阅读说明：本技术 一种改善pcb板翘的板边结构 (Improve flange limit structure of PCB board perk ) 是由 夏运州 李军 唐先渠 罗湘滔 于 2020-11-05 设计创作，主要内容包括：本发明涉及PCB板制造技术领域,公开了一种改善PCB板翘的板边结构,其包括工艺边和多个单元板,所述单元板和工艺边之间设有连接板,所述单元板沿工艺边的长度方向设置,所述工艺边的上下两端设有铜层。与现有技术相比,本发明通过在工艺边的上下两端设置铜层,利于工艺边均匀分摊应力从而有效减少翘曲的发生,而铜层的设置也利于提高PCB板的连接强度。工艺边与单元板之间的连接板不设铜层,工艺边应力就难以通过连接板传递到单元板中,从而能有效降低单元板翘曲的发生。本发明整体结构简单,能有效减少PCB板发生翘曲,且利于制作,适于推广应用。(The invention relates to the technical field of PCB manufacturing, and discloses a board edge structure for improving warping of a PCB, which comprises a process edge and a plurality of unit boards, wherein a connecting board is arranged between each unit board and the process edge, the unit boards are arranged along the length direction of the process edge, and copper layers are arranged at the upper end and the lower end of the process edge. Compared with the prior art, the copper layers are arranged at the upper end and the lower end of the process edge, so that the stress is uniformly distributed on the process edge, the warping is effectively reduced, and the arrangement of the copper layers is also beneficial to improving the connection strength of the PCB. The connecting plate between the process edge and the unit plate is not provided with a copper layer, and the stress of the process edge is difficult to be transmitted to the unit plate through the connecting plate, so that the warping of the unit plate can be effectively reduced. The PCB board has a simple integral structure, can effectively reduce the warping of the PCB board, is beneficial to manufacturing, and is suitable for popularization and application.)

1. The utility model provides an improve board edge structure of PCB board perk which characterized in that, includes technology limit and a plurality of cell boards, be equipped with the connecting plate between cell board and the technology limit, the cell board sets up along the length direction on technology limit, the upper and lower both ends on technology limit are equipped with the copper layer.

2. The board edge structure for improving the warpage of a PCB as claimed in claim 1, wherein the number of the process edges is two, and a plurality of unit boards are arranged between the two process edges and are symmetrically arranged.

3. The board edge structure of an improved PCB board warp according to claim 2, wherein the number of the connection boards between the unit board and the process edge is plural.

4. The board edge structure for improving the warpage of the PCB as claimed in claim 3, wherein both ends of the connecting board are provided with cambered surfaces, and the cambered surfaces protrude towards the inner direction of the connecting board.

5. The board edge structure of an improved PCB board warp as claimed in claim 4, wherein the length and width of the copper layer are consistent with the length and width of the process edge, respectively.

6. The board edge structure for improving the warpage of the PCB as claimed in claim 5, wherein the connecting board is made of prepreg.

7. A board edge structure of an improved PCB warp as claimed in claim 6 wherein the width of the connection board is 1.37mm-2mm, and the length of the connection board is 3.78mm-5 mm.

8. A board edge structure of an improved PCB warp as claimed in claim 7, wherein the width of the connection board is 1.37mm, and the length of the connection board is 3.78 mm.

Technical Field

The invention relates to the technical field of PCB manufacturing, in particular to a board edge structure for improving warping of a PCB.

Background

Conventional PCB board includes PCB body and technology limit, the technology edge covers and is equipped with the copper foil, the easy warpage of copper foil, traditional proof warp design is equipped with the connecting plate between PCB body and technology limit, cut into many sections with the copper foil on technology edge, every section copper foil is because length shortens, can effectively reduce the copper foil perk on the technology limit, the copper foil is cut and can reduce the joint strength of PCB board, for the joint strength who increases the PCB board, also cover on the connecting plate and establish the copper foil, this setting makes the copper foil on the connecting plate be connected with the copper foil on PCB body and technology edge respectively, however the spacious district between the copper foil on the technology edge also can lead to the technology limit atress uneven, thereby take place the perk, the perk on technology limit can influence the PCB body through the copper foil on the connecting plate. Along with the increase of the structure and thickness change of the board, after the PCB board warps, the subsequent PCBA process is very difficult to process, the mounting of the BGA element with small space and high precision requirement is particularly difficult, and due to the fact that the PCB board is uneven and warped in the PCBA process, the BGA element is uneven to be mounted, so that a cold solder joint is formed, and the conduction between elements cannot be realized, so that the performance of the whole machine is influenced.

Therefore, there is a need to provide a new board edge structure for improving the warpage of the PCB to solve the above-mentioned technical problems.

Disclosure of Invention

The invention aims to solve the technical problem of providing a board edge structure for improving the warping of a PCB, which has a simple structure and can effectively reduce the warping of the PCB.

