Pair thickness recognition device, bundle thickness recognition method and handwriting input device

文档序号:789172 发布日期:2021-04-09 浏览:28次 中文

阅读说明:本技术 纸沓厚度识别装置、纸沓厚度识别方法及手写输入装置 (Pair thickness recognition device, bundle thickness recognition method and handwriting input device ) 是由 李丽 于 2018-12-28 设计创作,主要内容包括:一种纸沓厚度识别装置(13),包括控制器(131)和厚度传感组件(132),所述控制器(131)与所述厚度传感组件(132)电性连接,所述厚度传感组件(132)与一纸张放置位(P)并列平铺设置,所述厚度传感组件(132)用于在所述纸张放置位(P)上放置纸沓时,感应所述纸沓的厚度并产生相应的厚度感应信号,所述控制器(131)响应所述厚度感应信号识别纸沓厚度。一种纸沓厚度识别方法及手写输入装置(1)。手写输入装置(1)中无论纸沓薄厚都具有很好的书写效果。(A paper bundle thickness recognition device (13) comprises a controller (131) and a thickness sensing assembly (132), wherein the controller (131) is electrically connected with the thickness sensing assembly (132), the thickness sensing assembly (132) is horizontally arranged with a paper placing position (P) in parallel, the thickness sensing assembly (132) is used for sensing the thickness of a paper bundle and generating a corresponding thickness sensing signal when the paper bundle is placed on the paper placing position (P), and the controller (131) responds to the thickness sensing signal to recognize the thickness of the paper bundle. A method for identifying the thickness of a stack of paper and a handwriting input device (1) are provided. The handwriting input device (1) has good writing effect no matter the thickness of the paper stack.)

The device for identifying the thickness of the paper bundle is characterized by comprising a controller and a thickness sensing assembly, wherein the controller is electrically connected with the thickness sensing assembly, the thickness sensing assembly and a paper placing position are tiled in parallel, the thickness sensing assembly is used for sensing the thickness of the paper bundle and generating a corresponding thickness sensing signal when the paper bundle is placed on the paper placing position, and the controller responds to the thickness sensing signal to identify the thickness of the paper bundle.

The bundle thickness recognition device according to claim 1, further comprising a storage unit that prestores a plurality of bundle thickness detection ranges, wherein the thickness sensing component includes a plurality of thickness sensors that are respectively disposed at different heights and correspond to the plurality of bundle thickness detection ranges, and wherein the controller determines that a bundle is present within the bundle thickness detection range corresponding to one of the plurality of thickness sensors, upon receiving a thickness sensing signal generated by the one of the plurality of thickness sensors.

The bundle thickness recognition device according to claim 2, wherein each of the thickness sensors includes a light emitting tube for emitting a transmission signal, and a light receiving tube for receiving a reflection signal when the transmission signal is reflected by a sheet within a bundle thickness monitoring range corresponding to the thickness sensor, the reflection signal being a thickness sensing signal, and the controller determines whether there is a bundle within a bundle thickness detection range corresponding to the thickness sensor based on the reflection signal.

The stack thickness recognition device of claim 3, wherein the plurality of thickness sensors simultaneously perform emission of emission signals and reception of reflection signals to recognize whether there is a sheet within a thickness detection range corresponding to each thickness sensor; or the thickness sensors transmit the transmission signals and receive the reflection signals one by one, and whether paper exists in the thickness detection range corresponding to each thickness sensor is identified one by one.

The bundle thickness recognition device according to any one of claims 3 to 4, further comprising a support, wherein the plurality of thickness sensors are respectively disposed at different heights of the support to respectively correspond to the plurality of bundle thickness detection ranges, and wherein a light ray of an emission signal from each thickness sensor is parallel to a bundle surface.

The apparatus for discriminating between a thickness of a bundle of paper according to claim 5, wherein said plurality of thickness sensors are arranged to be offset in a horizontal direction; and/or an optical spacer block is arranged between two adjacent thickness sensors in the plurality of thickness sensors, wherein the optical spacer block is opaque to light.

The bundle thickness identifying device according to any one of claims 2 to 6, wherein the plurality of bundle thickness detection ranges include n bundle thickness detection ranges sequentially arranged from small to large, the plurality of caliper sensors include n caliper sensors sequentially arranged from low to high, the n caliper sensors being provided corresponding to the n bundle thickness detection ranges; and when the 1 st thickness sensor and the n-1 th thickness sensor all receive corresponding reflected signals, determining that paper exists in the range from the 1 st thickness detection range to the n-1 th thickness detection range, and determining the thickness of the paper bundle as the thickness value corresponding to the n-1 th thickness detection range.

The stack thickness recognition device of claim 7, wherein the controller determines that the thickness of the stack is zero when none of the n thickness sensors receives a corresponding reflected signal within a preset time period.

