阅读说明：本技术 一种热封型中脱盖带及制备方法 (Heat-sealing type middle-release cover tape and preparation method thereof ) 是由 唐建仁 王寅 唐钰濠 王建涛 唐月江 蒋海云 于 2021-07-06 设计创作，主要内容包括：本发明公开了一种热封型中脱盖带的制备方法,所述的中脱盖带包括基材薄膜层(2),在基材薄膜层(2)上方设置有第一防静电层(1),在基材薄膜层(2)下方设置有缓冲层(3),在缓冲层(3)下方设置有热封层(4),在热封层(4)下方设置有第二防静电层(5),在中脱盖带边缘设置有微型切口(6)。本发明的中脱盖带通过设置热封层使中脱盖带在粘性差的载带上同样具有高剥离强度,解决了压敏型中脱盖带的压敏胶在粘性差的载带上封合强度不够,造成爆带不良的问题。(The invention discloses a preparation method of a heat-seal type middle release cover tape, which comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat-seal layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat-seal layer (4), and a micro notch (6) is arranged at the edge of the middle release cover tape. The heat-sealing layer is arranged on the middle release cover tape, so that the middle release cover tape also has high peel strength on the carrier tape with poor viscosity, and the problem that the sealing strength of the pressure-sensitive adhesive of the pressure-sensitive middle release cover tape on the carrier tape with poor viscosity is not enough, so that the poor tape explosion is caused is solved.)

1. The heat-seal type middle release cover tape is characterized by comprising a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat-seal layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat-seal layer (4), and a micro notch (6) is arranged at the edge of the middle release cover tape.

2. The heat-sealable release cover tape of claim 1, wherein: the base material film layer (2) is a biaxially oriented polyethylene terephthalate BOPET film; the thickness of the BOPET film is controlled to be 10-30 mu m.

3. The heat-sealable release cover tape of claim 1, wherein: the first anti-static layer (1) is obtained by coating a solution of one or a mixture of several of metal oxide, conductive carbon black, carbon nano tubes, an organic conductive agent and ionic liquid, and the thickness of the first anti-static layer is controlled to be 0.01-1 mu m.

4. The heat-sealable release cover tape of claim 1, wherein: the buffer layer (3) is formed by compounding a biaxially oriented polypropylene BOPP film on a base material film layer coated with a primer by adopting a film coating method, and the thickness of the buffer layer is controlled to be 5-50 mu m.

5. The heat-sealable release cover tape of claim 1, wherein: the heat sealing layer (4) is obtained by coating one or a mixture of more of styrene-butadiene-styrene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, EVA resin, tackifying resin and anti-blocking agent, and the thickness of the heat sealing layer is controlled to be 5-50 mu m.

6. The heat-sealable release cover tape of claim 1, wherein: the second anti-static layer (5) is obtained by coating a solution of one or a mixture of a plurality of metal oxides, conductive carbon black, carbon nano tubes, organic conductive agents and ionic liquid, and the thickness of the second anti-static layer is controlled to be 0.01-1 mu m.

7. The heat-sealable release cover tape of claim 1, wherein: the thickness of the middle stripping cover tape is controlled to be 30-100 mu m.

8. The heat-sealable release cover tape of claim 1, wherein: the middle stripping cover tape is provided with micro notches (6) at the edges of the base material film layer, the micro notches are formed by processing through special slitting cutters, the diameter of each micro notch is 0.3-1.0 mm, and the interval is 40-100 mm.

9. The heat-sealable release cover tape of claim 1, wherein: the depth of the micro-cuts on the two sides of the middle stripping cover tape is the thickness of the base material film layer.

10. The heat-sealable release cover tape according to any of claims 1 to 9, wherein:

the thickness of the base material film layer (2) is preferably 20-25 μm;

the thickness of the buffer layer (3) is preferably 20-25 mu m;

the thickness of the heat sealing layer (4) is preferably 15-20 μm;

the thickness of the middle stripping cover tape is preferably 55-65 μm;

the diameter of the micro-incisions is preferably 0.5mm, and the spacing is preferably 50 mm.

Technical Field

The invention relates to the field of electronic component packaging, in particular to a heat-seal type middle uncovering tape and a preparation method thereof.

Background

In recent years, the amount of cover tape used has been increasing with the automation and high speed of packaging and electronic component processes.

