阅读说明：本技术 正交连接器的晶片、正交连接器及连接器组件 (Chip of orthogonal connector, orthogonal connector and connector assembly ) 是由 鲁中原 杨兆振 林杨 潘波 程喜乐 史有权 于 2020-11-30 设计创作，主要内容包括：本发明涉及一种正交连接器的晶片、正交连接器及连接器组件,晶片包括绝缘框架,设有信号差分对和接地端子,信号差分对包括两个信号端子；信号端子、接地端子均包括位于安装端的安装端子,信号端子包括位于配合端的信号触头,接地端子包括位于配合端的接地触头；信号端子、接地端子的安装端子沿第一方向间隔排布,所述信号触头、接地触头均沿所述第一方向延伸以用于与适配连接器对插,信号触头、接地触头沿第二方向间隔排布,第一方向垂直于第二方向；所述信号触头、接地触头均相对于对应端子的本体部分垂直弯折,信号触头、接地触头相互平行；同一信号差分对中的两信号触头沿第三方向并列排布,第三方向同时垂直于第一方向和第二方向。(The invention relates to a wafer of an orthogonal connector, the orthogonal connector and a connector assembly, wherein the wafer comprises an insulating frame, a signal differential pair and a grounding terminal, wherein the signal differential pair comprises two signal terminals; the signal terminal and the ground terminal respectively comprise a mounting terminal at a mounting end, the signal terminal comprises a signal contact at a mating end, and the ground terminal comprises a ground contact at a mating end; the mounting terminals of the signal terminals and the ground terminals are arranged at intervals along a first direction, the signal contacts and the ground contacts extend along the first direction to be plugged with the adaptive connector, the signal contacts and the ground contacts are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; the signal contact and the grounding contact are vertically bent relative to the body part of the corresponding terminal, and the signal contact and the grounding contact are parallel to each other; two signal contacts in the same signal differential pair are arranged in parallel along a third direction, and the third direction is perpendicular to the first direction and the second direction at the same time.)

1. A wafer (200) of orthogonal connectors, characterized in that: the method comprises the following steps:

the insulating frame (203) is provided with a signal differential pair and a ground terminal (205), the signal differential pair comprises two signal terminals (204), and the signal terminals (204) and the ground terminal (205) are both bent terminals;

the signal terminals (204) and the ground terminals (205) are provided with mounting ends (201) used for being mounted on a circuit board and mating ends (202) used for being plugged with a mating connector, each of the signal terminals (204) and the ground terminals (205) comprises the mounting terminals positioned at the mounting ends (201), the mounting terminals are used for being mounted on the circuit board, the signal terminals (204) comprise signal contacts (2041) positioned at the mating ends (202), the ground terminals (205) comprise ground contacts (2051) positioned at the mating ends (202), each of the signal terminals (204) and the ground terminals (205) comprises a body part (207) arranged in an insulating frame (203), and the body parts (207) realize the vertical conversion from the mounting terminals to the contacts;

mounting terminals of the signal terminals (204) and the ground terminals (205) are arranged at intervals along a first direction, the signal contacts (2041) and the ground contacts (2051) extend along the first direction to be used for being plugged with an adaptive connector, the signal contacts (2041) and the ground contacts (2051) are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction;

the signal contact (2041) and the ground contact (2051) are vertically bent relative to the body part (207) of the corresponding terminal, and the signal contact (2041) and the ground contact (2051) are parallel to each other;

the two signal contacts (2041) in the same signal differential pair are arranged in parallel along a third direction, the two signal contacts (2041) are in the same plane, and the third direction is perpendicular to the first direction and the second direction at the same time.

2. The wafer (200) of orthogonal connectors as recited in claim 1, characterized in that: the mounting ends (201) of the signal terminals (204) and the grounding terminals (205) are respectively arranged in a bending way relative to the body part (207) of the corresponding terminal, the bending direction is the third direction, and the mounting ends (201) are bent to ensure the distance between the mounting ends of the adjacent wafers and the mounting terminals of the adjacent wafers in the third direction.

3. The wafer of orthogonal connectors as defined in claim 1 or 2, wherein: and the insulating frame (203) is provided with a reinforcing protrusion (208) corresponding to each mounting terminal, and the reinforcing protrusion (208) is positioned on one side of the corresponding mounting terminal along the third direction.

4. A quadrature connector, characterized by: the method comprises the following steps:

a housing (100);

a wafer (200) provided on the housing (100), the wafer (200) comprising:

the insulating frame (203) is provided with a signal differential pair and a ground terminal (205), the signal differential pair comprises two signal terminals (204), and the signal terminals (204) and the ground terminal (205) are both bent terminals;

the signal terminals (204) and the ground terminals (205) are provided with mounting ends (201) used for being mounted on a circuit board and mating ends (202) used for being plugged with an adaptive connector, the signal terminals (204) and the ground terminals (205) comprise mounting terminals located at the mounting ends (201), the mounting terminals are used for being mounted on the circuit board, the signal terminals (204) comprise signal contacts (2041) located at the mating ends (202), the ground terminals (205) comprise ground contacts (2051) located at the mating ends (202), the signal terminals (204) and the ground terminals (205) each comprise body parts arranged in an insulating frame (203), and the body parts realize vertical conversion from the mounting terminals to the contacts;

mounting terminals of the signal terminals (204) and the ground terminals (205) are arranged at intervals along a first direction, the signal contacts (2041) and the ground contacts (2051) extend along the first direction to be used for being plugged with an adaptive connector, the signal contacts (2041) and the ground contacts (2051) are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction;

the signal contact (2041) and the ground contact (2051) are vertically bent relative to the body part (207) of the corresponding terminal;

the two signal contacts (2041) in the same signal differential pair are arranged in parallel along a third direction, the two signal contacts (2041) are in the same plane, and the third direction is perpendicular to the first direction and the second direction at the same time.

5. The orthogonal connector as defined in claim 4, wherein: the wafers (200) are arranged in sequence along the third direction in at least two;

the mounting ends (201) of the signal terminals (204) and the ground terminals (205) of at least one wafer (200) of the two adjacent wafers (200) are arranged in a bending mode relative to the corresponding body part (207), and the bending direction of the mounting ends is the third direction, so that in the third direction, the distance between the mounting terminals of any two adjacent wafers (200) is larger than the distance between the ground contacts (2051) of the two corresponding wafers (200).

6. The orthogonal connector as defined in claim 4, wherein: the wafers (200) are arranged in sequence along the third direction in at least two;

and the paired signal contacts (2041) of one wafer (200) in any two adjacent wafers (200) and the paired signal contacts (2041) of the other wafer (200) are arranged in a staggered mode along the second direction, and the paired signal contacts (2041) in the wafer (200) and the ground contacts (2051) in the adjacent wafer (200) are arranged on the same straight line side by side along the third direction.

7. The orthogonal connector as defined in claim 6, wherein: the ground contact (2051) and one of the signal contacts (2041) in the same wafer (200) are arranged directly opposite to each other along the second direction.

