阅读说明：本技术 振动器件 (Vibration device ) 是由 小仓诚一郎 山口启一 西泽龙太 于 2020-08-27 设计创作，主要内容包括：提供振动器件,其具有优异的检测特性。该振动器件包含振动元件、基座和相对于基座支承振动元件的支承件。另外,从所述支承件的厚度方向俯视时,支承件具有框状的框架、配置在框架的外侧并固定于基座的底座、配置在框架的内侧并搭载有振动元件的元件保持架、从元件保持架起沿第1方向延伸并连接元件保持架和框架的一对第1梁、以及从框架起沿与第1方向不同的第2方向延伸并连接框架和底座的一堆第2梁。并且,在俯视时,将第1梁在第1方向上的长度设为L1(μm)、第1梁在与第1方向垂直的方向上的宽度W设为W1(μm)时,满足W1~2/L1＜30。(Provided is a vibration device having excellent detection characteristics. The vibration device includes a vibration element, a base, and a support that supports the vibration element with respect to the base. The support member has a frame shaped frame, a base fixed to the base and disposed outside the frame, an element holder disposed inside the frame and carrying the vibration element, a pair of first beams 1 extending from the element holder in a 1 st direction and connecting the element holder and the frame, and a pair of first beams 2 extending from the frame in a 2 nd direction different from the 1 st direction and connecting the frame and the base, when viewed in plan from the thickness direction of the support member. And, in the depressionWhen the length of the 1 st beam in the 1 st direction is L1(μm) and the width W of the 1 st beam in the direction perpendicular to the 1 st direction is W1(μm), W1 is satisfied 2 /L1＜30。)

1. A vibration device, characterized by having:

a vibration element that detects vibration based on a physical quantity around a detection axis;

a base; and

a support member that supports the vibration element with respect to the base,

the support member has, when viewed from a thickness direction of the support member:

a frame-shaped frame;

a base which is disposed outside the frame and fixed to the base;

an element holder which is disposed inside the frame and on which the vibration element is mounted;

a pair of 1 st beams extending from the component holder in a 1 st direction to connect the component holder and the frame; and

a pair of 2 nd beams extending from the frame in a 2 nd direction different from the 1 st direction to connect the frame and the base,

when the length of the 1 st beam in the 1 st direction is L1 μm and the width W of the 1 st beam in the direction perpendicular to the 1 st direction is W1 μm in the plan view, the following conditions are satisfied:

W1²/L1＜30。

2. the vibration device according to claim 1, wherein the vibration device satisfies:

W1²/L1＜12.5。

3. the vibration device according to claim 1 or 2,

when 3 axes perpendicular to each other are set as the a axis, the B axis and the C axis,

the thickness direction of the support member is along the C-axis,

the vibration element has:

an element base fixed to the element holder;

a pair of detection arms extending from the element base along the B axis;

a pair of connecting arms extending from said element base along said A axis;

a pair of driving arms extending from a distal end of one of the connecting arms along the B-axis; and

a pair of drive arms extending from the distal end of the other of said link arms along said B axis.

4. The vibration device of claim 3,

the 1 st direction is along the a-axis,

the 2 nd direction is along the B axis.

5. The vibration device of claim 3,

the component holder and the component base have the same shape in a plan view viewed in a direction along the C-axis.

6. The vibration device of claim 1,

the support member having a pair of 3 rd beams, the 3 rd beam extending from the frame in the 1 st direction and connecting the frame and the base,

the pair of 3 rd beams and the pair of 1 st beams are arranged on a straight line.

Technical Field

The present invention relates to a vibration device.

Background

Patent document 1 describes a vibration device including a circuit element, a vibration element, and a relay substrate for fixing the vibration element to the circuit element. The relay board has a gimbal (gimbal) structure, and includes a frame-shaped 1 st portion fixed to the circuit element, a frame-shaped 2 nd portion arranged inside the 1 st portion, a 3 rd portion arranged inside the 2 nd portion and fixed with the vibration element, a 1 st beam connecting the 1 st portion and the 2 nd portion, and a 2 nd beam connecting the 2 nd portion and the 3 rd portion. With such a relay board, transmission of stress to the vibration element is suppressed. Further, patent document 2 describes a structure in which a gyro element is supported above a TAB substrate by inner leads as a support structure for the gyro element.

Patent document 1: japanese patent laid-open publication No. 2019-102858

Patent document 2: japanese patent laid-open publication No. 2017-026336

When the gyro element described in patent document 2 is mounted on the gimbal-like relay substrate described in patent document 1 in place of the support structure described in the document, the rigidity of the 2 nd beam about the Z axis, that is, the detection axis of the gyro element becomes excessively high depending on the size of the 2 nd beam. If the rigidity of the 2 nd beam around the Z axis becomes too high, the detection vibration of the gyro element is hindered, and the detection sensitivity of the gyro element may be lowered.