Conventional cover tapes mainly include both heat-seal cover tapes and self-adhesive cover tapes. The heat-sealing cover tape is adhered to the carrier tape by means of a heat-activated adhesive under heating; self-adhesive cover tape relies on pressure sensitive adhesive to adhere the cover tape to the carrier tape. The problems of inconsistent peeling strength, uneven peeling force and the like of different carrier tapes generally exist in the heat-sealing cover tape and the self-adhesive cover tape.

When the middle peeling cover tape is used, the middle peeling cover tape is sealed on the carrier tape. When stripping, because of the existence of the micro-incision, the adhesive tapes on two sides of the middle stripping cover tape are still adhered to the carrier tape, the adhesive tape in the middle of the middle stripping cover tape is torn and stripped along two sides, and the stripping force depends on the tearing strength of the middle stripping cover tape and is irrelevant to the adhesive force of the adhesive layer on the carrier tape. Therefore, the medium-sized uncapping tape can achieve consistent peeling strength and uniform peeling force on different carrier tapes.

Traditional in take off lid area adopts and sets up miniature incision on the self-adhesion lid area, and it is more convenient when this kind of lid area uses, but because this year, the material that the carrier band market used is diversified, especially the wide use of recovery plastics for the easy viscidity of carrier band is more and more poor, and pressure sensitive adhesive hardly provides sufficient stripping force and high temperature and holds the adhesion force, causes the packing body of involution good frequent fracture, explodes the bad in area.

Chinese patent application 201310285158.3 discloses well lid area of taking off, well lid area of taking off from top to bottom include substrate film layer, pressure sensitive adhesive layer and tectorial membrane layer in proper order, the both sides of pressure sensitive adhesive layer bottom are exposed, are equipped with two rows of miniature incision groups respectively at the edge of substrate film layer both sides. The technical scheme of the invention has the following technical problems: the bonding of well taking off lid area and carrier band is realized through pressure-sensitive adhesive, and pressure-sensitive adhesive has big or small in the peeling strength on different carrier bands, and on some poor carrier bands of viscidity, pressure-sensitive adhesive's peeling strength is littleer, can lead to the lid area to seal the back up, and it is bad to appear exploding the area at the in-process of placing the transportation, leads to packing the product inside to spill.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a heat-seal type middle knockout cover tape and a preparation method thereof.

The technical scheme of the invention is as follows:

the first purpose of the invention is to provide a heat-sealing type middle release cover tape, which comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat-sealing layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat-sealing layer (4), and micro notches (6) are arranged at the edge of the middle release cover tape.

Preferably, the first and second electrodes are formed of a metal,

the base material film layer (2) is a BOPET film made of biaxially oriented polyethylene terephthalate; the thickness of the BOPET film is controlled to be 10-30 μm, preferably 20-25 μm. The thickness of the BOPET film is less than 10 mu m, the heat resistance of the film is insufficient, and the film is easy to deform in the processing process; the thickness of the BOPET film is higher than 30 mu m, which affects the heat sealability of the middle release cover tape, and causes the heat sealing temperature to be overhigh and the peeling force to be smaller.

The anti-static coating is characterized in that a first anti-static layer (1) is arranged above the base material film layer (2), and the first anti-static layer is obtained by coating one or a mixture of a plurality of metal oxides, conductive carbon black, carbon nano tubes, organic conductive agents and ionic liquid. The thickness of the first antistatic layer is controlled to be 0.01 to 1 μm, preferably 0.1 μm.

And a buffer layer (3) is arranged below the base material thin film layer (2). A primer is used between the substrate thin film layer (2) and the buffer layer (3) to ensure the interlayer bonding force, and the primer is coated on the substrate thin film layer by adopting a coating mode; the primer can be selected from polyurethane AC, and the thickness of the primer is controlled to be 0.001-0.1 μm. The buffer layer (3) adopts a film coating method to compound the biaxially oriented polypropylene BOPP film on the base material film layer coated with the primer. The thickness of the buffer layer is controlled to be 5 to 50 μm, preferably 20 to 25 μm. The thickness of the buffer layer is less than 5 mu m, so that the effect of buffering the sealing pressure of the sealing knife of the braider is difficult to achieve; the thickness of the buffer layer is higher than 50 mu m, which influences the heat sealing performance of the middle release cover tape, and causes the heat sealing temperature to be too high and the stripping force to be smaller.

