Heat pipe radiator and IGBT converter heat radiation device

文档序号：816220 发布日期：2021-03-26 浏览：2次中文

阅读说明：本技术 一种热管散热器以及一种igbt变流器散热装置 (Heat pipe radiator and IGBT converter heat radiation device ) 是由吴智勇王雄宋郭蒙黄南丁云廖军王幸智陈明翊王洪峰于 2019-09-25 设计创作，主要内容包括：本发明提供了一种热管散热器,包括：基板,由金属材料制成,包括相互平行的第一安装面和第二安装面,所述第一安装面和所述第二安装面用于安装功率器件；以及多根散热热管,所述多根散热热管的蒸发段穿过所述基板的第一侧面伸入所述基板内部以吸收所述功率器件的热量,所述多根散热热管的冷凝段裸露于环境中以进行散热,所述第一侧面与所述第一安装面和所述第二安装面邻接。(The invention provides a heat pipe radiator, comprising: the base plate is made of a metal material and comprises a first mounting surface and a second mounting surface which are parallel to each other, and the first mounting surface and the second mounting surface are used for mounting a power device; and evaporation sections of the heat dissipation heat pipes penetrate through the first side face of the substrate and extend into the substrate to absorb heat of the power device, condensation sections of the heat dissipation heat pipes are exposed in the environment to dissipate heat, and the first side face is adjacent to the first mounting face and the second mounting face.)

1. A heat pipe heat sink comprising:

the base plate is made of a metal material and comprises a first mounting surface and a second mounting surface which are parallel to each other, and the first mounting surface and the second mounting surface are used for mounting a power device; and

the evaporation sections of the heat dissipation heat pipes penetrate through the first side face of the substrate and extend into the substrate to absorb the heat of the power device, the condensation sections of the heat dissipation heat pipes are exposed in the environment to dissipate heat, and the first side face is adjacent to the first mounting face and the second mounting face.

2. A heat pipe heat sink as claimed in claim 1, wherein the lengths of said first mounting surface and said second mounting surface in a direction perpendicular to said first side surface are at least greater than the lengths of said power devices in a direction perpendicular to said first side surface.

3. A heat pipe heat sink as claimed in claim 2, wherein the length of the heat pipes extending into the substrate is greater than or equal to the length of the power device in the direction perpendicular to the first side.

4. A heat pipe radiator as claimed in any one of claims 1 to 3 wherein said plurality of heat dissipating heat pipes are arranged in at least one row between said first mounting surface and said second mounting surface.

5. A heat pipe radiator as claimed in claim 4 wherein said plurality of heat sink heat pipes are arranged in two rows between said first mounting surface and said second mounting surface.

6. A heat pipe radiator as claimed in claim 4 wherein said plurality of heat sink heat pipes are arranged in two staggered rows between said first mounting surface and said second mounting surface.

7. A heat pipe radiator as claimed in claim 1, wherein said heat dissipating heat pipes are Z-bent pipes, and the Z-bent sections of said heat dissipating heat pipes are exposed to the environment.

8. A heat pipe heat sink as recited in claim 1 wherein the number of heat dissipating heat pipes is related to the amount of heat generated by the power device.

9. A heat pipe radiator as claimed in claim 1, further comprising:

and the plurality of groups of radiating fins are sleeved on the plurality of radiating heat pipes.

10. A heat pipe heat sink, comprising:

the power device comprises at least one substrate, a first connecting piece and a second connecting piece, wherein the substrate is made of a metal material, each substrate comprises a first mounting surface and a second mounting surface which are parallel to each other, and the first mounting surface and the second mounting surface of each substrate are used for mounting a power device;

the first side surface of the base plate is fixedly connected to the first bearing surface of the base plate, and the second bearing surface of the base plate is parallel to the first bearing surface of the base plate; and

each base plate comprises a plurality of radiating heat pipes for radiating, evaporation sections of the radiating heat pipes of each base plate penetrate through the second bearing surface and the first bearing surface of the base plate and the first side surface of the base plate to extend into the base plate so as to absorb heat of power devices mounted on the base plate, and condensation sections of the radiating heat pipes are exposed in the environment so as to radiate heat.

11. A heat pipe heat sink as claimed in claim 10, wherein the first mounting surface and the second mounting surface of each substrate have a length in a direction perpendicular to the first side that is at least greater than a length of the power device mounted on the substrate in a direction perpendicular to the first side of the substrate.

12. A heat pipe heat sink as claimed in claim 11, wherein the plurality of heat pipes of each substrate extend into the substrate by a length equal to or greater than a length of the power device in a direction perpendicular to the first side of the substrate.

