Embossing die and embossing process

文档序号:930387 发布日期:2021-03-05 浏览:29次 中文

阅读说明:本技术 一种压花模具及压花工艺 (Embossing die and embossing process ) 是由 江东干 于 2020-11-27 设计创作,主要内容包括:本申请公开了一种压花模具及压花工艺,包括:上模机构,所述上模机构包括上模座、上垫板、上夹板、上脱板、上模板、上模弹簧、上模顶料销组件和上模等高套筒,所述上垫板安装在所述上模座的下侧,所述上夹板安装在所述上垫板的下侧,所述上脱板安装在所述上夹板的下侧,所述上脱板设置为环状结构,所述上模板设置在所述上脱板的内部,所述上模板和所述上脱板之间设置有间隙,所述上模弹簧设置在所述上夹板和上模板之间,所述上模等高套筒连接在所述上夹板和上脱板之间,所述上模板下侧设置有型芯;所述上模顶料销组件设置在所述上模座上。本方案通过冷挤压的方式印花,生产效率高,并对环境无污染,安全和干净。(The application discloses knurling mould and knurling technology includes: the upper die mechanism comprises an upper die base, an upper base plate, an upper clamping plate, an upper stripping plate, an upper die spring, an upper die ejector pin component and an upper die equal-height sleeve, wherein the upper base plate is installed on the lower side of the upper die base, the upper clamping plate is installed on the lower side of the upper base plate, the upper stripping plate is installed on the lower side of the upper clamping plate, the upper stripping plate is of an annular structure, the upper die plate is arranged inside the upper stripping plate, a gap is formed between the upper die plate and the upper stripping plate, the upper die spring is arranged between the upper clamping plate and the upper die plate, the upper die equal-height sleeve is connected between the upper clamping plate and the upper stripping plate, and a core is arranged on the lower side of the; the upper die ejector pin assembly is arranged on the upper die base. The pattern printing is carried out in a cold extrusion mode, the production efficiency is high, and the pattern printing machine is pollution-free, safe and clean to the environment.)

1. An embossing die, comprising:

the upper die mechanism comprises an upper die base, an upper base plate, an upper clamping plate, an upper stripping plate, an upper die spring, an upper die ejector pin component and an upper die equal-height sleeve, wherein the upper base plate is installed on the lower side of the upper die base, the upper clamping plate is installed on the lower side of the upper base plate, the upper stripping plate is installed on the lower side of the upper clamping plate, the upper stripping plate is of an annular structure, the upper die plate is arranged inside the upper stripping plate, a gap is formed between the upper die plate and the upper stripping plate, the upper die spring is arranged between the upper clamping plate and the upper die plate, the upper die equal-height sleeve is connected between the upper clamping plate and the upper stripping plate, and a core is arranged on the lower side of the; the upper die liftout pin assembly is arranged on the upper die base and penetrates through the upper base plate, the upper clamping plate and the upper die plate;

the lower die mechanism comprises a lower die base, a lower backing plate, a lower die plate, a lower stripper plate, a lower equal-height sleeve and a lower die ejector pin assembly; the lower bolster fixed connection be in the upside of die holder, the lower bolster is installed the lower bolster upside, the lower bolster sets up to the annular plate, it is in to take off the board setting down the inside of lower bolster, take off down the board with through lower equal height muffjoint between the lower bolster, it is provided with the lower mould spring down to take off between board and the lower bolster, lower mould knock-pin subassembly sets up on the die holder, lower mould knock-pin subassembly runs through the lower bolster with take off the board down.

2. The embossing die as claimed in claim 1, wherein the upper die mechanism further includes an upper die punch provided on a lower side of the upper backing plate, the upper die punch penetrating the upper clamping plate and the upper stripper plate.

3. The embossing die of claim 1, wherein a lower cushion block is fixedly connected to the lower side of the lower die holder, and a lower supporting plate is fixedly connected to the lower side of the lower cushion block.

