阅读说明：本技术 光刻胶涂布装置 (Photoresist coating device ) 是由 李波 刘小虎 于 2020-12-16 设计创作，主要内容包括：本发明公开了一种光刻胶涂布装置,所述光刻胶喷涂装置包括晶圆承载台、驱动装置、晶圆容置装置、光刻胶喷头、溶剂喷头和吸附垫；所述晶圆容置装置用于容置所述晶圆承载台,所述晶圆承载台用于放置晶圆；所述驱动装置与所述晶圆承载台连接以驱动所述晶圆承载台旋转；所述光刻胶喷头位于所述晶圆承载台上方,用于向晶圆喷涂光刻胶；所述溶剂喷头位于所述晶圆承载台上方,用于向所述晶圆边缘喷射溶剂,所述溶剂用于溶解所述光刻胶；所述吸附垫设置在所述晶圆容置装置内壁,并对准所述晶圆边缘,所述吸附垫用于吸附喷溅的所述溶剂；该装置能够有效去除光刻胶在晶圆边缘的隆起,且去除过程中有效避免晶圆表面产生缺陷。(The invention discloses a photoresist coating device, which comprises a wafer bearing table, a driving device, a wafer accommodating device, a photoresist nozzle, a solvent nozzle and an adsorption pad, wherein the wafer bearing table is arranged on the wafer bearing table; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent; the device can effectively remove the bulges of the photoresist on the edge of the wafer, and effectively avoid the defects on the surface of the wafer in the removing process.)

1. A photoresist coating device is characterized in that the photoresist spraying device comprises a wafer bearing table, a driving device, a wafer containing device, a photoresist nozzle, a solvent nozzle and an adsorption pad; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent.

2. The photoresist spraying apparatus of claim 1, wherein the wafer stage is circular.

3. The photoresist spraying apparatus of claim 2, wherein the wafer stage vacuum adsorbs the wafer.

4. The photoresist spraying apparatus of claim 3, wherein the number of the photoresist nozzles is plural.

5. The apparatus of claim 4, wherein a plurality of the photoresist nozzles are distributed along a same radius of the wafer stage, wherein a first one of the photoresist nozzles is located above a center of the wafer stage.

6. The photoresist spraying apparatus of claim 1, wherein a sensor is disposed on the photoresist sprayer.

7. The apparatus according to claim 4, wherein each of the photoresist nozzles has an inverted trapezoidal shape, and an outlet aperture of each of the photoresist nozzles is 0.2mm to 0.8 mm.

8. The photoresist spraying apparatus of claim 7, wherein the position and number of the photoresist nozzles can be changed according to the thickness of the photoresist and/or the wafer size at the time of spraying.

9. The photoresist coating apparatus of claim 8, wherein during the process of coating photoresist on the wafer by the plurality of photoresist nozzles, when a first photoresist nozzle is used for coating, the driving device drives the wafer bearing table to rotate, the wafer rotates for the first time, and the first rotation speed is lower than 3000 rpm.

10. The photoresist coating apparatus of claim 1, wherein the adsorption pad is made of a porous material.

Technical Field

The invention relates to the technical field of photoresist equipment, in particular to a photoresist coating device.

Background

In a semiconductor manufacturing process, a photolithography process has been considered as a key step in the integrated circuit manufacturing, and wafer coating is very important in the whole photolithography process, and the stability and reliability of the wafer coating have important influence on the quality, yield and cost of products. The photoetching process is a complex process, and is characterized by that the circuit structure can be copied into the wafer to be etched and ion-implanted in the form of pattern, firstly, a photoresist thin layer can be formed on the wafer by means of photoresist coating system, then the parallel light can be irradiated on the photoresist thin layer by means of mask plate to make it be exposed and changed, and finally, the developing process can be implemented by means of developing liquor to implement pattern transfer. In which, if the thickness of the formed photoresist thin layer is deviated, the subsequent related processes are directly affected.

In the semiconductor manufacturing industry, the existing photoresist spraying technology adopts a center spraying mode, namely, only one spray nozzle of a wafer is used for spraying photoresist, the photoresist spray nozzle is arranged above the center of the wafer, and the wafer rotates to enable the photoresist to be full of the wafer after the photoresist is sprayed. During specific operation, firstly, a photoresist solvent spray head is arranged for spraying a photoresist solvent to wet the wafer, so that the photoresist on the back surface is easy to coat. And then, spraying photoresist by using another photoresist sprayer, wherein the wafer can rotate or not rotate in the spraying process, the photoresist is thrown out to the periphery by rotating the wafer at a high speed after the spraying is finished, and a photoresist solvent is fully distributed on the wafer. Meanwhile, the photoresist flows on the wafer in a star pattern mode, and finally the photoresist is uniformly coated on the surface of the wafer.