13. A heat pipe radiator as claimed in any one of claims 10 to 12 wherein said plurality of heat pipes of each base plate are arranged in at least one row between said first and second mounting surfaces of said base plate.

14. A heat pipe heat sink as recited in claim 13 wherein said plurality of heat pipes of each base plate are disposed in two rows between said first mounting surface and said second mounting surface of said base plate.

15. A heat pipe radiator as claimed in claim 13 wherein said plurality of heat pipes of each base plate are arranged in two staggered rows between said first and second mounting surfaces of said base plate.

16. A heat pipe radiator as claimed in claim 10, wherein said heat pipes of each substrate are Z-bent pipes, and the Z-bent sections of said heat pipes are exposed to the environment.

17. A heat pipe radiator as claimed in claim 10 wherein the number of said plurality of heat dissipating heat pipes per substrate is related to the amount of heat generated by the power devices mounted on said substrate.

18. A heat pipe radiator as claimed in claim 10, further comprising:

and the plurality of groups of radiating fins are sleeved on at least part of the radiating heat pipes.

19. A heat pipe radiator as claimed in claim 18, wherein said heat pipe radiator further comprises:

and the radiator outer cover is arranged on the second bearing surface of the bottom plate, and all the radiating heat pipes and all the radiating fins of the at least one substrate are arranged in the radiator outer cover.

20. A heat pipe heat sink as claimed in claim 19, wherein said at least one substrate is a plurality of substrates, and first mounting surfaces of said plurality of substrates are disposed parallel to each other on said first load bearing surface of said base plate.

21. An IGBT converter heat sink comprising at least one heat pipe radiator according to any one of claims 1 to 20.

Technical Field

The invention relates to a heat dissipation device of a power device in the traffic field, in particular to a heat pipe radiator and an IGBT converter heat dissipation device comprising the same.

Background

The IGBT converter module is an important part of the converter, and is one of bottlenecks which restrict the development of a high-power converter in the rail transit industry of China at present. In recent years, with the rapid development of the rail transit field in China, traction converters of electric locomotives, motor cars, subways and other traffic rail equipment are developing towards high power, high integration, serialization and light weight, so that the heat flux density borne by corresponding radiators is increased rapidly, and the heat dissipation problem is increasingly prominent.

Theoretical strengthening methods for improving the heat dissipation performance of the heat sink include increasing the size of the heat sink, increasing the cooling flow rate of the heat sink, and decreasing the initial temperature of the cooling medium. However, the problems that follow are that the radiator becomes large in volume, heavy in weight, loud in noise, high in system complexity, and high in cost, and the like.

Currently, a heat pipe radiator is a type of air-cooled radiator with the highest heat exchange efficiency. The commonly adopted heat pipe radiators comprise gravity type, siphon type, plate type and loop heat pipe radiators, the radiators generally comprise a plurality of heat pipes, metal substrates and fins, the IGBT is installed on the single surface of the lower bottom surface of the radiator substrate and is cooled, the heat pipes are assembled in the substrate, absorb heat by the substrate and then transmit the heat to the heat pipes and the heat pipes to the fins, and finally heat exchange is carried out between the heat pipes and air.

When a plurality of high-power IGBT devices need to be installed, the area size of the substrate of the existing heat pipe radiator is large, and the heat dissipation requirement can be met only by a large number of heat pipes, so that the size is large, and inconvenience is caused to the design and installation of other devices of the whole converter cabinet. In addition, due to the difference in the distance measurement between each heat pipe and the heat source, the heat received by each heat pipe is not uniform, and the heat resistance between the heat pipe far away from the heat source and the heat source is large, thereby affecting the heat dissipation efficiency. With the requirement of the high-power module for the heat dissipation performance becoming higher and the development of the IGBT towards miniaturization, the existing single-sided heat dissipation structure cannot meet the requirement.

Therefore, it is highly desirable to provide a heat pipe radiator with double-sided cooling to satisfy the heat dissipation requirement of the high-power module under the condition of limited volume.

Disclosure of Invention

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

According to an aspect of the present invention, there is provided a heat pipe radiator, comprising:

Further, the length of the first mounting surface and the second mounting surface in the direction perpendicular to the first side surface is at least larger than the length of the power device in the direction perpendicular to the first side surface.

Furthermore, the length of the heat dissipation heat pipes extending into the substrate is greater than or equal to the length of the power device in the direction perpendicular to the first side surface.

Furthermore, the heat dissipation heat pipes are arranged between the first installation surface and the second installation surface in at least one row.

