阅读说明：本技术 超薄玻璃基板、超薄玻璃基板制程方法和面板制程方法 (Ultrathin glass substrate, ultrathin glass substrate processing method and panel processing method ) 是由 周晧煜 蒋承忠 吴天鸣 黄俊杰 陈风 于 2020-12-24 设计创作，主要内容包括：本发明提供了超薄玻璃基板、超薄玻璃基板制程方法和面板制程方法,超薄玻璃基板包括：一玻璃基板,玻璃基板的第一侧设有沿预设弯折路径延展的至少一弯折应力消散槽；以及一高分子补强层,高分子补强层填充弯折应力消散槽,高分子补强层露出于玻璃基板的上表面与玻璃基板的上表面平齐。本发明能够自玻璃母材获得玻璃基板的同时,在玻璃母材上设置填充高分子补强层的弯折应力消散槽,增强在后续的制程面板的过程中面板在预设弯折路径上的弯折性能,节约功能层制程的时间,同时提升超薄玻璃基板的抗弯折性能和抗冲击性能,大大提高了超薄玻璃基板的产品质量。(The invention provides an ultrathin glass substrate, a manufacturing method of the ultrathin glass substrate and a manufacturing method of a panel, wherein the ultrathin glass substrate comprises the following components: the first side of the glass substrate is provided with at least one bending stress dissipation groove extending along a preset bending path; and the polymer reinforcing layer is filled in the bending stress dissipation groove, and the polymer reinforcing layer is exposed out of the upper surface of the glass substrate and is flush with the upper surface of the glass substrate. According to the invention, the glass substrate can be obtained from the glass base material, and meanwhile, the bending stress dissipation groove filled with the high-molecular reinforcing layer is arranged on the glass base material, so that the bending performance of the panel on a preset bending path in the subsequent panel manufacturing process is enhanced, the functional layer manufacturing time is saved, the bending resistance and the impact resistance of the ultrathin glass substrate are improved, and the product quality of the ultrathin glass substrate is greatly improved.)

1. An ultra-thin glass substrate, comprising:

the glass substrate (30), the first side of the glass substrate (30) is provided with at least one bending stress dissipation groove extending along a preset bending path, and a stress dissipation edge is formed at the edge of the substrate area; and

the polymer reinforcing layer (24) fills the bending stress dissipation groove, and the polymer reinforcing layer (24) is exposed out of the upper surface of the glass substrate (30) and is flush with the upper surface of the glass substrate (30).

2. The ultra-thin glass substrate as claimed in claim 1, wherein the polymer material of the polymer reinforcement layer has a light transmittance of 90% or more, a refractive index in the range of 1.2 to 1.7, and an adhesion to the glass substrate (30) of 5B.

3. The ultra-thin glass substrate of claim 1, wherein the polymeric stiffening layer comprises a liquid-reinforced optical cement, acrylic, a silicon-containing organic polymeric material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

4. The ultra-thin glass substrate of claim 1, wherein the bending stress-dissipating slots are any one of:

a plurality of strip-shaped grooves which are parallel to the preset bending path;

a rectangular groove body extending along the preset bending path;

an elliptical trough body extending along the predetermined bending path.

5. The ultra-thin glass substrate of claim 1, further comprising: and the panel functional layer (23) is arranged on the first side of the glass substrate (30), and the polymer reinforcing layer (24) is attached to the glass substrate (30).

6. The ultra-thin glass substrate according to claim 1, wherein the second side of the glass substrate (30) is also provided with the bending stress dissipation groove filled with the polymeric reinforcement layer (24); and the bending stress dissipation groove on the first side is staggered with the bending stress dissipation groove on the second side based on the first projection of the glass substrate (30) and the second projection of the glass substrate (30).

