阅读说明：本技术 包括其上布置有围绕信号布线的多个接地布线的柔性印刷电路板的电子装置 (Electronic device including flexible printed circuit board having a plurality of ground wirings arranged thereon around signal wirings ) 是由 洪银奭 方正济 于 2019-06-05 设计创作，主要内容包括：根据各种实施例的电子装置包括：电路元件；印刷电路板,该印刷电路板包括连接到电子装置的接地的第一连接焊盘、第二连接焊盘、以及布置在第一连接焊盘与第二连接焊盘之间并连接到电路元件的信号端子的第三连接焊盘；以及柔性印刷电路板(FPCB),该FPCB包括连接到印刷电路板的耦合部分和从耦合部分延伸的连接部分,其中FPCB包括：第一接地布线,该第一接地布线连接到第一连接焊盘,并且在指定方向上从耦合部分延伸到连接部分；第二接地布线,该第二接地布线连接到第二连接焊盘,并且在指定方向上从耦合部分延伸到连接部分；信号布线,该信号布线连接到第三连接焊盘并在指定方向上从耦合部分延伸到连接部分,同时被布置在第一接地布线与第二接地布线之间；以及第三接地布线,该第三接地布线沿与指定方向相反的方向布置,以便在耦合部分中连接到第一接地布线和第二接地布线,并且围绕信号布线。其他各种实施例也是可能的。(An electronic device according to various embodiments includes: a circuit element; a printed circuit board including a first connection pad connected to a ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a Flexible Printed Circuit Board (FPCB) including a coupling portion connected to the printed circuit board and a connection portion extending from the coupling portion, wherein the FPCB includes: a first ground wiring connected to the first connection pad and extending from the coupling portion to the connection portion in a designated direction; a second ground wiring connected to the second connection pad and extending from the coupling portion to the connection portion in the designated direction; a signal wiring connected to the third connection pad and extending from the coupling portion to the connection portion in the specified direction while being arranged between the first ground wiring and the second ground wiring; and a third ground wiring arranged in a direction opposite to the prescribed direction so as to be connected to the first ground wiring and the second ground wiring in the coupling portion and surrounding the signal wiring. Other various embodiments are also possible.)

1. An electronic device, the electronic device comprising:

a circuit element;

a printed circuit board including a first connection pad connected to a ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and

a Flexible Printed Circuit Board (FPCB) including a coupling portion connected to the FPCB and a connection portion extended from the coupling portion,

wherein the FPCB includes:

a first ground wiring connected to the first connection pad and extending from the coupling portion to the connection portion in a specified direction;

a second ground wiring connected to the second connection pad and extending from the coupling portion to the connection portion in the specified direction;

a signal wiring connected to the third connection pad and extending from the coupling portion to the connection portion in the specified direction while being arranged between the first ground wiring and the second ground wiring; and

a third ground wiring arranged in a direction opposite to the specified direction so as to be connected to the first ground wiring and the second ground wiring in the coupling portion and surround the signal wiring.

2. The electronic device of claim 1, wherein the printed circuit board comprises:

a first insulating layer;

a second insulating layer disposed adjacent to the first insulating layer; and

a third insulating layer disposed adjacent to the second insulating layer and

wherein the third connection pad is electrically connected to the signal wiring arranged through the second insulating layer.

3. The electronic device according to claim 2, wherein the first connection pad, the second connection pad, and the third connection pad are arranged to be exposed through the first insulating layer.

4. The electronic device of claim 2, comprising:

a first ground plane disposed in the first insulating layer; and

a second ground plane disposed in the third insulating layer,

wherein the first connection pad and the second connection pad are electrically connected to at least one of the first ground plane or the second ground plane.

5. The electronic device of claim 4, further comprising a fourth connection pad disposed proximate to the third connection pad,

wherein the fourth connection pad is electrically connected to the first ground plane.

6. The electronic device of claim 5, wherein the flexible printed circuit board comprises:

a fourth insulating layer;

a fifth insulating layer disposed adjacent to the fourth insulating layer, and wherein the fourth insulating layer is not disposed in at least a partial region corresponding to the coupling portion; and

a sixth insulating layer disposed adjacent to the fifth insulating layer and

wherein at least a portion of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring is exposed through a partial region of the fifth insulating layer.

7. The electronic device of claim 6, comprising:

a first access pad electrically connected to the first ground wiring and arranged to be exposed through a partial region of the fifth insulating layer;

a second access pad electrically connected to the second ground routing;

a third access pad electrically connected to the signal wiring; and

a fourth access pad electrically connected to the third ground routing.

8. The electronic device of claim 7, wherein the fourth access pad is disposed at a location corresponding to the fourth connection pad.

9. The electronic device of claim 8, comprising:

a third ground plane disposed in the fourth insulating layer; and

a fourth ground plane disposed in the sixth insulating layer,

wherein at least a portion of the third ground wiring is electrically connected to the fourth ground plane.

10. The electronic device of claim 4, wherein the third ground routing is electrically connected to a fourth ground plane through a conductive via.

11. The electronic device of claim 10, wherein at least one of the second ground plane or the fourth ground plane extends to and is disposed in at least a portion of the coupling portion when the printed circuit board and the flexible printed circuit board are coupled.

12. The electronic device of claim 5, wherein the flexible printed circuit board comprises:

a fourth insulating layer;

a fifth insulating layer disposed adjacent to the fourth insulating layer; and

a sixth insulating layer disposed adjacent to the fifth insulating layer,

wherein at least a portion of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring is exposed to a region corresponding to a coupling portion of the fourth insulating layer.

13. The electronic device according to claim 1, wherein the flexible printed circuit board is soldered such that at least a part of the first ground wiring, the second ground wiring, and the signal wiring of the coupling portion correspond to the first connection pad, the third connection pad, and the third connection pad of the printed circuit board.

14. The electronic device of claim 1, wherein the soldering comprises Anisotropic Conductive Film (ACF) bonding, solder ball spray bonding, hot bar bonding, or self-Aligned Solder Adhesive (ASA) bonding.

15. The electronic device of claim 1, wherein the printed circuit board includes at least one antenna electrically connected to the circuit element, and

the circuit element is configured to transmit and/or receive signals having a frequency in the range of 10GHz to 100GHz through the at least one antenna.

Technical Field

Various embodiments of the present disclosure relate to an electronic device including a flexible printed circuit board on which a plurality of ground wirings surrounding signal wirings are arranged.

Background

With the development of wireless communication technology, it is a trend that electronic devices (e.g., communication electronic devices) are commonly used in daily life, and the final content usage thereof increases in a geometric progression. With this sudden increase in content usage, network capacity is gradually reaching a limit. With the demand for low-latency data communication, high-speed wireless communication technologies such as next-generation wireless communication technologies (e.g., 5G communication) or wireless gigabit alliance (WIGIG) (e.g., 802.11AD) are being developed.

Disclosure of Invention

Technical problem

A communication device using an ultra high frequency band may include a printed circuit board. In one surface of the printed circuit board, at least one conductive member (e.g., a conductive pattern or a conductive patch) serving as an antenna radiator may be arranged, and in the other surface, a wireless communication circuit (e.g., an RF module) electrically connected to the conductive member may be mounted. For example, the electronic device may comprise electrical connection means for forwarding high frequency RF signals from the printed circuit board of the communication device to the main printed circuit board of the electronic device. In recent years, as an electrical connection member, a Flexible Printed Circuit Board (FPCB) may be used, and as an electrical connection structure of a printed circuit board of a communication device and the flexible printed circuit board, a soldering structure having relatively excellent access reliability and relatively low price may be used.