And a heat sealing layer (4) is arranged below the buffer layer (3). The heat sealing layer (4) is obtained by coating one or a mixture of more of styrene-butadiene-styrene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, EVA resin, tackifying resin and anti-sticking agent. The thickness of the heat sealing layer is controlled to be 5-50 μm, preferably 15-20 μm. The thickness of the heat sealing layer is less than 5 mu m, and the peeling strength of the middle cover removing tape after heat sealing is not enough; the thickness of the heat-sealing layer is higher than 50 μm, and the tearing strength of the heat-sealing layer is too high, so that the tearing stability of the middle uncapping cover tape is influenced.

And a second anti-static layer (5) is arranged below the heat sealing layer (4). The second antistatic layer is obtained by coating one or a mixture of several of metal oxide, conductive carbon black, carbon nano tubes, organic conductive agent and ionic liquid. The thickness of the second antistatic layer is controlled to be 0.01 to 1 μm, preferably 0.1 μm.

The thickness of the middle stripping cover tape is controlled to be 30-100 mu m, and preferably 55-65 mu m. The thickness of the middle stripping cover tape is lower than 30 mu m, the tensile strength of the middle stripping cover tape is not enough, and the middle stripping cover tape is easy to break when the tape is woven at high speed; the thickness of the middle release cover tape is higher than 100 mu m, so that the heat sealability of the middle release cover tape is influenced, and the stripping force of the middle release cover tape is smaller.

The middle stripping cover tape is provided with a micro notch (6) at the edge of the base material film layer (2). The micro-incision is processed by a special slitting cutter. The diameter of the micro-cut is 0.3-1.0 mm, and the interval is 40-100 mm. Preferably, the diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts on the two sides of the middle stripping cover tape is the thickness of the base material film layer.

When the middle uncapping tape is used, the middle uncapping tape is sealed on the carrier tape through a certain sealing temperature and sealing pressure. When stripping, the adhesive tapes on two sides of the middle stripping cover tape are still adhered to the carrier tape due to the existence of the micro-cuts, the adhesive tape in the middle of the middle stripping cover tape is torn and stripped along two sides, and the stripping force depends on the tearing strength of the middle stripping cover tape and is irrelevant to the adhesive force of the adhesive layer on the carrier tape. Therefore, the medium-sized uncapping tape can achieve consistent peeling strength and uniform peeling force on different carrier tapes.

The second purpose of the invention is to provide a preparation method of the heat-seal type uncapping tape, which comprises the following steps:

1) uniformly coating the antistatic liquid on the base material thin film layer (2) in a reticulate pattern roller coating mode, and drying the solvent in the antistatic liquid through a coating machine drying oven to complete the process of arranging the first antistatic layer (1) above the base material thin film layer (2);

2) when the buffer layer is compounded, a primer is needed to ensure the interlayer bonding force, and the primer is uniformly coated below the base material film layer (2) in a reticulate pattern roller coating mode; drying the solvent in the primer through an oven, and then compounding the biaxially oriented polypropylene BOPP film on the base material film layer coated with the primer by using a film laminating machine to complete the process of arranging the buffer layer (3) below the base material film layer (2);

3) coating the hot melt adhesive liquid of the heat-sealing layer below the buffer layer (3) by using a coating machine, wherein the coating mode adopts scraper type coating, and the solvent in the hot melt adhesive liquid of the heat-sealing layer is dried by an oven of the coating machine to finish the process of arranging the heat-sealing layer (4) below the buffer layer (3);

4) and uniformly coating the antistatic liquid below the heat-sealing layer (4) in a reticulate pattern roller coating mode, and drying the solvent in the antistatic liquid through a coating machine drying oven to complete the process of arranging the second antistatic layer (5) below the heat-sealing layer (4).

5) And a special slitting cutter is used for cutting a micro-cut (6) on the edge of the base material film layer (2) of the middle uncapping tape. And finishing the arrangement of the micro-cut (6) at the edge of the base material film layer (2).

When the heat-sealing type middle release cover tape is used, the middle release cover tape is sealed on the carrier tape. Sealing can be carried out under the common sealing conditions, such as the sealing temperature: 120-180 ℃; sealing pressure range: 0.1MPa to 0.3 MPa; sealing time range: 0.1 to 1 s. The optimal sealing conditions of the invention are that the sealing temperature is 150 ℃, the sealing pressure is 0.2MPa, and the sealing time is 0.5 s. In addition: the stripping force of the hot melt adhesive is also the maximum value, which means that the higher the sealing temperature is, the greater the stripping force is, when the temperature is enough to completely melt the hot melt adhesive, the stripping force of the hot melt adhesive reaches the maximum value, and the sealing temperature is increased again, so that the stripping force of the hot melt adhesive can not change any more.

