermore, still include the transition metal base station, encapsulation ferry mechanism, the transition metal base station adopts the metal mesh structure, locate between heat conduction substrate and the NTC heat sensitive chip, be the transition layer, and print coated glass insulation paste on the netted transition metal base station of metal, after the sintering, the metal mesh is located the parcel of glass insulation paste, both do and connect the intensive skeleton, do the heat conduction skeleton again, it is practical high-efficient. The outer diameter of the metal mesh wire is 0.02 +/-0.002 mm, and the thickness ratio of the heat-conducting substrate, the transition metal base station and the NTC heat-sensitive chip is 0.5:0.5: 5.

The packaging and guiding mechanism is made of composite metal materials and is in a corrugated pipe shape, and is connected to the heat conducting substrate through glass insulation slurry sintering and infiltration. When the packaging and guiding mechanism is used, the packaging and guiding mechanism is sleeved on the outer wall of the lead, the inner diameter of the tube shape of the packaging and guiding mechanism is 1.5-2 times larger than the outer diameter of the lead, the length of the tube body is 1-3 times of the thickness of the NTC thermosensitive chip, and the packaging and guiding mechanism and the lead are sintered and fixed on the NTC thermosensitive chip by glass insulation sizing materials.

Example 2:

based on the temperature sensor structure of embodiment 1, it is further preferable that the inner and outer walls of the package ferry mechanism are sprayed with a conductive paste layer, and the thickness of the plating layer is 0.1-0.5 mm. The conductive paste adopts any one or a composition of silver electronic paste and copper electronic paste, and the composition is selected and mixed according to the volume ratio of 1:1 for application.

Example 3:

based on the temperature sensor structure of embodiment 1 or embodiment 2, the transition metal base and the heat conducting substrate both contain copper, aluminum, tin and manganese elements, the mass percentage of the (copper + aluminum + tin) elements accounts for more than 50% of the coincidence rate, the mass percentage of the manganese elements accounts for more than 5%, and the NTC thermosensitive chip is connected with the heat conducting substrate through the transition metal base and the glass insulation paste;

specifically, the raw materials for forming the heat-conducting substrate are an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot in a mass ratio of 1:0.1-0.3, the chemical components of the aluminum-tin-copper alloy ingot meet the GB/T20975 standard, and the chemical components of the aluminum-manganese alloy ingot meet the GB/T3190-2008 standard.

The transition metal base is formed by melting and casting brass, bronze, titanium-aluminum alloy and zinc-manganese alloy, wherein the mass percentage of (copper + aluminum + tin) elements is more than 70%.

Meanwhile, the packaging and guiding mechanism comprises the following element components, by mass, 4.5-6.3% of Mg, 2.6-3.8% of Si, 1.2-3.3% of Cu, 0.8-1.2% of Mn, 0.3-0.45% of Ni, 0.2-0.4% of RE, less than or equal to 0.06% of Fe, and the balance of Al and inevitable impurities. Wherein RE is selected from the composition of La, Ce and Y, and the mass percentage of La and (Ce + Y) is 60-75% and 25-40%.

Example 4:

the temperature sensor with the NTC heat-sensitive chip based on the embodiments 1-3 is prepared by the following processes:

1) taking materials, smelting an aluminum-tin-copper alloy ingot and an aluminum-manganese alloy ingot, preparing a heat conduction substrate blank, and slicing to obtain a heat conduction substrate;

2) stacking the heat-conducting substrate, the transition metal base station and the NTC heat-sensitive chip in sequence, and realizing interlayer printing and sintering by using glass insulation slurry;

3) a lead is arranged on an NTC thermosensitive chip electrode, a packaging transition mechanism is sleeved on the outer side of the lead, and the lead and the packaging transition mechanism are brushed and sintered by glass insulating slurry;

4) and (3) adopting a dispenser to dispense glass insulating slurry on the NTC thermosensitive chip, completely covering the thermosensitive resistor chip and the roots of the lead wire and the packaging transition mechanism, wherein the covering thicknesses of the lead wire and the roots of the packaging transition mechanism are more than 0.05mm, and sintering to form a glass insulating packaging layer.

Example 5:

a specific example preparation is given here based on the temperature sensor with NTC thermal chip and the preparation process thereof given in examples 1-4.

A temperature sensor with an NTC heat-sensitive chip comprises a heat-conducting substrate, the NTC heat-sensitive chip, a lead wire, a glass insulation packaging layer, a transition metal base station and a packaging transition mechanism, wherein the transition metal base station and the heat-conducting substrate both contain copper, aluminum, tin and manganese, the mass percentage of the elements (copper, aluminum and tin) is more than 50% (57.4% in the embodiment) of the overlapping rate, the mass percentage of the elements manganese is more than 5% (6.16% in the embodiment), and the NTC heat-sensitive chip is connected with the heat-conducting substrate through the transition metal base station and glass insulation slurry; the packaging and guiding mechanism is made of composite metal materials and is in a corrugated pipe shape, and is connected to the heat conducting substrate through glass insulation slurry sintering and infiltration.

The preparation process of the temperature sensor with the NTC heat-sensitive chip is the same as that of the embodiment 4. The transition metal base station is of a metal mesh structure, the outer diameter of a metal mesh wire is 0.02 +/-0.002 mm, and the thickness ratio of the heat-conducting substrate to the transition metal base station to the NTC heat-sensitive chip is 0.5:0.5: 5; the inner wall and the outer wall of the packaging guiding mechanism are sprayed with conductive slurry layers, the thickness of the coating is 0.22mm, the conductive slurry is a silver electronic slurry and copper electronic slurry composition, and the silver electronic slurry and the copper electronic slurry composition are mixed and applied according to the volume ratio of 1: 1.

Specifically, the aluminum-tin-copper alloy ingot and the aluminum-manganese alloy ingot in the mass ratio of 1:0.22 are selected as the raw materials for forming the heat-conducting substrate, the chemical components of the aluminum-tin-copper alloy ingot meet the GB/T20975 standard, and the chemical components of the aluminum-manganese alloy ingot meet the GB/T3190-2008 standard. The transition metal base is formed by melting and casting brass, bronze, titanium-aluminum alloy and zinc-manganese alloy, wherein the mass percentage of (copper + aluminum + tin) elements is more than 70%.

The packaging and guiding mechanism comprises the following element components, by mass, 4.75% of Mg, 3.2% of Si, 1.7% of Cu, 0.9% of Mn, 0.33% of Ni, 0.3% of RE, less than or equal to 0.06% of Fe, and the balance of Al and inevitable impurities. Wherein, RE is selected from La, Ce and Y composition, and the mass percentage of La and (Ce + Y) is 70 percent and 30 percent.

The finished product prepared in example 5 was subjected to performance testing with the following data:

	suitable temperature is lower	Voltage resistance, KV	Temperature sensitivity, s
				Example 5	-200—500	3.10	0.25±0.03
Comparative group 1	-200—500	2.65	0.58±0.05
				Comparative group 2	-200—500	2.80	0.84±0.07
Comparative group 3	-150—400	2.55	1.46±0.10
				Blank group	-100—400	2.60	1.12±0.10

Wherein comparative group 1 is based on example 5 and does not include a transition metal base;

comparative group 2 was based on example 5 without encapsulation ferry mechanism;

comparative group 3 was based on example 5 and did not include a transition metal base and a package ferry mechanism;

the blank group is a pure NTC thermosensitive chip.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.