8. The orthogonal connector as claimed in claim 6 or 7, wherein: the wafers (200) are arranged in sequence along the third direction in at least two;

the orthogonal connector includes:

a shield mesh (300) mounted on the housing (100), the shield mesh (300) being provided with signal contact through holes (301) corresponding to the signal contacts (2041) and ground contact through holes (302) corresponding to the ground contacts (2051);

the signal contacts (2041) in a pair are separated by the hole walls of the signal contact through holes (301) which penetrate through the signal contacts and correspond to the signal contact through holes (301) of different pairs, and the ground contacts (2051) penetrate through the ground contact through holes (302) and are electrically contacted with the hole walls of the ground contact through holes (302);

the shield mesh (300) includes shield beams that separate the differential signal pairs.

9. The orthogonal connector as defined in claim 8, wherein: two signal contacts (2041) in the same differential signal pair share one of the signal contact perforations (301).

10. A connector assembly for connecting between two circuit boards arranged orthogonally, characterized in that: the method comprises the following steps:

an orthogonal connector and an adaptive connector;

the orthogonal connector is the orthogonal connector of any one of claims 4-9;

the adaptive connector comprises at least two adaptive connector wafers which are sequentially arranged along a second direction;

the adaptive connector wafer comprises adaptive connector signal terminals arranged in pairs, adaptive connector ground terminals and mounting terminals for connecting with corresponding circuit boards, each adaptive connector signal terminal comprises an adaptive connector signal contact inserted with the orthogonal connector, and the adaptive connector ground terminals comprise adaptive connector ground contacts inserted with the orthogonal connector;

all the mounting terminals in the adaptive connector are sequentially arranged along the third direction, and the ground contacts and the adaptive connection signal contacts of the adaptive connector and the paired adaptive connector signal contacts are arranged at intervals along the third direction.

Technical Field

The invention relates to a wafer of an orthogonal connector, the orthogonal connector and a connector assembly.

Background

Orthogonal connector systems are intended to communicate signals between two mutually perpendicular circuit boards, which requires that the two connectors in the orthogonal connector system have a vertical flip-over on the terminals during the connection process. For example, chinese patent No. CN102176552B discloses a right-angle adapter, wherein the disclosed connector system comprises a first connector mounted on a first circuit board, a second connector mounted on a second circuit board, the first circuit board and the second circuit board are perpendicular to each other, and an adapter of the first connector and the second connector. The first connector and the second connector are both bending connectors with conventional design, the first connector and the second connector respectively comprise at least two wafers, the wafer arrangement directions in the two connectors are vertical, and terminals (including signal terminals and grounding terminals) in the first connector and the second connector are vertical to each other. In order to conduct the two connectors, a terminal array is arranged in the adapter, and the ends at the two ends of the terminal array are perpendicular to each other and are correspondingly inserted with terminals in the first connector and the second connector respectively.

The prior art has been to provide an adapter in which the vertical folding during the connection of the first and second connectors occurs, and which is of conventional design. However, since the adapter is added, the connection needs to be performed twice, and since the adapter is an additional component, although the design cost is saved, the manufacturing cost is also increased.

Disclosure of Invention

The invention aims to provide a wafer of an orthogonal connector, which aims to solve the technical problem that the manufacturing cost is higher after an adapter is added for switching in the prior art; an orthogonal connector and a connector assembly using the wafer are also provided to solve the above technical problems.

In order to achieve the above purpose, the technical scheme of the wafer of the orthogonal connector of the invention is as follows: a wafer of orthogonal connectors, comprising:

the insulating frame is provided with a signal differential pair and a grounding terminal, the signal differential pair comprises two signal terminals, and the signal terminals and the grounding terminal are both bent terminals;

the signal terminals and the ground terminals respectively have mounting ends used for being mounted on the circuit board and mating ends used for being inserted into the adaptive connector, the signal terminals and the ground terminals respectively comprise the mounting terminals located at the mounting ends, the mounting terminals are used for being mounted on the circuit board, the signal terminals comprise signal contacts located at the mating ends, the ground terminals comprise ground contacts located at the mating ends, the signal terminals and the ground terminals respectively comprise body parts arranged in the insulating frame, and the body parts realize vertical conversion from the mounting terminals to the contacts;

the mounting terminals of the signal terminals and the ground terminals are arranged at intervals along a first direction, the signal contacts and the ground contacts extend along the first direction to be plugged with the adaptive connector, the signal contacts and the ground contacts are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction;

the signal contact and the grounding contact are vertically bent relative to the body part of the corresponding terminal, and the signal contact and the grounding contact are parallel to each other;

the two signal contacts in the same signal differential pair are arranged in parallel along a third direction, the two signal contacts are in the same plane, and the third direction is perpendicular to the first direction and the second direction at the same time.

The invention has the beneficial effects that: the signal contacts are vertically bent, the two signal contacts are arranged in parallel along the third direction, the two signal contacts can be directly plugged with the signal contacts arranged at intervals along the third direction in the adaptive connector wafer, signal conduction is completed, the grounding contact is vertically bent, the grounding contact and the signal contacts are arranged in parallel, and signal differential pairs can be shielded after the orthogonal connector and the adaptive connector are plugged, so that the signal transmission quality is improved. In the invention, the terminals in the orthogonal connector are bent to realize reversing and opposite insertion, an adapter is not required to be added for conversion, the number of parts is less, the assembly is more convenient, and the manufacturing cost is lower.

As a further optimized scheme, the mounting ends of the signal terminals and the ground terminals are respectively arranged in a bending way relative to the body part of the corresponding terminal, the bending direction is the third direction, and the mounting ends are bent to ensure the distance between the mounting ends of the adjacent wafers and the mounting terminals of the adjacent wafers in the third direction.

The effect of this scheme is that after arranging a plurality of wafers, to ensure the output quality, the vertical spacing of the mounting terminals of adjacent wafers must be ensured to be greater than the vertical spacing of the ground contacts in adjacent wafers, and this comparison is ensured by bending the mounting ends of the terminals.

As a further optimized scheme, the insulating frame is provided with a reinforcing protrusion corresponding to each mounting terminal, and the reinforcing protrusion is located on one side of the corresponding mounting terminal along the third direction.

The effect of this scheme lies in, strengthens the arch through setting up, carries out the part to installation terminal department and strengthens, increases the steadiness of installation terminal root, prevents the crimping foot of kneeling.

The technical scheme of the orthogonal connector of the invention is as follows: a quadrature connector comprising:

a housing;

the wafer is located on the casing, and the wafer includes:

the insulating frame is provided with a signal differential pair and a grounding terminal, the signal differential pair comprises two signal terminals, and the signal terminals and the grounding terminal are both bent terminals;

the signal terminals and the ground terminals respectively have mounting ends used for being mounted on the circuit board and mating ends used for being inserted into the adaptive connector, the signal terminals and the ground terminals respectively comprise the mounting terminals located at the mounting ends, the mounting terminals are used for being mounted on the circuit board, the signal terminals comprise signal contacts located at the mating ends, the ground terminals comprise ground contacts located at the mating ends, the signal terminals and the ground terminals respectively comprise body parts arranged in the insulating frame, and the body parts realize vertical conversion from the mounting terminals to the contacts;

the mounting terminals of the signal terminals and the ground terminals are arranged at intervals along a first direction, the signal contacts and the ground contacts extend along the first direction to be plugged with the adaptive connector, the signal contacts and the ground contacts are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction;

the signal contact and the grounding contact are vertically bent relative to the body part of the corresponding terminal, and the signal contact and the grounding contact are parallel to each other;

the two signal contacts in the same signal differential pair are arranged in parallel along a third direction, the two signal contacts are in the same plane, and the third direction is perpendicular to the first direction and the second direction at the same time.