Disclosure of Invention

The vibration device of the present application example is characterized by having: a vibration element that detects vibration based on a physical quantity around a detection axis; a base; and a support that supports the vibration element with respect to the base, the support having, when viewed from above in a thickness direction of the support: a frame-shaped frame; a base which is disposed outside the frame and fixed to the base; an element holder which is disposed inside the frame and on which the vibration element is mounted; a pair of 1 st beams extending from the component holder in a 1 st direction to connect the component holder and the frame; and a pair of 2 nd beams extending from the frame along the same direction as the frameA 2 nd direction different from the 1 st direction, the frame and the base being connected to each other, and satisfying W1 when a length of the 1 st beam in the 1 st direction is L1 [ mu ] m and a width W of the 1 st beam in a direction perpendicular to the 1 st direction is W1 [ mu ] m in the plan view²/L1＜30。

In the vibration device of the present application example, it is preferable that: w1²/L1＜12.5。

In the vibration device of the present application example, it is preferable that the thickness direction of the support is along a C-axis when 3 axes perpendicular to each other are set as the a-axis, the B-axis, and the C-axis, and the vibration element includes: an element base fixed to the element holder; a pair of detection arms extending from the element base along the B axis; a pair of connecting arms extending from said element base along said A axis; a pair of driving arms extending from a distal end of one of the connecting arms along the B-axis; and a pair of driving arms extending from the end of the other of the connecting arms along the B-axis.

In the vibration device of the present application example, it is preferable that the 1 st direction is along the a axis and the 2 nd direction is along the B axis.

In the vibration device of the present application example, it is preferable that the element holder and the element base have the same shape in a plan view viewed in a direction along the C axis.

In the vibration device of the present application example, it is preferable that the support has a pair of 3 rd beams, the 3 rd beam extending from the frame in the 1 st direction and connecting the frame and the base, and the pair of 3 rd beams and the pair of 1 st beams are arranged on a straight line.

Drawings

Fig. 1 is a sectional view showing a vibration device of embodiment 1.

Fig. 2 is a plan view illustrating the vibration device of fig. 1.

Fig. 3 is a plan view showing a vibration element provided in the vibration device of fig. 1.

Fig. 4 is a sectional view taken along line D-D in fig. 3.

Fig. 5 is a sectional view taken along line E-E in fig. 3.

Fig. 6 is a schematic diagram illustrating driving of the vibration element of fig. 3.

Fig. 7 is a schematic diagram illustrating driving of the vibration element of fig. 3.

Fig. 8 is a top view of the support.

FIG. 9 shows W1²Graph of the relationship between/L1 and sensitivity.

Fig. 10 is a plan view of the vibration device of embodiment 2.

Fig. 11 is a plan view of a support member provided in the vibration device of embodiment 3.

Description of the reference symbols

1: a vibrating device; 2: packaging; 21: a base; 211. 211a to 211 c: a recess; 22: a cover; 23: an engaging member; 241. 242: an internal terminal; 243: an external terminal; 3: a circuit element; 4: a support member; 41: a frame; 411 to 414: a rim portion; 42: a base; 421 to 424: a rim portion; 43: a component holder; 44: a 1 st beam; 45: a 2 nd beam; 46: a 3 rd beam; 6: a vibrating element; 7: vibrating the substrate; 70: an element base; 701-706: a terminal; 71. 72: a detection arm; 73. 74: a connecting arm; 75-78: a drive arm; 8: an electrode; 81: a drive signal electrode; 82: driving a ground electrode; 83: 1 st detection signal electrode; 84: 1 st detection ground electrode; 85: a 2 nd detection signal electrode; 86: the 2 nd detection ground electrode; a. b: an arrow; b1, B2: an engaging member; BW: a bonding wire; la: an imaginary straight line; lb: an imaginary straight line; l1, L2: a length; o: a center; s: an interior space; w1, W2: a width; ω c: the angular velocity.

Detailed Description

Hereinafter, a vibration device according to the present application example will be described in detail based on embodiments shown in the drawings.

< embodiment 1 >

Fig. 1 is a sectional view showing a vibration device of embodiment 1. Fig. 2 is a plan view illustrating the vibration device of fig. 1. Fig. 3 is a plan view showing a vibration element provided in the vibration device of fig. 1. FIG. 4 is a view taken along line D-D in FIG. 3Cross-sectional view of (a). Fig. 5 is a sectional view taken along line E-E in fig. 3. Fig. 6 and 7 are schematic views illustrating driving of the vibration element of fig. 3. Fig. 8 is a top view of the support. FIG. 9 shows W1²Graph of the relationship between/L1 and sensitivity.

In addition, for convenience of explanation, 3 axes perpendicular to each other, i.e., an a axis, a B axis, and a C axis, are shown in fig. 1 to 8. Hereinafter, the arrow end side of each axis is also referred to as "positive side", and the opposite side is also referred to as "negative side". Also, the positive side and the negative side are also referred to as "both sides". In addition, the positive side of the C axis is also referred to as "up", and the negative side is also referred to as "down". In addition, a plan view from the thickness direction of the support 4, that is, the direction along the C axis is also simply referred to as a "plan view".