The invention has the following technical effects:

the heat-seal type middle peeling cover tape has high peeling strength and good high-temperature aging resistance, and can not cause the problem that a sealed package body is cracked and exploded, particularly:

1) the buffer layer and the heat sealing layer are used for replacing a pressure-sensitive adhesive layer and a sticking film layer in the existing product, the bonding strength of a hot melt adhesive used in the heat sealing layer is higher than that of a pressure-sensitive adhesive used in the pressure-sensitive adhesive layer, the cohesion and the bonding strength of the hot melt adhesive are higher than those of the pressure-sensitive adhesive, and the hot melt adhesive can obtain high stripping force on some carrier tapes with poor viscosity by adjusting the sealing temperature of the hot melt adhesive, so that the phenomenon of poor tape explosion in the process of placing and transporting after the cover tape is sealed is avoided.

2) According to the invention, the micro-cut is arranged on the heat-seal cover tape, the heat-seal cover tape can achieve high peel strength on the carrier tape with poor viscosity through the improvement of sealing temperature and sealing pressure, and the heat-activated adhesive has better holding viscosity than a pressure-sensitive adhesive, so that the bad phenomena of cracking and strip explosion of a sealed package body can be avoided.

Drawings

Fig. 1 is a schematic cross-sectional view of a decapping tape of the present invention.

In fig. 1, 1 a first antistatic layer, 2 a base film layer, 3 a buffer layer, 4 a heat seal layer, 5 a second antistatic layer, and 6 a micro-cut.

Fig. 2 is a schematic view of a uncapping tape of the invention.

Fig. 3 is a schematic cross-sectional view of a prior art pressure sensitive version of a uncapping tape.

In FIG. 3, 1 base film layer, 2 pressure-sensitive adhesive layer, 3 adhesive film layer, 4 micro-cuts

Fig. 4 is a schematic representation of a prior art pressure sensitive uncap tape.

Detailed description of the invention

For the purpose of enhancing the understanding of the present invention, the present invention will be further explained with reference to the accompanying drawings and examples, which are only for the purpose of explaining the present invention and do not limit the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the combination or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, are not to be construed as limiting the present invention. In addition, in the description process of the embodiment of the present invention, the positional relationships of the devices such as "upper", "lower", "front", "rear", "left", "right", and the like in all the drawings are based on the drawings.

The sources of materials involved in the present invention are illustrated below:

nanometer ATO (Jingrui VK)

BOPET film (Dupont hongji 20U 25U)

Polyurethane AC agent (Meibang JZ2260)

BOPP film (Ruitai YS12 YS20 YS25)

EVA heat activated adhesive (Ruitai 168)

Acrylate pressure sensitive adhesive (Ruitai KD31)

Organic conductive agent (Aikefa 1010)

PS carrier tape (Ruitai HL003)

Example 1

The middle peeling tape comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat sealing layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat sealing layer (4), and a micro notch (6) is arranged at the edge of the base material film layer (2).

The structure and the used materials are as follows according to the sequence from top to bottom:

first antistatic layer: nanometer ATO, thickness 0.1 μm.

A substrate thin film layer: BOPET film, thickness 20 μm.

Primer: polyurethane AC agent

Buffer layer: BOPP film, thickness 20 μm.

Heat sealing layer: EVA heat-activated adhesive, coating thickness 15 μm.

A second antistatic layer: organic conductive agent with a thickness of 0.1 μm.

In addition:

middle stripping cover tape: the thickness was 55 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 20 μm.