The invention has the beneficial effects that: the signal contacts are vertically bent, the two signal contacts are arranged in parallel along the third direction, the two signal contacts can be directly plugged with the signal contacts arranged at intervals along the third direction in the adaptive connector wafer, signal conduction is completed, the grounding contact is vertically bent, the grounding contact and the signal contacts are arranged in parallel, and signal differential pairs can be shielded after the orthogonal connector and the adaptive connector are plugged, so that the signal transmission quality is improved. In the invention, the terminals in the orthogonal connector are bent to realize reversing and opposite insertion, an adapter is not required to be added for conversion, the number of parts is less, the assembly is more convenient, and the manufacturing cost is lower.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

and the mounting ends of the signal terminal and the ground terminal of at least one of the two adjacent wafers are respectively arranged in a bending way relative to the corresponding body part, and the bending direction is the third direction, so that in the third direction, the distance between the mounting terminals of any two adjacent wafers is larger than the distance between the ground contacts of the two corresponding wafers.

The effect of this scheme is that after arranging a plurality of wafers, to ensure the output quality, the vertical spacing of the mounting terminals of adjacent wafers must be ensured to be greater than the vertical spacing of the ground contacts in adjacent wafers, and this comparison is ensured by bending the mounting ends of the terminals.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

and the paired signal contacts of one wafer in any two adjacent wafers are staggered with the paired signal contacts of the other wafer along the second direction, and the paired signal contacts in the wafer and the ground contacts in the adjacent wafer are arranged side by side on a straight line along the third direction.

The effect of this scheme lies in, through making in arbitrary two adjacent wafers become to signal contact along second direction dislocation arrangement, can shield signal contact with the ground contact of adjacent wafer, improve signal transmission quality.

As a further optimized solution, the ground contact and one of the signal contacts in the same wafer are arranged opposite to each other along the second direction.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

the orthogonal connector includes:

the shielding net is assembled on the shell, signal contact through holes are formed in the shielding net corresponding to the signal contacts, and grounding contact through holes are formed in the shielding net corresponding to the grounding contacts;

the paired signal contacts pass through the signal contact through holes and are spaced from the hole walls of the signal contact through holes corresponding to the different pairs of signal contacts, and the ground contacts pass through the ground contact through holes and are electrically contacted with the hole walls of the ground contact through holes;

the shield mesh includes shield beams that separate the differential signal pairs.

The effect of this scheme is that through setting up the shielding net, can be with each ground contact ground jointly, the shielding roof beam that forms also can be with each signal differential pair separation, makes orthogonal connector can be used in the scene of high-speed transmission.

As a further preferred solution, two signal contacts in the same signal differential pair share one of said signal contact through holes.

The effect of this scheme lies in, and a signal contact of sharing is perforated, adds man-hour more convenient.

As a further optimized scheme, a signal contact socket is arranged on the shell corresponding to the signal contact through hole;

clamping protrusions are arranged on the shell around two signal contact sockets corresponding to the same signal differential pair, and the signal contact through holes are matched with the clamping protrusions to be clamped.

The effect of this scheme lies in, installs the shielding net on the casing through the mode of joint, and the joint is protruding to be arranged around the signal contact socket, can utilize the signal contact perforation on the shielding net, need not the extra trompil on the shielding net.

As a further optimized scheme, both the two signal contacts of the same signal differential pair are provided with signal outlet bending parts bent along the second direction, so that the two signal contacts are opposite to the signal outlet bending parts arranged along the third direction, and the bending directions of the signal contact bending parts in the two signal contacts are opposite;

the both sides along the second direction of each signal contact socket of casing all are equipped with the joint is protruding, looks interval between one of them joint arch and the signal contact socket to the signal contact bending part that supplies signal contact arranges the interval in, and another joint is protruding to be arranged along the signal contact socket that corresponds, supports on signal contact with supporting.

The technical scheme has the advantages that one clamping protrusion is spaced from the signal contact socket, and the signal contact bending part can be arranged in the shielding net, so that the shielding effect is enhanced; the other clamping protrusion is arranged along the signal contact socket, and can support the signal contact in a propping manner, so that the strength is improved. In addition, according to the invention, the shielding net is arranged on the shell through the clamping protrusion, and the signal contact and the shielding net are separated through the clamping protrusion, so that the signal contact and the shielding net are prevented from being in short circuit due to contact, and the signal transmission quality is prevented from being influenced.

As a further optimized scheme, a clamping groove for clamping a ground contact bending part of the ground contact is arranged on the shielding net, and the clamping groove is communicated with the ground contact through hole.

The effect of this scheme lies in, sets up the draw-in groove after, dodges ground contact kink, and ground contact kink contacts with the draw-in groove contact simultaneously improves the contact reliability of ground contact and shielding net.

As a further optimized scheme, a grounding column is arranged on the shielding net corresponding to the position of the grounding contact through hole, and the grounding contact through hole is arranged in the grounding column.

The effect of this scheme lies in, sets up behind the ground connection post, can improve the reliability of being connected between ground contact and the shielding net.

As a further optimized scheme, a grounding contact jack is arranged on the shell corresponding to the grounding contact through hole;

the ground post is inserted into the ground contact receptacle.

As a further optimized solution, the housing is arranged extending along the first direction;

the shell comprises a partition board which divides the inner cavity of the shell into a first notch and a second notch, the first notch is used for the adaptive connector to penetrate, the second notch is used for the wafer to penetrate, and the ground contact and the signal contact of the wafer penetrate through the partition board so as to be oppositely inserted with the adaptive connector;

the housing includes a sidewall forming the second recess with the baffle;

one of the side wall and the insulating frame is provided with a bayonet, and the other is provided with a clamping block, so that the wafer is clamped on the shell along the first direction.

The effect of this scheme lies in, and the wafer is installed on the casing through the mode that clamps, and is more convenient during the equipment.

As a further optimized scheme, the bayonet is arranged on the side wall, and the fixture block is arranged on the insulating frame;

the clamping block and the bayonet are in blocking fit along the first direction so as to prevent the wafer from being pulled out;

the side wall is provided with a shell stopping step, one end of the insulating frame facing the shell along the first direction is provided with an insulating frame stopping step, the shell stopping step and the insulating frame stopping step are in stopping fit along the first direction, and the shell stopping step and the insulating frame stopping step are matched with a clamping block and a clamping opening which are mutually matched to position the wafer in the first direction.

The effect of this scheme lies in, has realized the location to the wafer through the cooperation of two fender steps, bayonet socket and fixture block, and positioning effect is better.

As a further optimized scheme, the side walls of the shell comprise two side walls located in the second direction, limiting grooves extending along the first direction are formed in the two side walls, and the insulating frame is adaptive to be clamped into the limiting grooves;

the bayonet is arranged at the bottom of the limiting groove.

The effect of this scheme lies in, can carry on spacingly to each wafer in the third direction through setting up the spacing groove to cooperate the location on the first direction, with the whole reliable fixed mounting of wafer on the casing.