The vibration device 1 shown in fig. 1 is a physical quantity sensor that detects an angular velocity ω C about the C-axis as a detection axis. In this way, by using the vibration device 1 as a physical quantity sensor, the vibration device 1 can be mounted on a wide range of electronic apparatuses, and a highly convenient vibration device 1 having a high demand can be obtained. Such a vibration device 1 has a package 2, a circuit element 3 housed in the package 2, a support 4, and a vibration element 6.

The package 2 has: a base 21 having a concave portion 211 opened on an upper surface; and a cover 22 which closes the opening of the concave portion 211 and is engaged with the upper surface of the base 21 via an engaging member 23. An internal space S is formed inside the package 2 by the concave portion 211, and the circuit element 3, the carrier 4, and the vibration element 6 are housed in the internal space S. For example, the base 21 may be made of ceramic such as alumina, and the lid 22 may be made of a metal material such as kovar. However, the material of the base 21 and the cover 22 is not particularly limited.

The internal space S is airtight and is in a reduced pressure state, preferably in a state closer to vacuum. This reduces viscous resistance, and improves the vibration characteristics of the vibration element 6. However, the environment of the internal space S is not particularly limited, and may be, for example, an atmospheric pressure state or a pressurized state.

The concave portion 211 is formed of a plurality of concave portions, and includes a concave portion 211a that opens on the upper surface of the base 21, a concave portion 211b that opens on the bottom surface of the concave portion 211a and has an opening width smaller than that of the concave portion 211a, and a concave portion 211c that opens on the bottom surface of the concave portion 211b and has an opening width smaller than that of the concave portion 211 b. Further, a support 4 is fixed to the bottom surface of concave portion 211a in a state of supporting vibration element 6, and circuit element 3 is fixed to the bottom surface of concave portion 211 c.

As shown in fig. 2, in the internal space S, the vibration element 6, the support 4, and the circuit element 3 are arranged to overlap each other in a plan view. In other words, the vibration element 6, the support 4, and the circuit element 3 are arranged along the C axis. This can suppress planar expansion of the package 2 in the direction along the a axis and the direction along the B axis, and can realize miniaturization of the vibration device 1. Further, the support 4 is located between the vibration element 6 and the circuit element 3, and supports the vibration element 6 from the lower side, i.e., the C-axis negative side.

As shown in fig. 1 and 2, a plurality of internal terminals 241 are disposed on the bottom surface of concave portion 211a, a plurality of internal terminals 242 are disposed on the bottom surface of concave portion 211b, and a plurality of external terminals 243 are disposed on the bottom surface of base 21. These internal terminals 241, 242 and external terminal 243 are electrically connected via a wiring, not shown, formed in the base 21. The internal terminal 241 is electrically connected to the vibration element 6 via conductive bonding members B1 and B2 and the support 4, and the internal terminal 242 is electrically connected to the circuit element 3 via a bonding wire BW.

The vibration element 6 is an angular velocity sensor element that detects an angular velocity ω C about the C axis as a detection axis, as a physical quantity sensor element. As shown in fig. 3, the vibration element 6 includes a vibration substrate 7 and an electrode 8 disposed on a surface of the vibration substrate 7. The vibration substrate 7 is formed of a Z-cut quartz substrate. The Z-cut quartz substrate has an extension in an X-Y plane defined by a crystal axis of quartz, i.e., an X axis as an electrical axis and a Y axis as a mechanical axis, and a thickness in a direction along the Z axis as an optical axis.

The vibration substrate 7 includes: an element base 70 located at the center portion; a pair of detection arms 71, 72 extending from the element base 70 to both sides in the direction along the B axis; a pair of connecting arms 73, 74 extending from the element base 70 to both sides in the direction along the a axis; a pair of drive arms 75, 76 extending from the distal end of the connecting arm 73 to both sides in the direction along the B axis; and a pair of drive arms 77, 78 extending from the distal end of the connecting arm 74 to both sides in the direction along the B axis. By using the vibration substrate 7 of such a shape, the vibration element 6 having excellent vibration balance can be obtained.

As shown in fig. 4 and 5, the driving arms 75 to 78 have a groove opened on the upper surface and a groove opened on the lower surface, and have a substantially H-shaped cross section. The detection arms 71 and 72 may have a groove opened in the upper surface and a groove opened in the lower surface, and may have a substantially H-shaped cross section.

As shown in fig. 3, the electrode 8 has a driving signal electrode 81, a driving ground electrode 82, a 1 st detection signal electrode 83, a 1 st detection ground electrode 84, a 2 nd detection signal electrode 85, and a 2 nd detection ground electrode 86. The driving signal electrodes 81 are disposed on both side surfaces of the driving arms 75, 76 and on upper and lower surfaces of the driving arms 77, 78. On the other hand, the driving ground electrodes 82 are disposed on the upper and lower surfaces of the driving arms 75, 76 and on both side surfaces of the driving arms 77, 78. The 1 st detection signal electrode 83 is disposed on the upper surface and the lower surface of the detection arm 71, and the 1 st detection ground electrode 84 is disposed on both side surfaces of the detection arm 71. On the other hand, the 2 nd detection signal electrode 85 is disposed on the upper surface and the lower surface of the detection arm 72, and the 2 nd detection ground electrode 86 is disposed on both side surfaces of the detection arm 72.

