阅读说明：本技术 一种半导体功率模块3d封装构造 (3D packaging structure of semiconductor power module ) 是由 郑裕玲 周琦 王亚宁 于 2020-12-02 设计创作，主要内容包括：本发明涉及半导体封装技术领域,且公开了一种半导体功率模块3D封装构造,包括支撑座、纵向电极座、横向电极座、电极、上绝缘层、下绝缘层和芯片组件,所述纵向电极座和横向电极座呈矩形分布设置于所述支撑座的上方,所述上绝缘层和下绝缘层卡接设置于所述纵向电极座和横向电极座之间,所述芯片组件设置于所述上绝缘层和下绝缘层之间,所述芯片组件之间通过导电柱连接设置,所述电极固定设置于所述纵向电极座和横向电极座的上端,所述支撑座为中空结构,所述支撑座的内部分别设有带动所述纵向电极座和横向电极座移动的纵向移动机构和横向移动机构。本发明采用3D封装结构,不仅体积小,而且便于拆装维修。(The invention relates to the technical field of semiconductor packaging, and discloses a 3D packaging structure of a semiconductor power module, which comprises a supporting seat, a longitudinal electrode seat, a transverse electrode seat, electrodes, an upper insulating layer, a lower insulating layer and a chip assembly, wherein the longitudinal electrode seat and the transverse electrode seat are arranged above the supporting seat in a rectangular distribution manner, the upper insulating layer and the lower insulating layer are clamped between the longitudinal electrode seat and the transverse electrode seat, the chip assembly is arranged between the upper insulating layer and the lower insulating layer, the chip assemblies are connected through a conductive column, the electrodes are fixedly arranged at the upper ends of the longitudinal electrode seat and the transverse electrode seat, the supporting seat is of a hollow structure, and a longitudinal moving mechanism and a transverse moving mechanism which drive the longitudinal electrode seat and the transverse electrode seat to move are respectively arranged in the supporting seat. The invention adopts a 3D packaging structure, not only has small volume, but also is convenient to disassemble, assemble and maintain.)

1. A3D packaging structure of a semiconductor power module comprises a supporting seat (1), a longitudinal electrode seat (2), a transverse electrode seat (3), electrodes (4), an upper insulating layer (5), a lower insulating layer (6) and a chip component (7), and is characterized in that the longitudinal electrode seat (2) and the transverse electrode seat (3) are distributed in a rectangular shape and are arranged above the supporting seat (1), the upper insulating layer (5) and the lower insulating layer (6) are clamped and arranged between the longitudinal electrode seat (2) and the transverse electrode seat (3), the chip component (7) is arranged between the upper insulating layer (5) and the lower insulating layer (6), the chip component (7) is connected and arranged through a conductive column (8), the electrodes (4) are fixedly arranged at the upper ends of the longitudinal electrode seat (2) and the transverse electrode seat (3), and the supporting seat (1) is of a hollow structure, the inside of the supporting seat (1) is respectively provided with a longitudinal moving mechanism and a transverse moving mechanism which drive the longitudinal electrode seat (2) and the transverse electrode seat (3) to move.

2. The 3D package structure of the semiconductor power module according to claim 1, wherein the longitudinal moving mechanism comprises a first screw rod (9), a first moving block (10) and a first connecting rod (11), the first screw rod (9) is longitudinally located inside the supporting base (1), two ends of the first screw rod (9) are respectively and rotatably connected with the front inner side wall and the rear inner side wall of the supporting base (1) through first rolling bearings, the first moving block (10) is symmetrically and spirally arranged on the rod wall of the first screw rod (9), the first connecting rod (11) is respectively and fixedly arranged on the upper side of the first moving block (10), an opening is arranged on the upper surface of the supporting base (1), the upper end of the first connecting rod (11) extends to the outside of the supporting base (1) and is fixedly connected with the longitudinal electrode base (2), one end of the first screw rod (9) penetrates through the outside of the supporting seat (1) and is fixedly provided with a first rocking handle (18).

3. The 3D package structure of a semiconductor power module according to claim 1, the transverse moving mechanism comprises a second screw rod (12), a second moving block (13) and a second connecting rod (14), the second screw rod (12) is transversely positioned on the supporting seat (1), and both ends of the second screw rod (12) are respectively and rotationally connected with the left and right inner side walls of the supporting seat (1) through second rolling bearings, the second moving block (13) is symmetrically and spirally arranged on the rod wall of the second screw rod (12), the second connecting rods (14) are respectively fixedly arranged at the upper side of the second moving block (13), the upper end of the second connecting rod (14) extends to the outside of the supporting seat (1) and is fixedly connected with the transverse electrode seat (3), one end of the second screw rod (12) penetrates through the outside of the supporting seat (1) and is fixedly provided with a second rocking handle (15).

