阅读说明：本技术 一种环状结构温度传感器 (Annular structure temperature sensor ) 是由 李维平 兰之康 于 2021-02-03 设计创作，主要内容包括：本发明公开一种环状结构温度传感器,包括：基板；外部环状电学通路,设置在所述基板上；多个电阻,串接在所述外部环状电学通路中；温度敏感环,设置在所述外部环状电学通路内侧；多个金属叉指,通过绝缘连接桥连接于所述温度敏感环的外侧；固定锚点,设置在所述外部环状电学通路的环心位置；多个回形梁,连接于所述温度敏感环的内侧以及所述固定锚点；其中,所述多个金属叉指与所述多个电阻相匹配,且所述多个金属叉指距离所述多个电阻的间距不同。本发明通过外部环状电学通路将不同数量的电阻/叉指闭合接触转化为压焊锚点之间电阻值变化实现温度的测量。具有设计灵活、结构简单、分辨率和量程可调、数字式输出、体积小、工艺兼容等优势。(The invention discloses a temperature sensor with an annular structure, which comprises: a substrate; an outer annular electrical via disposed on the substrate; a plurality of resistors connected in series in the outer annular electrical pathway; a temperature sensitive ring disposed inside the outer annular electrical pathway; the plurality of metal interdigital fingers are connected to the outer side of the temperature sensitive ring through an insulating connecting bridge; the fixed anchor point is arranged at the ring center position of the external annular electrical path; a plurality of loop beams connected to the inner side of the temperature sensitive ring and the anchor points; the metal fingers are matched with the resistors, and the distances between the metal fingers and the resistors are different. The invention converts different numbers of resistors/interdigital closed contacts into resistance value change between pressure welding anchor points through the external annular electrical path to realize temperature measurement. The device has the advantages of flexible design, simple structure, adjustable resolution and range, digital output, small volume, compatible process and the like.)

1. A ring structure temperature sensor, the temperature sensor comprising:

a substrate;

an outer annular electrical via disposed on the substrate;

a plurality of resistors connected in series in the outer annular electrical pathway;

a temperature sensitive ring disposed inside the outer annular electrical pathway;

the plurality of metal interdigital are connected to the outer side of the temperature sensitive ring through an insulating connecting bridge;

the fixed anchor point is arranged at the ring center position of the external ring-shaped electrical path;

a plurality of looped beams connected to an inner side of the temperature sensitive ring and the anchor points; wherein the content of the first and second substances,

the metal fingers are matched with the resistors, and the distances between the metal fingers and the resistors are different.

2. The loop structure temperature sensor of claim 1, further comprising at least two bonding anchors disposed on either side of the outer loop electrical path, the bonding anchors being electrically connected to any two of the plurality of resistors.

3. The ring structure temperature sensor of claim 2, wherein the bonding anchors are symmetrically distributed on both sides of the outer ring electrical path in a diameter direction.

4. A toroidal structure temperature sensor according to claim 3, wherein a plurality of resistors connected in series in said outer annular electrical path are symmetrically distributed about said diametrical direction.

5. The annular structure temperature sensor of claim 1, wherein the plurality of resistors are connected in series in the outer annular electrical path at equal intervals.

6. The annular structure temperature sensor of claim 1, wherein the metal fingers are in one-to-one correspondence with the resistors.

7. The loop structure temperature sensor according to claim 1, wherein the temperature sensitive loop is attached to the loop beam in suspension.

8. The annular ring structure temperature sensor of claim 1, wherein the loop beams are distributed along a diameter of the outer annular electrical pathway.

9. The annular structure temperature sensor of claim 1, wherein the number of said resistor/interdigital pairs or the length of said insulating connecting bridge is adjustable.

10. A temperature sensor according to claim 2 or 9, wherein the bridges of insulating material on the same diameter are of equal length.

Technical Field

The invention belongs to the technical field of microelectronic devices, and particularly relates to a temperature sensor with an annular structure.

Background

Temperature is a very important physical quantity that needs to be measured and controlled frequently in daily production and life. Therefore, the temperature sensor is a sensor which is extremely widely used. At present, the working principle of most temperature sensors is to convert external temperature signals into analog electronic signals, the traditional temperature sensing principle comprises a resistance type, a PN junction type, a thermoelectric type, a radiation type, an optical fiber type, an ultrasonic type, a surface acoustic wave type, a frequency type and the like, but the sensitivity and the range of the temperature sensor with a similar structure are relatively fixed for the same sensing principle and sensitive materials, so that the design scheme of the device cannot be flexibly changed according to the test requirement.

In recent years, several temperature sensor structures based on the MEMS technology are proposed at home and abroad, which realize temperature measurement through the MEMS structure, including cantilever piezoresistive temperature sensors, dual-resonator digital temperature sensors, and cantilever capacitive temperature sensors, which realize the advantages of miniaturization, high sensitivity, high consistency, low power consumption, low cost, etc. of the structure through the MEMS technology, and have a wide application prospect.