7. A method for manufacturing an ultra-thin glass substrate, the method being used for manufacturing the ultra-thin glass substrate according to claim 1, comprising the steps of:

s110, providing a glass base material (1), wherein n substrate regions (11) and a framework region (12) surrounding the substrate regions (11) are preset on the glass base material (1), and n is greater than or equal to 2;

s120, respectively forming etching protective layers on at least the upper surface and the lower surface of the substrate area (11) of the glass base material, wherein the etching protective layers comprise a main body area and at least one thinning area extending along a preset bending path;

s130, at least etching a skeleton region (12) of the glass parent material (1), separating the substrate region (11) from the glass parent material (1), forming at least one bending stress dissipation groove in the substrate region (11) along a preset bending path through the thinning region, and forming a stress dissipation edge (13) at the edge of the substrate region (11);

s140, removing the etching protection layer to obtain the independent glass substrate (30) (14) with the bending stress dissipation groove;

s150, arranging a polymer reinforcing layer in the bending stress dissipation groove, wherein the polymer reinforcing layer (24) is exposed out of the upper surface of the glass substrate (30) and is flush with the upper surface of the glass substrate (30).

8. The method of claim 7, wherein in step S150, the polymeric stiffening layer is added to the bend stress relief groove by coating or spray printing.

9. The method of claim 7, wherein the polymer reinforcement layer comprises a liquid optical adhesive, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

10. The method of claim 7, further comprising the following steps after the step S150:

and S160, setting one side of the bending stress dissipation groove on the glass substrate (30), curing the panel functional layer (23) on the glass substrate (30) through the high-molecular reinforcing layer in an exposure or heating mode, wherein the panel functional layer (23) comprises one or a combination of a TFT (thin film transistor) backboard, an organic light emitting layer, a touch detection layer, a fingerprint identification layer and a cover plate.

11. The ultra-thin glass substrate processing method according to claim 7, wherein the substrate regions (11) are arranged in the glass parent material (1) in a matrix manner, the adjacent substrate regions (11) are separated by the skeleton regions (12), all the skeleton regions (12) in the glass parent material (1) are removed by one-time etching, at least one bending stress dissipation groove is formed in the substrate region (11) along a preset bending path, and a stress dissipation edge (13) is formed at the edge of the substrate region (11).

12. A method for manufacturing a display panel, comprising the method for manufacturing an ultra-thin glass substrate according to any one of claims 7 to 11.

Technical Field

The invention relates to the technical field of panel processing, in particular to an ultrathin glass substrate, an ultrathin glass substrate processing method and a panel processing method.

Background

Ultra-thin glass substrates (UTG substrates) are an important component of foldable cover sheets, and the quality of the ultra-thin substrates themselves is critical to achieve the effect of smaller or even 2mm bend radii. Particularly, after the UTG substrate is cut into a specific size, special treatment of the edge part of the substrate, namely, removing defects such as edge breakage and microcracks generated by cutting is needed, so as to avoid the breakage of glass caused by microcracks and the like when the substrate is bent. In general, there are two issues to be addressed: 1) what cutting mode is taken to obtain a relatively straight edge quality; 2) and removing edge defects by adopting polishing and other modes.

At present, the wheel knife type cutting is limited to straight line cutting, the difficulty is still faced in the aspect of carrying out product profile (lead R angle) cutting, and moreover, the UTG substrate of about 100um without chemical strengthening treatment is very fragile, and the mechanical pressure generated in the wheel knife cutting process is difficult to bear, so that high-proportion fragments are generated, or the defects of obvious chipping, unfilled corner and the like of the edge of the substrate are generated undesirably. These defects are very fatal defects for subsequent edge polishing, and can directly result in rejection of the substrate. Therefore, finding a suitable cutting means to obtain a substrate with flat edges is an important work component.

In contrast, the laser cutting with non-mechanical force can obtain a better edge cutting effect and may become a mainstream mode of future ultrathin substrate cutting, and the laser cutting refers to melting and evaporating a workpiece by energy released when a laser beam irradiates on the surface of the workpiece so as to achieve the purpose of cutting and slicing. The laser cutting does not apply pressure on the surface of the glass, so that the glass substrate cannot be broken, and various special-shaped cuts can be made.