However, in the soldering structure, the coupling portions (e.g., regions where soldering is possible) of the printed circuit board and the flexible printed circuit board are arranged so that each pad is exposed for soldering. Therefore, in the coupling portion, a ground shield structure for RF signal wiring may not be applied. Therefore, in the coupling section, mismatch or unstable loss of RF loss may occur.

Various embodiments of the present disclosure may provide a communication device having a soldering structure and an electronic device including the communication device.

According to various embodiments, the present disclosure may provide a communication device having a soldering structure that improves mismatch between joining parts and is configured to provide stable RF loss in a coupling part, and an electronic device including the communication device.

Solution to the problem

According to various embodiments, an electronic device may comprise: a circuit element; a printed circuit board including a first connection pad connected to a ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a Flexible Printed Circuit Board (FPCB) including a coupling portion connected to the printed circuit board and a connection portion extending from the coupling portion. The flexible printed circuit board may include: a first ground wiring connected to the first connection pad and extending from the coupling portion to the connection portion in a specified direction; a second ground wiring connected to the second connection pad and extending from the coupling portion to the connection portion in the specified direction; a signal wiring connected to the third connection pad and extending from the coupling portion to the connection portion in the specified direction while being arranged between the first ground wiring and the second ground wiring; and a third ground wiring arranged in a direction opposite to the prescribed direction so as to be connected to the first ground wiring and the second ground wiring in the coupling portion and surround the signal wiring.

According to various embodiments, the flexible printed circuit board may include a flexible printed circuit board layer including a coupling portion connected to an external circuit board and a connection portion extending from the coupling portion. The flexible printed circuit board layer may include: a first ground wiring extending from the coupling portion to the connection portion in a specified direction; a second ground wiring extending from the coupling portion to the connection portion in the specified direction; a signal wiring extending from the coupling portion to the connection portion in the specified direction while being arranged between the first ground wiring and the second ground wiring; and a third ground wiring arranged in a direction opposite to the prescribed direction so as to be connected to the first ground wiring and the second ground wiring in the coupling portion and surround the signal wiring.

The invention has the advantages of

According to various embodiments of the present disclosure, a ground shield structure is applied even to a coupling portion between a printed circuit board and a flexible printed circuit board, thus improving mismatching and providing stable loss of RF loss, whereby reliability of a communication device can be secured.

Drawings

Fig. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Fig. 2a is a perspective view of a mobile electronic device according to various embodiments of the present disclosure.

Fig. 2b is a rear perspective view of the electronic device of fig. 2a, according to various embodiments of the present disclosure.

Fig. 2c is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

Fig. 3a is a diagram illustrating an example of an electronic device supporting 5G communication according to various embodiments of the present disclosure.

Fig. 3b is a block diagram of a communication device according to various embodiments of the present disclosure.

Fig. 4a, 4b, and 4c are perspective views of a communication device according to various embodiments of the present disclosure.

Fig. 5 is a diagram illustrating a configuration of a coupling part of a printed circuit board according to various embodiments of the present disclosure.

Fig. 6a is a diagram illustrating a configuration of a coupling part of a flexible printed circuit board according to various embodiments of the present disclosure.

Fig. 6B is a cross-sectional view looking along line B-B' of fig. 6a, according to various embodiments of the present disclosure.

Fig. 6C is a cross-sectional view looking along line C-C of fig. 6a, according to various embodiments of the present disclosure.

Fig. 6D is a cross-sectional view looking along line D-D' of fig. 6a, according to various embodiments of the present disclosure.

Fig. 7a and 7b are cross-sectional views illustrating a soldering state of a printed circuit board and a flexible printed circuit board according to various embodiments of the present disclosure.

Fig. 8 is a graph comparing loss of a ground structure with a coupling portion and loss of a ground structure without a coupling portion according to various embodiments of the present disclosure.

Fig. 9a is a cross-sectional view looking along line B-B' of fig. 6a, according to various embodiments of the present disclosure.

Fig. 9b is a cross-sectional view looking along line C-C of fig. 6a, according to various embodiments of the present disclosure.

Fig. 9c is a cross-sectional view looking along line D-D' of fig. 6a, according to various embodiments of the present disclosure.

Fig. 10a and 10b are cross-sectional views illustrating a soldering state of a printed circuit board and a flexible printed circuit board according to various embodiments of the present disclosure.

Detailed Description

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100, in accordance with various embodiments.

Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM)196, or an antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented to be embedded in the display device 160 (e.g., a display).

The processor 120 may run, for example, software (e.g., the program 140) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) and an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in conjunction with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or be adapted specifically for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. The memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and the program 140 may include, for example, an Operating System (OS)142, middleware 144, or an application 146.

The input device 150 may receive commands or data from outside of the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record and the receiver may be used for incoming calls. Depending on the embodiment, the receiver may be implemented separate from the speaker, or as part of the speaker.

Display device 160 may visually provide information to the exterior of electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to embodiments, the display device 160 may include touch circuitry adapted to detect a touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of a force caused by a touch.

The audio module 170 may convert sound into an electrical signal and vice versa. According to embodiments, the audio module 170 may obtain sound via the input device 150 or output sound via the sound output device 155 or a headset of an external electronic device (e.g., the electronic device 102) directly (e.g., wired) connected or wirelessly connected with the electronic device 101. The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more particular protocols to be used to directly (e.g., wired) or wirelessly connect the electronic device 101 with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of a Power Management Integrated Circuit (PMIC), for example.

The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) that are separate from one another. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information, such as an International Mobile Subscriber Identity (IMSI), stored in the subscriber identity module 196.

The antenna module 197 may transmit signals or power to or receive signals or power from outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may be additionally formed as part of the antenna module 197.

At least some of the above components may be interconnected and communicate signals (e.g., commands or data) communicatively between them via an inter-peripheral communication scheme (e.g., bus, General Purpose Input Output (GPIO), Serial Peripheral Interface (SPI), or Mobile Industry Processor Interface (MIPI)).

According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected with the second network 199. Each of the electronic device 102 and the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to embodiments, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to performing the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the functions or services or perform another function or another service related to the request and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may comprise, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to the embodiments of the present disclosure, the electronic devices are not limited to those described above.

It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents, or alternatives to the respective embodiments. For the description of the figures, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the relevant context clearly dictates otherwise. As used herein, each of the phrases such as "a or B," "at least one of a and B," "at least one of a or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any or all possible combinations of the items listed together with the respective one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to distinguish one element from another element simply and not to limit the elements in other respects (e.g., importance or order). It will be understood that, if an element (e.g., a first element) is referred to as being "coupled to", "connected to" or "connected to" another element (e.g., a second element), it can be directly (e.g., wiredly) connected to, wirelessly connected to, or connected to the other element via a third element, when the term "operatively" or "communicatively" is used or not.

As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, the modules may be implemented in the form of Application Specific Integrated Circuits (ASICs).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to be operable to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Where the term "non-transitory" simply means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting a transaction between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed via an application Store (e.g., Play Store)^TM) The computer program product is published (e.g. downloaded or uploaded) online, or may be distributed (e.g. downloaded or uploaded) directly between two user devices (e.g. smartphones). If published online, at least part of the computer program product may be temporarily generated or at least part of the computer program product may be temporarily stored in a machine readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server)) In (1).

According to various embodiments, each of the above components (e.g., modules or programs) may comprise a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. Operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added, in accordance with various embodiments.