In addition, these electrodes 81 to 86 are wound around the lower surface of the device base 70. As shown in fig. 3, on the lower surface of the element base 70, a terminal 701 electrically connected to the driving signal electrode 81, a terminal 702 electrically connected to the driving ground electrode 82, a terminal 703 electrically connected to the 1 st detection signal electrode 83, a terminal 704 electrically connected to the 1 st detection ground electrode 84, a terminal 705 electrically connected to the 2 nd detection signal electrode 85, and a terminal 706 electrically connected to the 2 nd detection ground electrode 86 are arranged.

Such a vibration element 6 detects the angular velocity ω c as follows. First, when a drive signal is applied between the drive signal electrode 81 and the drive ground electrode 82, the drive arms 75 to 78 vibrate in a bending manner as indicated by arrows in fig. 6. Hereinafter, this driving mode is referred to as a driving vibration mode. When the angular velocity ω c is applied to the vibration element 6 in the state of being driven in the driving vibration mode, the detection vibration mode shown in fig. 7 is newly excited. In the detection vibration mode, coriolis force acts on the drive arms 75 to 78 to excite vibration in the direction indicated by the arrow b, and the detection arms 71 and 72 generate detection vibration based on bending vibration in the direction indicated by the arrow a in response to the vibration. In this detection vibration mode, the electric charge generated in the detection arm 71 is taken out from between the 1 st detection signal electrode 83 and the 1 st detection ground electrode 84 as the 1 st detection signal, the electric charge generated in the detection arm 72 is taken out from between the 2 nd detection signal electrode 85 and the 2 nd detection ground electrode 86 as the 2 nd detection signal, and the angular velocity ω c can be detected from the 1 st detection signal and the 2 nd detection signal.

Returning to fig. 1, the circuit element 3 is fixed on the bottom surface of the concave portion 211 c. The circuit element 3 includes a drive circuit and a detection circuit for driving the vibration element 6 and detecting the angular velocity ω c applied to the vibration element 6. However, the circuit element 3 is not particularly limited, and may include other circuits such as a temperature compensation circuit, for example.

As shown in fig. 1, the support 4 is interposed between the base 21 and the vibration element 6. The support 4 mainly has a function of absorbing and relaxing stress generated by deformation of the base 21, and making it difficult for the stress to be transmitted to the vibration element 6.

Such a support 4 is a gimbal structure. Specifically, as shown in fig. 2 and 8, the support 4 includes: a frame 41 having a frame shape when viewed from a plane in a direction along the C axis; a frame-shaped base 42 disposed outside the frame 41 and fixed to the base 21; an element holder 43 disposed inside the frame 41 and having the vibration element 6 mounted thereon; a pair of 1 st beams 44, 44 extending from the element holder 43 to both sides in the a-axis direction and connecting the element holder 43 and the frame 41; and a pair of 2 nd beams 45, 45 extending from the frame 41 to both sides in the direction along the B axis and connecting the frame 41 and the base 42. In addition, hereinafter, when viewed in plan along the C-axis direction, a virtual straight line passing through the center O of the element holder 43 and parallel to the a-axis is referred to as a virtual straight line La, and a virtual straight line passing through the center O and parallel to the B-axis is referred to as a virtual straight line Lb. In the present embodiment, the frame 41, the base 42, the element holder 43, the pair of first beams 44, and the pair of second beams 45, 45 are all disposed line-symmetrically with respect to the imaginary straight line La and line-symmetrically with respect to the imaginary straight line Lb, but the present invention is not limited thereto.

The frame 41 has a rectangular frame shape, and has a pair of edges 411 and 412 extending in the direction along the a axis and a pair of edges 413 and 414 extending in the direction along the B axis. Similarly, the base 42 has a rectangular frame shape, and has a pair of edges 421 and 422 extending in the direction along the a axis and a pair of edges 423 and 424 extending in the direction along the B axis. In particular, in the present embodiment, when viewed in plan in the direction along the C axis, the edge portion 413 of the frame 41 overlaps the drive arms 75 and 76 of the vibration element 6, and the edge portion 414 of the frame 41 overlaps the drive arms 77 and 78 of the vibration element 6.

In addition, the pair of first beams 44, 44 are positioned on both sides of the component holder 43 in the a-axis direction, and connect the component holder 43 and the frame 41 so that both ends support the component holder 43. The pair of first beams 44 and 44 are arranged on a straight line along the imaginary straight line La. On the other hand, the pair of 2 nd beams 45, 45 are positioned on both sides of the frame 41 in the direction along the B axis, and connect the frame 41 and the base 42 so that both ends support the frame 41. The pair of 2 nd beams 45, 45 are arranged on a straight line along the virtual straight line Lb. That is, one 2 nd beam 45 connects the central portions in the extending direction of the edge portions 411 and 421 to each other, and the other 2 nd beam 45 connects the central portions in the extending direction of the edge portions 412 and 422 to each other.