On the other hand, the UTG substrate is easy to have quality defects such as scratch or mutual extrusion and support damage of the glass surface in the processing and transferring process, at present, the protective ink spraying mode is adopted to reduce or avoid the problems, and the processing processes of large sheet UTG mother plate glass cutting, edge polishing, chemical strengthening and protective ink spraying are formed. Finally, the UTG substrate which is subjected to the chemical strengthening treatment is coated with the functional film to form the foldable cover plate.

For this purpose, a general embodiment is: the ultra-thin substrate is sprayed with the protective ink at UTG and then laser cut or machined to the desired dimensions. However, it is a very difficult task to uniformly spray ink on the surface of UTG substrate, especially to eliminate the related air bubbles, ensure uniform film thickness, uniform color, clean spraying environment, etc. Meanwhile, the laser cutting path is often subjected to uneven spraying to cause the problem that laser is scattered in the area, and finally, the defects of incomplete glass cutting, difficult slicing, serious edge breakage and the like are caused, and the subsequent edge polishing process is seriously influenced by the defects.

Furthermore, when the folding screen cover comprises ultra-thin glass (UTG), the bending radius is required to be smaller and smaller, the strength requirement on the glass is gradually increased, but for improving the bending performance, the thickness of UTG is thinner and thinner, but the impact performance of UTG which is too thin is weak.

Therefore, the invention provides an ultrathin glass substrate, an ultrathin glass substrate processing method and a panel processing method.

Disclosure of Invention

The invention aims to provide an ultrathin glass substrate, an ultrathin glass substrate processing method and a panel processing method, overcomes the difficulties in the prior art, can obtain the glass substrate from a glass base material, and meanwhile, the glass base material is provided with a bending stress dissipation groove filled with a high-molecular reinforcing layer, so that the bending performance of the panel on a preset bending path in the subsequent panel processing process is enhanced, the time of a functional layer processing is saved, the bending resistance and the shock resistance of the ultrathin glass substrate are improved, and the product quality of the ultrathin glass substrate is greatly improved.

The embodiment of the invention provides a processing method of an ultrathin glass substrate, which comprises the following steps:

the glass substrate is provided with at least one bending stress dissipation groove extending along a preset bending path on a first side, and a stress dissipation edge is formed at the edge of the substrate area; and

the polymer reinforcing layer is filled in the bending stress dissipation groove, and the polymer reinforcing layer is exposed out of the upper surface of the glass substrate and is flush with the upper surface of the glass substrate.

Preferably, the light transmittance of the polymer material of the polymer reinforcing layer is greater than or equal to 90%, the refractive index is in the range of 1.2 to 1.7, and the adhesion with the glass substrate is 5B.

Preferably, the components of the polymer reinforcing layer include a liquid-reinforced optical cement, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

Preferably, the bending stress dissipation groove is any one of:

a plurality of strip-shaped grooves which are parallel to the preset bending path;

a rectangular groove body extending along the preset bending path;

an elliptical trough body extending along the predetermined bending path.

Preferably, the method further comprises the following steps: and the panel functional layer is arranged on the first side of the glass substrate and is adhered to the glass substrate by the polymer reinforcing layer.

Preferably, the second side of the glass substrate is also provided with the bending stress dissipation groove filled with the polymer reinforcing layer; and the bending stress dissipation groove on the first side is staggered with the bending stress dissipation groove on the second side based on the first projection of the glass substrate.

