阅读说明：本技术 Igbt功率模块的封装结构及采用该封装结构的igbt功率模块 (Packaging structure of IGBT power module and IGBT power module adopting same ) 是由 张凯 刘刚 孙峻峰 任静 谢云龙 任成才 王阔 于丽阳 王高虎 祁招 张文锦 于 2020-11-12 设计创作，主要内容包括：本发明涉及一种IGBT功率模块的封装结构以及采用该封装结构的IGBT功率模块,叠层母排中部设计有接线端,通过小铜排与IGBT功率器件搭接,优化了IGBT功率器件与叠层母排的搭接形式,使得母线电容上电流通过叠层母排能够以较短的路径达到IGBT功率器件,提升了产品性能,降低了产品成本。(The invention relates to an IGBT power module packaging structure and an IGBT power module adopting the packaging structure, wherein a wiring end is designed in the middle of a laminated busbar, and the lap joint form of an IGBT power device and the laminated busbar is optimized through the lap joint of a small copper bar and the IGBT power device, so that the current on a bus capacitor can reach the IGBT power device through the laminated busbar in a shorter path, the product performance is improved, and the product cost is reduced.)

1. The packaging structure of the IGBT power module is characterized by comprising a box body (1), a radiator (2), an IGBT power device (5), a laminated busbar (8), a busbar capacitor (9) and a connecting copper bar (7); wherein the content of the first and second substances,

the bus capacitor (9) is fixedly arranged on a base of the box body (1);

the laminated busbar (8) is tiled and covered on the busbar capacitor (9), a wiring end extends out of the middle of the laminated busbar, and the wiring end is connected with a wiring end of the IGBT power device (5) through a connecting copper bar (7);

the radiator (2) is arranged on the upper part of the bus capacitor (9) in a manner of being vertical to the laminated busbar;

and the IGBT power device (5) is fixedly arranged on the radiator (2).

2. The encapsulation structure according to claim 1, wherein the bus capacitor (9) is vertically fixed on a base of the box (1), and positive and negative electrodes of the bus capacitor are connected to the laminated busbar (8).

3. The encapsulation structure according to claim 2, characterized in that it further comprises a resistor (14);

and the resistor (14) is fixedly arranged on one surface of the radiator (2) opposite to the surface on which the IGBT power device (5) is arranged.

4. The package structure according to claim 3, further comprising an input-output copper bar (4);

the input and output copper bar (4) is connected with a wire outlet end on one side of the IGBT power device (5) far away from the laminated busbar (8) so as to lead the input and output end of the IGBT power module to the outside of the module.

5. The package structure according to claim 4, further comprising an IGBT driver board (11);

the IGBT driving board (11) is arranged on the IGBT power device (5).

6. The encapsulation structure according to claim 5, characterized in that it further comprises a drive interposer (10);

the driving adapter plate (10) is fixedly arranged on the inner side of the top of the box body (1) and is close to the IGBT driving plate (11).

7. The package structure according to claim 6, characterized in that it further comprises a power supply (13) and an SCE board (12);

the power supply (13) and the SCE board (12) are both arranged inside the box body (1).

8. An IGBT power module characterized in that the package structure according to any one of claims 1 to 7 is employed.

Technical Field

The invention relates to the technical field of power electronic devices, in particular to a packaging structure of an IGBT power module and the IGBT power module adopting the packaging structure.

Background

The power module is used as a core component for realizing functions of products such as a converter, an inverter and SVG in the power electronic industry, and the layout design of the whole cabinet body is often influenced by the scheme design, so that the function and the cost of the whole product are influenced.

In the prior art, the lap joint form of the laminated busbar for connecting the bus capacitor in the IGBT power module and the IGBT power device still stays at the edge extending pin of the laminated busbar to be directly connected with the terminal of the IGBT power device, or the overlapped busbar is bent to directly connect the edge extending pin with the IGBT power device, and the like, so that the structural form restricts the overall layout of the IGBT power module and mainly has the following defects:

(1) the arrangement mode in the prior art causes the size of the stacked row to be larger;

(2) the current walking path from the IGBT power module to the bus capacitor is long, so that the stray inductance is large;

(3) the problems of incompact internal structure, low space utilization rate and the like of the IGBT power module exist.

Disclosure of Invention

Based on the above situation in the prior art, the invention aims to design a novel IGBT power module on the basis of optimizing the lap joint form of the laminated busbar for connecting the bus capacitor and the IGBT power device, so as to improve the product performance and reduce the product cost.