By making the extending direction of the 1 st beams 44, 44 perpendicular to the extending direction of the 2 nd beams 45, 45 in this way, the stress can be absorbed and relaxed more effectively by the support 4. Further, by extending the 1 st beams 44, 44 in the same direction as the extending direction of the connecting arms 73, 74, that is, in the direction of the a-axis, it is possible to easily secure the same length as the connecting arms 73, 74. Therefore, the length of the 1 st beams 44, i.e., L1 described later, can be easily increased. In particular, as described above, in the present embodiment, the length of the 1 st beams 44, 44 is substantially equal to the length of the connecting arms 73, 74 because the edge portion 413 of the frame 41 overlaps the driving arms 75, 76 and the edge portion 414 of the frame 41 overlaps the driving arms 77, 78 when viewed in plan in the direction along the C axis.

In the support 4, the element base 70 of the vibration element 6 is fixed to the upper surface of the element holder 43 via the conductive joining member B2, and the edge portions 423 and 424 of the base 42 are fixed to the bottom surface of the recess 211a via the conductive joining member B1. By interposing the support 4 between the vibration element 6 and the base 21 in this manner, the stress transmitted from the base 21 can be absorbed and relaxed by the support 4, and the stress can be made less likely to be transmitted to the vibration element 6. Therefore, the decrease and fluctuation of the vibration characteristics of the vibration element 6 can be effectively suppressed.

The bonding members B1 and B2 are not particularly limited as long as they have both conductivity and bondability, and for example, various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps, conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic, and the like can be used. When the former metal bumps are used as the bonding members B1 and B2, generation of gas from the bonding members B1 and B2 can be suppressed, and changes in the environment of the internal space S, particularly, increases in pressure can be effectively suppressed. On the other hand, when the latter conductive adhesive is used as the joining members B1 and B2, the joining members B1 and B2 become relatively flexible, and the joining members B1 and B2 can absorb and relax the stress.

In the present embodiment, a conductive adhesive is used as the bonding member B1, and a metal bump is used as the bonding member B2. By using a conductive adhesive as the joining member B1 for joining the support 4 and the base 21 made of different materials, the thermal stress generated by the difference in thermal expansion coefficient between the support 4 and the base 21 can be effectively absorbed and relaxed by the joining member B1. On the other hand, since the support 4 and the vibration element 6 are bonded by the 6 bonding members B2 and the 6 bonding members B2 are arranged in a relatively narrow region, by using the metal bumps as the bonding members B2, spreading due to wetting such as a conductive adhesive can be suppressed, and contact between the bonding members B2 can be effectively suppressed.

Such a support 4 is composed of a quartz substrate. By forming the support 4 from a quartz substrate in the same manner as the vibration substrate 7, the thermal expansion coefficients of the support 4 and the vibration substrate 7 can be made substantially equal. Therefore, substantially no thermal stress due to the difference in the thermal expansion coefficients of the support 4 and the vibration substrate 7 occurs, and the vibration element 6 is less likely to receive stress. Therefore, the deterioration and fluctuation of the vibration characteristics of the vibration element 6 can be more effectively suppressed.

In particular, the support 4 is formed of a quartz substrate having a chamfer similar to that of the vibration substrate 7 of the vibration element 6. In the present embodiment, since the vibration substrate 7 is formed of a Z-cut quartz substrate, the support 4 is also formed of a Z-cut quartz substrate. The crystal axis of the support 4 is oriented in the same direction as the crystal axis of the vibration substrate 7. That is, the support 4 and the vibration substrate 7 have the same X axis, the same Y axis, and the same Z axis. Since the thermal expansion coefficient of quartz is different in each of the directions along the X axis, the Y axis, and the Z axis, the above-described thermal stress is less likely to occur between the support 4 and the vibration substrate 7 by making the support 4 and the vibration substrate 7 have the same tangential angle and aligning the crystal axes with each other. Therefore, the vibration element 6 is less likely to be subjected to stress, and the deterioration and fluctuation of the vibration characteristics thereof can be more effectively suppressed.

The support 4 is not limited to this, and may have the same chamfer as the vibration substrate 7 and a different crystal axis direction from the vibration substrate 7, for example. The support 4 may be formed of a quartz substrate having a different corner cut from the vibration substrate 7. The support 4 may not be formed of a quartz substrate, and in this case, it may be formed of, for example, a silicon substrate, a resin substrate, or the like. In this case, the constituent material of the support 4 is preferably a material having a smaller difference in thermal expansion coefficient from quartz than the constituent material of the susceptor 21.