Fig. 2a is a front perspective view of a mobile electronic device 200 according to various embodiments of the present disclosure. Fig. 2b is a rear perspective view of the mobile electronic device 200 of fig. 1, according to various embodiments of the present disclosure.

Referring to fig. 2a and 2B, the mobile electronic device 200 of an embodiment may include a case 210, the case 210 including a first surface (or a front surface) 210A, a second surface (or a rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing may also represent a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C of fig. 1. According to an embodiment, the first surface 210A may be formed by a front plate 202 (e.g., a glass plate or a polymer plate including various coatings), at least a portion of the front plate 202 being substantially transparent. The second surface 210B may be formed by a substantially opaque back-plate 211. The backplane 211 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, steel-type stainless steel (STS), or magnesium), or a combination of at least two materials. The side surface 210C may be formed by a side frame structure (or "side member") 218, the side frame structure 218 being bonded to the front plate 202 and the back plate 211 and comprising a metal and/or a polymer. In some embodiments, the back plate 211 and the side frame structure 218 may be integrally formed and comprise the same material (e.g., a metal material such as aluminum).

In the illustrated embodiment, the front plate 202 may include two first regions 210D at both ends of the long side of the front plate 202, the two first regions 210D being curved and extending seamlessly from the first surface 210A to the rear plate 211. In the illustrated embodiment (refer to fig. 2B), the back plate 211 may include two second regions 210E at both ends of the long side, the two second regions 210E being bent from the second surface 210B toward the front plate 202 and extending seamlessly. In some embodiments, the front panel 202 (or the back panel 211) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included. In an embodiment, the side bezel structure 218 may have a first thickness (or width) on a side excluding the first region 210D or the second region 210E and a second thickness thinner than the first thickness on a side including the first region 210D or the second region 210E when viewed from a side of the electronic device 200.

In an embodiment, the electronic device 200 may include at least one or more of a display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input 217, a light emitting element 206, and connector holes 208 and 209. In some embodiments, the electronic device 200 may omit at least one component (e.g., the key input device 217 or the light emitting element 206), or additionally include another component.

The display 201 may be exposed, for example, through a significant portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be exposed through the first surface 210A and the front plate 202 forming the first region 210D of the side surface 210C. In some embodiments, the edges of the display 201 may be generally formed identically to the adjacent outer shape of the front plate 202. In another embodiment (not shown), to expand the exposed area of the display 201, the interval between the outside of the display 201 and the outside of the front plate 202 may be generally formed the same.

In another embodiment (not shown), a notch or opening may be provided in a portion of the screen display area of the display 201, and may include at least one or more of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206 aligned with the notch or opening. In another embodiment (not shown), at least one or more of the audio module 214, the sensor module 204, the camera module 205, the fingerprint scanning sensor 216, and the light emitting elements 206 may be included in a rear surface of a screen display area of the display 201. In another embodiment (not shown), the display 201 may be integrated with, or disposed adjacent to, touch sensing circuitry, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer that detects a magnetic-type stylus. In some embodiments, at least a portion of the sensor modules 204 and 219 and/or at least a portion of the key input devices 217 may be disposed in the first region 210D and/or the second region 210E.

The audio modules 203, 207, and 214 may include a microphone aperture 203 and speaker apertures 207 and 214. A microphone for obtaining external sound may be disposed within the microphone hole 203. In some embodiments, multiple microphones may be arranged to sense the direction of sound. The speaker apertures 207 and 214 may include an external speaker aperture 207 and a call receiver aperture 214. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or may include a speaker (e.g., a piezoelectric speaker) without the speaker holes 207 and 214.

The sensor modules 204, 216, and 219 may provide electrical signals or data values corresponding to an operational state of the electronic device 200 or an environmental state external to the electronic device 200. The sensor modules 204, 216, and 219 may, for example, include a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint scanning sensor) disposed in the first surface 210A of the housing 210, and/or a third sensor module 219 (e.g., an HRM sensor) and/or a fourth sensor module 216 (e.g., a fingerprint scanning sensor) disposed in the second surface 210B of the housing 210. The fingerprint scanning sensors may be disposed in the second surface 210B as well as the first surface 210A (e.g., the display 201). The electronic device 200 may further include at least one of sensor modules not shown, such as a gesture sensor, a gyroscope sensor, a barometer, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an Infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor 204.

The camera modules 205, 212, and 213 may include a first camera device 205 disposed in a first surface 210A of the electronic apparatus 200, a second camera device 212 disposed in a second surface 210B, and/or a flash 213. The camera modules 205 and 212 may include one or more lenses, image sensors, and/or image signal processors. The flash lamp 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera and wide and tele lenses) and an image sensor may be disposed in one surface of the electronic device 200.

The key input device 217 may be disposed in the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the key input devices 217 described above. The non-included key input device 217 may be implemented on the display 201 in another form such as a soft key or the like. In some embodiments, the key input device may include a sensor module 216 disposed in the second surface 210B of the housing 210.

The light emitting elements 206 may, for example, be arranged in a first surface 210A of the housing 210. The light emitting elements 206 may provide status information of the electronic device 200, for example in the form of light. In another embodiment, the light emitting elements 206 may, for example, provide a light source that interacts with the operation of the camera module 205. The light emitting elements 206 may include, for example, light emitting diodes, infrared light emitting diodes, and xenon lamps.

The connector holes 208 and 209 may include a first connector hole 208 and/or a second connector hole 209, the first connector hole 208 being capable of receiving a connector (e.g., a USB connector) for transmitting and/or receiving power and/or data with an external electronic device, the second connector hole 209 being capable of receiving a connector for transmitting and/or receiving audio signals with the external electronic device.

Fig. 2c is an exploded perspective view of the mobile electronic device of fig. 2a (e.g., the mobile electronic device 200 of fig. 2 a) according to various embodiments of the present disclosure.

Referring to fig. 2c, the mobile electronic device 220 may include a side bezel structure 221, a first support member 2211 (e.g., a bracket and/or a middle plate), a front plate 222, a display 223, a printed circuit board 224 (e.g., a first printed circuit board), a battery 225, a second support member 226 (e.g., a back case), an antenna 227, and a back plate 228. In some embodiments, the electronic device 220 may omit at least one component (e.g., the first support member 2211 or the second support member 226), or additionally include another component. At least one component of the electronic device 200 may be the same as or similar to at least one component of the electronic device 200 of fig. 2a or 2b, and a repetitive description is omitted below.

The first support member 2211 may be disposed within the electronic device 220 so as to be connected to the side frame structure 221, or may be integrally formed with the side frame structure 221. The first support member 2211 may be formed of, for example, a metallic material and/or a non-metallic (e.g., polymeric) material. The first support member 2211 may be coupled to the display 223 at one surface thereof and to the printed circuit board 224 at the other surface. The printed circuit board 224 may mount a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing device, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communications processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 220 with an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

Battery 225 is a device for powering at least one component of electronic apparatus 220 and may comprise, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 225 may be disposed on substantially the same plane as the printed circuit board 224. The battery 225 may be integrally disposed within the electronic device 220, and may also be detachably disposed with the electronic device 220.

The antenna 227 may be disposed between the backplate 228 and the battery 225. The antenna 227 may include, for example, a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Secure Transport (MST) antenna. The antenna 227 may, for example, perform short-range communication with an external device, or may wirelessly transmit and/or receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 221 and/or the first support member 2211, or a combination thereof.

Fig. 3a is a diagram illustrating an example of an electronic device 300 supporting 5G communication.