As a further preferred solution, the side walls of the housing include two side walls in the second direction, one of the two side walls, which faces away from the mounting terminals, is arranged to protrude from the other side wall in the first direction, and the protruding portions of the side walls are adapted to abut against the insulating frame of the wafer after the wafer is inserted into the housing.

The effect of this scheme lies in, through protruding portion to the wafer top, when installing the wafer on the circuit board, this protruding portion carries out effective support to the wafer, makes the installation terminal can insert in the circuit board.

As a further optimized scheme, the insulating frame is provided with a reinforcing protrusion corresponding to each mounting terminal, and the reinforcing protrusion is located on one side of the corresponding mounting terminal along the third direction.

The effect of this scheme lies in, strengthens the arch through setting up, carries out the part to installation terminal department and strengthens, increases the steadiness of installation terminal root, prevents the crimping foot of kneeling.

The technical scheme of the connector assembly is as follows: a connector assembly for connecting between two circuit boards in an orthogonal arrangement, comprising:

an orthogonal connector and an adaptive connector;

the orthogonal connector includes: a housing;

the wafer is located on the casing, and the wafer includes:

the insulating frame is provided with a signal differential pair and a grounding terminal, the signal differential pair comprises two signal terminals, and the signal terminals and the grounding terminal are both bent terminals;

the signal terminals and the ground terminals respectively have mounting ends used for being mounted on the circuit board and mating ends used for being inserted into the adaptive connector, the signal terminals and the ground terminals respectively comprise the mounting terminals located at the mounting ends, the mounting terminals are used for being mounted on the circuit board, the signal terminals comprise signal contacts located at the mating ends, the ground terminals comprise ground contacts located at the mating ends, the signal terminals and the ground terminals respectively comprise body parts arranged in the insulating frame, and the body parts realize vertical conversion from the mounting terminals to the contacts;

the mounting terminals of the signal terminals and the ground terminals are arranged at intervals along a first direction, the signal contacts and the ground contacts extend along the first direction to be plugged with the adaptive connector, the signal contacts and the ground contacts are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction;

the signal contact and the grounding contact are vertically bent relative to the body part of the corresponding terminal, and the signal contact and the grounding contact are parallel to each other;

two signal contacts in the same signal differential pair are arranged in parallel along a third direction, the two signal contacts are in the same plane, and the third direction is perpendicular to the first direction and the second direction;

the adaptive connector comprises at least two adaptive connector wafers which are sequentially arranged along a second direction;

the adaptive connector wafer comprises adaptive connector signal terminals arranged in pairs, adaptive connector ground terminals and mounting terminals for connecting with corresponding circuit boards, each adaptive connector signal terminal comprises an adaptive connector signal contact inserted with the orthogonal connector, and the adaptive connector ground terminals comprise adaptive connector ground contacts inserted with the orthogonal connector;

all the mounting terminals in the adaptive connector are sequentially arranged along the third direction, and the ground contacts and the adaptive connection signal contacts of the adaptive connector and the paired adaptive connector signal contacts are arranged at intervals along the third direction.

The invention has the beneficial effects that: the signal contacts are vertically bent, the two signal contacts are arranged in parallel along the third direction, the two signal contacts can be directly plugged with the signal contacts arranged at intervals along the third direction in the adaptive connector wafer, signal conduction is completed, the grounding contact is vertically bent, the grounding contact and the signal contacts are arranged in parallel, and signal differential pairs can be shielded after the orthogonal connector and the adaptive connector are plugged, so that the signal transmission quality is improved. In the invention, the terminals in the orthogonal connector are bent to realize reversing and opposite insertion, an adapter is not required to be added for conversion, and the adaptive connector can be a conventional connector, so that the number of parts is less, the assembly is more convenient, and the manufacturing cost is lower.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

and the mounting ends of the signal terminal and the ground terminal of at least one of the two adjacent wafers are respectively arranged in a bending way relative to the corresponding body part, and the bending direction is the third direction, so that in the third direction, the distance between the mounting terminals of any two adjacent wafers is larger than the distance between the ground contacts of the two corresponding wafers.

The effect of this scheme is that after arranging a plurality of wafers, to ensure the output quality, the vertical spacing of the mounting terminals of adjacent wafers must be ensured to be greater than the vertical spacing of the ground contacts in adjacent wafers, and this comparison is ensured by bending the mounting ends of the terminals.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

and the paired signal contacts of one wafer in any two adjacent wafers are staggered with the paired signal contacts of the other wafer along the second direction, and the paired signal contacts in the wafer and the ground contacts in the adjacent wafer are arranged side by side on a straight line along the third direction.

The effect of this scheme lies in, through making in arbitrary two adjacent wafers become to signal contact along second direction dislocation arrangement, can shield signal contact with the ground contact of adjacent wafer, improve signal transmission quality.

As a further optimized solution, the ground contact and one of the signal contacts in the same wafer are arranged opposite to each other along the second direction.

As a further optimized solution, at least two of the wafers are arranged in sequence along the third direction;

the orthogonal connector includes:

the shielding net is assembled on the shell, signal contact through holes are formed in the shielding net corresponding to the signal contacts, and grounding contact through holes are formed in the shielding net corresponding to the grounding contacts;

the paired signal contacts pass through the signal contact through holes and are spaced from the hole walls of the signal contact through holes corresponding to the different pairs of signal contacts, and the ground contacts pass through the ground contact through holes and are electrically contacted with the hole walls of the ground contact through holes;

the shield mesh includes shield beams that separate the differential signal pairs.

The effect of this scheme is that through setting up the shielding net, can be with each ground contact ground jointly, the shielding roof beam that forms also can be with each signal differential pair separation, makes orthogonal connector can be used in the scene of high-speed transmission.

As a further preferred solution, two signal contacts in the same signal differential pair share one of said signal contact through holes.

The effect of this scheme lies in, and a signal contact of sharing is perforated, adds man-hour more convenient.

As a further optimized scheme, a signal contact socket is arranged on the shell corresponding to the signal contact through hole;

clamping protrusions are arranged on the shell around two signal contact sockets corresponding to the same signal differential pair, and the signal contact through holes are matched with the clamping protrusions to be clamped.

The effect of this scheme lies in, installs the shielding net on the casing through the mode of joint, and the joint is protruding to be arranged around the signal contact socket, can utilize the signal contact perforation on the shielding net, need not the extra trompil on the shielding net.

As a further optimized scheme, both the two signal contacts of the same signal differential pair are provided with signal outlet bending parts bent along the second direction, so that the two signal contacts are opposite to the signal outlet bending parts arranged along the third direction, and the bending directions of the signal contact bending parts in the two signal contacts are opposite;

the both sides along the second direction of each signal contact socket of casing all are equipped with the joint is protruding, looks interval between one of them joint arch and the signal contact socket to the signal contact bending part that supplies signal contact arranges the interval in, and another joint is protruding to be arranged along the signal contact socket that corresponds, supports on signal contact with supporting.

The technical scheme has the advantages that one clamping protrusion is spaced from the signal contact socket, and the signal contact bending part can be arranged in the shielding net, so that the shielding effect is enhanced; the other clamping protrusion is arranged along the signal contact socket, and can support the signal contact in a propping manner, so that the strength is improved. In addition, according to the invention, the shielding net is arranged on the shell through the clamping protrusion, and the signal contact and the shielding net are separated through the clamping protrusion, so that the signal contact and the shielding net are prevented from being in short circuit due to contact, and the signal transmission quality is prevented from being influenced.