In addition, a wiring pattern, not shown, for electrically connecting the vibration element 6 and the internal terminal 241 is arranged on the support 4. The wiring pattern electrically connects each of the terminals 701 to 706 to the corresponding internal terminal 241.

Next, the dimensions of the pair of 1 st beams 44, 44 will be described. As shown in figure 8 of the drawings,when the length of each 1 st beam 44 in the direction along the a axis is L1(μm) and the length of each 1 st beam 44 in the direction along the B axis is W1(μm), it is preferable that each 1 st beam 44, 44 satisfies W1²The relationship of/L1 < 30, particularly preferably W1²A relationship of/L1 < 12.5. By satisfying such a relationship, the length L1 becomes sufficiently long with respect to the width W1, and the 1 st beams 44, 44 are easily elastically deformed in the direction along the B axis. Therefore, the element holder 43 supported by these 1 st beams 44, 44 is easily rotated about the C axis with respect to the frame 41. By facilitating the rotation of the element holder 43 about the C axis in this way, the detection vibration mode generated in the vibration element 6 is less likely to be hindered. Therefore, a decrease in the detection sensitivity of the vibration element 6 can be effectively suppressed.

The length L1 may be slightly different between the 1 st beam 44 on the a-axis positive side and the 1 st beam 44 on the a-axis negative side with respect to the center O, but in this case, the average value of the two may be the length L1. Similarly, the width W1 may be slightly different between the 1 st beam 44 on the a-axis positive side and the 1 st beam 44 on the a-axis negative side with respect to the center O, but in this case, the average value of the two may be the width W1.

The above-described effects are demonstrated based on the simulation results shown in fig. 9. FIG. 9 shows W1²Graph of the relationship between/L1 and sensitivity ratio (%). In this figure, W1 of each of the models 01 to 36 shown in table 1 below is plotted²The relationship between/L1 and sensitivity ratio (%) further shows a quadratic curve approximated by the least square method. As is clear from table 1, the length L1 and the width W1 of the respective patterns 01 to 36 and the length L2 of the element holder 43 in the a axis direction are different from each other. The length L1 was changed within a range of 150 to 700. mu.m, the width W1 was changed within a range of 50 to 200. mu.m, and the length L2 was changed within a range of 400 to 600. mu.m. The "sensitivity ratio" as the vertical axis in the figure is the ratio of the detection sensitivity of the angular velocity ω c of the vibration element 6 in the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead as described in patent document 2 to the detection sensitivity of the vibration element 6 in the present embodiment, and a higher sensitivity ratio means a higher sensitivity.

[ Table 1]

	L1(um)	W1(um)	L2(um)	W12/L1	Sensitivity ratio
						Model 01	150	50	400	16.67	83.6
Model 02	250	50	400	10.00	90.0
						Model 03	300	50	400	8.33	91.9
Model 04	500	50	400	5.00	95.9
						Model 05	700	50	400	3.57	97.5
Model 06	300	100	400	33.33	77.5
						Model 07	500	100	400	20.00	85.6
Model 08	300	150	400	75.00	61.9
						Model 09	500	150	400	45.00	72.0
Model 10	700	150	400	32.14	74.4
						Model 11	150	100	400	66.67	68.3
Model 12	650	100	400	15.38	88.7
						Model 13	400	200	400	100.00	56.1
Model 14	300	50	500	8.33	91.3
						Model 15	500	50	500	5.00	95.7
Model 16	700	50	500	3.57	97.7
						Model 17	300	100	500	33.33	77.3
Model 18	500	100	500	20.00	85.8
						Model 19	700	100	500	14.29	91.1
Model 20	300	150	500	75.00	62.2
						Model 21	500	150	500	45.00	72.0
Model 22	700	150	500	32.14	80.9
						Model 23	150	100	500	66.67	65.9
Model 24	150	50	500	16.67	82.8
						Model 25	650	100	500	15.38	89.0
Model 26	400	200	500	100.00	57.0
						Model 27	300	50	600	8.33	91.2
Model 28	500	50	600	5.00	95.7
						Model 29	700	50	600	3.57	98.1
Model 30	150	100	600	66.67	66.5
						Model 31	300	100	600	33.33	77.8
Model 32	500	100	600	20.00	86.4
						Model 33	700	100	600	14.29	92.3
Model 34	650	100	600	15.38	91.0
						Model 35	500	150	600	45.00	73.4
Model 36	300	150	600	75.00	63.1

As shown in the graph of FIG. 9, it can be seen that W1 is satisfied²The relationship of/L1 < 30 means that the sensitivity ratio is approximately 80% or more, and the detection sensitivity of the vibration element 6 can be maintained sufficiently high. Further, if W1 is satisfied²The relationship of/L1 < 12.5 indicates that the sensitivity ratio is 90% or more, and that the detection sensitivity of the vibration element 6 can be maintained higher. As is clear from the simulation results, the above-described "reduction in detection sensitivity of the vibration element 6 can be effectively suppressed" effect can be obtained.