Referring to fig. 3a, the electronic device 300 may include a housing 310, a processor 340, a communication module 350 (e.g., the communication module 190 of fig. 1), a first communication device 321, a second communication device 322, a third communication device 323, a fourth communication device 324, a first wire 331, a second wire 332, a third wire 333, or a fourth wire 334.

According to an embodiment, the housing 310 may protect other components of the electronic device 300. The housing 310 may include, for example, a front plate, a rear plate facing away from the front plate, and side members (or metal frames) attached to or integrally formed with the rear plate and surrounding a space between the front plate and the rear plate.

According to an embodiment, the electronic device 300 may comprise at least one of a first communication device 321, a second communication device 322, a third communication device 323 or a fourth communication device 324.

According to an embodiment, the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 may be located within the housing 310. According to an embodiment, the first communication device 321 may be disposed at an upper left end of the electronic device 300, the second communication device 322 may be disposed at an upper right end of the electronic device 300, the third communication device 323 may be disposed at a lower left end of the electronic device 300, and the fourth communication device 300 may be disposed at a lower right end of the electronic device 300, when viewed from above a rear panel of the electronic device.

According to an embodiment, the processor 340 may include one or more of a central processing unit, an application processor, a Graphics Processing Unit (GPU), an image signal processor of a camera, or a baseband processor (or Communication Processor (CP)). According to an embodiment, processor 340 may be implemented as a system on chip (SoC) or a System In Package (SiP).

According to an embodiment, the communication module 350 may be electrically connected to the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 by using the first conductive line 331, the second conductive line 332, the third conductive line 333, or the fourth conductive line 334. The communication module 350 may include, for example, a base processor or at least one communication circuit (e.g., an Intermediate Frequency Integrated Circuit (IFIC) or a Radio Frequency Integrated Circuit (RFIC)). The communication module 350 may include, for example, a baseband processor (e.g., an Application Processor (AP)) separate from the processor 340. The first, second, third, or fourth conductive lines 331, 332, 333, or 334 may include, for example, a coaxial cable or FPCB.

According to an embodiment, the communication module 350 may include a first baseband processor (not shown) or a second baseband processor (not shown). The electronic device 300 may also include one or more interfaces to support inter-chip communication between the first BP (or the second BP) and the processor 340. The processor 340 and the first BP or the second BP may transmit and/or receive data using an inter-chip interface (i.e., an inter-processor communication channel).

According to an embodiment, the first BP or the second BP may provide an interface for performing communication with other entities. The first BP may support, for example, wireless communication by a first network (not shown). The second BP may support, for example, wireless communication by a second network (not shown).

According to an embodiment, the first BP or the second BP may form one module with the processor 340. For example, the first blood pressure or the second blood pressure may be integrally formed with the processor 340. As another example, the first BP or the second BP may be arranged within one chip or formed in a separate chip form. According to an embodiment, the processor 340 and at least one baseband processor (e.g., a first baseband processor) may be integrally formed within one chip (SoC chip), and another baseband processor (e.g., a second baseband processor) may be formed in a separate chip form.

According to an embodiment, the first network (not shown) or the second network (not shown) may correspond to the network 199 of fig. 1. According to an embodiment, each of the first network (not shown) and the second network (not shown) may include a fourth generation (4G) network and a fifth generation (5G) network. The 4G network may support a Long Term Evolution (LTE) protocol, for example, as specified in 3 GPP. For example, a 5G network may support a new air interface (NR) protocol specified in 3 GPP.

Fig. 3b is a block diagram of a communication device 360 according to an embodiment.

Referring to fig. 3b, a communication device 360 (e.g., the first communication device 321, the second communication device 322, the third communication device 323, or the fourth communication device 324 of fig. 3 a) may include a communication circuit 362 (e.g., an RFIC), a Printed Circuit Board (PCB)361, a first antenna array 363, or a second antenna array 364.

According to an embodiment, the communication circuitry 362, the first antenna array 363, or the second antenna array 364 may be located in the PCB 361. For example, the first antenna array 363 or the second antenna array 364 may be disposed in a first surface of the PCB 361, and the communication circuitry 362 may be located in a second surface of the PCB 361. The PCB 361 may include a connector (e.g., a coaxial cable connector or a board-to-board (B-to-B)) for electrically connecting with another PCB (e.g., a PCB on which the communication module 350 of fig. 3a has been arranged) by using a transmission line (e.g., the first conductor 331 and/or a coaxial cable of fig. 3 a). The PCB 361 is connected, for example, by a coaxial cable, with a PCB on which the communication module 350 has been arranged by using a coaxial cable connector. Coaxial cables may be used to transmit and receive Intermediate Frequency (IF) signals or Radio Frequency (RF) signals. In another example, power or other control signals may be forwarded through the B-to-B connector.

According to an embodiment, the first antenna array 363 or the second antenna array 364 may comprise a plurality of antennas. The antenna may include, for example, a patch antenna, a loop antenna, or a dipole antenna. For example, at least some of the plurality of antennas included in the first antenna array 363 may be patch antennas to form a beam toward a backplane of the electronic device 300. As another example, at least some of the plurality of antennas included in the second antenna array 364 may be dipole antennas or loop antennas to form a beam towards a side component of the electronic device 300.

According to an embodiment, the communication circuitry 362 may support at least a portion of the frequency band from about 20GHz to about 100GHz (e.g., from about 24GHz to about 30GHz or from about 37GHz to about 40 GHz). According to an embodiment, the communication circuit 362 may up-convert or down-convert frequencies. For example, communication circuitry 362 included in communication device 360 (e.g., first communication device 321 of fig. 3 a) may up-convert IF signals received from a communication module (e.g., communication module 350 of fig. 3 a) over a conductor (e.g., first conductor 331 of fig. 3 a) to RF signals. As another example, the communication circuitry 362 included in the communication device 360 (e.g., the first communication device 321 of fig. 3 a) may downconvert RF signals (e.g., millimeter wave signals) received through the first antenna array 363 or the second antenna array 364 to intermediate frequency signals and transmit to the communication module using wires.

Fig. 4a, 4b, and 4c are perspective views of a communication device according to various embodiments of the present disclosure.

The communication device 400 of fig. 4a, 4b and 4c may be at least partially similar to the communication devices 321, 322, 323 and 324 of fig. 3a or the communication device 360 of fig. 3b, or comprise other embodiments of communication devices.

Referring to fig. 4a, 4b and 4c, the communication device 400 may include a printed circuit board 410. According to an embodiment, the printed circuit board 410 may comprise a first substrate surface 411, a second substrate surface 412 facing away from the first substrate surface 411, and a substrate side surface 413 surrounding a space between the first substrate surface 411 and the second substrate surface 412. According to an embodiment, the printed circuit board 410 may be arranged such that the second substrate surface 412 faces a backplane (e.g., backplane 211 of fig. 2b) of an electronic device (e.g., electronic device 200 of fig. 2 b). In another embodiment, the printed circuit board 410 may be arranged such that the second substrate surface 412 of the printed circuit board 410 also faces a side member (e.g., side member 218 of fig. 2 a) or a front plate (e.g., front plate 202 of fig. 2 a) of the electronic device.

According to various embodiments, the communication device 400 may include at least one of a first antenna array 420, a second antenna array 430, or a third antenna array 440 arranged in a printed circuit board 410. According to an embodiment, the first antenna array 420 may be arranged such that the beam pattern is formed in a z-axis direction through the second substrate surface 412 of the printed circuit board 410. According to an embodiment, the second antenna array 430 may be arranged such that a beam pattern is formed in the x-axis direction in a first edge region (E1) of the printed circuit board 410. According to an embodiment, the third antenna array 440 may be arranged adjacent to the second antenna array 430 and arranged such that a beam pattern is formed in the y-axis direction in the second edge region (E2) of the printed circuit board 410.