The embodiment of the invention also provides a manufacturing method of the ultrathin glass substrate, which is characterized in that the method is used for manufacturing the ultrathin glass substrate and comprises the following steps:

s110, providing a glass base material, wherein n substrate regions and a framework region surrounding the substrate regions are preset on the glass base material, and n is more than or equal to 2;

s120, respectively forming etching protective layers on at least the upper surface and the lower surface of the substrate area of the glass base material, wherein each etching protective layer comprises a main body area and at least one thinning area extending along a preset bending path;

s130, at least etching the skeleton area of the glass base material, enabling the substrate area to be separated from the glass base material, forming at least one bending stress dissipation groove in the substrate area along a preset bending path through the thinning area, and forming a stress dissipation edge at the edge of the substrate area;

s140, removing the etching protection layer to obtain the independent glass substrate with the bending stress dissipation groove;

s150, arranging a polymer reinforcing layer in the bending stress dissipation groove, wherein the polymer reinforcing layer is exposed out of the upper surface of the glass substrate and is flush with the upper surface of the glass substrate.

Preferably, in the step S150, the polymer reinforcing layer is added into the bending stress dissipation groove by coating or spray printing.

Preferably, the components of the polymer reinforcing layer include a liquid-reinforced optical cement, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

Preferably, the step S150 further includes the following steps:

and S160, arranging the glass substrate on one side of the bending stress dissipation groove, curing the panel functional layer on the glass substrate through the high-molecular reinforcing layer in an exposure or heating mode, wherein the panel functional layer comprises one or a combination of a TFT (thin film transistor) backboard, an organic light emitting layer, a touch detection layer, a fingerprint identification layer and a cover plate.

Preferably, the substrate regions are arranged in the glass parent material in a matrix, the adjacent substrate regions are separated by the framework regions, all the framework regions in the glass parent material are eliminated by one-time etching, at least one bending stress dissipation groove is formed in each substrate region along a preset bending path, and a stress dissipation edge is formed at the edge of each substrate region.

Preferably, the thinned area is a strip-shaped area extending along a predetermined bending path.

Preferably, at least one narrow slit parallel to a predetermined bending path is disposed in the thinned region, and a partial substrate region is exposed to the narrow slit.

Preferably, the thinned region of the etch protection layer has a thickness less than a thickness of the body region of the etch protection layer.

Preferably, the etching protection layer includes an etching buffer layer for reducing etching and an etching barrier layer for blocking etching, which are disposed on the same layer, the etching buffer layer forms the thinned region, and the etching protection layer forms a main region of the etching protection layer.

The embodiment of the invention also provides a display panel processing method, which comprises the above ultra-thin glass substrate processing method.

The invention aims to provide an ultrathin glass substrate, an ultrathin glass substrate processing method and a panel processing method, wherein the glass substrate can be obtained from a glass base material, meanwhile, a bending stress dissipation groove filled with a high-molecular reinforcing layer is arranged on the glass base material, so that the bending performance of a panel on a preset bending path in the subsequent panel processing process is enhanced, the functional layer processing time is saved, the bending resistance and the impact resistance of the ultrathin glass substrate are improved, and the product quality of the ultrathin glass substrate is greatly improved.

Drawings

Other features, objects and advantages of the present invention will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a first ultra-thin glass substrate according to the present invention.

FIG. 2 is a cross-sectional view of a second ultra-thin glass substrate of the present invention.

FIG. 3 is a cross-sectional view of a second ultra-thin glass substrate according to the present invention in a rolled state.

FIG. 4 is a cross-sectional view of a third ultra-thin glass substrate of the present invention.

FIG. 5 is a cross-sectional view of a fourth ultra-thin glass substrate of the present invention.

FIG. 6 is a cross-sectional view of a fifth ultra-thin glass substrate according to the present invention.

FIG. 7 is a flow chart of the ultra-thin glass substrate processing method of the present invention.

Fig. 8 to 16 are schematic views illustrating a first process of the ultra-thin glass substrate processing method according to the present invention.

FIG. 17 is a schematic process diagram of a second process of the ultra-thin glass substrate processing method of the present invention.

FIG. 18 is a schematic process diagram of a third process of the ultra-thin glass substrate processing method of the present invention.