The preparation method of the middle decapping tape of this example is as follows:

1) uniformly coating the antistatic liquid on the base material thin film layer (2) in a reticulate pattern roller coating mode, and drying the solvent in the antistatic liquid through a coating machine drying oven to complete the process of arranging the first antistatic layer (1) above the base material thin film layer (2);

2) when the buffer layer is compounded, a primer is needed to ensure the interlayer bonding force, and the primer is uniformly coated below the base material film layer (2) in a reticulate pattern roller coating mode; drying the solvent in the primer through an oven, and then compounding the biaxially oriented polypropylene BOPP film on the base material film layer coated with the primer by using a film laminating machine to complete the process of arranging the buffer layer (3) below the base material film layer (2);

3) coating the hot melt adhesive liquid of the heat-sealing layer below the buffer layer (3) by using a coating machine, wherein the coating mode adopts scraper type coating, and the solvent in the hot melt adhesive liquid of the heat-sealing layer is dried by an oven of the coating machine to finish the process of arranging the heat-sealing layer (4) below the buffer layer (3);

4) and uniformly coating the antistatic liquid below the heat-sealing layer (4) in a reticulate pattern roller coating mode, and drying the solvent in the antistatic liquid through a coating machine drying oven to complete the process of arranging the second antistatic layer (5) below the heat-sealing layer (4).

5) And a special slitting cutter is used for cutting a micro-cut (6) on the edge of the base material film layer (2) of the middle uncapping tape. And finishing the arrangement of the micro-cut (6) at the edge of the base material film layer (2).

Example 2

The middle peeling tape comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat sealing layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat sealing layer (4), and a micro notch (6) is arranged at the edge of the base material film layer (2).

The structure and the used materials are as follows according to the sequence from top to bottom:

first antistatic layer: nanometer ATO, thickness 0.1 μm.

A substrate thin film layer: BOPET film, thickness 25 μm.

Primer: polyurethane AC agent

Buffer layer: BOPP film, thickness 20 μm.

Heat sealing layer: EVA heat-activated adhesive, coating thickness 15 μm.

A second antistatic layer: organic conductive agent with a thickness of 0.1 μm.

In addition:

middle stripping cover tape: the thickness was 60 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 25 μm.

The preparation method is the same as example 1.

Example 3

The middle peeling tape comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat sealing layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat sealing layer (4), and a micro notch (6) is arranged at the edge of the base material film layer (2).

The structure and the used materials are as follows according to the sequence from top to bottom:

first antistatic layer: nanometer ATO, thickness 0.1 μm.

A substrate thin film layer: BOPET film, thickness 20 μm.

Primer: polyurethane AC agent

Buffer layer: BOPP film, thickness 25 μm.

Heat sealing layer: EVA heat-activated adhesive, coating thickness 15 μm.

A second antistatic layer: organic conductive agent with a thickness of 0.1 μm.

In addition:

middle stripping cover tape: the thickness was 60 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 20 μm.

The preparation method is the same as example 1.

Example 4

The middle peeling tape comprises a base material film layer (2), wherein a first anti-static layer (1) is arranged above the base material film layer (2), a buffer layer (3) is arranged below the base material film layer (2), a heat sealing layer (4) is arranged below the buffer layer (3), a second anti-static layer (5) is arranged below the heat sealing layer (4), and a micro notch (6) is arranged at the edge of the base material film layer (2).

The structure and the used materials are as follows according to the sequence from top to bottom:

first antistatic layer: nanometer ATO, thickness 0.1 μm.

A substrate thin film layer: BOPET film, thickness 20 μm.

Primer: polyurethane AC agent

Buffer layer: BOPP film, thickness 25 μm.

Heat sealing layer: the EVA heat-activated adhesive was coated to a thickness of 20 μm.

A second antistatic layer: organic conductive agent with a thickness of 0.1 μm.

In addition:

middle stripping cover tape: the thickness was 65 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 20 μm.

The preparation method is the same as example 1.

Comparative example 1

The structure and the materials of the cover removing tape in the comparative example are as follows from top to bottom:

a substrate thin film layer: BOPET film, thickness 20 μm.

Pressure-sensitive adhesive layer: acrylic pressure sensitive adhesive, coating thickness 15 μm.

Film pasting: BOPP film, thickness 20 μm.

Middle stripping cover tape: the thickness was 55 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 20 μm.

The preparation method comprises the following steps:

1) coating the acrylate pressure-sensitive adhesive glue solution of the pressure-sensitive adhesive layer below the base material film layer (1) by using a coating machine, selecting a scraper type coating mode, and drying the solvent in the acrylate pressure-sensitive adhesive glue solution of the pressure-sensitive adhesive layer by using a coating machine drying oven to complete the process of arranging the pressure-sensitive adhesive layer (2) below the base material film layer (1);

2) a cover tape laminating machine is used for laminating the biaxially oriented polypropylene BOPP film below the pressure-sensitive adhesive layer (2) to complete the process of arranging the film-sticking layer (3) below the pressure-sensitive adhesive layer (2);

3) and (3) cutting a micro-cut (4) at the edge of the base material film layer (1) of the middle uncapping tape by using a special slitting cutter. Finishing the arrangement of a micro notch (4) at the edge of the base material film layer (1);

the difference from the invention lies in: the adhesive layer used in the comparative example was a pressure-sensitive adhesive layer, and the adhesive layer used in the present invention was a heat-seal layer.