The web thickness recognition device of claim 7, wherein the controller determines that the web is excessively thick and controls the sending of an excessive thickness prompt when the n thickness sensors each receive a corresponding reflected signal within a preset time period.

The device for identifying a thickness of a bundle of papers according to claim 7, wherein said controller determines that the detection of the thickness is failed and controls the issuance of the detection failure notice when the 1 st thickness sensor and the n-1 st thickness sensor of said n thickness sensors receive the corresponding reflection signals but at least one thickness sensor between said 1 st thickness sensor and said n-1 st thickness sensor does not receive the corresponding reflection signal.

The device for identifying the thickness of a bundle according to any one of claims 2 to 10, wherein the thickness sensor is an infrared sensor.

A paper bundle thickness recognition method is applied to a paper bundle thickness recognition device, the paper bundle thickness recognition device comprises a thickness sensing component, and the thickness sensing component and a paper placement position are tiled in parallel, and the paper bundle thickness recognition method is characterized by comprising the following steps:

when the paper bundle is placed on the paper placing position, the thickness sensing component senses the thickness of the paper bundle and generates a corresponding thickness sensing signal; and

and identifying the thickness of the paper stack in response to the thickness sensing signal.

The bundle thickness recognition method according to claim 12, wherein the bundle thickness recognition device further includes a storage unit that prestores n bundle thickness detection ranges arranged in order from small to large, the thickness sensing elements include n thickness sensors arranged in order from low to high, the n thickness sensors being provided in correspondence with the n bundle thickness detection ranges; the step of identifying the thickness of the paper stack in response to the thickness sensing signal comprises the following steps:

when the 1 st thickness sensor and the n-1 th thickness sensor receive corresponding reflected signals, determining that paper exists in the range from the 1 st paper bundle thickness detection range to the n-1 th paper bundle thickness detection range, wherein the reflected signals are the thickness sensing signals;

and determining the thickness of the paper bundle as a thickness value corresponding to the detection range of the thickness of the n-1 th paper bundle.

The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the n thickness sensors do not receive corresponding reflection signals within a preset time period, determining that the thickness of the paper bundle is zero.

The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the n thickness sensors receive corresponding reflection signals within a preset time period, determining that the paper bundle is excessively thick, and controlling to send out an excessive thickness prompt.

The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the 1 st thickness sensor and the n-1 st thickness sensor in the n thickness sensors receive corresponding reflection signals, but at least one thickness sensor between the 1 st thickness sensor and the n-1 st thickness sensor does not receive the corresponding reflection signals, determining that the thickness detection fails, and controlling to send out a detection failure prompt.

The bundle thickness recognition method according to claim 13, wherein the thickness sensing module includes a plurality of thickness sensors provided at different heights, and before the thickness sensing module senses a thickness of the bundle and generates a corresponding thickness sensing signal when the bundle is placed on the sheet placement position, the bundle thickness recognition method further includes the steps of:

and controlling the plurality of thickness sensors to simultaneously transmit a transmission signal and receive a reflection signal, wherein the reflection signal is the thickness induction signal.

The bundle thickness recognition method according to claim 13, wherein the thickness sensing module includes a plurality of thickness sensors provided at different heights, and before the thickness sensing module senses a thickness of the bundle and generates a corresponding thickness sensing signal when the bundle is placed on the sheet placement position, the bundle thickness recognition method further includes the steps of:

and controlling the thickness sensors to transmit transmission signals and receive reflection signals one by one, wherein the reflection signals are the thickness induction signals.

A handwriting input device, comprising a writing board and a pad thickness recognition device, wherein the pad thickness recognition device is arranged on one side of the writing board, the pad thickness recognition device is the pad thickness recognition device according to any one of claims 1-11, the writing board comprises a touch controller and a touch sensor, the paper placement position is arranged on the touch sensor, the pad thickness recognition device recognizes the pad thickness, and the touch controller calls out a compensation capacitor for handwriting recognition between the touch sensor and a pen nib according to the pad thickness, wherein the compensation capacitor is adapted to the pad thickness.

The handwriting input apparatus of claim 19, wherein the tablet comprises a processor, the processor calculates a writing distance between the touch sensor and a stylus pen tip when writing according to the thickness of the stack, the touch controller calls a linear table corresponding to the writing distance according to the writing distance, and adjusts a compensation capacitance for handwriting recognition between the touch sensor and the stylus pen tip according to the linear table.

The handwriting input apparatus of claim 19, wherein said stack thickness recognition apparatus further comprises a bracket, said bracket is arranged at a side of said tablet, and said bracket is perpendicular to a surface of said paper placing position.

25页详细技术资料下载
上一篇:一种医用注射器针头装配设备
下一篇:滑动轴承紧余量高度测量方法和装置

网友询问留言

已有0条留言

还没有人留言评论。精彩留言会获得点赞!

精彩留言,会给你点赞!