Reference numerals

1 glass base material

11 area of the substrate

12 framework region

13 stress dissipating edge

14 bending stress dissipation groove

141 bending stress dissipation groove

142 bending stress dissipation groove

20 first etching protective layer

21 thinned region

22 main body region

23 functional layer

24 polymer reinforcing layer

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted.

FIG. 1 is a cross-sectional view of a first ultra-thin glass substrate according to the present invention. As shown in fig. 1, the ultra-thin glass substrate of the present invention includes: a glass substrate 30 and a polymer reinforcing layer 24. The glass substrate 30 is provided at a first side thereof with at least one bending stress-dissipating groove 14 extending along a predetermined bending path, and a stress-dissipating edge is formed at an edge of the substrate region. The polymer reinforcing layer 24 fills the bending stress dissipation groove 14, and the polymer reinforcing layer 24 is exposed on the upper surface of the glass substrate 30 and is flush with the upper surface of the glass substrate 30. According to the invention, the method for etching the pattern in the bending area of the ultrathin glass and filling the high polymer material is used, the ultrathin glass with excellent bending performance and impact resistance and rigidity can be manufactured, and the ultrathin glass meeting the specific rigidity and bending performance can be designed by changing the etching pattern according to the requirements.

In a preferred embodiment, the light transmittance of the polymer material of the polymer reinforcing layer 24 is greater than or equal to 90%, the refractive index is in the range of 1.2 to 1.7, and the adhesion with the glass substrate 30 is 5B, so that the polymer reinforcing layer 24 can be firmly embedded in the bending stress dissipation groove 14 and kept flush with the upper surface of the glass substrate 30, and meanwhile, the polymer reinforcing layer 24 can also have the characteristics of light transmittance, flexibility and no falling off, but not limited thereto.

In a preferred embodiment, the composition of the polymer reinforcing layer includes, but is not limited to, a liquid-reinforced optical adhesive, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

In a preferred embodiment, the bending stress-dissipating slots 14 are any one of the following:

FIG. 2 is a cross-sectional view of a second ultra-thin glass substrate of the present invention. Referring to fig. 2, a plurality of bar-shaped grooves each parallel to a predetermined bending path;

a rectangular groove body extending along a preset bending path;

an oval slot extending along the predetermined bending path, but not limited thereto.

In a preferred embodiment, the stress-dissipating edge is a rounded edge, a blade edge, or a polygonal edge, the blade edge or the polygonal edge including at least one beveled edge or curved beveled edge, the beveled edge having an angle with the glass parent material in the range of (15 °, 90 °), the glass parent material having a thickness of 10um to 150 um; the stress dissipation edge surrounds the edge of the substrate region, and the width of the stress dissipation edge is 5um to 300um, but not limited thereto.

According to the invention, partial material is etched in the bending area of the ultrathin glass substrate and another high polymer material is filled in the bending area, and a thicker glass body is reserved in the non-bending area, so that the rigidity and the shock resistance of most areas are stronger. The polymer material needs to satisfy certain mechanical properties and optical properties. Mechanical properties: after being combined with the ultrathin glass substrate, the ultrathin glass substrate does not fall off within the working bending radius, and the material of the ultrathin glass substrate does not yield or break within the working radius. Optical properties: the glass has penetrability and refractive index close to that of the glass, so that the glass has no optical problem after being combined with the glass.

FIG. 3 is a cross-sectional view of a second ultra-thin glass substrate according to the present invention in a rolled state. Referring to fig. 3, the circumference (predetermined bending path) of the bent portion of the ultra-thin glass substrate is S, where S is pi × R, where pi is a circumferential ratio and R is a radius of the arc of the bent portion of the ultra-thin glass substrate. The width of the whole of the plurality of parallel bending stress dissipation grooves 14 on the ultra-thin glass substrate is (S +2W), the preset bending path (width S) is located in the middle of the whole bending stress dissipation groove 14, and in actual use, both sides of the bending portion of the ultra-thin glass substrate are also affected by bending. In this embodiment, W is 3h (i.e., the width W of the expanded portion is 3 times the thickness h of the ultra-thin glass substrate). So as to weaken the stress jump between the bending region and the straight region of the ultra-thin glass substrate, thereby effectively enhancing the curling property of the ultra-thin glass substrate, but not limited thereto.