As a further optimized scheme, a clamping groove for clamping a ground contact bending part of the ground contact is arranged on the shielding net, and the clamping groove is communicated with the ground contact through hole.

The effect of this scheme lies in, sets up the draw-in groove after, dodges ground contact kink, and ground contact kink contacts with the draw-in groove contact simultaneously improves the contact reliability of ground contact and shielding net.

As a further optimized scheme, a grounding column is arranged on the shielding net corresponding to the position of the grounding contact through hole, and the grounding contact through hole is arranged in the grounding column.

The effect of this scheme lies in, sets up behind the ground connection post, can improve the reliability of being connected between ground contact and the shielding net.

As a further optimized scheme, a grounding contact jack is arranged on the shell corresponding to the grounding contact through hole;

the ground post is inserted into the ground contact receptacle.

As a further optimized solution, the housing is arranged extending along the first direction;

the shell comprises a partition board which divides the inner cavity of the shell into a first notch and a second notch, the first notch is used for the adaptive connector to penetrate, the second notch is used for the wafer to penetrate, and the ground contact and the signal contact of the wafer penetrate through the partition board so as to be oppositely inserted with the adaptive connector;

the housing includes a sidewall forming the second recess with the baffle;

one of the side wall and the insulating frame is provided with a bayonet, and the other is provided with a clamping block, so that the wafer is clamped on the shell along the first direction.

The effect of this scheme lies in, and the wafer is installed on the casing through the mode that clamps, and is more convenient during the equipment.

As a further optimized scheme, the bayonet is arranged on the side wall, and the fixture block is arranged on the insulating frame;

the clamping block and the bayonet are in blocking fit along the first direction so as to prevent the wafer from being pulled out;

the side wall is provided with a shell stopping step, one end of the insulating frame facing the shell along the first direction is provided with an insulating frame stopping step, the shell stopping step and the insulating frame stopping step are in stopping fit along the first direction, and the shell stopping step and the insulating frame stopping step are matched with a clamping block and a clamping opening which are mutually matched to position the wafer in the first direction.

The effect of this scheme lies in, has realized the location to the wafer through the cooperation of two fender steps, bayonet socket and fixture block, and positioning effect is better.

As a further optimized scheme, the side walls of the shell comprise two side walls located in the second direction, limiting grooves extending along the first direction are formed in the two side walls, and the insulating frame is adaptive to be clamped into the limiting grooves;

the bayonet is arranged at the bottom of the limiting groove.

The effect of this scheme lies in, can carry on spacingly to each wafer in the third direction through setting up the spacing groove to cooperate the location on the first direction, with the whole reliable fixed mounting of wafer on the casing.

As a further preferred solution, the side walls of the housing include two side walls in the second direction, one of the two side walls, which faces away from the mounting terminals, is arranged to protrude from the other side wall in the first direction, and the protruding portions of the side walls are adapted to abut against the insulating frame of the wafer after the wafer is inserted into the housing.

The effect of this scheme lies in, through protruding portion to the wafer top, when installing the wafer on the circuit board, this protruding portion carries out effective support to the wafer, makes the installation terminal can insert in the circuit board.

As a further optimized scheme, the insulating frame is provided with a reinforcing protrusion corresponding to each mounting terminal, and the reinforcing protrusion is located on one side of the corresponding mounting terminal along the third direction.

The effect of this scheme lies in, strengthens the arch through setting up, carries out the part to installation terminal department and strengthens, increases the steadiness of installation terminal root, prevents the crimping foot of kneeling.

Drawings

Fig. 1 is a first schematic diagram of an orthogonal connector embodiment 1 of the present invention;

FIG. 2 is a second schematic view of an orthogonal connector embodiment 1 of the present invention (only one wafer is shown in the figure);

FIG. 3 is a schematic view of the wafer of FIGS. 1 and 2;

FIG. 4 is the view of FIG. 3 with the dielectric frame removed;

FIG. 5 is a schematic view of a plurality of wafers arranged in an orthogonal connector embodiment 1 of the present invention;

FIG. 6 is a cross-sectional view of the cross-connector embodiment 1 showing the mounting of the housing and wafer;

FIG. 7 is a perspective view showing the mounting of the housing and the chip in the orthogonal connector of embodiment 1 of the present invention;

fig. 8 is a schematic view of a first perspective of a housing in an orthogonal connector embodiment 1 of the present invention;

fig. 9 is a top view of the housing of the orthogonal connector embodiment 1 of the present invention;

fig. 10 is a front view of a shielding mesh in an orthogonal connector embodiment 1 of the present invention;

fig. 11 is a perspective view of a shielding mesh in an orthogonal connector embodiment 1 of the present invention;

FIG. 12 is a schematic view of the shield mesh and wafer of the orthogonal connector of embodiment 1 of the present invention;

fig. 13 is a schematic view of the orthogonal connector embodiment 1 of the present invention after the shield mesh is mounted to the housing;

FIG. 14 is a bottom view of FIG. 13;

in the attached figure 1: 100-a housing; 101-a first side wall; 200-a wafer;

in the attached fig. 2: 100-a housing; 200-a wafer; 201-a mounting end; 203-an insulating frame;

in FIG. 3: 200-a wafer; 201-a mounting end; 202-a mating end; 203-an insulating frame; 2041-signal contacts; 2042-signal contact bend; 2051-ground contacts; 2052-bent portion of ground contact; 206-fish eye; 207-a body portion; 208-a reinforcing protrusion;

in fig. 4: 204-signal terminals; 205-ground terminal; 2051-ground contacts; 2052-bent portion of ground contact; 206-fish eye;

in fig. 5: 2051-ground contacts; 206-fish eye;

in fig. 6: 100-a housing; 101-a first side wall; 102-a second sidewall; 103-housing stop step; 104-a separator; 105-a first recess; 106-a second recess; 114-bayonet; 115-the inner wall of the backstop; 201-a mounting end; 202-a mating end; 203-an insulating frame; 2031-fixture block; 2032-stopping the step with the insulating frame;

in FIG. 7: 101-a first side wall; 102-a second sidewall; 104-a separator; 107-a limit groove; 203-an insulating frame;

in fig. 8: 100-a housing; 108-first snap projections; 109-a second snap projection; 110-a third snap projection;

in fig. 9: 100-a housing; 108-first snap projections; 109-a second snap projection; 110-a third snap projection; 111-a first signal contact receptacle; 112-a second signal contact receptacle; 113-ground contact sockets;

in fig. 10: 300-a shielding mesh; 301-signal contact piercing; 302-ground contact penetration; 303-a ground post; 304-card slot;

in fig. 11: 300-a shielding mesh; 301-signal contact piercing; 304-card slot;

in fig. 12: 300-a shielding mesh; 301-signal contact piercing; 302-ground contact penetration; 303-a ground post; 204-signal terminals; 2041-signal contacts; 205-ground terminal; 2051-ground contacts;

in fig. 13: 300-a shielding mesh; 108-first snap projections; 109-a second snap projection; 110-a third snap projection;

in fig. 14: 104-a separator; 111-a first signal contact receptacle; 112-a second signal contact receptacle; 113-ground contact sockets; 303-ground post.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The features and properties of the present invention are described in further detail below with reference to examples.