Disclosure of Invention

Aiming at the application prospect, the invention provides the annular structure temperature sensor, the temperature sensor converts the mechanical deformation generated by temperature change into the electrical change of the external annular electrical path by utilizing the combination of the internal suspended temperature sensitive ring and the metal interdigital, and different temperature nodes correspond to different resistance values of the external annular electrical path. When the temperature of the external environment rises, the temperature rise is converted into the expansion of the ring diameter through the internal suspended temperature sensitive ring connected with the anchor point by the loop beam, so that the distance between the metal interdigital and the corresponding resistor is changed, the distance change of different degrees between the metal interdigital and the corresponding resistor caused by different temperature nodes is converted into the resistance/interdigital closed contact of different numbers through the external electrical connection path, and then the resistance/interdigital closed contact of different numbers is converted into the resistance change between the pressure welding anchor points through the external annular electrical path, so that the measurement of the temperature of the surrounding environment is realized. By adopting the structure, the number of resistor/interdigital combinations can be added or reduced according to the measurement requirement, the digital output temperature sensor with adjustable resolution and measuring range is obtained, the structure has the characteristics of flexible design, simple structure and the like, the traditional MEMS process can be integrated into the manufacturing process, the problems in various aspects such as material, process, reliability, repeatability, production cost and the like are solved, and support and guarantee are provided for realizing the industrial application of the annular structure temperature sensor in an integrated circuit and the Internet of things.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a ring structure temperature sensor, the temperature sensor comprising:

a substrate;

an outer annular electrical via disposed on the substrate;

a plurality of resistors connected in series in the outer annular electrical pathway;

a temperature sensitive ring disposed inside the outer annular electrical pathway;

the plurality of metal interdigital are connected to the outer side of the temperature sensitive ring through an insulating connecting bridge;

the fixed anchor point is arranged at the ring center position of the external ring-shaped electrical path;

a plurality of looped beams connected to an inner side of the temperature sensitive ring and the anchor points; wherein the content of the first and second substances,

the metal fingers are matched with the resistors, and the distances between the metal fingers and the resistors are different.

Optionally, the resistor further comprises at least two bonding anchors, the bonding anchors are disposed on two sides of the external annular electrical path, and the bonding anchors are electrically connected to any two of the plurality of resistors.

Optionally, the bonding anchors are symmetrically distributed on two sides of the outer annular electrical path in the diameter direction.

Optionally, a plurality of resistors connected in series in the outer annular electrical pathway are symmetrically distributed about the diametrical direction.

Optionally, the plurality of resistors are connected in series in the outer annular electrical path at equal distances.

Optionally, the metal fingers correspond to the resistors one to one.

Optionally, the temperature sensitive ring is attached to the return beam in suspension.

Optionally, the loop beams are distributed along a diameter of the outer annular electrical pathway.

Optionally, the number of resistor/finger pairs or the length of the insulating connecting bridge is adjustable.

Optionally, the insulating connecting bridges on the same diameter are of equal length.

According to the annular structure temperature sensor, deformation of the internal suspended temperature sensitive ring to external temperature is converted into change of distance between the resistor and the interdigital through a design mode of matching a plurality of groups of resistors/interdigital, node type change of the resistance value of an external annular electrical path is caused through change of the number of matched contacts of the resistor/interdigital, digital discretization output of measured temperature is achieved, the structure can achieve adjustment of resolution and measuring range of a device through adding the number of the resistors/interdigital and changing the length of an insulating connecting bridge according to different test requirements, and therefore design of the device is flexible. Meanwhile, the annular structure temperature sensor also has the advantages of simple structure, adjustable sensitivity and measuring range, digital output, small volume, compatible process and the like.

Drawings

Fig. 1 is a schematic structural diagram of a temperature sensor with a ring structure according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view A-A' of a ring structure temperature sensor according to an embodiment of the present invention.

Among them are: the structure comprises a substrate 1, bonding anchors 2 and 3, electrical connections 4 and 5, resistors 6, 7, 8, 9, 10, 11, 12 and 13, an outer annular electrical path 14, metal fingers 15, 16, 17, 18, 19, 20, 21 and 22, insulating connection bridges 23, 24, 25, 26, 27, 28, 29 and 30, an inner suspended temperature sensitive ring 31, bent beams 32, 33, 34 and 35 and fixing anchors 36.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.