Here, when only the sensitivity is observed, the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead as in the conventional case is more likely to exhibit high sensitivity than the structure in which the vibration element 6 is supported by the support 4 as in the present embodiment. However, in the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead, there is a problem that the processing variation is large and unnecessary vibration is likely to occur accordingly, or the processing variation is large and it is difficult to set conditions for reducing the unnecessary vibration. That is, the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead can exhibit high detection sensitivity, but has problems of large variation in detection sensitivity and low yield.

In contrast, in the structure in which the vibration element 6 is supported by the support 4 as in the present embodiment, it is difficult to exhibit detection sensitivity equivalent to that of the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead. However, since the support 4 is formed of a quartz substrate, the support 4 can be processed with high accuracy by etching, and the processing variation is extremely small. Further, since the machining variation is small, the condition setting for reducing unnecessary vibration is made easy. That is, in the structure in which the vibration element 6 is supported by the support 4 as in the present embodiment, although it is difficult to exhibit high detection sensitivity, there are advantages that variations in detection sensitivity are small and yield is high.

Therefore, in the present embodiment, in order to achieve the advantages and to exhibit the detection sensitivity equal to or higher than that of the structure in which the vibration element 6 is mounted on the TAB substrate via the inner lead, W1 is satisfied as described above²The relationship of/L1 < 30 preferably satisfies W1²A relationship of/L1 < 12.5. Thus, the vibration device 1 can exhibit high detection sensitivity, and can exhibit extremely excellent effects of small variations in detection sensitivity and high yield.

In addition, the element holder 43 of the support 4 has the same shape as the element base 70 of the vibration element 6 when viewed in plan from the direction along the C-axis. In fig. 2, the component holder 43 is illustrated as being slightly larger than the component base 70 for the sake of convenience of explanation. Further, the outer edges of the component holder 43 and the component base 70 overlap each other over the entire circumference thereof when viewed in plan from the direction along the C-axis. By forming the element holder 43 and the element base 70 in the same shape in this way, a sufficient space required for arranging the 6 engaging members B2 on the element holder 43 can be secured, and the element holder 43 can be reduced in size. Further, the length L1 of the 1 st beams 44, 44 can be made longer according to the amount of reduction of the element holder 43, and the detection sensitivity of the vibration element 6 can be improved. The phrase "the element holder 43 and the element base 70 have the same shape" means that the shapes of the element holder and the element base are completely identical to each other, and includes a case where there is a slight error in the shapes of the element holder and the element base due to, for example, a manufacturing error or a manufacturing limitation.

However, the shape of the component holder 43 is not particularly limited, and may be smaller than the component base 70 or larger than the component base 70. The planar shape may be the same as (i.e., may be similar to) the element base 70, or may be different from it.

The vibration device 1 is explained above. As described above, such a vibration device 1 has: vibrationAn element 6 that detects vibration from an angular velocity ω c that is a physical quantity around a detection axis; a base 21; and a support 4 that supports the vibrating element 6 with respect to the base 21. Further, the support 4 has, when viewed from the thickness direction of the support 4, that is, the direction along the C-axis: a frame-shaped frame 41; a base 42 disposed outside the frame 41 and fixed to the base 21; an element holder 43 disposed inside the frame 41 and having the vibration element 6 mounted thereon; a pair of 1 st beams 44, 44 extending from the element holder 43 to both sides in the direction along the a axis as the 1 st direction and connecting the element holder 43 and the frame 41; and a pair of 2 nd beams 45, 45 extending from the frame 41 to both sides in the direction along the B axis as the 2 nd direction different from the direction along the a axis and connecting the frame 41 and the base 42. When the length of the 1 st beam 44 in the A axis direction is L1(μm) and the width W of the 1 st beam 44 in the B axis direction perpendicular to the A axis direction is W1(μm) when viewed from above in the C axis direction, W1 is satisfied²and/L1 is less than 30. With such a configuration, the vibration device 1 can exhibit high detection sensitivity, and can exhibit excellent effects of small variations in detection sensitivity and high yield.

In addition, as described above, the vibration device 1 satisfies W1²the/L1 is less than 12.5. By satisfying such a relationship, the vibration device 1 can exhibit higher detection sensitivity, and can exhibit more excellent effects of small variations in detection sensitivity and high yield.

In addition, as described above, when 3 axes perpendicular to each other are defined as the a axis, the B axis, and the C axis, the thickness direction of the support 4 is along the C axis, and the vibration element 6 includes: a component base 70 fixed to the component holder 43; a pair of detection arms 71, 72 extending from the element base 70 along the B axis; a pair of connecting arms 73, 74 extending from the element base 70 along the a axis; a pair of drive arms 75, 76 extending from the distal end of one connecting arm 73 along the B axis; and a pair of drive arms 77, 78 extending from the distal end of the other connecting arm 74 along the B axis. By adopting such a structure, the vibration element 6 having excellent vibration balance and high angular velocity detection characteristics can be obtained.