Specific embodiment 1 of the orthogonal connector of the present invention:

as shown in fig. 1-14, the orthogonal connector is mounted, in use, on a first circuit board for direct mating with an adapter connector, which is mounted, in use, on a second circuit board, the first and second circuit boards being orthogonally arranged. The orthogonal connector comprises a housing 100, a plurality of (at least two) wafers 200 are arranged in the housing 100, signal terminals 204 and ground terminals 205 are arranged in the wafers 200, one end of each of the signal terminals 204 and the ground terminals 205 is arranged on a first circuit board in use, and the other end of each of the signal terminals and the ground terminals is inserted into the signal terminals and the ground terminals in the adaptive connector.

The structure of the wafer 200 is shown in fig. 3 and 4, the wafer 200 includes an insulating frame 203, three signal differential pairs and three ground terminals 205 are fixed on the insulating frame 203, the signal differential pairs and the ground terminals 205 are alternately arranged in sequence, and the signal differential pairs include two signal terminals 204. The signal terminals 204, the ground terminals 205 each have a mounting end 201 and a mating end 202, the mounting end 201 being mounted on the first circuit board in use, the mating end 202 being directly mateable with the mating connector in use. The signal terminals 204 and the ground terminals 205 are bent terminals, and the mounting ends 201 and the mating ends 202 are perpendicular to each other. The signal terminals 204 and the ground terminals 205 include mounting terminals at the mounting end 201, which are fisheyes 206 for press-fit engagement with the printed board (in other embodiments, the mounting terminals may be pin-shaped or column-shaped terminals for soldering with the printed board, etc.). The fish-eye 206 is assembled and inserted into the first circuit board and soldered, the signal terminal 204 includes the signal contact 2041 at the mating end 202, the ground terminal 205 includes the ground contact 2051 at the mating end 202, a body portion 207 is between the fish-eye 206 and the contacts (including the signal contact 204 and the ground contact 205), the body portion 207 is fixed in the insulating frame 203, and the bending conversion from the fish-eye 206 to the contacts is realized by the body portion 207.

For convenience of description, in the present embodiment, the arrangement direction of the fish-eyes 206 in the same wafer 200 is defined as a first direction (the up-down direction in fig. 6, and the direction perpendicular to the paper surface in fig. 10 and 12), and the signal contacts 204 and the ground contacts 205 are inserted into the mating connector along the first direction; defining the arrangement direction of the signal contacts 204 and the ground contacts 205 as a second direction (the up-down direction in fig. 10 and 12), which is perpendicular to the first direction; a third direction is defined as being perpendicular to both the first direction and the second direction, and the third direction is a thickness direction of the insulating frame 203 (the left-right direction in fig. 5, and also an arrangement direction of the respective wafers 200).

As shown in fig. 3 and 4, the signal contacts 2041 and the ground contacts 2051 are each bent vertically with respect to the body portion 207, thereby forming signal contact bent portions 2042 and ground contact bent portions 2052, two signal contacts 2041 of a same signal differential pair are arranged side by side along a third direction, and two signal contacts 2041 are in a same plane (the plane is perpendicular to the second direction) and can be inserted into a signal differential pair in a wafer perpendicular to each other in the adapter connector. Wherein the two signal contacts 2041 in the same signal differential pair are bent in the opposite direction along the second direction.

As shown in fig. 3 and 4, when the signal contacts 2041 are bent, preferably, two signal contacts 2041 of the same signal differential pair are symmetrically arranged on two sides of the body portion 207 along the third direction, and the ground contact 2051 and one of the signal contacts 2041 are arranged opposite to each other along the second direction and are located on the same straight line. The signal contact 2041 and the ground contact 2051 are both rectangular plate-shaped, and the plate surfaces of the contacts are parallel to each other and perpendicular to the second direction.

By vertically bending the signal contacts 2041 and the ground contacts 2051, the signal contacts and the ground contacts corresponding to the wafers in the adaptive connector can be adaptively inserted into each other without an intermediate adapter, so that the number of parts is less, and the manufacturing cost is lower.

As shown in fig. 3, in order to partially reinforce the fisheyes 206 and ensure reliable connection between the fisheyes 206 and the circuit board, a reinforcing protrusion 208 is integrally formed on the insulating frame 203 corresponding to each fisheye, and the reinforcing protrusion 208 is located on one side of the fisheyes 206 in the third direction.

After assembling, at least two wafers 200 in the housing 100 are sequentially arranged along the third direction, and through calculation of various electrical parameters, in order to ensure the stability of signal transmission, after each wafer 200 is sequentially arranged, the following conditions need to be satisfied: as shown in fig. 5, the distance d1 between the fisheyes 206 of any two adjacent wafers 200 in the third direction is greater than the distance d2 between the ground contacts 2051 of any two adjacent wafers 200 in the third direction. To satisfy such a constraint, as shown in fig. 4, the mounting ends 201 of the signal terminals 204 and the ground terminals 205 are bent with respect to the body portion 207 in the present embodiment, where the reason why the mounting ends 201 are bent is that: if the distance between the fish-eyes 206 of two adjacent wafers 200 is kept constant, and the ground contact 205 is bent in the third direction, the maximum bending degree is limited by the width of the tape in the ground terminal 205, and the maximum bending distance of the ground contact 2051 in the third direction is constant, which cannot meet the requirement of the distance between any two adjacent wafers. The bending degree of the signal terminals 204 and the ground terminals 205 at the mounting end 201 is not limited, so that the bending of the mounting end 201 is more suitable for practical processing. In the specific design, one or two of the two adjacent wafers 200 are selected to be bent according to actual conditions.

As shown in fig. 6 and 7, the housing 100 extends in a first direction as a whole and extends around a plurality of wafers 200 arranged in sequence. The housing 100 is made of an insulating material, the housing 100 includes a partition 104 in the middle, the partition 104 divides the housing 100 into two parts and forms a first recess 105 and a second recess 106, wherein the first recess 105 is used for an adapter to be inserted, the first recess 105 is defined to be located in front of the second recess 106, and the connector is inserted into the adapter connector forward. The partition 104 is provided with through-holes each including a signal contact hole 111 and a ground contact hole 113, and the signal contact holes are provided in pairs corresponding to the signal contacts 2041 in pairs including a first signal contact hole 111 and a second signal contact hole 112. When assembled, the signal contacts 2041, ground contacts 2051 of the wafer 200 extend from the second recess 106 through the jack and into the first recess 105.

In this embodiment, the wafer 200 is fixed on the housing 100 by clamping, and specifically, the housing 100 includes four sidewalls forming the second recess 106 and a partition 104, where two of the four sidewalls in the second direction are defined as a first sidewall 101 and a second sidewall 102, respectively, and the second sidewall 102 is close to the fish-eye 206 of the wafer 200. A bayonet 114 is provided on the first and second sidewalls 101 and 102 corresponding to each wafer 200, where the bayonet 114 penetrates the sidewalls. Furthermore, as shown in fig. 6, the first side wall 101 and the second side wall 102 are not of an equal thickness structure, one end close to the partition plate 104 is thicker, and the other end far from the partition plate 104 is thinner, and a housing stop step 103 is formed on the first side wall 101 and the second side wall 102, and the housing stop step 103 is located at the bayonet 114.