Furthermore, the heat dissipation heat pipes are arranged between the first installation surface and the second installation surface in two rows.

Furthermore, the heat dissipation heat pipes are arranged between the first installation surface and the second installation surface in a staggered mode in two rows.

Furthermore, the plurality of heat dissipation heat pipes are Z-shaped bent pipes, and Z-shaped bent sections of the plurality of heat dissipation heat pipes are exposed in the environment.

Further, the number of the heat dissipation heat pipes is related to the heat generation amount of the power device.

Still further, the heat pipe radiator further comprises:

and the plurality of groups of radiating fins are sleeved on the plurality of radiating heat pipes.

According to another aspect of the present invention, there is provided a heat pipe radiator, comprising:

Further, the length of the first mounting surface and the second mounting surface of each substrate in a direction perpendicular to the first side surface is at least greater than the length of the power device mounted on the substrate in the direction perpendicular to the first side surface of the substrate.

Furthermore, the length of the plurality of heat dissipation heat pipes of each substrate extending into the substrate is greater than or equal to the length of the power device in the direction perpendicular to the first side surface of the substrate.

Furthermore, the plurality of heat dissipation heat pipes of each substrate are arranged between the first mounting surface and the second mounting surface of the substrate in at least one row.

Furthermore, the plurality of heat dissipation heat pipes of each substrate are arranged between the first mounting surface and the second mounting surface of the substrate in two rows.

Furthermore, the plurality of heat dissipation heat pipes of each substrate are arranged between the first mounting surface and the second mounting surface of the substrate in two rows in a staggered manner.

Furthermore, the plurality of heat dissipation heat pipes of each substrate are Z-shaped bent pipes, and the Z-shaped bent sections of the plurality of heat dissipation heat pipes are exposed in the environment.

Furthermore, the number of the plurality of heat dissipation heat pipes of each substrate is related to the heat generation amount of the power device mounted on the substrate.

Still further, the heat pipe radiator further comprises:

and the plurality of groups of radiating fins are sleeved on at least part of the radiating heat pipes.

Still further, the heat pipe radiator further comprises:

Furthermore, the at least one substrate is a plurality of substrates, and the first mounting surfaces of the plurality of substrates are arranged on the first bearing surface of the bottom plate in parallel.

According to yet another aspect of the present invention, there is provided an IGBT converter heat sink comprising at least one heat pipe heat sink as described in any one of the above.

Drawings

The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings.

FIG. 1A is a front view of a heatpipe heatsink 100 in one embodiment, depicted in accordance with one aspect of the present invention;

FIG. 1B is a left side view of the heatpipe heatsink 100 in an embodiment, depicted in accordance with an aspect of the present invention;

FIG. 1C is a top view of the substrate of the heatpipe heat sink 100 in one embodiment according to one aspect of the present invention;

FIG. 2 is a cross-sectional view of a Z-shaped heat sink heat pipe in one embodiment according to one aspect of the present invention;

FIG. 3A is a front view of a heatpipe heatsink 200 in one embodiment, shown in accordance with another aspect of the present invention;

FIG. 3B is a left side view of the heatpipe heatsink 200 in an embodiment, according to another aspect of the present invention;

FIG. 3C is a top view of the substrate of the heatpipe heat sink 200 in an embodiment according to another aspect of the present invention;

FIG. 4A is a front view of a heatpipe heatsink 300 in one embodiment, depicted in accordance with yet another aspect of the present invention;

FIG. 4B is a left side view of a heatpipe heatsink 300 in an embodiment, shown in accordance with yet another aspect of the present invention;

fig. 4C is a top view of the substrate of the heatpipe heat sink 300 according to another embodiment of the present invention.

Detailed Description

The following description is presented to enable any person skilled in the art to make and use the invention and is incorporated in the context of a particular application. Various modifications, as well as various uses in different applications will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to a wide range of embodiments. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

In the following detailed description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the practice of the invention may not necessarily be limited to these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.

The reader's attention is directed to all papers and documents which are filed concurrently with this specification and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference. All the features disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature disclosed is one example only of a generic series of equivalent or similar features.

Note that where used, the designations first, second, left, right, front, back, top, bottom, positive, negative, clockwise, and counterclockwise are used merely for convenience and do not imply any particular fixed orientation. In fact, they are used to reflect the relative position and/or orientation between the various parts of the object.