According to various embodiments, the first antenna array 420 may include a plurality of first unit antennas 421 arranged in the second substrate surface 412 of the printed circuit board 410 at certain intervals. The plurality of first unit antennas 421 may include an antenna element formed of a conductive plate (e.g., a metal patch) or a conductive pattern. According to an embodiment, the second antenna array 430 may include a plurality of second unit antennas 431 arranged at certain intervals in a first edge region (E1) of the second substrate surface 412 of the printed circuit board 410. According to an embodiment, the third antenna array 440 may include a plurality of third element antennas 441 arranged at certain intervals in the second edge region (E2) of the second substrate surface 412 of the printed circuit board 410.

According to various embodiments, the communication device 400 may include wireless communication circuitry 490 mounted in the first substrate surface 411 of the printed circuit board 410 and electrically connected to the antenna arrays 420, 430, and 440. According to an embodiment, the wireless communication circuitry 490 may be configured to transmit and/or receive signals having frequency bands in the range of about 10GHz to about 100GHz through the plurality of antenna arrays 420, 430, and 440.

According to various embodiments, each of the plurality of second unit antennas 431 of the second antenna array 430 may include a first antenna (a1) and a second antenna (a 2). According to an embodiment, the first antenna (a1) may include a first antenna element 4311 and a second antenna element 4312. According to an embodiment, the first antenna element 4311 and the second antenna element 4312 may be arranged to be spaced apart by a certain interval in a position where at least partial areas overlap each other when viewed from above the second substrate surface 412 of the printed circuit board 410. According to an embodiment, the wireless communication circuit 490 may transmit and/or receive vertically polarized waves through the first antenna element 4311 and the second antenna element 4312. According to an embodiment, the first antenna element 4311 and the second antenna element 4312 may be formed in the form of a metal plate or a metal patch. According to an embodiment, the second antenna (a2) may include a third antenna element 4313 and a fourth antenna element 4314. According to an embodiment, the third antenna element 4313 and the fourth antenna element 4314 may be arranged side by side and in a space between the first antenna element 4311 and the second antenna element 4312. According to an embodiment, wireless communication circuitry 490 may transmit and/or receive horizontally polarized waves through third antenna element 4311 and fourth antenna element 4312. According to an embodiment, the third antenna element 4313 and the fourth antenna element 4314 may be formed as dipole radiators in the form of metal patterns in the printed circuit board 410. For example, each of the plurality of third unit antennas 441 of the third antenna array 440 may also be formed to have the same structure as the second unit antenna 431 described above.

According to various embodiments, the communication device 400 may include a shield 491 (or shield cover) arranged in a scheme to cover the first wireless communication circuit 490 mounted in the first substrate surface 411 of the substrate 410 for noise shielding. The communication device 400 may comprise at least one dielectric material 450 or 451 arranged to have a thickness in the first substrate surface 411 of the printed circuit board 410. According to an embodiment, the at least one dielectric material 450 or 451 may include a first dielectric material 450 and a second dielectric material 451, the first dielectric material 450 being disposed in a pattern at least a portion of which overlaps a first edge region (E1) of the printed circuit board 410, the second dielectric material 451 being disposed in a pattern at least a portion of which overlaps a second edge region (E2) of the printed circuit board 410. According to embodiments, the first dielectric material 450 and/or the second dielectric material 451 may be formed of the same material as the printed circuit board 410, or may also be formed of a polymer material. For example, the first dielectric material 450 and/or the second dielectric material 451 can utilize at least one of the flame retardants (FR-1, FR-2, FR-3, FR-4, or FR-6) defined by the National Electrical Manufacturers Association (NEMA). For example, the first dielectric material 450 and/or the second dielectric material 451 can utilize at least one of a composite type laminate bonded with a NEMA defined flame retardant epoxy (CEM-1 or CEM-3). According to an embodiment, the first dielectric material 450 and the second dielectric material 451 may reduce distortion of signals radiated from the second antenna array 430 and the third antenna array 440. For example, the first dielectric material 450 and the second dielectric material 451 can reduce a shadow region (e.g., a region of reduced beam pattern size) disposed at a contact point between a front plate (e.g., the front plate 202 of fig. 2 a) and a housing (e.g., the housing 210 of fig. 2 a) or a contact point between a rear plate (e.g., the rear plate 211 of fig. 2 a) and a housing of an electronic device (e.g., the electronic device 200 of fig. 2 a) having different dielectric constants.

According to various embodiments, the communication device 400 may comprise at least one electrical connection member for electrically connecting with a main Printed Circuit Board (PCB) of an electronic device (e.g. printed circuit board 224 of fig. 2 c) through at least a partial area of the printed circuit board 410. According to an embodiment, the electrical connection member may be electrically connected through the first substrate surface 411 of the printed circuit board 410. According to an embodiment, the electrical connection member may include a Flexible Printed Circuit Board (FPCB) 500. According to an embodiment, the flexible printed circuit board 500 may be electrically connected to the printed circuit board 410 through soldering in the coupling region (region a). According to embodiments, soldering may include Anisotropic Conductive Film (ACF) bonding, ball jet bonding, hot bar bonding, or self-Aligned Solder Adhesive (ASA) bonding.

According to various embodiments, the coupling regions (region a) of the flexible printed circuit board 500 and the printed circuit board 410 shield the RF signal wiring by the improved peripheral grounding structure according to the exemplary embodiment of the present disclosure, and thus mismatch caused by peripheral exposure of the RF signal wiring or unstable loss of the RF loss may be excluded.

Fig. 5 is a diagram illustrating a configuration of a coupling part (CP1) of the printed circuit board 410 according to various embodiments of the present disclosure. Fig. 7a and 7b are cross-sectional views illustrating a soldering state of the printed circuit board 410 and the flexible printed circuit board 500 according to various embodiments of the present disclosure.

Referring to fig. 5, the printed circuit board 410 may include a first coupling part (CP1) for electrically connecting with a second coupling part (e.g., the second coupling part (CP2) of the flexible printed circuit board (e.g., the flexible printed circuit board 500 of fig. 6 a)). According to an embodiment, the printed circuit board 410 may include a first connection pad 4611 exposed in the first coupling part (CP1), a second connection pad 4621 spaced apart from the first connection pad by a certain interval and disposed, and a third connection pad 4631 disposed between the first connection pad 4611 and the second connection pad 4621. According to an embodiment, the printed circuit board 410 may include fourth connection pads 4651 spaced apart by a certain interval on the same line as the third connection pads 4631. According to an embodiment, the first connection pad 4611, the second connection pad 4621 and the fourth connection pad 4651 may be electrically connected to a ground of the printed circuit board 410. According to an embodiment, the third connection pad 4631 disposed between the first connection pad 4611 and the second connection pad 4621 may be connected to a first signal wiring (e.g., the first signal wiring 463 of fig. 7 a) for transmitting an RF signal, thereby being electrically connected to the wireless communication circuit 490. According to an embodiment, the first coupling portion (CP1) may arrange the additional connection pads 4671 and 4681 disposed outside the first connection pad 4611 and the second connection pad 4621. According to an embodiment, the additional connection pads 4671 and 4681 may be electrically connected to another signal wiring or may also be electrically connected to a ground.