4. The embossing die as claimed in claim 3, wherein the lower cushion block has a blind hole formed at one side thereof.

5. The embossing die of claim 1, wherein a guide post is fixedly connected to the lower surface of the upper stripper plate, a guide sleeve is arranged in the lower die plate, and the guide post and the guide sleeve are in sliding fit.

6. The embossing die as claimed in claim 1, wherein the upper die ejector pin assembly includes an upper sleeve, an upper compression spring and an upper ejector rod, the upper sleeve is fixedly connected with the upper die base, the upper compression spring is disposed in the upper sleeve, the upper ejector rod is slidably disposed in the upper sleeve, and an upper end of the upper ejector rod is engaged with the upper compression spring.

7. The embossing die of claim 1, wherein the lower die ejector pin assembly comprises a lower sleeve, a lower compression spring and a lower ejector rod, the lower sleeve is fixedly connected with the lower die base, the lower compression spring is arranged in the lower sleeve, the lower ejector rod is slidably arranged in the lower sleeve, and the lower end of the lower ejector rod is attached to the lower compression spring.

8. The embossing die of claim 1, wherein the lower backing plate is provided with a lower die screw hole.

9. The embossing die of claim 1, wherein an outer positioning block is arranged between the upper stripper plate and the lower stripper plate.

10. An embossing process of an embossing die, which is characterized by comprising the following steps:

s1, a workpiece to be machined is placed on a lower die holder, an external power mechanism drives an upper die holder to move downwards, the upper die holder sequentially drives an upper base plate and an upper clamping plate to move downwards, the upper die plate is in contact with the upper surface of the workpiece, the upper die holder continuously moves downwards, an upper die spring is compressed, the upper clamping plate is attached to the upper die plate, the upper clamping plate pushes the upper die plate to move downwards to press the workpiece, meanwhile, the workpiece is removed downwards, the horizontal height of the upper side of the lower removing plate is equal to the horizontal height of the upper side of the lower die plate, so that a mold core extrudes the workpiece, and three-dimensional patterns are extruded;

s2, an external power mechanism drives an upper die holder to move upwards to drive the upper die holder to move upwards, an upper die ejector pin component pushes a workpiece downwards to separate the workpiece from an upper die plate, after extrusion is finished, a lower die spring extends to drive a lower stripper plate to jack the workpiece, so that the lower surface of the workpiece is separated from a lower die holder, and the lower die ejector pin component pushes the workpiece upwards to separate the lower surface of the workpiece from the lower stripper plate, so that demoulding is realized;

s3, performing surface treatment on the embossed workpiece to enable the surface of the workpiece to be colored, and effectively protecting patterns from being damaged in the using process.

Technical Field

The application relates to the technical field of dies, in particular to an embossing die and an embossing process.

Background

At present, if the industry needs to realize the appearance three-dimensional pattern, the product has three-dimensional grains and hand feeling by adopting an etching mode, but the etching mode adopts a chemical corrosion mode because of the problems of environmental pollution and yield, the use of strong acid and alkali pollutes the environment, and the appearance effect can not be produced in batches.

Disclosure of Invention

The present application provides an embossing mold and an embossing process to solve the problems of the related art.

In order to achieve the above object, the present application provides an embossing die comprising:

the upper die mechanism comprises an upper die base, an upper base plate, an upper clamping plate, an upper stripping plate, an upper die spring, an upper die ejector pin component and an upper die equal-height sleeve, wherein the upper base plate is installed on the lower side of the upper die base, the upper clamping plate is installed on the lower side of the upper base plate, the upper stripping plate is installed on the lower side of the upper clamping plate, the upper stripping plate is of an annular structure, the upper die plate is arranged inside the upper stripping plate, a gap is formed between the upper die plate and the upper stripping plate, the upper die spring is arranged between the upper clamping plate and the upper die plate, the upper die equal-height sleeve is connected between the upper clamping plate and the upper stripping plate, and a core is arranged on the lower side of the; the upper die liftout pin assembly is arranged on the upper die base and penetrates through the upper base plate, the upper clamping plate and the upper die plate;

