阅读说明：本技术 高分断能力的贴片熔断器 (Paster fuse with high breaking capacity ) 是由 伊尔玛·瓦莱里亚诺·桑托斯 G·托德·迪特希 于 2020-09-25 设计创作，主要内容包括：一种高分断能力的贴片熔断器包括：以下述顺序堆叠布置设置的底部绝缘层、第一中间绝缘层、第二中间绝缘层和顶部绝缘层；可熔元件,其设置在第一中间绝缘层与第二中间绝缘层之间并且在导电的第一端子与第二端子之间延伸,第一端子和第二端子位于底部绝缘层、第一中间绝缘层、第二中间绝缘层和顶部绝缘层的相对的纵向端部处；其中,第一中间绝缘层和第二中间绝缘层由多孔陶瓷形成。(A high breaking capacity chip fuse comprising: a bottom insulating layer, a first intermediate insulating layer, a second intermediate insulating layer, and a top insulating layer disposed in a stacked arrangement in this order; a fusible element disposed between the first and second intermediate insulating layers and extending between electrically conductive first and second terminals at opposite longitudinal ends of the bottom, first, second and top insulating layers; wherein the first and second intermediate insulating layers are formed of porous ceramics.)

1. A high breaking capacity chip fuse comprising:

a bottom insulating layer, a first intermediate insulating layer, a second intermediate insulating layer, and a top insulating layer disposed in a stacked arrangement; and

a fusible element disposed between the first and second intermediate insulating layers and extending between electrically conductive first and second terminals at opposite longitudinal ends of the bottom, first, second and top insulating layers;

wherein the first and second intermediate insulating layers are formed of porous ceramics.

2. A high breaking capacity patch fuse in accordance with claim 1 wherein said fusible element is one of: a conductive core, wire, tape, metal chain, spiral wound wire, film deposited on a substrate.

3. A high breaking capacity patch fuse of claim 1, wherein the first and second intermediate insulating layers have a porosity greater than the bottom and top insulating layers.

4. A high breaking capacity patch fuse of claim 1, wherein the first and second intermediate insulating layers have a porosity at least 25% greater than the porosity of the bottom and top insulating layers.

5. A high breaking capacity patch fuse of claim 3, wherein the first and second intermediate insulating layers have a porosity at least 50% greater than the porosity of the bottom and top insulating layers.

6. A high breaking capacity patch fuse of claim 3, wherein the first and second intermediate insulating layers have a porosity at least 75% greater than the porosity of the bottom and top insulating layers.

7. A high breaking capacity patch fuse of claim 3, wherein the first and second intermediate insulating layers have a porosity at least 100% greater than the porosity of the bottom and top insulating layers.

8. A high breaking capacity patch fuse in accordance with claim 1, wherein said bottom insulating layer and said top insulating layer are formed of one of FR-4, glass and ceramic.

9. A high breaking capacity patch fuse in accordance with claim 1, said bottom insulating layer, said first intermediate insulating layer, said second intermediate insulating layer and said top insulating layer being flatly bonded to each other with a conductive insulating adhesive.

10. A method of forming a high breaking capacity chip fuse, comprising:

providing a bottom insulating layer, a first intermediate insulating layer, a second intermediate insulating layer, and a top insulating layer disposed in a stacked arrangement; and

disposing a fusible element between the first and second intermediate insulating layers, the fusible element extending between electrically conductive first and second terminals at opposite longitudinal ends of the bottom, first, second and top insulating layers;

wherein the first and second intermediate insulating layers are formed of porous ceramics.

11. The method of claim 10, wherein the fusible element is one of: a conductive core, wire, tape, metal chain, spiral wound wire, film deposited on a substrate.

12. The method of claim 10, wherein the first and second intermediate insulating layers have a porosity greater than the porosity of the bottom and top insulating layers.

13. The method of claim 12, wherein the first and second intermediate insulating layers have a porosity at least 25% greater than the porosity of the bottom and top insulating layers.

14. The method of claim 12, wherein the first and second intermediate insulating layers have a porosity at least 50% greater than the porosity of the bottom and top insulating layers.

15. The method of claim 12, wherein the first and second intermediate insulating layers have a porosity at least 75% greater than the porosity of the bottom and top insulating layers.

16. The method of claim 12, wherein the first and second intermediate insulating layers have a porosity at least 100% greater than the porosity of the bottom and top insulating layers.