Referring to fig. 7a, the printed circuit board 410 may include a plurality of insulating layers 4101, 4102, and 4103 arranged adjacent to each other. According to an embodiment, the printed circuit board 410 may include a first insulating layer 4101, a second insulating layer 4102 disposed adjacent to the first insulating layer 4101, and a third insulating layer 4103 disposed adjacent to the second insulating layer 4102. According to an embodiment, the first, second, third and fourth connection pads 4611, 4621, 4631 and 4651 and the additional connection pads 4671 and 4681 may be arranged to be exposed outside the first coupling portion (CP1) of the printed circuit board 410 through the first insulating layer 4101. According to an embodiment, the printed circuit board 410 may include a first ground plane 465 disposed through the first insulating layer 4101, and a second ground plane 466 disposed through the third insulating layer 4103. According to an embodiment, the first connection pad 4611, the second connection pad 4621, and the fourth connection pad 4651 may be electrically connected to the first ground plane 465. According to an embodiment, the first connection pad 4611 and the second connection pad 4621 may be electrically connected to the second ground plane 4102 through at least one first auxiliary wiring 4612 and at least one conductive via 4001.

According to various embodiments, the first signal wiring 463 electrically connected to the third connection pad 4631 may be disposed through the second insulating layer 4102. According to the embodiment, the first signal wiring 463 serving as an RF signal wiring may be electrically connected to the third connection pad 4631 through the second auxiliary wiring 4632 and the conductive via 4001 arranged in the first insulating layer 4101. According to an embodiment, the first signal wiring 463 may be electrically connected to the wireless communication circuit 490 through an electrical path 4901 arranged in the printed circuit board 410.

Fig. 6a is a diagram illustrating a configuration of a coupling part (CP2) of a flexible printed circuit board 500 according to various embodiments of the present disclosure.

Referring to fig. 6a, the flexible printed circuit board 500 may include a second coupling part (CP2) for coupling with a first coupling part (e.g., the first coupling part (CP1) of fig. 5) of a printed circuit board (e.g., the printed circuit board 410 of fig. 5), and a connection part (CP3) extending from the second coupling part (CP 2). According to an embodiment, the flexible printed circuit board 500 may include a first access pad 5211 exposed in the second coupling portion (CP2) and electrically connected to the first connection pad (e.g., the first connection pad 4611 of fig. 5), a second access pad 5221 electrically connected to the second connection pad (e.g., the second connection pad 4621 of fig. 5), a third access pad 5231 electrically connected to the third connection pad (e.g., the third connection pad 4631 of fig. 5), and a fourth access pad 5241 electrically connected to the fourth connection pad (e.g., the fourth connection pad 4651 of fig. 5). According to an embodiment, the first, second, and fourth access pads 5211, 5221, and 5241 may be electrically connected to ground wiring of the flexible printed circuit board 500, and the third access pad 5231 may be electrically connected to second signal wiring (e.g., the second signal wiring 523 of fig. 6 b) (e.g., RF signal wiring). According to an embodiment, the second coupling portion (CP2) may include additional access pads 5271 and 5281, which are disposed outside the first and second access pads 5211 and 5221 and are respectively connected to additional connection pads (e.g., additional connection pads 4671 and 4681 of fig. 5) of a printed circuit board (e.g., printed circuit board 410 of fig. 5).

Fig. 6B is a cross-sectional view looking along line B-B' of fig. 6a, according to various embodiments of the present disclosure. Fig. 6C is a cross-sectional view looking along line C-C of fig. 6a, according to various embodiments of the present disclosure. Fig. 6D is a cross-sectional view looking along line D-D' of fig. 6a, according to various embodiments of the present disclosure.

Referring to fig. 6b to 6d, the flexible printed circuit board 500 may include a plurality of insulating layers 5101, 5102, and 5103 arranged to be adjacent. According to an embodiment, the flexible printed circuit board 500 may include a fourth insulating layer 5101, a fifth insulating layer 5102 disposed adjacent to the fourth insulating layer 5101, and a sixth insulating layer 5103 disposed adjacent to the fifth insulating layer 5102. According to an embodiment, the flexible printed circuit board 500 may include a third ground plane 525 disposed through the fourth insulating layer 5101 and a fourth ground plane 526 disposed through the sixth insulating layer 5103. According to an embodiment, in the second coupling part (CP2), the first access pad 5211, the second access pad 5221, the third access pad 5231 and the fourth access pad 5241 and the additional access pads 5271 and 5281 may be arranged to be exposed through the fifth insulating layer 5102, which has excluded the fourth insulating layer 5101. According to an embodiment, the first access pad 5211 may be electrically connected to the first ground wiring 521, and the first ground wiring 521 extends to the connection portion (CP3) through the second insulating layer 5102. According to an embodiment, the second access pad 5221 may be electrically connected to the second ground wiring 522, and the second ground wiring 522 extends to the connection portion (CP3) through the fifth insulating layer 5102. According to an embodiment, the third access pad 5231 may be electrically connected to the second signal wiring 523 (e.g., RF signal wiring), and the second signal wiring 523 extends to the connection portion (CP2) through the fifth insulating layer 5102. According to an embodiment, the fourth access pad 5241 may be electrically connected to the fourth ground plane 526 through the third auxiliary wiring 524 and the conductive via 5001, the third auxiliary wiring 524 being disposed through the fifth insulating layer 5102.

Fig. 7a and 7b are cross-sectional views illustrating a soldering state of the printed circuit board 410 and the flexible printed circuit board 500 according to various embodiments of the present disclosure.

Referring to fig. 7a and 7b, the first coupling portion (CP1) of the printed circuit board 410 and the second coupling portion (CP2) of the flexible printed circuit board 500 may be electrically connected by soldering. In this case, the first, second, third and fourth connection pads 4611, 4621, 4631 and 4651 and the additional connection pads 4671 and 4681 of the printed circuit board 410 may be connected to physically contact the first, second, third and fourth access pads 5211, 5221, 5231 and 5241 and the additional access pads 5271 and 5281 of the flexible printed circuit board 500. According to an embodiment, the first signal wiring 463 disposed through the second insulating layer 4102 of the printed circuit board 500 may be electrically connected to the third connection pad 4631 through the second auxiliary wiring 4632 and the conductive via 4001, the second auxiliary wiring 4632 being disposed through the first insulating layer 4101. According to an embodiment, the third connection pad 4631 may be electrically connected to the third access pad 5231 of the flexible printed circuit board 500. According to an embodiment, the third access pad 5231 may be electrically connected to the second signal wiring 523, the second signal wiring 523 being disposed through the fifth insulating layer 5102 of the flexible printed circuit board 500.

According to various embodiments, the fourth connection pad 4651 electrically connected to the first ground plane 4101 of the printed circuit board 410 may be electrically connected to the fourth access pad 5241 of the flexible printed circuit board 500, whereby the second ground path (c) may be formed. According to an embodiment, the fourth access pad 5241 may be electrically connected to the fourth ground plane 526 through a third auxiliary wiring 524 and the conductive via 5001, the third auxiliary wiring 524 being disposed through the fifth insulating layer 5102 of the flexible printed circuit board 500. According to an embodiment, the second ground plane 466 may extend to and be disposed in at least a partial region of the first coupling portion (CP1) in the third insulating layer 4103, and may be electrically connected to the first connection pad 4611 and/or the second connection pad 4621 through at least one first auxiliary wiring 4612 and the conductive via 4001. According to an embodiment, the first connection pad 4611 and/or the second connection pad 4621 may be connected to the first access pad 5211 and/or the second access pad 5221 of the flexible printed circuit board 500. According to an embodiment, the first and/or second access pads 5211 and/or 5221 may be electrically connected to the first and/or second ground wiring 521 and/or 522 arranged through the fifth insulating layer 5102. According to an embodiment, the first ground wiring 521 and/or the second ground wiring 522 may be electrically connected to the third ground layer 525 through the at least one conductive via 5001, whereby a first ground path (r) may be formed. According to various embodiments, a return path of an RF signal may be formed in the same direction as a ground path (r, c).

