阅读说明：本技术 掩模板的定位点制作方法和掩模板 (Positioning point manufacturing method of mask plate and mask plate ) 是由 潘仲光 陈霞玲 贾建荣 于 2020-09-15 设计创作，主要内容包括：本申请涉及表面贴装技术领域,特别涉及一种掩模板的定位点制作方法和掩模板,第一方面,该掩模板的定位点制作方法包括：第一金属层制作：在基板的表面制作第一金属层；变色：对所述第一金属层的表面作变色处理；第二金属层制作：在基板的表面制作第二金属层,所述第二金属层覆盖所述第一金属层,并在所述第一金属层的所在区域留出通孔。第二方面,掩模板包括：本体,所述本体的表面设置有盲孔,所述盲孔的底壁上的金属材料的颜色与所述本体表面的金属材料的颜色不同。本申请实施方式所提供的方法所制作出的掩模版的定位点可识别度高,使用寿命长。(The application relates to the technical field of surface mounting, in particular to a mask plate and a positioning point manufacturing method thereof, and on the first aspect, the positioning point manufacturing method of the mask plate comprises the following steps: manufacturing a first metal layer: manufacturing a first metal layer on the surface of a substrate; color change: carrying out color change treatment on the surface of the first metal layer; manufacturing a second metal layer: and manufacturing a second metal layer on the surface of the substrate, wherein the second metal layer covers the first metal layer, and a through hole is reserved in the area of the first metal layer. In a second aspect, a mask plate includes: the body, the surface of body is provided with the blind hole, the colour of the metal material on the diapire of blind hole with the colour of the metal material on body surface is different. The positioning points of the mask manufactured by the method provided by the embodiment of the application have high identifiability and long service life.)

1. A method for manufacturing positioning points of a mask plate is characterized by comprising the following steps:

manufacturing a first metal layer (31): manufacturing a first metal layer (31) on the surface of a substrate (1);

color change: performing color change treatment on the surface of the first metal layer (31);

manufacturing a second metal layer (32): and manufacturing a second metal layer (32) on the surface of the substrate (1), wherein the second metal layer (32) covers part of the first metal layer (31), and a through hole (4) is reserved in the area of the first metal layer (31).

2. Method for producing anchor points for a mask blank according to claim 1, wherein the step of producing the first metal layer (31) comprises:

first graphic film (22) production: manufacturing a first graphic film (22) on the surface of the substrate (1), wherein the cross section of the first graphic film (22) encloses a closed plane graphic;

first electroforming and film stripping: and manufacturing a first metal layer (31) on the surface of the substrate (1) positioned in the plane pattern in an electroforming mode, and removing the first pattern film (22).

3. Method for producing an anchor point of a mask blank according to claim 2, characterized in that the first graphic film (22) production step comprises:

manufacturing a first film layer (21): manufacturing a first film layer (21) on a substrate (1);

first exposure and development: and exposing a pattern area on the first film layer (21), and removing the unexposed area of the first film layer (21) through development to form the first pattern film (22).

4. The method for fabricating anchor points of a mask blank according to claim 2, wherein the first electroforming and stripping step comprises:

electroforming a first metal layer (31) on the substrate (1);

and removing the first pattern film (22) and uncovering the metal on the substrate (1) outside the plane pattern.

5. The anchor point fabrication method of a mask blank according to claim 1, wherein in the discoloring step, the surface of the first metal layer (31) is blackened by etching.

6. The method for fabricating anchor points of a mask blank according to claim 1, wherein the step of fabricating the second metal layer (32) comprises:

second graphic film (52) production: manufacturing a second graphic film (52) on the surface of the substrate (1), wherein the second graphic film (52) is positioned on the first metal layer (31);

second electroforming and stripping: and manufacturing a second metal layer (32) on the substrate (1) in an electroforming mode, and removing the second pattern film (52).

7. Method for producing an anchor point of a mask blank according to claim 6, characterized in that the second graphic film (52) production step comprises:

manufacturing a second film layer (51): manufacturing a second film layer (51) on the substrate (1), wherein the second film layer (51) covers the first metal layer (31);

and (3) exposure and development for the second time: and exposing a pattern area on the second film layer (51), and removing the unexposed area of the second film layer (51) through development to form the second pattern film (52).