In order to achieve the above object, according to an aspect of the present invention, there is provided an IGBT power module package structure, including a box 1, a heat sink 2, an IGBT power device 5, a laminated busbar 8, a busbar capacitor 9, and a connecting copper bar 7; wherein the content of the first and second substances,

the bus capacitor 9 is fixedly arranged on the base of the box body 1;

the laminated busbar 8 is tiled on the bus capacitor 9, the middle part of the laminated busbar extends out of a wiring end, and the wiring end is connected with a wiring end of the IGBT power device 5 through a connecting copper bar 7;

the radiator 2 is arranged on the upper part of the bus capacitor 9 in a manner of being vertical to the laminated busbar 8;

the IGBT power device 5 is fixedly disposed on the heat sink 2.

Further, the bus capacitor 9 is vertically and fixedly arranged on the base of the box body 1, and the positive electrode and the negative electrode of the bus capacitor are connected to the laminated busbar 8.

Further, the package structure further includes a resistor 14;

the resistor 14 is fixedly arranged on the surface of the radiator 2 opposite to the surface on which the IGBT power device 5 is arranged.

Further, the packaging structure further comprises an input/output copper bar 4;

the input and output copper bar 4 is connected with a wire outlet end on one side of the IGBT power device 5 far away from the laminated busbar 8 so as to lead the input and output end of the IGBT power module to the outside of the module.

Further, the packaging structure further comprises an IGBT driving board 11;

the IGBT driving board 11 is arranged on the IGBT power device 5.

Further, the package structure further includes a driving adapter plate 10;

the driving adapter plate 10 is fixedly arranged on the inner side of the top of the box body 1 and is close to the IGBT driving plate 11.

Further, the packaging structure further comprises a power supply 13 and an SCE board 12;

the power supply 13 and the SCE board 12 are both disposed inside the case 1.

According to another aspect of the present invention, there is provided an IGBT power module employing the package structure according to the first aspect of the present invention.

In summary, the invention provides an IGBT power module packaging structure and an IGBT power module using the same, wherein a wiring end is designed in the middle of a laminated busbar, and the small copper bar is lapped with an IGBT power device, so that the lapping form of the IGBT power device and the laminated busbar is optimized, and the current on a bus capacitor can reach the IGBT power device through the laminated busbar in a shorter path, thereby improving the product performance and reducing the product cost. The technical scheme of the invention can obtain the following beneficial technical effects:

(1) the product size is reduced, the external dimension of the power module with the same capacity is changed from the original 630 multiplied by 280 multiplied by 515 (unit: mm) to be: 623X 215X 512 (unit: mm).

(2) The size of the laminated busbar is reduced by 15%, the current path from the laminated busbar to the IGBT power device is reduced by 30mm, and the cost of the laminated busbar is reduced.

(3) The overall size of the IGBT power module is reduced, so that the size of the cabinet body is reduced by about 15%.

(4) The wiring of the IGBT power module is more reasonable and convenient, and the reliability of the electrical performance is greatly improved.

Drawings

FIG. 1 is a schematic diagram of an IGBT power module case frame of the present invention;

fig. 2 is a schematic structural diagram of a laminated busbar in the IGBT power module according to the present invention;

FIG. 3 is a general schematic diagram of the packaging structure of the IGBT power module of the invention;

FIG. 4 is a schematic view of the connection and the arrangement of the internal components of the IGBT power module;

fig. 5 is a schematic diagram of connection and vertical placement of internal components of the IGBT power module according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

Reference will first be made to the reference numerals referred to in the drawings: 1-a box body; 2-a radiator; 3-positive and negative terminals; 4-input/output copper bar; 5-IGBT power devices; 6-a radiator; 7-connecting copper bars; 8-laminated busbar; 9-bus capacitance; 10-driving the adapter plate; 11-a drive plate; 12-SCE plate; 13-a power supply; 14-resistance.