In addition, as described above, the 1 st direction in which the 1 st beams 44, 44 extend is along the a axis, and the 2 nd direction in which the 2 nd beams 45, 45 extend is along the B axis. Accordingly, the extending direction of the 1 st beams 44, 44 is perpendicular to the extending direction of the 2 nd beams 45, and the support 4 can absorb and relax the stress more effectively. Further, by extending the 1 st beams 44, 44 along the axis a, which is the same direction as the extending direction of the connecting arms 73, 74, the length L1 can be easily secured to the same extent as the connecting arms 73, 74.

As described above, the component holder 43 and the component base 70 have the same shape in a plan view taken along the C axis. This ensures a sufficient space for arranging the 6 engaging members B2 on the element holder 43, and reduces the size of the element holder 43. Further, the length L1 of the 1 st beams 44, 44 can be made longer according to the amount of reduction of the element holder 43, and the detection sensitivity of the vibration element 6 can be improved.

< embodiment 2 >

Fig. 10 is a plan view of the vibration device of embodiment 2.

This embodiment is the same as embodiment 1 above, except that the orientation of the vibration element 6 and the structure of the support 4 are different. In the following description, the present embodiment will be mainly described with respect to differences from the above-described embodiment, and the description of the same matters will be omitted. In fig. 10, the same components as those of the above-described embodiment are denoted by the same reference numerals.

As shown in fig. 10, in the vibration device 1 of the present embodiment, the vibration element 6 is fixed to the support 4 in a posture rotated by 90 degrees about the C axis with respect to the above-described embodiment 1.

In addition, in the support 4, the pair of first beams 44, 44 are located on both sides of the element holder 43 in the direction along the B axis, and the element holder 43 and the frame 41 are connected in such a manner that both ends support the element holder 43. The pair of first beams 44 and 44 are arranged on a straight line along the virtual straight line Lb. On the other hand, the pair of 2 nd beams 45, 45 are positioned on both sides of the frame 41 in the a-axis direction, and connect the frame 41 and the base 42 so that both ends support the frame 41. The pair of 2 nd beams 45, 45 are arranged on a straight line along the imaginary straight line La. According to such a configuration, compared to the above-described embodiment 1, since the connection portions of the 2 nd beams 45 and 45 to the base 42 are close to the internal terminals 241, the wiring length of the wiring pattern disposed on the support 4 can be shortened.

The same effects as those of the above-described embodiment 1 can be obtained also in the above-described embodiment 2.

< embodiment 3 >

Fig. 11 is a plan view of a support member provided in the vibration device of embodiment 3.

This embodiment is the same as embodiment 1 described above, except that the structure of the support 4 is different. In the following description, the present embodiment will be mainly described with respect to differences from the above-described embodiment, and the description of the same matters will be omitted. In fig. 11, the same components as those of the above-described embodiment are denoted by the same reference numerals.

As shown in fig. 11, the support 4 of the present embodiment has, in addition to the structure of embodiment 1, a pair of 3 rd beams 46, and the pair of 3 rd beams 46, 46 extend from the frame 41 to both sides in the direction along the a axis and connect the frame 41 and the base 42. The pair of 3 rd beams 46, 46 are positioned on both sides of the frame 41 in the a axis direction, and connect the frame 41 and the base 42 so that both ends support the frame 41. That is, in the support 4 of the present embodiment, the frame 41 is configured to be supported from four directions thereof by the pair of 2 nd beams 45, 45 and the pair of 3 rd beams 46, 46. Thereby, the mechanical strength of the support 4 is increased.

In particular, the pair of 3 rd beams 46 and 46 are arranged on a straight line along the imaginary straight line La. That is, the pair of 3 rd beams 46 and the pair of 1 st beams 44 and 44 are arranged on a straight line. Therefore, the frame 41 can be supported more evenly from the four directions of the frame 41. Further, if the width W2 of the 3 rd beams 46 and 46 is too large, the sensitivity of the vibration element 6 may be lowered. Therefore, the width W2 of the 3 rd beams 46, 46 is not particularly limited, but is preferably equal to or less than the width W1 of the 1 st beams 44, 44.

As described above, in the vibration device 1 of the present embodiment, the support 4 includes the pair of 3 rd beams 46, the pair of 3 rd beams 46, 46 extend from the frame 41 to both sides in the direction along the a axis as the 1 st direction and connect the frame 41 and the base 42, and the pair of 3 rd beams 46, 46 and the pair of 1 st beams 44, 44 are arranged on a straight line. Thereby, the frame 41 is supported by the pair of 2 nd beams 45, 45 and the pair of 3 rd beams 46, 46 from the four directions thereof. Therefore, the mechanical strength of the support 4 is increased.

The same effects as those of the above-described embodiment 1 can be obtained also in embodiment 3.

The vibration device of the present invention has been described above based on the illustrated embodiments, but the present invention is not limited thereto, and the structure of each part can be replaced with any structure having the same function. In addition, other arbitrary structures may be added to the present invention. Further, the embodiments can be appropriately combined.