8. The method for fabricating locating points of a mask blank according to claim 6, wherein the second electroforming and stripping step comprises:

electroforming a second metal layer (32) on the substrate (1);

and removing the second pattern film (52) to expose the first metal layer (31).

9. A mask blank, characterized in that it is produced by a method according to any one of claims 1 to 8.

10. A mask blank, comprising:

the body (6), the surface of body (6) is provided with blind hole (7), the colour of the metal material on the diapire of blind hole (7) is different with the colour of the metal material on body (6) surface.

11. The mask blank according to claim 10, characterized in that the metallic material on the bottom wall of the blind hole (7) is black.

12. Mask according to claim 11, characterized in that the colour of the metallic material on the bottom wall of the blind holes (7) is obtained by means of an etching process.

Technical Field

The application relates to the technical field of surface mounting, in particular to a mask plate and a positioning point manufacturing method thereof.

Background

Surface Mounting Technology (SMT) was born in the last 60 years. SMT is the process of accurately placing a leadless surface mount device onto a PCB pad into which solder paste has been dispensed or dispensed using a tool, and then establishing a good mechanical and electrical connection between the device and the circuit board by wave soldering or reflow soldering.

The surface mounting technology is a mounting and connecting technology which directly attaches and welds the surface assembly element to the specified position on the surface of the printed board without drilling an insertion hole on the printed board. In order to align the printing mask plate with the PCB to be printed with high precision, positioning points corresponding to the PCB, also called positioning points, need to be manufactured on the mask plate.

When a printer automatically identifies a positioning point through a CCD (charge coupled device image sensor), firstly scanning a template within a range of 5mm, and calculating chromatic aberration to determine whether the positioning point is the positioning point; therefore, the inner area of the positioning point also needs to have a certain gray scale. When a positioning point is captured, the center coordinates of the positioning point are determined by capturing the edge of the positioning point, so the blackness and smoothness of the edge of the positioning point are important for identifiability.

In the prior art, two methods, namely laser etching and black glue, are often adopted to manufacture positioning points, but the two methods have various problems.

Disclosure of Invention

In order to solve or partially solve the technical problems in the prior art, the application provides a method for manufacturing positioning points of a mask plate and the mask plate.

In a first aspect, the present application provides a method for manufacturing locating points of a mask plate, including the following steps:

manufacturing a first metal layer: manufacturing a first metal layer on the surface of a substrate;

color change: carrying out color change treatment on the surface of the first metal layer;

manufacturing a second metal layer: and manufacturing a second metal layer on the surface of the substrate, wherein the second metal layer covers part of the first metal layer, and a through hole is reserved in the area of the first metal layer.

On the other hand, the application provides a mask plate manufactured by the method.

In yet another aspect, the present application provides a method of laser welding a metal mask plate, including:

the body, the surface of body is provided with the blind hole, the colour of the metal material on the diapire of blind hole with the colour of the metal material on body surface is different.

Optionally, the first metal layer manufacturing step includes:

first graphic film fabrication: manufacturing a first graphic film on the surface of the substrate, wherein the cross section of the first graphic film encloses a closed plane graphic;

first electroforming and film stripping: and manufacturing a first metal layer on the surface of the substrate positioned in the plane pattern in an electroforming mode, and removing the first pattern film.

Optionally, the first graphic film producing step comprises:

manufacturing a first film layer: manufacturing a first film layer on a substrate;

first exposure and development: and exposing a pattern area on the first film layer, and removing the unexposed area of the first film layer through development, wherein the remained film layer forms the first pattern film.

Optionally, the first electroforming and stripping step comprises:

electroforming a first metal layer on a substrate;

and removing the first pattern film and uncovering the metal outside the plane pattern on the substrate.

Optionally, in the discoloring step, the surface of the first metal layer is blackened by means of etching.