It is noted that, where used, further, preferably, still further and more preferably is a brief introduction to the exposition of the alternative embodiment on the basis of the preceding embodiment, the contents of the further, preferably, still further or more preferably back band being combined with the preceding embodiment as a complete constituent of the alternative embodiment. Several further, preferred, still further or more preferred arrangements of the belt after the same embodiment may be combined in any combination to form a further embodiment.

The invention is described in detail below with reference to the figures and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be construed as imposing any limitation on the scope of the present invention.

According to an aspect of the present invention, there is provided a heat pipe radiator, which is an apparatus for rapidly radiating heat dissipated by a heat radiating object such as various power devices mounted thereon into the air.

In one embodiment, the heat pipe heat sink 100 includes a substrate 110 and a plurality of heat dissipating heat pipes 120.

Fig. 1A shows a front view of the heatpipe heatsink 100, and fig. 1B shows a left side view of the heatpipe heatsink 100.

The substrate 110 is a metal plate having a certain thickness, and is mainly used for mounting a power device. The substrate 110 is generally a flat rectangular parallelepiped structure, and at least two planes with the largest area of the substrate 110 can be generally selected as the mounting surface of the power device. As shown in fig. 1B, the first mounting surface 111 and the second mounting surface 112 are parallel to each other, and the first mounting surface 111 and the second mounting surface 112 are used for mounting a power device (in a dotted frame in fig. 1A).

The arrangement that the power devices are simultaneously arranged on the first mounting surface and the second mounting surface of the substrate is equivalent to one-time folding of the plane where the heat source is located, the area is reduced by half, the size of the substrate is correspondingly greatly reduced, and the problem that the size of the heat pipe radiator is too large is effectively solved.

The plurality of heat-dissipating heat pipes 120 serve to dissipate heat of the power device mounted on the substrate 110. As shown in fig. 1A to 1B, the plurality of heat dissipating heat pipes 120 are generally attached to the first side surface 113 adjacent to the long sides of the first attachment surface 111 and the second attachment surface 112. The evaporation sections of the heat pipes 120 penetrate through the first side surface 113 and extend into the substrate 110 to absorb heat conducted from the power device mounted on the substrate 110 to the substrate 110, and the condensation sections of the heat pipes 120 are exposed in the external environment for air cooling and heat dissipation.

Specifically, when the substrate 110 is formed by casting, the first side surface 113 may be provided with heat pipe press-fitting grooves, the number of which is the same as that of the heat dissipation heat pipes 120, and the heat dissipation heat pipes 120 are fixed in the corresponding heat pipe press-fitting grooves by welding or interference fit.

It is understood that when the thickness of the substrate 110 is thicker, the other two sides 114 and 115 of the substrate 110 can be used for mounting power devices, and even different numbers of power devices can be mounted according to the size of the area of each mounting surface.

Preferably, for the purpose of mounting the power device, the length a of the first mounting surface 111 and the second mounting surface 112 of the substrate 110 is at least greater than the length b of the power device so as to meet the requirement of the mounting area of the power device.

Further preferably, in order to meet the heat dissipation requirement of the power device, the length c of the plurality of heat dissipation heat pipes 120 extending into the substrate 110 is greater than or equal to the length b of the power device.

Strictly speaking, the lengths a, b and c in this case refer to the heights of the first mounting surface 111 (or the second mounting surface 112), the power device and the part of the heat pipe where the heat dissipation heat pipe 120 extends into the substrate 110, in the direction perpendicular to the first side surface 113, respectively. When the first mounting surface 111, the second mounting surface 112, and the power device are rectangular, the length a is a length of one side of the first mounting surface 111 and the second mounting surface 112 in a strict sense, and the length b is a length of one side of the power device in a strict sense. When the heat-dissipating heat pipe 120 extends into the substrate 110 in a direction perpendicular to the first side surface, the lengths a, b, and c are the lengths of the heat-dissipating heat pipe extending into the substrate 110 in a strict sense.

Obviously, compared with the arrangement of installing the heat-radiating heat pipe on the single surface of the existing heat pipe radiator, the length of the heat-radiating heat pipe extending into the substrate in the scheme is greatly increased, even more than 2 times of the traditional length, the evaporation section area of the heat-radiating heat pipe is increased, and the heat-radiating efficiency is improved accordingly.

Further, the heat-dissipating heat pipes 120 are disposed in at least one row between the first mounting surface 111 and the second mounting surface 112 of the substrate 110 so as to absorb the heat dissipated by the power device conducted on the substrate 110.

It is understood that when the thickness of the substrate 110, i.e., the distance between the first mounting surface 111 and the second mounting surface 112 is small, the plurality of heat dissipation heat pipes 120 may be disposed in a row between the first mounting surface 111 and the second mounting surface 112.