In order to fit the bayonet 114 of the housing 100, two side surfaces of the insulating frame 203 in the second direction are provided with a fixture block 2031, and one side of the fixture block 2031 is provided with an inclined surface, so that the fixture block 2031 can slide into the bayonet 114, as shown in fig. 6, for fitting with the housing stop step 103, a notch is provided at one side of the insulating frame 203 close to the signal contact 2041 and the ground contact 2051, so as to form an insulating frame stop step 2032, and the insulating frame stop step 2032 is located at one side of the fixture block 2031 close to the signal contact 2041 and the ground contact 2051.

As shown in fig. 6 and 7, a limit groove 107 is formed on each of the first side wall 101 and the second side wall 102 corresponding to each wafer 200, the insulating frame 203 integrally slides into the limit groove 107 during assembly, the wafer 200 is positioned in the third direction by the engagement of the side surface of the insulating frame 203 and the groove wall of the limit groove 107, and the bayonet 114 is disposed at the groove bottom of the limit groove 107.

During assembly, the wafer 200 is inserted into the second recess 106 of the housing 100, the bumps 2031 on the insulating frame 203 are inserted into the notches 114 on the housing 100, the insulating frame stop step 2032 and the housing stop step 103 are in stop fit in the insertion direction, and the end surfaces of the bumps 2031 and the inner wall 115 of the rear stop of the notches 114 are in stop fit in the insertion direction, so that the wafer 200 is fixed in the housing 100.

As shown in fig. 6, the first sidewall 101 protrudes from the second sidewall 102 along the first direction, and after the wafer 200 is inserted into the housing 100, the side of the insulating frame 203 facing away from the fish-eye 206 is abutted by the protruding portion of the first sidewall 101, so that the insulating frame 203 and the fish-eye 206 can be supported when the wafer 200 is mounted on the first circuit board.

In order to improve the signal transmission quality after the orthogonal connector and the adaptive connector are plugged and enhance the shielding effect between the signal differential pairs, as shown in fig. 13, a shielding net 300 is fixedly mounted on the partition plate 104 of the housing 100, so as to realize the common grounding of the ground contacts 2051.

The structure of the shielding net 300 is as shown in fig. 10 and 11, the shielding net 300 is made of a conductive material, the shielding net 300 is actually a shielding net frame and has a certain thickness, a plurality of rows of perforation assemblies (a plurality of rows are arranged along the left-right direction in fig. 10) are disposed on the shielding net 300, and each row of perforation assemblies corresponds to one wafer 200. The perforation assemblies in the same row include signal contact perforations 301 and ground contact perforations 302, and the signal contact perforations 301 and the ground contact perforations 302 are alternately arranged in order in the up-down direction of fig. 10. The signal contact through hole 301 corresponds to a signal contact jack on the partition plate 104, the signal contact through hole 301 is large, two signal contacts 2041 in the same signal differential pair can pass through the signal contact through hole 301, and the signal contacts 2041 pass through the signal contact through hole and are spaced from the hole walls of the signal contact through hole 301. The ground contact through holes 302 correspond to the ground contact insertion holes 113 on the partition 104, through which the ground contacts 2051 pass, and when the ground contacts 2051 pass through, the ground contacts 2051 electrically contact with the hole walls of the ground contact through holes 2051 to achieve conductive communication, and the ground contacts 2051 are commonly grounded through the shielding mesh 300. The signal contact through holes 301 are relatively independent, and the portions of the shielding net 300 located between two adjacent signal contact through holes 301 can separate signal differential pairs to form shielding beams, so that signal crosstalk is prevented, and transmission quality is improved.

In this embodiment, the orthogonal connector includes four wafer groups, each wafer group includes two adjacent wafers 200 along the third direction, and the two wafers 200 are arranged in a staggered manner along the second direction, so that the two wafers 200 in the same wafer group have signal contacts 2041 facing each other along the third direction. In order to match the arrangement of the wafer groups in the orthogonal connector, as shown in fig. 12, in the two rows of the punching assemblies corresponding to the same wafer group, the signal contact through holes 301 have portions overlapping each other in the second direction.

In this embodiment, in order to improve the contact stability between the ground contact 2051 and the shielding mesh 300 and improve the grounding effect, as shown in fig. 10 and 12, a grounding post 303 is integrally formed at a position of a ground contact through hole 302 of the shielding mesh 300, and the ground contact through hole 302 is opened in the grounding post 303. The ground posts 303 in this embodiment are rectangular posts that, in use, pass into the ground contact insertion openings 113 of the bulkhead 104, for which reason the size of the ground contact insertion openings 113 need to be adaptively enlarged. As shown in fig. 10 and 11, in order to enable the ground contact 2051 of the ground terminal 205 to be inserted into the ground contact penetration hole 302, a card slot 304 is provided on the shield mesh 300, and the card slot 304 is fittingly inserted by the ground contact bent portion 2052.

During installation, the shielding net 300 is installed on one side of the partition board 104, which is located in the second notch 106, the grounding column 303 penetrates into the grounding contact socket 113, but the grounding column 303 does not penetrate out of the partition board 104, the end surface of the grounding column 303 is flush with the board surface of the partition board 104, and one side of the partition board 104, which is located in the first notch 105, is kept in a planar shape, so that the opposite insertion with an adaptive connector is facilitated.

In this embodiment, the shielding mesh 300 is mounted on the partition 104 in a snap-fit manner, and as shown in fig. 8 and 9, a protrusion is provided on one side of the partition 104 located at the first notch 105, and the protrusion is arranged around each pair of signal contact jacks. Specifically, each pair of signal contact sockets has three clamping protrusions, namely a first clamping protrusion 108, a second clamping protrusion 109 and a third clamping protrusion 110. The first catching projection 108 and the second catching projection 109 are respectively provided on both sides of the first signal contact receptacle 111, and the first catching projection 108 and the third catching projection 110 are respectively provided on both sides of the second signal contact receptacle 112, where both sides refer to both sides in the second direction. The clamping protrusions are insulators.

As shown in fig. 9, the first catching projection 108 is spaced apart from the first signal-contact receptacle 111, and the second catching projection 109 is disposed against the first signal-contact receptacle 111; the first snap projection 108 is disposed against the second signal contact receptacle 111 with a space between the third snap projection 110 and the second signal contact receptacle 112. The space between the clamping protrusion and the signal contact jack is used for inserting the signal contact bending part 2042 of the signal contact 2041, so that the signal contact bending part 2042 is also positioned in the signal contact through hole 301 of the shielding net 300, and the shielding effect is improved. The clamping protrusion is attached to the signal contact socket, so that the clamping protrusion can strengthen the signal contact. The first, second and third snap projections have an overall contour conforming to the shape of the inner wall of the signal contact through hole 301 of the shield mesh 300, and the shield mesh 300 is adapted to snap onto the projections when assembled, as shown in fig. 13 and 14. The shielding net 300 is installed in a clamping convex mode, so that the signal contact 2041 and the signal contact bending part 2042 can be isolated from the shielding net 300, and the signal contact 2041 or the signal contact bending part 2042 is prevented from being in contact with the shielding net 300 and being short-circuited.