Optionally, the second metal layer manufacturing step includes:

second graphic film preparation: manufacturing a second graphic film on the surface of the substrate, wherein the second graphic film is positioned on the first metal layer;

second electroforming and stripping: and manufacturing a second metal layer on the substrate in an electroforming mode, and removing the second pattern film.

Optionally, a second graphic film fabrication step comprising:

manufacturing a second film layer: manufacturing a second film layer on the substrate, wherein the second film layer covers the first metal layer;

and (3) exposure and development for the second time: and exposing a pattern area on the second film layer, and removing the unexposed area of the second film layer through development, wherein the remained film layer forms a second pattern film.

Optionally, the second electroforming and stripping step comprises:

electroforming a second metal layer on the substrate;

and removing the second pattern film to expose the first metal layer.

Optionally, the metal material on the bottom wall of the blind hole is black.

Optionally, the color of the metal material on the bottom wall of the blind hole is obtained by an etching process.

Compared with the prior art, the metal mask plate of the embodiment of the application distinguishes the positioning points from the peripheral metal material through different metal material colors. Due to the fact that the metal is distinguished through the color of the metal, compared with a mode of cutting through laser or dot black glue, abrasion and falling are not prone to occur, and the service life of the positioning point is longer. In addition, the edges are quite even because destructive damage is not required to be produced on the surface of the mask plate by adopting laser and black glue is not required to be pasted at the positioning points.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to derive the related structures that do not appear in other drawings without creative efforts.

FIG. 1 is a schematic diagram of a first film layer formed on a substrate and a pattern area exposed on the first film layer according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of an embodiment of the present disclosure when unexposed regions of a first film layer are removed by development;

FIG. 3 is a schematic view of a first metal layer electroformed on a substrate according to an embodiment of the present application;

FIG. 4 is a schematic view of the present embodiment with the first graphic film removed and the metal on the substrate outside the planar pattern removed;

fig. 5 is a schematic diagram illustrating a second film layer formed on a substrate according to an embodiment of the present disclosure, the second film layer covering a first metal layer;

FIG. 6 is a schematic view of an embodiment of the present application exposing a patterned area on a second film layer;

FIG. 7 is a schematic diagram of an embodiment of the present disclosure when unexposed areas of a second film layer are removed by development;

FIG. 8 is a schematic view of an embodiment of the present application when electroforming a second metal layer on a substrate;

FIG. 9 is a schematic view of the embodiment of the present application with the second patterned film removed to expose the first metal layer;

FIG. 10 is a schematic view of FIG. 2 from a top view;

FIG. 11 is a photograph of a reticle at a location point according to an embodiment of the present application;

fig. 12 is a schematic view of a finished reticle according to an embodiment of the present application.

Description of reference numerals:

1. a substrate; 21. a first film layer; 22. a first graphic film; 31. a first metal layer; 32. a second metal layer; 4. a through hole; 51. a second film layer; 52. a second graphic film; 6. a body; 7. and (4) blind holes.

Detailed Description

Implementation mode one

The inventor of the present application has found that the positioning point manufacturing of the mask plate is problematic whether the method of dispensing the black paste or the laser method is adopted.

Specifically, the contrast of the positioning points formed by the laser is not sufficient, the contrast is still insufficient if the laser is deep enough to leave a mark with high contrast on the surface of the electroformed plate, and the cross section of the mark left by the laser is stepped, and the stepped marks are mapped to each other, so that the positioning points with high contrast of deep blackness appear when viewed from the outside. In the prior art, a circle is only engraved on the surface of an electroforming plate, the inside of the circle is filled with a plurality of criss-cross straight lines, notches with basically the same depth cannot form steps, the contrast of a positioning point cannot meet the ideal requirement, and the identification of the positioning point is influenced; positioning points of laser etching are not easy to grab; the locating points of laser etching are easy to fall off in cleaning, because the electroforming mask plates are all very thin, the thickness of the electroforming mask plates is in the range of 70-150 mu m, straight lines which are intersected vertically and horizontally are carved on a stainless steel plate by laser, and the nicks are intersected with each other, and if the power of the laser is low, the depth of the intersected parts of the nicks on the whole locating points is shallow, so that the electroforming mask plates are not wear-resistant.