Preferably, when the sides 114 and 115 of the substrate 110 are not used for mounting the power device, the plurality of heat dissipation heat pipes 120 may be disposed between the first mounting surface 111 and the second mounting surface 112 in two rows to improve the heat dissipation efficiency of the power device.

Preferably, the heat dissipation heat pipes 120 are disposed between the first mounting surface 111 and the second mounting surface 112 in two staggered rows. Fig. 1C shows a top view of the first side 113 of the substrate 110 in an embodiment, wherein two rows of heat pipe press-fitting grooves 1131 for installing the heat dissipation heat pipes 120 are arranged in a staggered manner, and two rows of heat dissipation heat pipes 120 fixedly installed in the corresponding heat pipe press-fitting grooves 1131 are also arranged in a staggered manner. It can be understood that the staggered heat-dissipating heat pipes 120 can more uniformly absorb the heat dissipated by the power devices conducted on the substrate 120.

Preferably, the heat-dissipating heat pipes 120 may be Z-shaped bent pipes, and fig. 2 shows a cross-sectional side view of one of the Z-shaped heat-dissipating heat pipes 120. The Z-shaped bent portion 121 of the Z-shaped heat pipe 120 can increase the contact area, so that the Z-shaped bent portion 121 of the Z-shaped heat pipe 120 is preferably exposed to the environment, that is, only a part or all of the left or right section of the Z-shaped bent portion 121 of the Z-shaped heat pipe 120 shown in fig. 2 is extended into the substrate 110 to serve as an evaporation section.

It is understood that the number of the heat dissipating heat pipes 120 may be set according to the heat dissipating requirement of the power device, and the heat dissipating requirement of the power device is related to the total heat generation of all the installed power devices. The number of heat-dissipating heat pipes can be specifically set based on the individual heat generation amount and the number of power devices mounted on the substrate 110. Correspondingly, the arrangement of the heat dissipation heat pipes can be correspondingly set according to the position on the substrate for mounting the power device. Correspondingly, the hot pipe press-fitting groove is correspondingly arranged.

In order to further improve the heat dissipation efficiency of the heatpipe heat sink 100, the heatpipe heat sink 100 may further include a plurality of sets of fins 130, as shown in fig. 1A to 1B, the plurality of sets of fins 130 are sleeved on the plurality of heat dissipation heatpipes 120. Specifically, the heat sink 130 may be fixedly connected to the one or more heat pipes 120 by welding or interference fit.

According to another aspect of the present invention, a base plate may be disposed on the first side of the substrate to increase the load bearing capacity of the heatpipe heatsink.

In one embodiment, as shown in FIG. 3, a heatpipe heat sink 200 includes a substrate 210, a plurality of heat dissipating heatpipes 220, and a base plate 230.

FIG. 3A shows a front view of heatpipe heatsink 200, FIG. 3B shows a left side view of heatpipe heatsink 200, and FIG. 3C shows a top view of heatpipe heatsink 200.

The substrate 210 is a metal plate having a certain thickness, and is mainly used for mounting a power device. The substrate 210 is generally a flat rectangular parallelepiped structure, and at least two planes with the largest area of the substrate 210 can be generally selected as the mounting surface of the power device. As shown in fig. 3B, the first mounting surface 211 and the second mounting surface 212 are parallel to each other, and the first mounting surface 211 and the second mounting surface 212 are used for mounting a power device (in a dotted frame in fig. 3A).

The bottom plate 230 is a plate having a certain thickness and is fixedly disposed on the substrate 210. The two planes of the bottom plate 230 having the largest area serve as load bearing surfaces of the bottom plate 230. As shown in fig. 3A-3B, the first and second bearing surfaces 231 and 232 are parallel to each other, and the first bearing surface of the base plate 230 is fixedly connected to the substrate 210.

The plurality of heat-dissipating heat pipes 220 are used to dissipate heat of the power device mounted on the substrate 210. As shown in fig. 3A, the heat-dissipating heat pipes 220 penetrate through the second bearing surface 232 and the first bearing surface 231 of the bottom plate 230 and the first side surface 213 of the substrate 210 to extend into the substrate 210 to absorb heat of the power device mounted on the substrate 210, and the condensation sections of the heat-dissipating heat pipes 220 are exposed to the environment for air-cooling heat dissipation.

The first side 210 of the substrate 210 is generally a side adjacent to the long sides of the first mounting surface 211 and the second mounting surface 212 of the substrate 210.