the lower die mechanism comprises a lower die base, a lower backing plate, a lower die plate, a lower stripper plate, a lower equal-height sleeve and a lower die ejector pin assembly; the lower bolster fixed connection be in the upside of die holder, the lower bolster is installed the lower bolster upside, the lower bolster sets up to the annular plate, it is in to take off the board setting down the inside of lower bolster, take off down the board with through lower equal height muffjoint between the lower bolster, it is provided with the lower mould spring down to take off between board and the lower bolster, lower mould knock-pin subassembly sets up on the die holder, lower mould knock-pin subassembly runs through the lower bolster with take off the board down.

In an embodiment of the present invention, the upper die mechanism further includes an upper die punch disposed on a lower side of the upper backing plate, and the upper die punch penetrates through the upper clamping plate and the upper stripper plate.

In one embodiment of the invention, a lower cushion block is fixedly connected to the lower side of the lower die holder, and a lower supporting plate is fixedly connected to the lower side of the lower cushion block.

In an embodiment of the present invention, a blind hole is formed at one side of the lower pad.

In an embodiment of the invention, a guide pillar is fixedly connected to the lower surface of the upper stripper plate, a guide sleeve is arranged in the lower die plate, and the guide pillar and the guide sleeve are in sliding fit.

In an embodiment of the invention, the upper die ejector pin assembly comprises an upper sleeve, an upper compression spring and an upper ejector rod, the upper sleeve is fixedly connected with the upper die base, the upper compression spring is arranged in the upper sleeve, the upper ejector rod is slidably arranged in the upper sleeve, and the upper end of the upper ejector rod is attached to the upper compression spring.

In an embodiment of the invention, the lower die ejector pin assembly comprises a lower sleeve, a lower compression spring and a lower ejector rod, the lower sleeve is fixedly connected with the lower die base, the lower compression spring is arranged in the lower sleeve, the lower ejector rod is slidably arranged in the lower sleeve, and the lower end of the lower ejector rod is attached to the lower compression spring.

In an embodiment of the present invention, the lower backing plate is provided with a lower die screw hole.

In an embodiment of the invention, an outer positioning block is arranged between the upper stripper plate and the lower template.

An embossing process of an embossing die, comprising the steps of:

s1, a workpiece to be machined is placed on a lower die holder, an external power mechanism drives an upper die holder to move downwards, the upper die holder sequentially drives an upper base plate and an upper clamping plate to move downwards, the upper die plate is in contact with the upper surface of the workpiece, the upper die holder continuously moves downwards, an upper die spring is compressed, the upper clamping plate is attached to the upper die plate, the upper clamping plate pushes the upper die plate to move downwards to press the workpiece, meanwhile, the workpiece is removed downwards, the horizontal height of the upper side of the lower removing plate is equal to the horizontal height of the upper side of the lower die plate, so that a mold core extrudes the workpiece, and three-dimensional patterns are extruded;

s2, an external power mechanism drives an upper die holder to move upwards to drive the upper die holder to move upwards, an upper die ejector pin component pushes a workpiece downwards to separate the workpiece from an upper die plate, after extrusion is finished, a lower die spring extends to drive a lower stripper plate to jack the workpiece, so that the lower surface of the workpiece is separated from a lower die holder, and the lower die ejector pin component pushes the workpiece upwards to separate the lower surface of the workpiece from the lower stripper plate, so that demoulding is realized;

s3, performing surface treatment on the embossed workpiece to enable the surface of the workpiece to be colored, and effectively protecting patterns from being damaged in the using process.