Accordingly, the first signal wiring 463 and the second signal wiring 523 electrically connected in the first coupling part (CP1) of the printed circuit board 410 and the second coupling part (CP2) of the flexible printed circuit board 500, the first ground wiring 521 and the second ground wiring 522 are arranged on the left and right sides, and the ground wiring connected by the first ground plane 4101, the third auxiliary wiring 524 and the fourth ground plane 526 are arranged on the lower side, and are surrounded by the ground wiring connected by the second ground plane 4102, the first auxiliary wiring 4612, the first ground plane 4101 and the third ground plane 525 on the upper side, whereby a ground shield structure can be realized.

Fig. 8 is a graph comparing insertion loss of a ground structure with a coupling portion and insertion loss of a ground structure without a coupling portion according to various embodiments of the present disclosure.

Referring to fig. 8, it can be appreciated that the insertion loss (e.g., RF loss) in the state where the above-described ground structure has been applied changes more smoothly than the insertion loss in the state where the ground structure has not been applied. In detail, a loss value of about (-1.8682) db is shown at point 2 in a state where the ground structure has been applied (S11), whereas a loss value of about (-0.91912) db can be identified at point 1 (e.g., corresponding to a frequency of point 2) in a state where the ground structure has not been applied. This may mean a ratio between the magnitude of a signal input and the magnitude of a signal output through the coupling parts of various embodiments, and may mean that the insertion loss is relatively stably varied because the insertion loss value in a state where the ground structure has been applied is displayed as a relatively small value in the (-) direction according to exemplary embodiments of the present disclosure.

Fig. 9a is a cross-sectional view looking along line B-B' of fig. 6a, according to various embodiments of the present disclosure. Fig. 9b is a cross-sectional view looking along line C-C of fig. 6a, according to various embodiments of the present disclosure. Fig. 9c is a cross-sectional view looking along line D-D' of fig. 6a, according to various embodiments of the present disclosure.

The flexible printed circuit board 900 of fig. 9a, 9b and 9c may be at least partially similar to the flexible printed circuit board 500 of fig. 6a, 6b, 6c and 6d, or include other embodiments of flexible printed circuit boards.

In describing the flexible printed circuit board 900 of fig. 9a, 9b, and 9c, the same components of the flexible printed circuit board (e.g., the flexible printed circuit board 500 of fig. 6a, 6b, and 6c, and 6 d) described above are denoted by the same symbols, and detailed description thereof may be omitted.

Referring to fig. 9a, 9b and 9c, in the flexible printed circuit board 900, first, second, third and fourth access pads 5211, 5221, 5231 and 5241 and additional access pads 5271 and 5281 may be disposed in a fourth insulating layer 5101. In this case, the third access pad 5231 may be electrically connected to the fourth auxiliary wiring 5232 disposed through the fourth insulating layer 5101, and the fourth auxiliary wiring 5232 may be electrically connected to the second signal wiring 523 disposed in the fifth insulating layer 5102 through the conductive via 5001. According to an embodiment, the fourth access pad 5241 may also be electrically connected to the fifth auxiliary wiring 5242 disposed in the fourth insulating layer 5101. According to an embodiment, the fifth auxiliary wiring 5242 may be electrically connected to the fourth ground plane 526 disposed in the sixth insulating layer 5103 through the sixth auxiliary wiring 5243 and the at least one conductive via 5001 disposed in the fifth insulating layer 5102.

According to various embodiments, since the spacing distance (d) between the fourth auxiliary wiring 5232 electrically connected to the second signal wiring 523 and arranged in the fourth insulating layer 5101 and the fourth ground plane 526 is ensured in the second coupling portion (CP2), it may be more advantageous for impedance matching.

Fig. 10a and 10b are cross-sectional views illustrating a soldering state of a printed circuit board and a flexible printed circuit board according to various embodiments of the present disclosure.

The flexible printed circuit board 900 of fig. 10a and 10b may be at least partially similar to the flexible printed circuit board 500 of fig. 6a, 6b and 6c and 6d, or include other embodiments of flexible printed circuit boards.

Referring to fig. 10a and 10b, the first coupling portion (CP1) of the printed circuit board 410 and the second coupling portion (CP2) of the flexible printed circuit board 500 may be electrically connected by soldering. In this case, the first, second, third and fourth connection pads 4621, 4631 and 4651 and the additional connection pads 4671 and 4681 of the printed circuit board 410 may physically contact the first, second, third and fourth access pads 5211, 5221, 5231 and 5241 and the additional access pads 5271 and 5281 of the flexible printed circuit board 500. According to an embodiment, the first signal wiring 463 disposed through the second insulating layer 4102 of the printed circuit board 500 may be electrically connected to the third connection pad 4631 through the second auxiliary wiring 4632 and the conductive via 4001, the second auxiliary wiring 4632 being disposed through the first insulating layer 4101. According to an embodiment, the third connection pad 4631 may be electrically connected to the third access pad 5231 of the flexible printed circuit board 500. According to an embodiment, the third access pad 5231 may be electrically connected to a fourth auxiliary wiring 5232 arranged through the fourth insulating layer 5101 of the flexible printed circuit board 500. According to an embodiment, the fourth auxiliary wiring 5232 disposed in the fourth insulating layer 5101 may be electrically connected to the second signal wiring 523 disposed in the fifth insulating layer 5102 through the conductive via 5001.

According to various embodiments, the fourth connection pad 4651 electrically connected to the first ground plane 4101 of the printed circuit board 410 may be electrically connected to the fourth access pad 5241 of the flexible printed circuit board 500. According to an embodiment, the fourth access pad 5241 may be electrically connected to the fourth ground plane 526 disposed in the sixth insulating layer 5103 of the flexible printed circuit board 500 through the fifth auxiliary wiring 5242, the sixth auxiliary wiring 5243, and the conductive via 5001, which are disposed through the fourth insulating layer 5101 and the fifth insulating layer 5102 of the flexible printed circuit board 500. According to an embodiment, the second ground plane 466 may extend to and be disposed in at least a partial region of the first coupling portion (CP1) in the third insulating layer 4103, and may be electrically connected to the first connection pad 4611 and/or the second connection pad 4621 through at least one first auxiliary wiring 4612 and the conductive via 4001. According to an embodiment, the first connection pad 4611 and/or the second connection pad 4621 may be electrically connected to the first ground wiring 521 and/or the second ground wiring 522 disposed through the fourth insulation layer of the flexible printed circuit board 500. According to an embodiment, the first ground routing 521 and/or the second ground routing 522 may be electrically connected to the third ground plane 525 through at least one conductive via 5001.

Accordingly, the first and second signal wirings 463 and 523 electrically connected in the first coupling part (CP1) of the printed circuit board 410 and the second coupling part (CP2) of the flexible printed circuit board 500, the first and second ground wirings 521 and 522 are arranged at the left and right sides, and are surrounded by the ground wiring connected by the first ground plane 4101, the fifth auxiliary wiring 5242, the sixth auxiliary wiring 5243, and the fourth ground plane 526 at the lower side, whereby a ground shield structure can be realized.