Specifically, when the bottom plate 230 is formed by casting, heat pipe mounting holes are formed from the first bearing surface 231 to the second bearing surface 232, the number of the heat pipe mounting holes is the same as that of the heat dissipation heat pipes 220, and the heat dissipation heat pipes 220 penetrate through the heat pipe mounting holes on the bottom plate 230 and extend into the substrate 210.

When the substrate 210 is formed by casting, the first side 213 may be provided with heat pipe press-fitting grooves having the same number as that of the heat dissipation heat pipes 220, and the heat dissipation heat pipes 220 are fixed in the heat pipe press-fitting grooves on the substrate 210 by welding or interference fit.

It is understood that when the thickness of the substrate 210 is thicker, the other two sides 214 and 215 of the substrate 210 can be used for mounting power devices, and even different numbers of power devices can be mounted according to the size of the area of each mounting surface.

Preferably, for the purpose of mounting the power device, the lengths of the first mounting surface 211 and the second mounting surface 212 of the substrate 210 in the direction perpendicular to the first side surface 213 are at least greater than the lengths of the power devices mounted on the substrate 210 in the direction perpendicular to the first side surface 213.

Further preferably, in order to meet the heat dissipation requirement of the power device, the length of the plurality of heat dissipation heat pipes 220 of the substrate 210 extending into the substrate 210 is greater than or equal to the length of the power device in the direction perpendicular to the first side surface 213.

Further, the heat dissipation heat pipes 220 are disposed in at least one row between the first mounting surface 211 and the second mounting surface 212 of the substrate 210 so as to absorb the heat dissipated by the power devices conducted on the substrate 210.

It is understood that when the thickness of the substrate 210, i.e., the distance between the first mounting surface 211 and the second mounting surface 212 is small, the plurality of heat dissipation heat pipes 220 may be disposed in a row between the first mounting surface 211 and the second mounting surface 212.

Preferably, when the side surfaces 214 and 215 of the substrate 210 are not used for mounting the power device, in order to improve the heat dissipation efficiency of the power device, the plurality of heat dissipation heat pipes 220 may be disposed between the first mounting surface 211 and the second mounting surface 212 in two rows.

Preferably, the heat dissipation heat pipes 220 are disposed between the first mounting surface 211 and the second mounting surface 212 in two staggered rows. Fig. 3C shows a top view (partially cut away) of the heatpipe heat sink 200 in an embodiment in which the heat-dissipating heatpipes 220 are arranged in two staggered rows. It can be understood that the staggered heat dissipation heat pipes 220 can more uniformly absorb the heat dissipated by the power devices conducted on the substrate 210.

Preferably, the plurality of heat pipes 220 may be Z-shaped bent pipes, and the Z-shaped bent sections of the Z-shaped heat pipes can increase the contact area, so that the Z-shaped bent sections of the Z-shaped heat pipes 220 are preferably exposed to the environment outside the second bearing surface 232 of the bottom plate 230.

It is understood that the number of heat dissipation heat pipes 220 may be set according to the heat dissipation requirement of the power device, and the heat dissipation requirement of the power device is related to the total heat generation of all installed power devices. The number of heat-dissipating heat pipes can be specifically set based on the individual heat generation amount and the number of power devices mounted on the substrate 210. Correspondingly, the arrangement of the heat dissipation heat pipes can be correspondingly set according to the position on the substrate for mounting the power device. Correspondingly, the arrangement of the heat pipe mounting hole on the bottom plate and the heat pipe press-fitting groove on the base plate corresponds to that of the heat dissipation heat pipe.

In order to further improve the heat dissipation efficiency of the heatpipe heat sink 200, the heatpipe heat sink 200 may further include a plurality of sets of fins 240, as shown in fig. 3A, the plurality of sets of fins 240 are sleeved on the plurality of heat dissipation heatpipes 220. Specifically, the heat sink 240 may be fixedly connected to the one or more heat pipes 220 by welding or interference fit.

To protect the heatpipe heatsink 200, the heatpipe heatsink 200 may further include a heatsink housing 250, wherein the heatsink housing 250 is mounted on the second supporting surface 232 of the base plate 230, and all the heatsink heatpipes 220 and all the heatsink fins 240 are disposed in the heatsink housing 250 to prevent the heatsink heatpipes 220 and the heatsink fins 240 from being damaged by external force.

Specifically, the heat sink housing 250 may include a housing bracket 251 and a housing cover plate 252. The housing bracket 251 is fixedly disposed on the second bearing surface 232 of the bottom plate 230, the housing bracket 251 surrounds the heat dissipating heat pipe 220 and the heat dissipating fin 240, and the housing cover 252 is fixedly disposed on the housing bracket 251.