In the embodiment of the application, an embossing process of an embossing die is provided, a workpiece to be processed is placed on a lower die base, an external power mechanism drives an upper die base to move downwards, the upper die base sequentially drives an upper base plate and an upper clamping plate to move downwards, so that the upper die plate contacts the upper surface of the workpiece, the upper die base continuously moves downwards, an upper die spring is compressed, the upper clamping plate is attached to the upper die plate, the upper clamping plate pushes the upper die plate to move downwards to press the workpiece, meanwhile, the workpiece is removed downwards, the horizontal height of the upper side of the lower removal plate is equal to the horizontal height of the upper side of the lower die plate, a mold core extrudes the workpiece, and three-dimensional patterns are extruded; an external power mechanism drives an upper die base to move upwards to drive the upper die base to move upwards, an upper die ejector pin component pushes a workpiece downwards so as to separate the workpiece from an upper die plate, after extrusion is finished, a lower die spring extends to drive a lower stripper plate to jack the workpiece so as to separate the lower surface of the workpiece from a lower die base, and the lower die ejector pin component pushes the workpiece upwards so as to separate the lower surface of the workpiece from the lower stripper plate, so that demoulding is realized; carrying out surface treatment on the embossed workpiece to enable the surface of the workpiece to be colored, and effectively protecting the patterns from being damaged in the using process; the printing is carried out in a cold extrusion mode, the production efficiency is high, and the printing die is pollution-free, safe and clean to the environment.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:

FIG. 1 is a schematic front view of an embossing die provided in accordance with an embodiment of the present application;

FIG. 2 is a schematic bottom view of an embossing die provided in accordance with an embodiment of the present application;

FIG. 3 is a schematic top view of an upper die base of an embossing die provided according to an embodiment of the present application;

FIG. 4 is a schematic top view of a lower bolster plate of an embossing die provided in accordance with an embodiment of the present application;

FIG. 5 is a schematic top view of a lower die base of an embossing die provided in accordance with an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of an upper die ejector pin assembly of an embossing die provided in accordance with an embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of a lower die ejector pin assembly of an embossing die provided in accordance with an embodiment of the present application.

In the figure: 1. an upper die mechanism; 11. an upper die holder; 12. an upper base plate; 13. an upper splint; 14. an upper stripping plate; 15. mounting a template; 151. a core; 16. an upper die spring; 17. an upper die ejector pin assembly; 18. an upper die equal-height sleeve; 2. a lower die mechanism; 21. a lower die holder; 22. a lower base plate; 23. a lower template; 24. removing the plate; 25. a lower equal-height sleeve; 26. a lower die lifter pin assembly; 27. a lower die spring; 19. an upper die punch; 28. a lower cushion block; 29. a lower supporting plate; 141. a guide post; 231. a guide sleeve; 171. an upper sleeve; 172. an upper compression spring; 173. an ejector rod is arranged; 261. a lower sleeve; 262. a lower compression spring; 263. a lower ejector rod; 3. and an outer positioning block.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

In addition, the term "plurality" shall mean two as well as more than two.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Example 1

Referring to fig. 1-7, the present application provides an embossing die, which includes an upper die mechanism 1 and a lower die mechanism 2.

The upper die mechanism 1 comprises an upper die base 11, an upper padding plate 12, an upper clamping plate 13, an upper stripper plate 14, an upper die plate 15, an upper die spring 16, an upper die ejector pin assembly 17 and an upper die equal-height sleeve 18, wherein the upper padding plate 12 is installed on the lower side of the upper die base 11, the upper clamping plate 13 is installed on the lower side of the upper padding plate 12, the upper stripper plate 14 is installed on the lower side of the upper clamping plate 13, the upper stripper plate 14 is of an annular structure, the upper die plate 15 is arranged inside the upper stripper plate 14, a gap is formed between the upper die plate 15 and the upper stripper plate 14, the upper die spring 16 is arranged between the upper clamping plate 13 and the upper die plate 15, the upper die equal-height sleeve 18 is connected between the upper clamping; an upper die ejector pin assembly 17 is arranged on the upper die base 11, and the upper die ejector pin assembly 17 penetrates through the upper base plate 12, the upper clamping plate 13 and the upper die plate 15;

the upper die mechanism 1 further includes an upper die punch 19, the upper die punch 19 is disposed on the lower side of the upper shim plate 12, and the upper die punch 19 penetrates the upper clamp plate 13 and the upper stripper plate 14.