According to various embodiments, an electronic device (e.g., electronic device 220 of fig. 2 c) may include: circuit elements (e.g., wireless communication circuit 490 of fig. 7 a); a printed circuit board (e.g., the printed circuit board 410 of fig. 5) including a first connection pad (e.g., the first connection pad 4611 of fig. 5), a second connection pad (the second connection pad 4621 of fig. 5) connected to a ground of the electronic device, and a third connection pad (e.g., the third connection pad 4631 of fig. 5) disposed between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a Flexible Printed Circuit Board (FPCB) (e.g., the flexible printed circuit board of fig. 6 a) including a coupling portion (e.g., the coupling portion (CP2) of fig. 6 a) connected to the printed circuit board and a connection portion (e.g., the connection portion (CP3) of fig. 6 a) extending from the coupling portion, the flexible printed circuit board may include a first ground wiring (e.g., the first ground wiring 521 of fig. 6 d) connected to the first connection pad and extending from the coupling portion to the connection portion in a designated direction, a second ground wiring (e.g., the second ground wiring 522 of fig. 6 d) connected to the second connection pad and extending from the coupling portion to the connection portion in the designated direction, while a signal wiring (e.g., the second signal wiring 523 of fig. 6 d); and a third ground wiring (e.g., a third auxiliary wiring 524 of fig. 6 b) arranged in a direction opposite to the designated direction so as to be connected to the first ground wiring and the second ground wiring and surround the signal wiring in the coupling portion.

According to various embodiments, the printed circuit board may include a first insulating layer (e.g., the first insulating layer 4101 of fig. 7 a), a second insulating layer (e.g., the second insulating layer 4102 of fig. 7 a) disposed adjacent to the first insulating layer, and a third insulating layer (e.g., the third insulating layer 4103 of fig. 7 a) disposed adjacent to the second insulating layer. The third connection pad may be electrically connected to a signal wiring (e.g., the first signal wiring 463 of fig. 7 a) disposed through the second insulating layer.

According to various embodiments, the first connection pad, the second connection pad, and the third connection pad may be arranged to be exposed through the first insulating layer.

According to various embodiments, an electronic device may include a first ground plane (e.g., first ground plane 465 of fig. 7 a) disposed in a first insulating layer, and a second ground plane (e.g., second ground plane 466 of fig. 7 a) disposed in a third insulating layer. The first and second connection pads may be electrically connected to at least one of the first ground plane and/or the second ground plane.

According to various embodiments, the electronic device may further include a fourth connection pad (e.g., fourth connection pad 4651 of fig. 5) disposed adjacent to the third connection pad, and the fourth connection pad may be electrically connected to the first ground plane.

According to various embodiments, the flexible printed circuit board may include a fourth insulating layer (e.g., the fourth insulating layer 5101 of fig. 7 a), a fifth insulating layer (e.g., the fifth insulating layer 5102 of fig. 7 a) disposed adjacent to the fourth insulating layer, and wherein the fourth insulating layer is not disposed in at least a partial region corresponding to the coupling portion, and a sixth insulating layer (e.g., the sixth insulating layer 5103 of fig. 7 a) disposed adjacent to the fifth insulating layer, at least a portion of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring may be exposed through a partial region of the fifth insulating layer.

According to various embodiments, an electronic device may comprise: a first access pad (e.g., the first access pad 5211 of fig. 6 a) electrically connected to the first ground wiring, which is arranged to be exposed through a partial region of the fifth insulating layer; a second access pad (a second access pad 5241 of fig. 6 a) electrically connected to the second ground wiring; a third access pad (a third access pad 5231 of fig. 6 a) electrically connected to the signal wiring; and a fourth access pad (fourth access pad 5241 of fig. 6 a) electrically connected to the third ground.

According to various embodiments, the fourth access pad may be disposed at a position corresponding to the fourth connection pad.

According to various embodiments, an electronic device may include a third ground plane (e.g., third ground plane 525 of fig. 7 a) disposed in a fourth insulating layer, and a fourth ground plane (e.g., fourth ground plane 526 of fig. 7 a) disposed in a sixth insulating layer. At least a portion of the third ground wiring may be electrically connected to the fourth ground plane.

According to various embodiments, the third ground routing may be electrically connected to the fourth ground plane through a conductive via (conductive via 5001 of fig. 7 a).

According to various embodiments, when the printed circuit board and the flexible printed circuit board are coupled, at least one of the second ground plane or the fourth ground plane may extend to and be disposed in at least a portion of the coupling portion.

According to various embodiments, the flexible printed circuit board may include a fourth insulating layer, a fifth insulating layer disposed adjacent to the fourth insulating layer, and a sixth insulating layer disposed adjacent to the fifth insulating layer. At least a portion of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring may be exposed to a region corresponding to the coupling portion of the fourth insulating layer.

According to various embodiments, the flexible printed circuit board may be soldered such that at least a portion of the first ground wiring, the second ground wiring, and the signal wiring of the coupling portion correspond to the first connection pad, the third connection pad, and the third connection pad of the printed circuit board.

According to various embodiments, soldering may include Anisotropic Conductive Film (ACF) bonding, ball jet bonding, hot bar bonding, or self-Aligned Solder Adhesive (ASA) bonding.

According to various embodiments, the printed circuit board may comprise at least one antenna electrically connected to the circuit element. The circuit element may be configured to transmit and/or receive signals having frequencies in the range of 10GHz to 100GHz through the at least one antenna.

According to various embodiments, a flexible printed circuit board (e.g., the flexible printed circuit board 500 of fig. 6 d) may include a flexible printed circuit board layer including a coupling part (e.g., the second coupling part (CP2) of fig. 6 a) connected to an external circuit board (e.g., the printed circuit board 410 of fig. 7 a) and a connection part (e.g., the connection part (CP3) of fig. 6 a) extending from the coupling part. The flexible printed circuit board layer may include: a first ground wiring (first ground wiring 521 of fig. 6 d) extending from the coupling portion to the connection portion in a prescribed direction; a second ground wiring (second ground wiring 522 of fig. 6 d) extending from the coupling portion to the connection portion in a prescribed direction; a signal wiring (a second signal wiring 523 of fig. 6 d) extending from the coupling portion to the connection portion in the specified direction while being arranged between the first ground wiring and the second ground wiring; and a third ground wiring (a third auxiliary wiring of fig. 6 b) arranged in a direction opposite to the prescribed direction so as to be connected to the first ground wiring and the second ground wiring and surround the signal wiring in the coupling portion.

According to various embodiments, the flexible printed circuit board may include a first insulating layer, a second insulating layer disposed adjacent to the first insulating layer, and a third insulating layer disposed adjacent to the second insulating layer.

According to various embodiments, the fourth insulating layer is not disposed in at least a partial region of the second insulating layer corresponding to the coupling portion, and at least portions of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring may be exposed through at least a partial region of the second insulating layer.

According to various embodiments, at least a portion of the first ground wiring, the second ground wiring, the signal wiring, and the third ground wiring may be exposed through a region corresponding to the coupling portion of the first insulating layer.

According to various embodiments, an electronic device may include a first ground plane disposed in a first insulating layer and a second ground plane disposed in a third insulating layer. At least a portion of the third ground wiring may be electrically connected to the second ground plane.

The various embodiments of the present disclosure disclosed in the specification and the drawings are merely suggested as specific examples to easily explain technical contents of the embodiments of the present disclosure and to assist understanding of the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of various embodiments of the present disclosure should be construed to include all modifications or changes drawn based on the technical spirit of various embodiments of the present disclosure, in addition to the embodiments disclosed herein.