17. The method of claim 10, wherein the bottom insulating layer and the top insulating layer are formed from one of FR-4, glass, and ceramic.

18. The method of claim 10, further comprising: the porous ceramic is formed by mixing particles of one or more fugitive materials into a ceramic, and then firing the ceramic to burn off the particles of the fugitive materials, leaving hollow pores within the ceramic.

19. The method of claim 18, wherein the temporary material comprises at least one of carbon and corn starch.

20. The method of claim 10, further comprising: the bottom insulating layer, the first intermediate insulating layer, the second intermediate insulating layer, and the top insulating layer are flatly bonded to each other with a conductive insulating adhesive.

Technical Field

The present disclosure relates generally to the field of circuit protection devices, and more particularly to a patch fuse (chip fuse) having a porous inner layer adapted to absorb energy from a blown fusible element.

Background

Patch fuses (also commonly referred to as "solid" fuses) typically include a fusible element that extends between two conductive end caps and is sandwiched between two or more layers of dielectric material (e.g., ceramic). When the fusible elements of a patch fuse melt or otherwise open in the event of an overcurrent, an arc may sometimes propagate between the separate components of the fusible element. The arc will rapidly heat the surrounding air and ambient particles and may cause a small explosion within the patch fuse. In some cases, the explosion may damage the dielectric layer and rupture the patch fuse, possibly damaging surrounding components. The likelihood of a rupture is generally proportional to the severity of the overcurrent condition. The maximum current that the patch fuse can cut without breaking is called "breaking capacity" of the patch fuse. It is generally desirable to maximize the breaking capacity of a patch fuse without significantly increasing the size or form factor of the patch fuse.

In view of these and other considerations, the improvements of the present invention may be useful.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended as an aid in determining the scope of the claimed subject matter.

A high breaking capacity chip fuse according to a non-limiting embodiment of the present disclosure may include: a bottom insulating layer, a first intermediate insulating layer, a second intermediate insulating layer, and a top insulating layer (which are disposed in a stacked arrangement in the order described above); a fusible element disposed between the first and second intermediate insulating layers and extending between electrically conductive first and second terminals at opposite longitudinal ends of the bottom, first, second and top insulating layers; wherein the first and second intermediate insulating layers are formed of porous ceramics.

A method of forming a high breaking capacity chip fuse according to a non-limiting embodiment of the present disclosure may include: providing a bottom insulating layer, a first intermediate insulating layer, a second intermediate insulating layer, and a top insulating layer (which are disposed in a stacked arrangement in the order described above); and disposing a fusible element between the first and second intermediate insulating layers, the fusible element extending between electrically conductive first and second terminals at opposite longitudinal ends of the bottom, first, second and top insulating layers; wherein the first and second intermediate insulating layers are formed of porous ceramics.

Drawings

By way of example, various embodiments of the disclosed system will now be described with reference to the accompanying drawings, in which:

fig. 1A is a perspective view illustrating a high breaking capacity chip fuse according to an exemplary embodiment of the present disclosure;

fig. 1B is a sectional view illustrating the high breaking capacity chip fuse shown in fig. 1A.

Detailed Description

A high-breaking-capacity chip fuse according to the present disclosure will now be described more fully with reference to the accompanying drawings, in which preferred embodiments of the high-breaking-capacity chip fuse are presented. It will be understood, however, that the high breaking capacity patch fuses described below may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will convey to those skilled in the art certain exemplary aspects of high breaking capacity patch fuses.

Referring to fig. 1A and 1B, perspective and cross-sectional side views illustrating a high breaking capacity chip fuse 10 (hereinafter referred to as "fuse 10") according to an exemplary non-limiting embodiment of the present disclosure are presented. The fuse 10 may include a bottom insulating layer 12, a first intermediate insulating layer 14, a second intermediate insulating layer 16, and a top insulating layer 18, which are disposed in a stacked arrangement in the order described above. The layers 12-18 may be joined to one another flat, such as with an epoxy or other electrically insulating adhesive or fastener. Although the fuse 10 presented and described herein has only two intermediate insulating layers (the first intermediate insulating layer 14 and the second intermediate insulating layer 16), it is contemplated that the fuse 10 may be provided with additional intermediate insulating layers without departing from the scope of the present invention. For example, the fuse 10 may be provided with a third intermediate insulating layer disposed between the bottom insulating layer 12 and the first intermediate insulating layer 14, and/or a fourth intermediate insulating layer disposed between the top insulating layer 18 and the second intermediate insulating layer 16. The present disclosure is not limited thereto.