The lower surface of the upper stripper plate 14 is fixedly connected with a guide post 141, a guide sleeve 231 is arranged in the lower template 23, and the guide post 141 and the guide sleeve 231 are in sliding fit.

The upper mold ejector pin assembly 17 includes an upper sleeve 171, an upper compression spring 172, and an upper ejector rod 173, the upper sleeve 171 is fixedly connected to the upper mold base 11, the upper compression spring 172 is disposed in the upper sleeve 171, the upper ejector rod 173 is slidably disposed in the upper sleeve 171, and the upper end of the upper ejector rod 173 is attached to the upper compression spring 172.

The lower die mechanism 2 comprises a lower die base 21, a lower backing plate 22, a lower die plate 23, a lower stripper plate 24, a lower equal-height sleeve 25 and a lower die ejector pin assembly 26; lower bolster 22 fixed connection is in the upside of die holder 21, lower bolster 23 is installed at lower bolster 22 upside, lower bolster 23 sets up to the annular plate, lower stripper plate 24 sets up the inside at lower bolster 23, lower stripper plate 24 and lower bolster 22 are connected through lower equal-height sleeve 25, lower stripper plate 24 and lower bolster 22 are provided with lower mould spring 27 between, lower mould liftout round pin subassembly 26 sets up on lower die holder 21, lower mould liftout round pin subassembly 26 runs through lower bolster 22 and lower stripper plate 24.

The lower die holder 21 downside fixedly connected with lower cushion 28, lower cushion 28 downside fixedly connected with bottom plate 29, lower cushion 28 one side has seted up the blind hole.

The lower die ejector pin assembly 26 comprises a lower sleeve 261, a lower compression spring 262 and a lower ejector rod 263, wherein the lower sleeve 261 is fixedly connected with the lower die base 21, the lower compression spring 262 is arranged in the lower sleeve 261, the lower ejector rod 263 is arranged in the lower sleeve 261 in a sliding mode, and the lower end of the lower ejector rod 263 is attached to the lower compression spring 262.

The lower backing plate 22 is provided with a lower die screw hole.

An outer positioning block 3 is arranged between the upper stripping plate 14 and the lower template 23.

An embossing process of an embossing die, comprising the steps of:

s1, a workpiece to be machined is placed on a lower die holder, an external power mechanism drives an upper die holder to move downwards, the upper die holder sequentially drives an upper base plate and an upper clamping plate to move downwards, the upper die plate is in contact with the upper surface of the workpiece, the upper die holder continuously moves downwards, an upper die spring is compressed, the upper clamping plate is attached to the upper die plate, the upper clamping plate pushes the upper die plate to move downwards to press the workpiece, meanwhile, the workpiece is removed downwards, the horizontal height of the upper side of the lower removing plate is equal to the horizontal height of the upper side of the lower die plate, so that a mold core extrudes the workpiece, and three-dimensional patterns are extruded;

s2, an external power mechanism drives an upper die holder to move upwards to drive the upper die holder to move upwards, an upper die ejector pin component pushes a workpiece downwards to separate the workpiece from an upper die plate, after extrusion is finished, a lower die spring extends to drive a lower stripper plate to jack the workpiece, so that the lower surface of the workpiece is separated from a lower die holder, and the lower die ejector pin component pushes the workpiece upwards to separate the lower surface of the workpiece from the lower stripper plate, so that demoulding is realized;

s3, performing surface treatment on the embossed workpiece to enable the surface of the workpiece to be colored, and effectively protecting patterns from being damaged in the using process.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

12页详细技术资料下载
上一篇:一种医用注射器针头装配设备
下一篇:一种即时制造纪念章的方法及设备

网友询问留言

已有0条留言

还没有人留言评论。精彩留言会获得点赞!

精彩留言,会给你点赞!