The photoresist edging is a necessary step of photoresist coating, in the photoresist spin coating process, redundant photoresist can be thrown to the edge of a wafer by centrifugal force, a raised edge is formed after solidification, a small amount of photoresist can flow to the back of the wafer along the edge under the action of surface tension to pollute the wafer, and part of photoresist is stripped to easily form defects, so that the photoresist needs to be removed immediately after the photoresist coating is finished.

Therefore, it is necessary to provide a photoresist coating apparatus, which can effectively remove the photoresist at the edge of the wafer and effectively avoid the defect on the surface of the wafer during the removal process.

Disclosure of Invention

The invention aims to provide a photoresist coating device which can effectively remove the bulge of photoresist on the edge of a wafer and effectively avoid the defect of the surface of the wafer in the removing process.

In order to achieve the above objects and other related objects, the present invention provides a photoresist coating apparatus, which is characterized in that the photoresist coating apparatus comprises a wafer carrying stage, a driving device, a wafer accommodating device, a photoresist nozzle, a solvent nozzle and an adsorption pad; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent.

Preferably, the wafer carrier is circular.

Preferably, the wafer bearing table vacuum-adsorbs the wafer.

Preferably, the number of the photoresist nozzles is plural.

Preferably, the photoresist nozzles are distributed along the same radius of the wafer bearing table, wherein the first photoresist nozzle is located above the center of the wafer bearing table.

Preferably, a sensor is arranged on the photoresist nozzle.

Preferably, each photoresist nozzle is in an inverted trapezoid shape, and the outlet aperture of each photoresist nozzle is 0.2 mm-0.8 mm.

Preferably, the position and the number of the photoresist nozzles can be changed according to the thickness of the photoresist and/or the size of the wafer during spraying.

Preferably, in the process that the photoresist is sprayed on the wafer by the photoresist sprayers, when the first photoresist sprayer is sprayed, the driving device drives the wafer bearing table to rotate, the wafer rotates for the first time, and the first rotating speed is lower than 3000 revolutions per minute.

Preferably, the absorbent pad is made of a porous material.

In summary, the photoresist coating apparatus provided by the invention combines the photoresist nozzle and the solvent nozzle, the photoresist nozzle is used for spraying photoresist to form a photoresist film on the surface of the wafer, and the solvent nozzle is used for spraying solvent to the edge of the wafer to dissolve the photoresist bump formed at the edge, so as to perform photoresist edge removal; in addition, a layer of adsorption material is added on the surface of the inner wall of the gluing and accommodating device and used for adsorbing the solvent splashed to the inner wall, so that the solvent is prevented from being splashed back, and the photoresist is dissolved to form defects.

Drawings

Fig. 1 is a schematic view of a photoresist coating apparatus according to an embodiment of the invention.

Wherein the reference numerals are as follows:

10-wafer, 20-wafer containing device, 30-driving device, 30 a-wafer bearing table, 40-photoresist nozzle, 50-solvent nozzle and 60-adsorption pad.

Detailed Description

The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Fig. 1 is a schematic view of a photoresist coating apparatus according to an embodiment of the present invention, and referring to fig. 1, the photoresist coating apparatus according to the embodiment includes a wafer stage 30a, a driving device 30, a wafer accommodating device 20, a photoresist nozzle 40, a solvent nozzle 50, and an adsorption pad 60; the wafer accommodating device 20 is used for accommodating the wafer bearing table 30a, and the wafer bearing table 30a is used for placing the wafer 10; the driving device 30 is connected to the wafer carrying stage 30a to drive the wafer carrying stage 30a to rotate; the photoresist nozzle 40 is positioned above the wafer bearing table 30a and is used for spraying photoresist on the wafer 10; the solvent spray head 50 is located above the wafer bearing table 30a, and is used for spraying a solvent to the edge of the wafer 10, wherein the solvent is used for dissolving the photoresist; the adsorption pad 60 is disposed on an inner wall of the wafer accommodating device 20 and aligned with an edge of the wafer 10, and the adsorption pad 60 is used for adsorbing the sputtered solvent.

In this embodiment, the wafer carrier 30a is circular.