Referring to fig. 1 and 2, the invention provides a ring-shaped structure temperature sensor, which comprises a substrate 1, bonding anchors 2 and 3, electrical connections 4 and 5, resistors 6, 7, 8, 9, 10, 11, 12 and 13, an outer ring-shaped electrical path 14, metal fingers 15, 16, 17, 18, 19, 20, 21 and 22, insulating connecting bridges 23, 24, 25, 26, 27, 28, 29 and 30, an inner suspended temperature sensitive ring 31, bent beams 32, 33, 34 and 35 and anchors 36. The bonding anchor points 2 and 3 are located on the surface of the substrate 1, the electrical connections 4 and 5 are respectively connected with the bonding anchor points 2 and 3, the external annular electrical path 14 is connected with the electrical connections 4 and 5, and the resistors 6, 7, 8, 9, 10, 11, 12 and 13 are distributed in the external annular electrical path 14. The metal fingers 15, 16, 17, 18, 19, 20, 21, 22 are located inside the outer annular electrical path 14 and correspond to the resistors 6, 7, 8, 9, 10, 11, 12, 13 one by one, and the metal fingers 15, 16, 17, 18, 19, 20, 21, 22 are connected to respective insulating connecting bridges 23, 24, 25, 26, 27, 28, 29, 30 of different lengths, wherein the insulating connecting bridges located on the same diameter have the same length, i.e., the insulating connecting bridges 23 and 27 have the same length, the insulating connecting bridges 24 and 28 have the same length, the insulating connecting bridges 25 and 29 have the same length, the insulating connecting bridges 26 and 30 have the same length, the insulating connecting bridges 23, 24, 25, 26, 27, 28, 29, 30 are connected to an inner suspended temperature sensitive ring 31, and the inner suspended temperature sensitive ring 31 is connected to a fixed anchor point 36 through return beams 32, 33, 34, 35. The anchor points 36 may be disposed at suitable locations within the ring of the outer annular electrical pathway 14, such as at the center of the ring of the outer annular electrical pathway 14.

Alternatively, the resistors 6, 7, 8, 9, 10, 11, 12, 13 are equally spaced in the outer annular electrical via 14.

The use method of the temperature sensor comprises the following steps: when the external environment temperature changes, the inner suspension temperature sensitive ring 31 connected with the anchor point 36 through the loop beams 32, 33, 34 and 35 induces the temperature rise to generate thermal expansion, and further to the expansion of the diameter of the temperature sensitive ring 31, thereby changing the distance between the metal fingers 15, 16, 17, 18, 19, 20, 21, 22 and the corresponding resistors 6, 7, 8, 9, 10, 11, 12, 13, the outer annular electrical path 14 converts the distance change between the metal fingers 15, 16, 17, 18, 19, 20, 21, 22 and the corresponding resistors 6, 7, 8, 9, 10, 11, 12, 13 caused by different temperature nodes into different numbers of resistor/finger closed contacts, and then converts the different numbers of resistor/finger closed contacts into the resistance change between the pressure welding anchors 2, 3 through the outer annular electrical path 14 to realize the temperature measurement.

The temperature sensor is simple in structure, the precision of the structural size of the whole sensor can reach a higher level through a microelectronic processing technology, the size is greatly reduced, and the miniaturization of the sensor is facilitated; the structure can realize the adjustment of resolution and measuring range by increasing and decreasing the number of resistors/interdigital and changing the length of the insulated connecting bridge according to different test requirements, and the design is very flexible.

The annular structure temperature sensor is different from other MEMS temperature sensors, and has the following main characteristics: the temperature sensor can adjust the resolution and the measuring range by increasing or decreasing the number of resistors/interdigital and changing the length of the insulated connecting bridge according to different test requirements, and the design is very flexible; the temperature sensor adopts digital discretization output, different resistor/interdigital combinations correspond to different temperature nodes, once the resistor and the interdigital are closed, the resistance of an external annular electrical path is changed in a digital mode, and the temperature sensor has the advantages of high measurement precision and strong anti-interference capability; the temperature sensor has the advantages of simple structure, small volume and simple and reliable detection mechanism, and can meet the application requirements of high reliability, miniaturization and low power consumption; and fourthly, the temperature sensor is manufactured without special materials and is compatible with the traditional MEMS manufacturing technology.

The criteria for distinguishing whether this structure is present are as follows:

(a) the temperature rise is converted into the enlargement of the ring diameter by adopting an internal suspended temperature sensitive ring connected with the loop beam and the anchor point, thereby changing the distance between the metal interdigital and the corresponding resistor,

(b) the design of resistance/interdigital closed contact is adopted, the distance change between the metal interdigital and the corresponding resistance caused by different temperature nodes is converted into the resistance/interdigital closed contact with different quantity, and then the resistance/interdigital closed contact with different quantity is converted into the resistance value change of the self through the external annular electrical path.

A structure satisfying the above two conditions should be regarded as a temperature sensor of the structure.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiment, but equivalent modifications or changes made by those skilled in the art according to the present disclosure should be included in the scope of the present invention as set forth in the appended claims.