Preferably, housing holder 251 is coupled to base plate 230 by a removable fastening means, such as a bolted connection, and housing cover 252 is coupled to housing holder 251 by a removable fastening means, such as a bolted connection.

According to still another aspect of the present invention, in order to further reduce the volume of the heatpipe heatsink, a plurality of substrates may be disposed on a bottom plate of the heatpipe heatsink while satisfying the requirement for mounting a large number of power devices.

In one embodiment, the heatpipe heat sink 300 includes two substrates 310, two sets of heat-dissipating heatpipes 320 respectively disposed on the two substrates 310, and a bottom plate 330.

FIG. 4A shows a front view of heatpipe heatsink 300, FIG. 4B shows a left side view of heatpipe heatsink 300, and FIG. 4C shows a top view of heatpipe heatsink 300.

Each substrate 310 is a metal plate having a certain thickness, and is mainly used for mounting a power device. The substrate 310 is generally a flat rectangular parallelepiped structure, and at least two planes with the largest area of the substrate 310 can be generally selected as the mounting surface of the power device. As shown in fig. 4B, the first mounting surface 311 and the second mounting surface 312 are parallel to each other, and the first mounting surface 311 and the second mounting surface 312 are used for mounting a power device (in a dotted frame in fig. 4A).

The base plate 330 is a plate having a certain thickness, and two planes having the largest area of the base plate 330 are used as the first load bearing surface 331 and the second load bearing surface 332 of the load bearing surface 1 of the base plate 330, which are parallel to each other as shown in fig. 4A to 4B. As shown in fig. 4B, the two substrates 310 are fixedly mounted on the first bearing surface 331 of the base plate 330.

Preferably, the two substrates 310 are disposed on the first bearing surface 331 of the base plate 330 in parallel. The two substrates 310 are parallel to each other, which means that the first mounting surface and the second mounting surface of the two substrates 310 are parallel to each other, respectively.

Each substrate 310 has a plurality of heat dissipation heat pipes 320 corresponding thereto for dissipating heat from the power devices mounted on its corresponding substrate 310. As shown in fig. 4A, a plurality of heat pipes 320 extend into the substrate 310 through the second bearing surface 332 and the first bearing surface 331 of the bottom plate 330 and the first side surface 313 of the corresponding substrate 310 to absorb heat of the power device mounted on the substrate 310, and the condensation sections of the heat pipes 320 are exposed to the environment for air cooling and heat dissipation.

The first side 310 of the substrate 310 is generally a side adjacent to the long sides of the first mounting surface 311 and the second mounting surface 312 of the substrate 310.

Specifically, when the base plate 330 is formed by casting, two sets of heat pipe mounting holes are formed in the base plate 330 from the first bearing surface 331 to the second bearing surface 332, the number of the heat pipe mounting holes is the same as that of the heat dissipation heat pipes 320, and the heat dissipation heat pipes 320 penetrate through the heat pipe mounting holes in the base plate 330 and extend into the substrate 310.

When each substrate 310 is formed by casting, the first side 313 of each substrate may be provided with heat pipe press-fitting grooves having the same number as the number of the heat dissipation heat pipes 320 for dissipating heat from the substrate 310, and the corresponding heat dissipation heat pipes 320 are fixed in the corresponding heat pipe press-fitting grooves on the substrate 310 by welding or interference fit.

It is understood that when the two base plates 310 are thicker, the other two sides 314 and 315 of the base plate 310 can be used for mounting power devices, and even different numbers of power devices can be mounted according to the area of the respective mounting surfaces.

Preferably, for the purpose of mounting power devices, the lengths of the first mounting surface 311 and the second mounting surface 312 of the two substrates 310 in the direction perpendicular to the first side surface 313 are respectively at least greater than the lengths of the power devices mounted on the two substrates 310 in the direction perpendicular to the first side surface 313.

Further preferably, in order to meet the heat dissipation requirement of the power device, the length of the plurality of heat dissipation heat pipes 320 corresponding to each substrate 310 extending into the substrate 310 is greater than or equal to the length of the power device mounted thereon in the direction perpendicular to the first side surface 313.

It is understood that the two substrates coupled to the base plate 330 may have different configurations according to different requirements.

Further, the plurality of heat dissipation heat pipes 320 corresponding to each substrate 310 are disposed in at least one row between the first mounting surface 311 and the second mounting surface 312 of the substrate 310 so as to absorb the heat dissipated by the power devices conducted on the substrate 310.