The technical solution of the present invention will be described in detail below with reference to the accompanying drawings. According to one embodiment of the invention, a packaging structure of an IGBT power module is provided. The IGBT power module generally comprises a box body 1, a radiator 2, an IGBT power device 5, a laminated busbar 8, a bus capacitor 9, a connecting copper bar 7, a power supply 13, a resistor 14, various board cards and the like. The box 1 is a basic frame forming an IGBT power module, and fig. 1 shows a schematic diagram of the box frame of the IGBT power module. The radiator 2 is fixed in the box body 1, and the IGBT power device 5 is fixed on the radiator 2; the bus capacitor 9 group is fixed on the base of the box body 1 and is connected with one side of the IGBT through the laminated busbar 8 and the connecting copper bar 7, the input and the output of the IGBT power device 5 are led out by the copper bar and are used as the input end and the output end of the module, and various board cards are distributed and installed in the box body 1. In order to optimize the internal layout of the existing module, the packaging structure provided in this embodiment designs a novel IGBT power module on the basis of optimizing the lap joint form of the laminated busbar 8 connecting the bus capacitor 9 in the IGBT power module and the IGBT power device 5. Fig. 3 shows an overall schematic diagram of a packaging structure of the IGBT power module, and fig. 2 shows a schematic diagram of a structure of the laminated busbar 8. The packaging structure of the IGBT power module comprises a box body 1, a radiator 2, an IGBT power device 5, a laminated busbar 8, a bus capacitor 9 and a connecting copper bar 7.

And the bus capacitor 9 is vertically and fixedly arranged on the base of the box body 1, and the positive electrode and the negative electrode of the bus capacitor are connected to the laminated busbar 8.

The laminated busbar 8 is tiled on the bus capacitor 9, the middle part of the laminated busbar extends out of a wiring end, and the wiring end is connected with a wiring end of the IGBT power device 5 through a connecting copper bar 7. The design that the middle part of the laminated busbar 8 directly extends out of the wiring terminal is an important design point of the embodiment, so that the radiator 2 can be arranged on the left side of the module (as shown in figure 3) to the maximum extent, the right space of the module is reserved, and the IGBT power device 5 and other board cards are arranged; in addition, the structure also shortens a current path from the IGBT power device 5 to the laminated busbar 8, and stray inductance is reduced.

The heat radiator 2 is arranged on the upper part of the bus capacitor 9 perpendicular to the laminated busbar 8. The IGBT power device 5 is fixedly disposed on the heat sink 2. The packaging structure further comprises a resistor 14, and the resistor 14 is fixedly arranged on the surface, opposite to the surface on which the IGBT power device 5 is arranged, of the radiator 2. Through this kind of structural design, guaranteed the heat dissipation demand of IGBT and electric capacity respectively.

The packaging structure further comprises an input and output copper bar 4, wherein the input and output copper bar 4 is connected with a leading-out terminal on one side, far away from the laminated busbar 8, of the IGBT power device 5 so as to lead the input and output terminal of the IGBT power module to the outside of the module.

Fig. 4 and 5 further show a horizontal connection schematic diagram and a vertical connection schematic diagram of the internal components of the IGBT power module according to the present invention, respectively. The packaging structure further comprises an IGBT drive board 11 and a drive adapter board 10, wherein the IGBT drive board 11 is arranged on the IGBT power device 5. The driving adapter plate 10 is fixedly arranged on the inner side of the top of the box body 1 and is close to the IGBT driving plate 11. The packaging structure further comprises a power supply 13 and an SCE board 12, wherein the power supply 13 and the SCE board 12 are both arranged inside the box body 1. The specific arrangement of the modules and the board card can refer to fig. 4 and 5.

According to another embodiment of the present invention, there is provided an IGBT power module employing the package structure according to the first embodiment of the present invention. The IGBT power module provided by the present invention can be installed according to the following steps:

step 1, fixing a bus capacitor in a corresponding mounting hole of a box body 1;

step 2, assembling the radiator 2 into the frame of the box body 1;

step 3, assembling the IGBT power device 5 on the radiator 2;

step 4, fixing the laminated busbar 8 on the bus capacitor;

step 5, connecting the laminated busbar 8 with the IGBT power device 5 through connecting small copper bars;

step 6, inserting the IGBT driving board 11 onto the IGBT power device 5;

step 7, installing an input/output copper bar 4;

step 8, mounting various board cards such as a driving board 11 and the like, a power supply 13, a resistor 14 and the like;

and 9, connecting various cables to complete wiring.

In summary, the invention relates to an IGBT power module packaging structure and an IGBT power module adopting the packaging structure, wherein a wiring terminal extends out of the middle part of a laminated busbar, and the small copper bar is lapped with an IGBT power device, so that the lapping form of the IGBT power device and the laminated busbar is optimized, the current on a bus capacitor can reach the IGBT power device through the laminated busbar in a shorter path, the product performance is improved, and the product cost is reduced.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.