In one variation, the distribution of the bending stress dispersion grooves 14 decreases from high to low in density from the bending region (predetermined bending path) to the linear region of the glass substrate 30, so that the flexibility of the bending stress can be satisfied and the rigidity of the linear region portion of the glass substrate 30 can be maintained.

FIG. 4 is a cross-sectional view of a third ultra-thin glass substrate of the present invention. In a preferred embodiment, referring to fig. 4, the third ultra-thin glass substrate of the present invention further comprises: and the panel functional layer 23 is arranged on the first side of the glass substrate 30, and the polymer reinforcing layer 24 is adhered to the glass substrate 30. The panel functional layer 23 is formed by bonding the polymer reinforcing layer 24 embedded in the glass substrate 30 to the glass substrate 30. Therefore, an adhesive layer is not required to be added between the panel functional layer 23 and the glass substrate 30, and the entire thickness of the ultra-thin glass substrate is further reduced.

FIG. 5 is a cross-sectional view of a fourth ultra-thin glass substrate of the present invention. In a preferred embodiment, as shown in fig. 5, the first side of the glass substrate 30 is also provided with a bending stress dissipation groove 141 filled with the polymer reinforcement layer 24. The second side of the glass substrate 30 is also provided with a bending stress dissipation groove 142 filled with the polymer reinforcement layer 24. And the bending stress dissipation groove 141 on the first side is staggered with the bending stress dissipation groove 142 on the second side based on the first projection of the glass substrate 30, so that the glass substrate 30 can be curled towards two different surfaces and can have better flexibility, and the rigidity of the ultra-thin glass substrate is prevented from being weakened by the arrangement of the bending stress dissipation groove through the dislocation between the bending stress dissipation groove 141 and the bending stress dissipation groove 142, but not limited to this.

FIG. 6 is a cross-sectional view of a fifth ultra-thin glass substrate according to the present invention. In a preferred embodiment, as shown in fig. 5, the first side of the glass substrate 30 is also provided with a bending stress dissipation groove 141 filled with the polymer reinforcement layer 24, the panel functional layer 23 is disposed on the first side of the glass substrate 30, and the polymer reinforcement layer 24 is attached to the first side of the glass substrate 30. The second side of the glass substrate 30 is also provided with a bending stress dissipating groove 142 filled with the polymer reinforcing layer 24, the panel functional layer 23 is disposed on the second side of the glass substrate 30, and the polymer reinforcing layer 24 is attached to the second side of the glass substrate 30, but not limited thereto.

FIG. 7 is a flow chart of the ultra-thin glass substrate processing method of the present invention. As shown in fig. 7, the ultra-thin glass substrate processing method of the present invention for processing the ultra-thin glass substrate as claimed in claim 1 comprises the steps of:

s110, providing a glass base material 1, wherein n substrate regions 11 and a framework region 12 surrounding the substrate regions 11 are preset on the glass base material 1, and n is greater than or equal to 2.

S120, respectively forming etching protective layers on at least the upper surface and the lower surface of the substrate area 11 of the glass base material, wherein the etching protective layers comprise a main body area and at least one thinning area extending along a preset bending path.

S130, etching at least the skeleton region 12 of the glass preform 1, so as to separate the substrate region 11 from the glass preform 1, forming at least one bending stress dissipation groove 14 on the substrate region 11 along a predetermined bending path through the thinning region, and forming a stress dissipation edge 13 on an edge of the substrate region 11.

And S140, removing the etching protection layer to obtain the independent glass substrate 3014 with the bending stress dissipation grooves 14.

S150, a polymer reinforcing layer is disposed in the bending stress dissipation groove 14, and the polymer reinforcing layer 24 is exposed on the upper surface of the glass substrate 30 and is flush with the upper surface of the glass substrate 30.