It is understood that when the thickness of the substrate 310, i.e., the distance between the first mounting surface 311 and the second mounting surface 312, is small, the corresponding plurality of heat dissipation heat pipes 320 may be arranged in a row between the first mounting surface 311 and the second mounting surface 312.

Preferably, when the side surfaces 314 and 315 of one substrate 310 are not used for mounting a power device, in order to improve the heat dissipation efficiency of the power device, the plurality of heat dissipation heat pipes 320 corresponding to the substrate 310 may be disposed between the first mounting surface 311 and the second mounting surface 312 of the substrate 310 in two rows.

Preferably, the heat dissipation heat pipes 320 corresponding to the substrate 310 are disposed between the first mounting surface 311 and the second mounting surface 312 in two staggered rows. Fig. 4C shows a top view (partially cut away) of the heatpipe heat sink 300 in an embodiment, wherein each group of the plurality of heat-dissipating heatpipes 320 is arranged in two staggered rows, and the two groups of heat-dissipating heatpipes can also be staggered. It is understood that the staggered heat dissipation heat pipes can more uniformly absorb the heat dissipated from the power devices on the substrate 310.

Preferably, the two sets of heat pipes 320 may be Z-shaped bent pipes, and the Z-shaped bent sections of the Z-shaped heat pipes can increase the contact area, so that the Z-shaped bent sections of the Z-shaped heat pipes 320 are preferably exposed to the environment outside the second bearing surface 332 of the bottom plate 330.

It is understood that the number of each set of heat-dissipating heat pipes 320 may be set according to the heat-dissipating requirement of the power devices mounted on the corresponding substrate, and the heat-dissipating requirement of the power devices is related to the total heat generation of all the mounted power devices. The number of heat-dissipating heat pipes per group can be specifically set based on the individual heat generation amount and the number of power devices mounted on their corresponding substrates 310.

Correspondingly, the arrangement of each group of heat dissipation heat pipes can be correspondingly arranged according to the position on the corresponding substrate for mounting the power device. Correspondingly, the arrangement of the heat pipe mounting holes on the bottom plate and the corresponding heat pipe press-fitting grooves on the base plate and the heat dissipation heat pipes can also be correspondingly arranged.

In order to further improve the heat dissipation efficiency of the heatpipe heat sink 300, the heatpipe heat sink 300 may further include a plurality of sets of fins 340, as shown in fig. 3A, the plurality of sets of fins 340 are sleeved on the heat dissipation heatpipe 320. Each heat sink 340 may be sleeved on one or more heat pipes according to its size. When the heat sink is large enough, it can even be sleeved on all the heat dissipating heat pipes on the bottom plate 330.

Specifically, the heat sink 340 may be fixedly connected to the heat pipe 320 by welding or interference fit.

To protect the heatpipe heatsink 300, the heatpipe heatsink 300 may further include a heatsink housing 350, wherein the heatsink housing 350 is mounted on the second supporting surface 332 of the base plate 330, and the two sets of heat-dissipating heatpipes 320 and all the heat-dissipating fins 340 are disposed in the heatsink housing 350 to prevent the heat-dissipating heatpipes 320 and the heat-dissipating fins 340 from being damaged by external force.

Specifically, the heat sink housing 350 may include a housing bracket 351 and a housing cover plate 352. The cover holder 351 is fixedly provided on the second bearing surface 332 of the base plate 330, the cover holder 351 surrounds the heat radiating pipe 320 and the heat radiating fin 340, and the cover plate 352 is fixedly provided on the cover holder 351.

Preferably, the housing bracket 351 may be coupled to the base plate 330 by a detachable fixing means such as a bolt coupling, and the housing cover 352 may be coupled to the housing bracket 351 by a detachable fixing means such as a bolt coupling.

Although the heat pipe radiator 300 takes two substrates and two sets of corresponding heat dissipating heat pipes as an example, it can be understood by those skilled in the art that any number of substrates and corresponding heat dissipating heat pipes can be disposed on the bottom plate as required.

According to another aspect of the present invention, there is provided an IGBT converter heat sink comprising at least one heat pipe heat sink as described in any of the above embodiments, wherein the IGBTs of the IGBT converter are mounted on a substrate of the heat pipe heat sink.

The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. It is to be understood that the scope of the invention is to be defined by the appended claims and not by the specific constructions and components of the embodiments illustrated above. Those skilled in the art can make various changes and modifications to the embodiments within the spirit and scope of the present invention, and these changes and modifications also fall within the scope of the present invention.

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Heat pipe radiator and IGBT converter heat radiation device

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