4. The 3D packaging structure of the semiconductor power module according to claim 1, wherein the side walls of the longitudinal electrode holder (2) and the transverse electrode holder (3) are provided with slots (16), and the upper insulating layer (5), the lower insulating layer (6) and the chip assembly (7) are inserted into the slots (16).

5. The 3D packaging structure of the semiconductor power module according to claim 1, wherein the conductive posts (8) are fixedly arranged at the lower sides of the upper insulating layer (5) and the chip assembly (7), and sliding grooves (17) for inserting the conductive posts (8) are formed at the upper sides of the lower insulating layer (6) and the chip assembly (7).

6. A semiconductor power module 3D package configuration according to claim 1, characterized in that the dimensions of the upper insulating layer (5), the lower insulating layer (6) and the chip assembly (7) are the same.

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a 3D packaging structure of a semiconductor power module.

Background

The power module is formed by combining and encapsulating power electronic devices into a module according to a certain function, the existing power module is mainly in a plane layout, the chip fixing mode is a welding type or a compression joint type, and the welding type (chip) module has limited number of chips connected in series and in parallel in the structure due to the reliability problem of bonding wires and welding fluxes; and a plurality of chips of series-parallel connection can be simultaneously established ties in the crimping formula module, but because its planar layout's scheme causes the volume great, simultaneously, when its inside chip takes place to become invalid, be not convenient for dismouting replacement restoration. Therefore, the invention provides a 3D packaging structure of a semiconductor power module.

Disclosure of Invention

The invention aims to solve the problems that a power module in the prior art is mainly in a planar layout, is large in size and is inconvenient to disassemble, assemble and maintain, and provides a 3D packaging structure of a semiconductor power module.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a semiconductor power module 3D packaging structure, includes supporting seat, vertical electrode holder, horizontal electrode holder, electrode, goes up the insulating layer, insulating layer and chip subassembly down, vertical electrode holder and horizontal electrode holder be the rectangle distribution set up in the top of supporting seat, go up insulating layer and lower insulating layer joint set up in between vertical electrode holder and the horizontal electrode holder, the chip subassembly set up in go up between insulating layer and the lower insulating layer, connect the setting through leading electrical pillar between the chip subassembly, the electrode is fixed set up in the upper end of vertical electrode holder and horizontal electrode holder, the supporting seat is hollow structure, the inside of supporting seat is equipped with the drive respectively vertical movement mechanism and the lateral shifting mechanism that vertical electrode holder and horizontal electrode holder removed.

Preferably, the longitudinal movement mechanism includes a first screw rod, a first moving block and a first connecting rod, the first screw rod is longitudinally located inside the supporting seat, two ends of the first screw rod are respectively rotatably connected with the front inner side wall and the rear inner side wall of the supporting seat through first rolling bearings, the first moving block is symmetrically arranged on the rod wall of the first screw rod in a threaded manner, the first connecting rod is respectively and fixedly arranged on the upper side of the first moving block, an opening is formed in the upper surface of the supporting seat, the upper end of the first connecting rod extends to the outside of the supporting seat and is fixedly connected with the longitudinal electrode base, and one end of the first screw rod penetrates through the outside of the supporting seat and is fixedly provided with a first rocking handle.

Preferably, the transverse moving mechanism includes a second screw rod, a second moving block and a second connecting rod, the second screw rod is transversely located on the supporting seat, two ends of the second screw rod are respectively rotatably connected with the left inner side wall and the right inner side wall of the supporting seat through second rolling bearings, the second moving block is symmetrically and spirally arranged on the rod wall of the second screw rod, the second connecting rod is respectively and fixedly arranged on the upper side of the second moving block, the upper end of the second connecting rod extends to the outside of the supporting seat and is fixedly connected with the transverse electrode holder, and one end of the second screw rod penetrates through the outside of the supporting seat and is fixedly provided with a second rocking handle.

Preferably, slots are formed in the side walls of the longitudinal electrode holder and the transverse electrode holder, and the upper insulating layer, the lower insulating layer and the chip assembly are inserted into the slots.

Preferably, it sets up in to lead fixed the setting of electrical pillar the downside of going up insulating layer and chip subassembly, the upside of insulating layer and chip subassembly all is seted up down and is used for lead electrical pillar male spout.

Preferably, the upper insulating layer, the lower insulating layer and the chip assembly have the same size.

Compared with the prior art, the invention provides a 3D packaging structure of a semiconductor power module, which has the following beneficial effects:

1. this semiconductor power module 3D packaging structure, supporting seat, electrode holder, horizontal electrode holder, electrode, last insulating layer, lower insulating layer, chip subassembly and the electrical pillar that has through being equipped with have realized power module 3D encapsulation, and the volume is less.

2. This semiconductor power module 3D packaging structure is convenient for remove two vertical electrode holders and two horizontal electrode holders through first screw rod, first movable block, head rod, first rocking handle, second screw rod, second movable block, second connecting rod and the second rocking handle that is equipped with to be convenient for with the dismouting maintenance of the chip subassembly between upper insulation layer and the lower insulation layer.

