阅读说明：本技术 一种石墨烯薄膜传感器及其制备方法、设备 (Graphene film sensor and preparation method and equipment thereof ) 是由 李扬 张彬 李星亮 宋影 韩如锦 于 2020-12-13 设计创作，主要内容包括：本发明提供一种石墨烯薄膜传感器及制备方法、设备,该传感器从下到上,采用压力将基底、柔性电路板、碳纳米管薄膜以及导热绝缘陶瓷片一体封装,改变了传统传感器和机械结构分离式设计的方式,占用体积更小；以及该传感器采用灵敏度很高的碳纳米管薄膜作为传感器的敏感材料,柔性电路板作为引线方式,导热绝缘陶瓷作为封装材料,相比一般温度传感器灵敏度更高。此外,将传感器大部分集成设计在结构件表层,除了不需加装专用传感器实现减重,还可以减小体积,结构智能化强度设计等方法减轻飞行器重量,这对于飞行器减重减小体积有着重要的贡献。(The invention provides a graphene film sensor and a preparation method and equipment thereof, wherein the sensor is characterized in that a substrate, a flexible circuit board, a carbon nanotube film and a heat-conducting insulating ceramic wafer are integrally packaged by pressure from bottom to top, so that the mode of a traditional sensor and a mechanical structure separation type design is changed, and the occupied volume is smaller; the sensor adopts the carbon nanotube film with high sensitivity as a sensitive material of the sensor, the flexible circuit board as a lead mode, and the heat-conducting insulating ceramic as a packaging material, so that the sensitivity of the sensor is higher than that of a common temperature sensor. In addition, most of the sensors are integrated and designed on the surface layer of the structural member, so that the weight of the aircraft can be reduced without additionally arranging special sensors, the size of the aircraft can be reduced, the weight of the aircraft can be reduced by methods such as structural intelligent strength design and the like, and the method has important contribution to the weight reduction and the volume reduction of the aircraft.)

1. The utility model provides a graphite alkene film sensor which from the bottom up includes in proper order: the heat-conducting insulating ceramic plate comprises a substrate, a flexible circuit board, a carbon nanotube film and a heat-conducting insulating ceramic plate; integrally packaging the substrate, the flexible circuit board, the carbon nanotube film and the heat-conducting insulating ceramic sheet by adopting pressure; the flexible circuit board is connected with the carbon nanotube film through a preset pole and is used for collecting the resistance value of the carbon nanotube film.

2. The sensor of claim 1, wherein the carbon nanotube film has a thickness of between 15 μ ι η -25 μ ι η.

3. The sensor according to claim 1, characterized in that it comprises at least two poles for the flexible circuit board to be in contact with the carbon nanotube film, the non-contact positions being provided with an equal number of wiring holes; the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the wiring hole is used for leading out a connecting wire and is connected with external equipment.

4. The sensor according to claim 1, wherein the thermal conductivity of the thermally conductive insulating ceramic sheet is between 160 and 180W/(m-K); the thickness of the film is ensured to be between 0.18mm and 0.2 mm.

5. The sensor of claim 1, wherein the pressure applied during packaging is between 5 and 10N.

6. The sensor of claim 1, wherein the substrate is a structural surface or a thermally conductive and insulating ceramic.

7. An apparatus, characterized in that it comprises a sensor according to any of the preceding claims 1-6.

8. A method for preparing a graphene thin film sensor, wherein the method is used for preparing the sensor of any one of claims 1 to 6, and comprises the following steps:

preparing a carbon nanotube film by adopting a spray suction filtration method, and cutting the carbon nanotube film into a preset size;

connecting two ends of the carbon nanotube film with poles of the flexible circuit board in a contact manner;

and pressing the carbon nanotube film and the flexible circuit board on a substrate by using a heat-conducting insulating ceramic sheet at a certain pressure, and packaging by using an adhesive.

9. The method according to claim 8, wherein at least two poles are provided for connecting the flexible circuit board and the carbon nanotube film, and the non-contact positions are provided with an equal number of wiring holes; the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the wiring hole is used for leading out a connecting wire and is connected with external equipment.

10. The method of claim 8, wherein the carbon nanotube film has a thickness of between 15 μm and 25 μm; the heat conductivity coefficient of the heat-conducting insulating ceramic sheet is 160-180W/(m-K); the thickness of the material is ensured to be between 0.18mm and 0.2 mm; and the pressure adopted during packaging is between 5 and 10N.

Technical Field

The invention relates to the technical field of sensors, in particular to a graphene film sensor and a preparation method and equipment thereof.