The fuse 10 may also include a fusible element 20, the fusible element 20 being disposed between the first and second intermediate insulating layers 14, 16 (e.g., sandwiched between the first and second intermediate insulating layers 14, 16) and extending between electrically conductive first and second terminals 22, 24, the first and second terminals 22, 24 being located at opposite longitudinal ends of the layers 12-18. The fusible element 20 may be formed of a conductive material including, but not limited to, tin or copper, and may be formed as a conductive core, wire, ribbon, metal chain, spiral wound wire, film, etc., deposited on a substrate. The fusible element 20 may be configured to: melts and separates upon the occurrence of a predetermined fault condition in the fuse 10, such as an overcurrent condition in which an amount of current exceeding a predetermined maximum current (i.e., the "rating" of the fuse 10) flows through the fusible element 20. As will be appreciated by one of ordinary skill in the art, the size, shape, configuration, and material of the fusible element 20 may contribute to the rating of the fuse 10.

The bottom and top insulating layers 12, 18 of the fuse 10 may be formed of any suitable dielectric material, including but not limited to FR-4, glass, ceramic (e.g., low temperature co-fired ceramic), etc., and may be generally non-porous. The first and second intermediate insulating layers 14 and 16 of the fuse 10 may be formed of a porous ceramic (e.g., a low-temperature co-fired ceramic) having a plurality of hollow holes 26 formed therein. The porous ceramic of the first and second intermediate insulating layers 14, 16 may be made by mixing particles or granules of one or more temporary (functional) materials (e.g., carbon, corn starch, etc.) into the ceramic prior to firing/curing the ceramic. During firing/curing, the particles of the fugitive material may be burned off, leaving hollow pores 26 within the ceramic. The present disclosure is not limited thereto.

In various embodiments, the porosity of the first and second intermediate insulating layers 14, 16 may be greater than the porosity of the bottom and top insulating layers 12, 18 of the fuse 10. In a particular embodiment, the porosity of the first and second intermediate insulating layers 14, 16 may be 25% greater than the porosity of the bottom and top insulating layers 12, 18 of the fuse 10. In another embodiment, the porosity of the first and second intermediate insulating layers 14, 16 may be 50% greater than the porosity of the bottom and top insulating layers 12, 18 of the fuse 10. In another embodiment, the porosity of the first and second intermediate insulating layers 14, 16 may be 75% greater than the porosity of the bottom and top insulating layers 12, 18 of the fuse 10. In another embodiment, the porosity of the first and second intermediate insulating layers 14, 16 may be 100% greater than the porosity of the bottom and top insulating layers 12, 18 of the fuse 10. The present disclosure is not limited thereto.

During operation of the fuse 10, if an overcurrent condition causes the fusible element 20 to melt and produce an explosion, the first and second intermediate insulating layers 14, 16, which are relatively weaker and more porous and breakable than the bottom and top insulating layers 12, 18, will break due to the provision of the holes 26 and can absorb the energy of the explosion (e.g., in the manner of a crash cushion in an automobile), thereby preventing a large amount of energy from the explosion from being transmitted to the bottom and top insulating layers 12, 18. Furthermore, vaporized material of the melted fusible element 20 can be quickly cleared into the holes 26 of the broken first and second intermediate insulating layers 14, 16, thereby preventing such vaporized material from feeding and extending the arc between the separate components of the fusible element 20. Accordingly, by the fracture of the first and second intermediate insulating layers 14 and 16, the risk of the fuse 10 breaking is reduced, and thus the breaking capacity of the fuse 10 of the present disclosure may be relatively greater compared to the breaking capacity of a patch fuse without the porous first and second intermediate insulating layers 14 and 16.

As used herein, an element or step recited in the singular and proceeded with the word "a" or "an" should be understood as not excluding plural elements or steps, unless such exclusion is explicitly recited. Furthermore, references to "one embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

Although the present disclosure has been described with reference to certain embodiments, numerous modifications, alterations, and changes to the described embodiments are possible without departing from the sphere and scope of the present disclosure, as defined in the appended claims. Accordingly, it is intended that the disclosure not be limited to the described embodiments, but that it have the full scope defined by the language of the following claims, and equivalents thereof.