The parts which are not involved in the device are the same as or can be realized by adopting the prior art, and the device adopts a 3D packaging structure, so that the volume is small, and the disassembly, the assembly and the maintenance are convenient.

Drawings

Fig. 1 is a schematic structural diagram of a 3D package structure of a semiconductor power module according to the present invention;

fig. 2 is an overall view of a 3D package structure of a semiconductor power module according to the present invention.

In the figure: the electrode comprises a support base 1, a longitudinal electrode base 2, a transverse electrode base 3, an electrode 4, an upper insulating layer 5, a lower insulating layer 6, a chip assembly 7, a conductive column 8, a first screw 9, a first moving block 10, a first connecting rod 11, a second screw 12, a second moving block 13, a second connecting rod 14, a second rocking handle 15, a slot 16, a sliding chute 17 and a first rocking handle 18.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-2, a 3D package structure of a semiconductor power module comprises a support base 1, a longitudinal electrode base 2, a transverse electrode base 3, and electrodes 4, go up insulating layer 5, lower insulating layer 6 and chip subassembly 7, vertical electrode holder 2 and horizontal electrode holder 3 are the rectangle and distribute and set up in supporting seat 1's top, go up insulating layer 5 and lower insulating layer 6 joint and set up between vertical electrode holder 2 and horizontal electrode holder 3, go up insulating layer 5, lower insulating layer 6 is the same with chip subassembly 7's size, chip subassembly 7 sets up between last insulating layer 5 and lower insulating layer 6, connect the setting through leading electrical pillar 8 between the chip subassembly 7, electrode 4 is fixed to be set up in the upper end of vertical electrode holder 2 and horizontal electrode holder 3, supporting seat 1 is hollow structure, supporting seat 1's inside is equipped with vertical moving mechanism and the transverse movement mechanism that drives vertical electrode holder 2 and the removal of horizontal electrode holder 3 respectively.

The longitudinal movement mechanism comprises a first screw rod 9, a first moving block 10 and a first connecting rod 11, the first screw rod 9 is located inside the supporting seat 1 in the longitudinal direction, two ends of the first screw rod 9 are respectively and rotationally connected with the front inner side wall and the rear inner side wall of the supporting seat 1 through first rolling bearings, the first moving block 10 is arranged on the rod wall of the first screw rod 9 in a symmetrical threaded mode, the first connecting rod 11 is respectively and fixedly arranged on the upper side of the first moving block 10, an opening is formed in the upper surface of the supporting seat 1, the upper end of the first connecting rod 11 extends to the outside of the supporting seat 1 and is fixedly connected with the longitudinal electrode seat 2, and a first rocking handle 18 is fixedly arranged at one end of the first screw rod 9 and penetrates through the outside of.

The transverse moving mechanism comprises a second screw 12, a second moving block 13 and a second connecting rod 14, the second screw 12 is transversely located on the supporting seat 1, two ends of the second screw 12 are respectively and rotatably connected with the left inner side wall and the right inner side wall of the supporting seat 1 through second rolling bearings, the second moving block 13 is symmetrically arranged on the rod wall of the second screw 12 in a threaded mode, the second connecting rod 14 is respectively and fixedly arranged on the upper side of the second moving block 13, the upper end of the second connecting rod 14 extends to the outside of the supporting seat 1 and is fixedly connected with the transverse electrode holder 3, and one end of the second screw 12 penetrates through the outside of the supporting seat 1 and is fixedly provided with a second rocking handle 15.

The slots 16 are formed in the side walls of the longitudinal electrode holder 2 and the transverse electrode holder 3, and the upper insulating layer 5, the lower insulating layer 6 and the chip assembly 7 are inserted into the slots 16.

Lead fixed the setting in the downside of upper insulation layer 5 and chip subassembly 7 of electrical pillar 8, the upside of lower insulation layer 6 and chip subassembly 7 has all been offered and is used for leading electrical pillar 8 male spout 17.

In the invention, during installation, a worker rotates the first rocking handle 18 by hand to drive the first screw rod 9 to rotate, the first screw rod 9 enables the two first moving blocks 10 to relatively approach and drives the two longitudinal electrode holders 2 to relatively approach through the first connecting rod 11, then the upper insulating layer 5, the lower insulating layer 6 and the chip component 7 are sequentially inserted between the two longitudinal electrode holders 2, and the worker rotates the second rocking handle 15 by hand to enable the second screw rod 12 to rotate and drive the two second moving blocks 13 to relatively approach, so that the two transverse electrode holders 3 relatively approach and clamp and fix the upper insulating layer 5, the lower insulating layer 6 and the chip component 7, and further 3D packaging of the upper insulating layer 5, the lower insulating layer 6 and the chip component 7 is completed, and meanwhile, the disassembly and maintenance are convenient.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.