Background

In recent years, with higher requirements on speed, maneuverability and the like of aerospace vehicles, the aerospace vehicles are required to reduce weight and volume while sensing external physical field changes with high precision. This presents a new challenge to the design of modern aircraft structures and sensors, where the conventional mechanical structures and sensors are designed independently, and are generally designed and assembled together, and the separated structure cannot meet the requirements of light weight and miniaturization.

Disclosure of Invention

In order to solve the problem that the lightweight and miniaturization requirements in the aerospace field cannot be met due to the separated design of a sensor and a mechanical structure in the prior art, the embodiment of the invention provides a graphene film sensor integrally packaged by pressure. The sensor adopts the carbon nanotube film with high sensitivity as the sensitive material of the sensor, the flexible circuit board as the lead mode, and the heat-conducting insulating ceramic as the packaging material, so that the sensor has higher sensitivity and smaller occupied volume compared with a common temperature sensor. Most of the sensors are integrated and designed on the surface layer of the structural member, so that the weight of the aircraft can be reduced by methods such as no additional special sensor, volume reduction, structural intelligent strength design and the like, and the weight of the aircraft can be reduced, which makes an important contribution to the weight reduction and volume reduction of the aircraft. The specific technical scheme is as follows:

in a first aspect, an embodiment of the present invention provides a graphene film sensor, which sequentially includes, from bottom to top: the heat-conducting insulating ceramic plate comprises a substrate, a flexible circuit board, a carbon nanotube film and a heat-conducting insulating ceramic plate; integrally packaging the substrate, the flexible circuit board, the carbon nanotube film and the heat-conducting insulating ceramic sheet by adopting pressure; the flexible circuit board is connected with the carbon nanotube film through a preset pole and is used for collecting the resistance value of the carbon nanotube film.

Further, the thickness of the carbon nano tube film is between 15 and 25 mu m.

Furthermore, at least two poles are included for connecting the flexible circuit board and the carbon nanotube film, and the non-contact positions are provided with equal number of wiring holes; the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the wiring hole is used for leading out a connecting wire and is connected with external equipment.

Further, the heat conduction coefficient of the heat conduction insulating ceramic sheet is 160-180W/(m-K); the thickness of the film is ensured to be between 0.18mm and 0.2 mm.

Further, the pressure adopted during packaging is between 5 and 10N.

Further, the substrate is a structural member surface or heat conduction insulating ceramic.

Further, an integrated element of a plurality of sensors is disposed on the substrate.

A second aspect of the invention provides an apparatus comprising a sensor as described in any of the above.

A third aspect of the present invention provides a method for preparing a graphene thin film sensor, the method being used for preparing any one of the above sensors, and the method including the steps of:

preparing a carbon nanotube film by adopting a spray suction filtration method, and cutting the carbon nanotube film into a preset size;

connecting two ends of the carbon nanotube film with poles of the flexible circuit board in a contact manner;

and pressing the carbon nanotube film and the flexible circuit board on a substrate by using a heat-conducting insulating ceramic sheet at a certain pressure, and packaging by using an adhesive.

Furthermore, at least two poles are included for connecting the flexible circuit board and the carbon nanotube film, and the non-contact positions are provided with the equal number of wiring holes; the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the wiring hole is used for leading out a connecting wire and is connected with external equipment.

Further, the thickness of the carbon nano tube film is between 15 and 25 mu m; the heat conductivity coefficient of the heat-conducting insulating ceramic sheet is 160-180W/(m-K); the thickness of the material is ensured to be between 0.18mm and 0.2 mm; and the pressure adopted during packaging is between 5 and 10N.

Further, an integrated element of a plurality of sensors is disposed on the substrate.

(3) Advantageous effects

In conclusion, the substrate, the flexible circuit board, the carbon nanotube film and the heat-conducting insulating ceramic sheet are integrally packaged by pressure from bottom to top, so that the mode of a traditional sensor and a mechanical structure separated design is changed, and the occupied size is smaller; the sensor adopts the carbon nanotube film with high sensitivity as a sensitive material of the sensor, the flexible circuit board as a lead mode, and the heat-conducting insulating ceramic as a packaging material, so that the sensitivity of the sensor is higher than that of a common temperature sensor. In addition, most of the sensors are integrated and designed on the surface layer of the structural member, so that the weight of the aircraft can be reduced without additionally arranging special sensors, the size of the aircraft can be reduced, the weight of the aircraft can be reduced by methods such as structural intelligent strength design and the like, and the method has important contribution to the weight reduction and the volume reduction of the aircraft.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a graphene thin film sensor according to an embodiment of the present invention.