Comparative example 2

The structure and the materials of the cover removing tape in the comparative example are as follows from top to bottom:

a substrate thin film layer: BOPET film, thickness 20 μm.

Pressure-sensitive adhesive layer: acrylate pressure sensitive adhesive, coated to a thickness of 28 μm.

Film pasting: BOPP film, thickness 12 μm.

Middle stripping cover tape: the thickness was 60 μm.

The diameter of the micro-incisions is 0.5mm, with a spacing of 50 mm.

The depth of the micro-cuts was 20 μm.

The preparation method is consistent with that of comparative example 1.

The following performance tests were performed on the middle release cover tapes of examples 1 to 4 and comparative examples 1 to 2:

in examples 1 to 4, the stripping force of the middle stripping cover tape was measured by using a PS carrier tape prepared from a recycled material, and the sealing was performed at a sealing temperature of 150 ℃, a sealing pressure of 0.2MPa, and a sealing time of 0.5 s. In comparative examples 1 to 2, the test of the peeling force of the pressure-sensitive release cover tape was carried out by sealing a PS carrier tape prepared from a recycled material under a sealing pressure of 0.2MPa for a symbol time of 0.5 s. The sealing tension is higher than 150g, which is indicated by the symbol; sealing tension is 100-150 g and is indicated by a symbol O; the sealing pull is less than 100g and is indicated by the symbol Δ.

In examples 1 to 4 and comparative examples 1 to 2, the high-temperature aging performance of the medium-sized uncapping tape was measured by placing the sealed package in a constant-temperature and constant-humidity chamber at a temperature of 60 ℃ and a relative humidity of 90% for one week to measure the cracking and bursting of the package. The crack explosion band phenomenon does not occur, and the symbol is four-star; the occurrence of a crack band phenomenon is indicated by the symbol Δ.

In examples 1 to 4 and comparative examples 1 to 2, the tearability of the intermediate release tape was measured by tearing the sealed package with a packaging machine and detecting whether the tear tape was cut obliquely. The tearing tape does not have the phenomenon of oblique fracture in 500 meters and is indicated by a symbol; the tape tear was skewed 500 meters apart and is indicated by the symbol Δ.

The test results are as follows:

TABLE 1

As can be seen from table 1:

1, the embodiment 1-4 and the comparative example 1-2 are realized by cutting micro cuts on the edges of the base material film layer of the middle release cover tape by using a special slitting cutter, and the middle release cover tape of the manufacturing method has good tearability.

2, the examples 1 to 4 using the heat seal layer as the adhesive layer and the comparative examples 1 to 2 using the pressure sensitive adhesive layer as the adhesive layer were compared in terms of high-temperature aging performance, and the examples 1 to 4 showed good performance and did not have the phenomenon of cracking and bursting, while the comparative examples 1 to 2 showed poor performance and all showed the phenomenon of cracking and bursting.

3, comparing example 1 and example 2, it can be seen that the peel force of the middle uncapping tape gradually decreased as the substrate film layer thickness increased.

4, comparing example 1 and example 3, it can be seen that the peel force of the medium release tape gradually decreased as the thickness of the buffer layer increased.

5, comparing example 3 with example 4, it can be seen that the peel force of the middle uncapping tape gradually increases as the thickness of the heat-seal layer increases.

Comparing comparative example 1 and comparative example 2, it can be seen that the peeling force of the middle peeling tape gradually becomes larger as the thickness of the pressure sensitive adhesive layer decreases and the thickness of the adhesive layer decreases.

In comparison with example 3 and comparative example 2, it was found that the middle release cover tape using the heat seal layer as the adhesive layer exhibited good high-temperature aging properties without the occurrence of the cracking and popping phenomenon, while the middle release cover tape using the pressure-sensitive adhesive layer as the adhesive layer exhibited poor high-temperature aging properties with the occurrence of the cracking and popping phenomenon, under the same peel force.