According to the technical scheme, the board edge structure for improving the warping of the PCB comprises a technical edge and a plurality of unit boards, wherein a connecting board is arranged between each unit board and the corresponding technical edge, the unit boards are arranged along the length direction of the technical edge, and copper layers are arranged at the upper end and the lower end of the technical edge.

Preferably, the number of the process edges is two, and a plurality of unit plates are arranged between the two process edges and are symmetrically arranged.

Preferably, the number of the connecting plates between the unit plate and the technical edge is multiple.

Preferably, both ends of the connecting plate are provided with cambered surfaces, and the cambered surfaces protrude towards the inner direction of the connecting plate.

Preferably, the length and width of the copper layer correspond to the length and width of the process edge, respectively.

Preferably, the connection plate is made of a prepreg.

Preferably, the width of the connecting plate is 1.37mm-2mm, and the length of the connecting plate is 3.78mm-5 mm.

Preferably, the width of the connecting plate is 1.37mm, and the length of the connecting plate is 3.78 mm.

Compared with the prior art, the copper layers are arranged at the upper end and the lower end of the process edge, so that the stress is uniformly distributed on the process edge, the warping is effectively reduced, and the arrangement of the copper layers is also beneficial to improving the connection strength of the PCB. The connecting plate between the process edge and the unit plate is not provided with a copper layer, and the stress of the process edge is difficult to be transmitted to the unit plate through the connecting plate, so that the warping of the unit plate can be effectively reduced. The PCB board has a simple integral structure, can effectively reduce the warping of the PCB board, is beneficial to manufacturing, and is suitable for popularization and application.

Drawings

FIG. 1 is a schematic structural view of the present invention (a connecting plate on a cell plate);

fig. 2 is a schematic structural diagram (two connecting plates on a unit plate) of the invention.

In the figure:

1. the process edge comprises 2 units, 3 connecting plates and 31 cambered surfaces.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1-2, the present embodiment provides a board edge structure for improving a warpage of a PCB, including a process edge 1 and a plurality of unit boards 2, where the unit boards 2 are circuit boards required by customers, and a plurality of unit boards 2 can be manufactured in one PCB; be equipped with connecting plate 3 between cell board 2 and the technology limit 1, cell board 2 sets up along the length direction on technology limit 1, and the upper and lower both ends on technology limit 1 are equipped with the copper layer, and this setting makes the effectual formation that reduces of stress ability that distributes that technology limit 1 can be even, and the copper layer is not established at the upper and lower both ends of connecting plate 3, and the stress on technology limit 1 is difficult to influence cell board 2 through connecting plate 3.

The number of the process edges 1 is two, and a plurality of unit plates 2 are arranged between the two process edges 1 and are symmetrically arranged. In a PCB, two technical edges 1 are respectively arranged at two sides of the PCB, and all unit boards 2 are arranged between the two technical edges 1 and are distributed in an array manner along the length direction of the technical edges 1. This arrangement can effectively reduce the occurrence of warpage of the unit board 2.

The number of the connection plates 3 between the unit plate 2 and the technical edge 1 is multiple. One connecting plate 3 is provided when the width of the unit board 2 is small, and several connecting plates 3 are correspondingly provided when the width of the unit board 2 is large, so as to maintain the connection strength of the PCB. In this embodiment, if the width of the cell plate 2 is less than 50mm, one connecting plate 3 is disposed between the cell plate 2 and the process edge 1, and if the width of the cell plate 2 is greater than or equal to 50mm, two or more connecting plates 3 are disposed between the cell plate 2 and the process edge 1.

Both ends of connecting plate 3 all are equipped with cambered surface 31, and cambered surface 31 is towards the inside direction protrusion of connecting plate 3. The area between the technical edge 1 and the unit board 2 is required to be milled except for the connecting board 3, the two ends of the connecting board 3 are set to be cambered surfaces 31 so as to be matched with milling cutters, and the arrangement is favorable for reducing the production difficulty and improving the production efficiency.

The length and width of the copper layer correspond to the length and width of the technical edge 1, respectively. This setting makes the joint strength of PCB board better.

The connection plate 3 is made of a prepreg. The stress of the process board is hardly transmitted to the unit board 2 through the prepreg, so that the unit board 2 can be effectively prevented from warping.

The width of the connecting plate 3 is 1.37mm-2mm, and the length of the connecting plate 3 is 3.78mm-5 mm.

The width of connecting plate 3 is 1.37mm, and the length of connecting plate 3 is 3.78 mm.

According to the invention, the copper layers are arranged at the upper end and the lower end of the process edge 1, so that the process edge 1 can uniformly distribute stress, the warping is effectively reduced, and the arrangement of the copper layers is also beneficial to improving the connection strength of the PCB. The connecting plate 3 between the process edge 1 and the unit plate 2 is not provided with a copper layer, and the stress of the process edge 1 is difficult to be transmitted to the unit plate 2 through the connecting plate 3, so that the warping of the unit plate 2 can be effectively reduced. The PCB board has a simple integral structure, can effectively reduce the warping of the PCB board, is beneficial to manufacturing, and is suitable for popularization and application.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.