It should be noted that, in this embodiment, the clamping protrusions are disposed on two sides of the signal contact socket in the second direction, and the clamping protrusions have a certain extending length, so that on one hand, the signal contact is bent along the second direction, and a signal contact bending portion is provided; on the other hand, signal contact is the slice, and its thickness direction is the second direction, is changeed when processing and installation to have the bending deformation along the second direction, arranges the joint arch in the both sides of signal contact socket second direction, helps preventing signal contact bending deformation back and shielding net contact.

Specific embodiment 2 of the orthogonal connector of the present invention:

in embodiment 1, reinforcing protrusions are provided on the insulating frame corresponding to the respective fish eyes. In this embodiment, the reinforcing protrusion may be eliminated in the case where the strength of the insulating frame itself is large.

Specific embodiment 3 of the orthogonal connector of the present invention:

in embodiment 1, the first sidewall of the housing is disposed to protrude from the second sidewall, so that the protruding portion of the first sidewall can abut against the insulating frame. In this embodiment, when the strength of the fisheye is sufficiently high, the two side walls can be arranged at the same height without abutting against the insulating frame.

Specific embodiment 4 of the orthogonal connector of the present invention:

in embodiment 1, a bayonet is provided on the housing, and a fixture block is provided on the insulating frame, the fixture block being matched with the bayonet; the shell is provided with a shell stopping step, the insulating frame is provided with an insulating frame stopping step, and the shell and the wafer are positioned in the first direction through cooperation. In this embodiment, the housing and the insulating frame can be eliminated. At the moment, the size of the clamping block and the size of the bayonet need to be matched, and after the clamping block extends into the bayonet, two side faces of the clamping block in the first direction are in blocking fit with the bayonet, so that positioning is realized.

Specific embodiment 5 of the orthogonal connector of the present invention:

in embodiment 1, the housing is provided with a bayonet, and the insulating frame is provided with a latch. In this embodiment, the bayonet is disposed on the insulating frame, and the latch is disposed on the housing. In addition, the arrangement position of the latch or the bayonet on the insulating frame is not limited to the two side surfaces in the second direction, and may be arranged on the two side surfaces in the third direction.

Specific embodiment 6 of the orthogonal connector of the present invention:

in example 1, the wafer was mounted on the housing by snap-fitting. In this embodiment, the wafer may be mounted on the housing by means of bolts or the like.

Specific embodiment 7 of the orthogonal connector of the present invention:

in example 1, the ground post is a rectangular post. In this embodiment, the shape of the ground post may be cylindrical or other shapes.

Specific embodiment 8 of the orthogonal connector of the present invention:

in embodiment 1, the ground post is inserted into the ground contact insertion opening, and the end face of the ground post is flush with the plate surface of the spacer. In this embodiment, the end face of the ground post may be located inside the ground contact receptacle in the bulkhead. Alternatively, in other embodiments, the ground posts may not be inserted into the ground contact receptacles, i.e., the ground contact receptacles are smaller, with the ground posts being located on one side of the ground contact receptacles.

Specific embodiment of the orthogonal connector of the present invention 9:

in example 1, in order to increase the contact reliability between the ground contact and the shield mesh, a ground post was provided on the shield mesh. In this embodiment, when the ground contact perforation precision in the shielding net is higher, can guarantee that ground contact and ground contact perforation pore wall between the reliable contact, can cancel the ground connection post.

Specific embodiment 10 of the orthogonal connector of the present invention:

in embodiment 1, the shielding net is clamped on the housing through the clamping protrusions, and one of the two clamping protrusions corresponding to the same signal contact socket is arranged at intervals, and the other clamping protrusion is arranged in a manner of being attached to the housing. In this embodiment, two joint bulges can be arranged at equal intervals, and can also be arranged in a sticking manner, and when the joint bulges are arranged in a sticking manner, the bent part of the signal contact cannot extend into the shielding net.

Specific embodiment of the orthogonal connector of the present invention 11:

in embodiment 1, the arrangement of the engaging projections is regularly arranged on both sides of the signal contact insertion opening in the second direction. In this embodiment, the clamping protrusion may be arranged around the signal contact socket for a circle, and particularly, for a non-sheet (for example, a column) or the like form of the signal contact, the clamping protrusion is arranged around a circle, so that the signal contact can be ensured to be separated from the shielding net in all directions.

Specific embodiment 12 of the orthogonal connector of the present invention:

in embodiment 1, the shield net is mounted on the housing by snap-fitting. In this embodiment, the shielding net is mounted on the housing by bonding, or may be welded.

Specific embodiment of the orthogonal connector of the present invention 13:

in example 1, two signal contacts in the same differential signal pair share a single signal contact aperture. In this embodiment, each signal contact corresponds to an individual signal contact through hole, and it should be noted that when each signal contact corresponds to an individual signal contact through hole, the clamping protrusion on the housing also needs to be changed adaptively, and a clamping protrusion is disposed corresponding to each signal contact through hole.

Specific embodiment 14 of the orthogonal connector of the present invention:

in embodiment 1, a shield net is disposed on the housing, and common grounding of the respective ground contacts is achieved. In this embodiment, the shielding net is eliminated, the orthogonal connector at this time is suitable for a low-speed connector, and the signal between adjacent signal differential pairs can be shielded by the shielding of the ground contact, so that the signal transmission quality is ensured.

Specific embodiment of the orthogonal connector of the present invention 15:

in example 1, when the wafers are arranged, the two wafers in the same wafer group have signal contacts facing each other in the second direction in consideration of the compactness of the layout. In this embodiment, the wafers may be completely staggered in the third direction, i.e., no contact (including signal contact and ground contact) in any two adjacent wafers has a portion overlapping with each other in the second direction. In other embodiments, any two adjacent wafers are not staggered in the second direction, and the wafers are arranged in an array.

Specific embodiment of the orthogonal connector of the present invention 16:

in embodiment 1, the mounting ends of the ground terminal and the signal terminal in at least one of the two adjacent wafers are bent so that the distance between the fish eyes of the adjacent wafers is greater than the distance between the ground contacts. In this embodiment, on the premise that the mating end material strap of the ground terminal and the signal terminal is wider, the ground contact may be bent in the third direction to satisfy the size comparison relationship.

Specific embodiments of the wafer of the orthogonal connector of the present invention:

the chip structure of the orthogonal connector is the same as that of the above embodiments of the orthogonal connector, and the description thereof is omitted.

Specific embodiments of the connector assembly of the present invention:

the connector assembly includes a directly opposite-inserted orthogonal connector and an adaptive connector, and the orthogonal connector is the same as those in the above embodiments, and is not described herein again. The adapter connector is a conventional connector and comprises at least two adapter connector wafers which are sequentially arranged along the second direction, each adapter connector wafer comprises an adapter connector signal differential pair and an adapter connector ground terminal, the adapter connector signal differential pair comprises two adapter connector signal terminals, the adapter connector signal terminals and the adapter connector ground terminal are arranged along the third direction, and the two adapter connector signal terminals in the same adapter connector signal differential pair are sequentially arranged along the third direction. The adapting connector signal terminal and the adapting connector grounding terminal are perpendicular to the signal terminal and the grounding terminal of the orthogonal connector.

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.