In this embodiment, the wafer stage 30a vacuum-adsorbs the wafer 10. The center position of the wafer 10 corresponds to the center position of the wafer carrying table 30a, and the radius of the suction area of the wafer carrying table 30a for sucking the wafer 10 is 1/3 of the radius of the wafer 10.

In the embodiment of the present invention, the number of the photoresist nozzles 40 is generally plural, and a plurality of the photoresist nozzles 40 are distributed along the same radius of the wafer bearing table 30a, wherein a first photoresist nozzle 40 is located above the center of the wafer bearing table 30a, for example, as shown in fig. 1, three photoresist nozzles 40 are distributed along the same radius of the wafer bearing table 30a, wherein the first photoresist nozzle 40 is located above the center of the wafer bearing table 30 a. If the photoresist is used to place the wafer 10 on the susceptor 30a, three photoresist nozzles 40 can be distributed along the same radius of the wafer 10, wherein the first photoresist nozzle 40 is located above the center of the wafer 10.

In the embodiment of the present application, each of the photoresist nozzles 40 is provided with a sensor, which can sense the position of the photoresist flowing on the wafer 10.

In the embodiment of the application, each photoresist nozzle 40 is in an inverted trapezoid shape, the outlet aperture of each photoresist nozzle 40 is 0.2 mm-0.8 mm, each photoresist nozzle 40 is in an inverted trapezoid shape, the spraying amount of the photoresist outlet can be reduced, the outlet aperture is 0.2 mm-0.8 mm, the size of each photoresist nozzle 40 is large or small, the spraying amount is large or small, and the photoresist nozzles 40 can be selected according to different wafers 10 needing spraying at each time.

In the embodiment of the present application, the position and the number of the photoresist nozzles 40 can be changed according to the thickness of the photoresist and/or the wafer size during spraying. The apertures of the photoresist nozzles 40 are different, the spraying amount of each photoresist nozzle 40 is different, and the total usage amount of the photoresist is determined by the thickness of the photoresist and the size of the wafer 10, so that the number of the photoresist nozzles to be used can be determined according to the thickness of the photoresist and the size of the wafer 10, and the position of the photoresist nozzle 40 can also be determined.

In the specific implementation process, in the process of spraying the photoresist on the wafer 10 by the photoresist sprayers 40, when the first photoresist sprayer 40 is sprayed, the driving device 30 drives the wafer bearing table 30a to rotate, the wafer 10 rotates for the first time, and the first rotating speed is lower than 3000 r/min. The first photoresist nozzle 40 starts to rotate when spraying, other photoresist nozzles 40 distributed along the radius of the wafer 10 are sprayed in sequence, the spraying process is increased and still rotates at the first rotating speed, and after the last photoresist nozzle 40 is sprayed, the photoresist nozzles continue to rotate at the first rotating speed until the wafer is full of photoresist.

According to fig. 1, in the embodiment of the present application, during the process of spraying the photoresist on the wafer 10 by the plurality of photoresist nozzles 40, after the first photoresist nozzle 40 sprays the photoresist, the photoresist 40 flows around the wafer 10 in the shape of a star pattern, when the sensor on the next photoresist nozzle 40 monitors that the photoresist sprayed from the previous nozzle flows to the lower side, the photoresist nozzle 40 sprays the photoresist, the sprayed photoresist can increase the inner angle of the star pattern of the photoresist flowing on the wafer, so that the photoresist is more easily spread on the wafer, and the wafer 10 keeps rotating at the first rotation speed during the spraying of the plurality of photoresist nozzles 40.

When the photoresist nozzle 40 sprays photoresist, the solvent nozzle 50 is opened, the solvent nozzle 50 sprays solvent to the far side of the wafer 10 to dissolve the photoresist at the edge of the wafer 10, the sprayed solvent is absorbed by the absorption pad 60, and the absorption pad 60 is generally made of porous material which is beneficial to absorption.

The photoresist coating device provided by the invention has the advantages that through the combination of the photoresist sprayer and the solvent sprayer, the photoresist sprayer is used for spraying photoresist to form a photoresist film on the surface of a wafer, and the solvent sprayer is used for spraying solvent to the edge of the wafer to dissolve photoresist bumps formed on the edge, so that photoresist edge removal is carried out; in addition, a layer of adsorption material is added on the surface of the inner wall of the gluing and accommodating device and used for adsorbing the solvent splashed to the inner wall, so that the solvent is prevented from being splashed back, and the photoresist is dissolved to form defects.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.