In the figure:

1-heat conducting insulating ceramic chip; 2-carbon nanotube film; 3-a flexible circuit board; 4-a substrate; 5-pole; 6-wiring hole.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention and are not intended to limit the scope of the invention, i.e., the invention is not limited to the embodiments described, but covers any modifications, alterations, and improvements in the parts, components, and connections without departing from the spirit of the invention.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Fig. 1 is a schematic general structural diagram of a graphene thin film sensor according to an embodiment of the present invention, and as shown in fig. 1, the sensor sequentially includes, from bottom to top: the device comprises a substrate (4), a flexible circuit board (3), a carbon nanotube film (2) and a heat-conducting insulating ceramic sheet (1); the substrate (4), the flexible circuit board (3), the carbon nanotube film (2) and the heat-conducting insulating ceramic sheet (1) are integrally packaged by adopting pressure; the flexible circuit board (3) is connected with the carbon nano tube film through a preset pole (5) and is used for collecting the resistance value of the carbon nano tube film.

In an embodiment of the invention, the other integrated components of the sensor are arranged on the surface of the structure. The carbon nanotube film (2) is a sensor sensitive part, the flexible circuit board (3) is a signal acquisition part, the number of the poles (5) is at least two, the poles are used for acquiring the resistance value of the carbon nanotube film (2), and the substrate (4) is a structural part surface or heat-conducting insulating ceramic. And the non-contact positions are provided with wiring holes with the number equal to that of the poles (5), and the wiring holes are used for leading out connecting wires and connecting the connecting wires with external equipment.

According to the invention, the substrate, the flexible circuit board, the carbon nanotube film and the heat-conducting insulating ceramic sheet are integrally packaged by pressure, so that the mode of a traditional sensor and a mechanical structure separated design is changed, and the occupied volume is smaller; the sensor adopts the carbon nanotube film with high sensitivity as a sensitive material of the sensor, the flexible circuit board as a lead mode, and the heat-conducting insulating ceramic as a packaging material, so that the sensitivity of the sensor is higher than that of a common temperature sensor. In addition, most of the sensors are integrated and designed on the surface layer of the structural member, so that the weight of the aircraft can be reduced without additionally arranging special sensors, the size of the aircraft can be reduced, the weight of the aircraft can be reduced by methods such as structural intelligent strength design and the like, and the method has important contribution to the weight reduction and the volume reduction of the aircraft.

In an alternative embodiment of the present invention, the carbon nanotube film has a thickness of 15 μm to 25 μm. Preferably, the thickness is selected to be 20 μm.

As a preferred embodiment, the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the heat conductivity coefficient of the heat-conducting insulating ceramic sheet is 160-180W/(m-K); the thickness of the material is ensured to be between 0.18mm and 0.2 mm; and the pressure adopted during packaging is between 5 and 10N.

Specifically, it is preferable that the flexible circuit board is set to have a thickness of 0.15mm, the heat conductivity of the heat conductive insulating ceramic sheet is set to 170W/(m-K), the thickness of the heat conductive insulating ceramic sheet is set to 0.19mm, and the pressure is set to 8N.

A second aspect of the invention provides apparatus comprising a sensor as described in any one of the above.

A third aspect of the present invention provides a method for preparing a graphene thin film sensor, the method being used for preparing any one of the above sensors or devices, and the method comprising the steps of:

preparing a carbon nanotube film by adopting a spray suction filtration method, and cutting the carbon nanotube film into a preset size;

connecting two ends of the carbon nanotube film with poles of the flexible circuit board in a contact manner;

and pressing the carbon nanotube film and the flexible circuit board on a substrate by using a heat-conducting insulating ceramic sheet at a certain pressure, and packaging by using an adhesive.

In an optional embodiment of the invention, at least two poles are included for connecting the flexible circuit board and the carbon nanotube film, and the non-contact positions are provided with an equal number of wiring holes; the thickness of the flexible circuit board is between 0.1mm and 0.2 mm; the wiring hole is used for leading out a connecting wire and is connected with external equipment.

In an alternative embodiment of the invention, the carbon nanotube film has a thickness of between 15 μm and 25 μm; the heat conductivity coefficient of the heat-conducting insulating ceramic sheet is 160-180W/(m-K); the thickness of the material is ensured to be between 0.18mm and 0.2 mm; and the pressure adopted during packaging is between 5 and 10N.

The above description is only an example of the present application and is not limited to the present application. Various modifications and alterations to this application will become apparent to those skilled in the art without departing from the scope of this invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.