In a preferred embodiment, the polymeric reinforcement layer is added to the bending stress dissipation groove 14 by coating or spray printing, but not limited thereto.

In a preferred embodiment, the composition of the polymer reinforcing layer includes, but is not limited to, a liquid-reinforced optical adhesive, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

In a preferred embodiment, step S150 is followed by the following steps:

step S160, the glass substrate 30 is disposed on one side of the bending stress dissipation groove 14, the glass substrate 30 is disposed on the panel functional layer 23 through the polymer reinforcing layer, and the polymer reinforcing layer is cured through exposure or heating, where the panel functional layer 23 includes one or a combination of a TFT backplane, an organic light emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate, but not limited thereto.

In a preferred embodiment, the substrate regions 11 are arranged in a matrix on the glass preform 1, the adjacent substrate regions 11 are separated by the skeleton regions 12, all the skeleton regions 12 in the glass preform 1 are removed by etching, at least one bending stress dissipation groove 14 is formed along a predetermined bending path in the substrate region 11, and a stress dissipation edge 13 is formed at an edge of the substrate region 11, but not limited thereto.

Fig. 8 to 16 are schematic views illustrating a first process of the ultra-thin glass substrate processing method according to the present invention. As shown in fig. 8 to 16, the first process of the ultra-thin glass substrate processing method of the present invention is as follows:

referring to fig. 8, first, a glass preform 1 is provided, the glass preform 1 has a thickness of 10um to 150um, substrate regions 11 are arranged in the glass preform 1 in a matrix, and adjacent substrate regions 11 are separated by a skeleton region 12.

Referring to fig. 9 and 10, n substrate regions 11 and a skeleton region 12 surrounding the substrate regions 11 are preset on a glass parent material 1, where n is greater than or equal to 2, etching protective layers 20 are respectively formed on upper and lower surfaces of the substrate regions 11 of the glass parent material, the etching protective layers 20 only cover the upper and lower surfaces of the substrate regions 11, and the upper and lower surfaces of the skeleton region 12 are exposed outside the etching protective layers 20, so that the upper and lower surfaces of the skeleton region 12 can be etched simultaneously in subsequent etching, a stress dissipation edge 13 having a plurality of stress dissipation surfaces is easily formed, the substrate regions 11 are arranged in a matrix on the glass parent material 1, and a skeleton region 12 is provided between adjacent substrate regions 11. The etching protection layer 20 includes a main region 22 and at least one thinned region 21 extending along a predetermined bending path. In this embodiment, the thinned region 21 is a strip region extending along the predetermined bending path, at least one narrow slit parallel to the predetermined bending path is disposed in the thinned region 21, and the local substrate region 11 is exposed from the narrow slit, so that at least one bending stress dissipation groove 14 is formed in the substrate region 11 along the predetermined bending path during the etching process.

Referring to fig. 11, 12, 13, and 14, the skeleton region 12 of the glass preform 1 is etched, the substrate region 11 is separated from the glass preform 1, at least one bending stress dissipation groove 14 is formed in the substrate region 11 along a predetermined bending path through the thinned region, and a stress dissipation edge 13 is formed at an edge of the substrate region 11. The etching buffer layer in the invention can not completely block the etching of the substrate area 11 below the etching buffer layer in the etching process, but only weakens the etching of the substrate area 11 below the etching buffer layer, so that shallow grooves extending along a preset bending path are left in the substrate area 11 corresponding to the thinned area (as a contrast, the substrate area 11 covered by the etching barrier layer is not etched at all), and the shallow grooves can disperse bending stress when the panel is bent and can be used as bending stress dissipation grooves. In this embodiment, the first etching process is performed to remove all the skeleton regions 12 in the glass preform 1, leaving the substrate regions 11 protected by the etching resist 20. The stress dissipating edge 13 is a blade edge, the stress dissipating edge 13 surrounds the edge of the substrate region 11, and the width of the stress dissipating edge 13 is 5um to 300 um. In this embodiment, all the skeleton regions 12 in the glass preform 1 are removed by one-time etching, at least one bending stress dissipation groove is formed in the substrate region 11 along a preset bending path, and a stress dissipation edge 13 is formed at the edge of the substrate region 11, that is, three etching effects are simultaneously achieved in the one-time etching process. In the present embodiment, the bending stress dissipation grooves 14 are formed symmetrically to each other on both sides of the substrate region 11, so that the stresses in both bending directions can be dispersed, respectively. In a modification, the bending stress dispersion groove 14 may be provided only on one surface of the substrate region 11 to disperse the stress in only one bending direction.