When the positioning point manufactured by the way of dispensing the black glue is adopted, the problems of high operation difficulty and irregular edge also exist. Moreover, the black glue can limit the size of the positioning point, and is easy to wear and fall off.

In addition, no matter the positioning points are cut by laser or the points are made by a black glue point, the positions of the positioning points to be engraved need to be found by CCD secondary positioning, and then laser sintering is carried out, so that the problem of position precision deviation is inevitably generated.

In view of the above, in a first embodiment of the present application, a method for manufacturing an alignment point of a mask blank is provided, as shown in fig. 4 and 9, including the following steps:

manufacturing the first metal layer 31: manufacturing a first metal layer 31 on the surface of the substrate 1;

color change: performing color change treatment on the surface of the first metal layer 31;

manufacturing the second metal layer 32: and manufacturing a second metal layer 32 on the surface of the substrate 1, wherein the second metal layer 32 covers part of the first metal layer 31, and a through hole 4 is reserved in the area where the first metal layer 31 is located. At this time, the first metal layer 31 forms an anchor point at the through hole 4. It will be appreciated that the through-hole 4 is limited to penetrating the second metal layer, so that, from the whole reticle, a blind hole is formed, and the first metal layer 31 forms the bottom wall of this blind hole.

The first embodiment of the application also provides a mask plate, and the mask plate is manufactured by the method.

It can be understood that two metal layers are sequentially formed on the surface of the substrate 1, and the first metal layer 31 exposed from the through hole 4 can be used as an anchor point after the color change treatment is performed on the first metal layer 31. The color change treatment may be performed in various ways, for example, by combining metal atoms on the surface of the first metal layer 31 with non-metal elements through oxidation reaction to form a compound to change the color thereof. Preferably, in the discoloration step, the surface of the first metal layer 31 may be color-changed, for example, blackened, by means of corrosion. The process of corrosion may be carried out by strong acids.

Due to the adoption of the color change treatment aiming at the metal, the combination between the metal of the color change part and the first metal layer 31 is more stable, so that compared with the mode of cutting by laser or dispensing black glue, the abrasion and the falling off are not easy to occur, namely the service life of the positioning point is longer.

The cross-sectional area of the first metal layer 31 does not need to be made too large, and only needs to be equal to or slightly larger than the through holes 4 of the positioning points, so that the first metal layer 31 with a smaller cross-sectional area can avoid the layering phenomenon between the surface subjected to color change treatment and the second metal layer 32, and the structural strength of the metal mask is improved. Of course, it is basically possible that the first metal layer 31 covers the entire substrate 1.

In the embodiment of the present application, the same metal may be used for the first metal layer 31 and the second metal layer 32, or different metals may be used. The skilled person can choose different materials to make the two metal layers according to actual requirements. When the same metal is used for both, there is no significant delamination between the first metal layer 31 and the second metal layer 32. The first metal layer 31 and the second metal layer 32 may be formed by various methods, for example, electroforming, evaporation, and the like.

Next, a specific procedure for fabricating the first metal layer 31 will be described by taking an electroforming method as an example:

alternatively, referring to fig. 2 and 10, the step of fabricating the first metal layer 31 may include:

first graphic film 22 fabrication: manufacturing a first graphic film 22 on the surface of the substrate 1, wherein the cross section of the first graphic film 22 encloses a closed plane figure;

first electroforming and film stripping: by electroforming, the first metal layer 31 is formed on the surface of the substrate 1 inside the planar pattern, and the first pattern film 22 is removed.

Specifically, the manufacturing step of the first graphic film 22 includes:

manufacturing a first film layer 21: as shown in fig. 1, a first film layer 21 is formed on a substrate 1; the first film layer 21 may be a dry film.

First exposure and development: the first film layer 21 is exposed to form a pattern region, and the unexposed region of the first film layer 21 is removed by development, so that the remaining film layer forms a first pattern film 22, as shown in fig. 2 and 10.