Referring to fig. 15, the etching protection layer is removed to obtain individual glass substrates 30 having bending stress dissipation grooves.

Referring to fig. 16, the etching protection layer is removed to obtain an independent glass substrate having bending stress dissipation grooves. The polymeric reinforcing layer is disposed in the bending stress dissipation groove 14, and the polymeric reinforcing layer 24 is exposed on the upper surface of the glass substrate 30 and flush with the upper surface of the glass substrate 30. The polymeric reinforcement layer is added to the bending stress dissipation groove 14 by coating or spray printing, but not limited thereto. The components of the polymer reinforcing layer 24 include, but are not limited to, a liquid-reinforced optical adhesive, acrylic, a silicon-containing organic polymer material, an epoxy resin, a fluororesin, a polyamide, a polyimide, a polycarbonate, a polyethylene terephthalate, and a poly-1, 4-cyclohexanedimethylene terephthalate.

FIG. 17 is a schematic process diagram of a second process of the ultra-thin glass substrate processing method of the present invention. As shown in fig. 17, the ultra-thin glass substrate processing method of the present invention may further include, on the basis of the processing steps shown in fig. 8 to 16, arranging a plurality of preset bending paths on two sides of the ultra-thin glass substrate, distributing a plurality of bending stress dissipation grooves 14 on two sides of the glass substrate 30, and filling the polymer reinforcement layers 24 in the bending stress dissipation grooves 14 on two sides of the glass substrate 30. So that the second process can provide better flexibility when the glass substrate 30 is bent at any position.

FIG. 18 is a schematic process diagram of a third process of the ultra-thin glass substrate processing method of the present invention. As shown in fig. 18, the ultra-thin glass substrate processing method of the present invention may further bond the panel functional layer 23 through the polymer reinforcement layers 24 in the bending stress dissipation grooves 14 on both sides of the glass substrate 30 based on the processing procedures of fig. 8 to 17. The panel functional layer 23 is formed by bonding the polymer reinforcing layer 24 embedded in the glass substrate 30 to the glass substrate 30. Therefore, an adhesive layer does not need to be added between the panel functional layer 23 and the glass substrate 30, and the entire thickness of the ultra-thin glass substrate having the panel functional layer 23 is further reduced, but not limited thereto.

The third process can enhance the overall flexibility of the glass substrate when the glass substrate is bent and recovered, so that the anti-fragmentation property of the glass substrate is improved; meanwhile, the bending stress dissipation groove 14 formed in the glass substrate improves the bending performance of the panel on a preset bending path in the subsequent panel manufacturing process, so that the time of functional layer manufacturing is greatly saved, and the product quality of the ultrathin glass substrate is improved.

In summary, the present invention is directed to provide an ultra-thin glass substrate, an ultra-thin glass substrate processing method, and a panel processing method, in which a glass substrate can be obtained from a glass base material, and a bending stress dissipation groove filled with a polymer reinforcement layer is formed on the glass base material, so as to enhance the bending performance of a panel on a preset bending path in the subsequent panel processing process, save the time of a functional layer processing, improve the bending resistance and impact resistance of the ultra-thin glass substrate, and greatly improve the product quality of the ultra-thin glass substrate.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.