Wherein the planar pattern surrounds the peripheral shape of the first metal layer 31. Since the size of the first metal layer 31 may be slightly larger than the size of the anchor point, the planar pattern may have any shape, but it is preferable that the planar pattern is identical to the anchor point. In fig. 10, the case of the first pattern film 22 is illustrated in which the planar pattern is a ring shape.

By electroforming, the first metal layer 31 can be formed in the region where the first pattern film 22 is not provided. In the step of removing the first pattern film 22, as shown in fig. 4, all metal layers of the substrate 1 except the region of the planar pattern may be removed, so that the remaining first metal layer 31 may have a small cross-sectional area. Accordingly, optionally, the first electroforming and stripping step further comprises:

referring to fig. 3, a first metal layer 31 is electroformed on a substrate 1;

referring to fig. 4, the first graphic film 22 is removed and the metal on the substrate 1 outside the plane pattern is uncovered.

After the metal on the substrate 1 outside the planar pattern is removed, a more integrated and complete metal mask can be formed in the subsequent electroforming process of the second metal layer 32.

For the second metal layer 32, also optionally, the step of manufacturing the second metal layer 32 includes:

second graphic film 52 fabrication: referring to fig. 7, a second graphic film 52 is formed on the surface of the substrate 1, and the second graphic film 52 is located on the first metal layer 31;

second electroforming and stripping: referring to fig. 8 and 9, a second metal layer 32 is formed on the substrate 1 by electroforming, and the second pattern film 52 is removed.

Specifically, the second graphic film 52 may be manufactured by the following steps:

manufacturing the second film layer 51: referring to fig. 5, a second film layer 51 is formed on the substrate 1, and the second film layer 51 covers the first metal layer 31;

and (3) exposure and development for the second time: referring to fig. 6 and 7, pattern areas are exposed on the second film layer 51, and the unexposed areas of the second film layer 51 are removed by development, so that the remaining film layer constitutes the second pattern film 52.

Also optionally, the second electroforming and stripping step may include:

referring to fig. 8, a second metal layer 32 is electroformed on the substrate 1;

referring to fig. 9, the second pattern film 52 is removed to expose the first metal layer 31.

It is to be understood that since the second pattern film 52 is located on the first metal layer 31, the pattern region is also located on the first metal layer 31. The position of the graphic area is the position of the positioning point, so the shape of the graphic area is consistent with the shape of the positioning point, and a circular shape is usually preferred.

When the second film layer 51 is manufactured, since the position of the second pattern film 52 is the position of the positioning point, the position of the positioning point does not need to be searched again by the CCD in the subsequent electroforming and film stripping steps. That is to say, the technical scheme provided by the embodiment of the application does not need to carry out secondary positioning on the positioning point, so that the problem of position precision deviation is not easy to occur.

In fig. 11, a finished photograph of the reticle in the region of the registration hole is illustrated. Therefore, the positioning points of the metal mask plate prepared by the embodiment of the application do not need to be damaged destructively by laser on the surface of the mask plate, and the black glue does not need to be pasted on the positioning points, so that the edges are very neat, and the identification precision of the positioning points is improved.

Based on the above technical solution, in the embodiment of the present application, a particularly preferred manufacturing process of the positioning point of the mask plate is given as follows:

1. referring to fig. 1, a first film layer 21 is formed on a substrate 1, and a pattern area is exposed on the first film layer 21;

2. referring to fig. 2, the unexposed area of the first film 21 is removed by development, and the remaining film forms the first pattern film 22;

3. referring to fig. 3, a first metal layer 31 is electroformed on a substrate 1;

4. referring to fig. 4, the first pattern film 22 is removed, and the metal layer outside the plane pattern on the substrate 1 is uncovered, thereby completing the fabrication of the first metal layer 31 on the surface of the substrate 1;

5. etching the surface of the first metal layer 31 to make it black;

6. referring to fig. 5, a second film layer 51 is formed on the substrate 1, and the second film layer 51 covers the first metal layer 31;

7. referring to fig. 6, a pattern area is exposed on the second film layer 51;

8. referring to fig. 7, the unexposed area of the second film 51 is removed by development, and the remaining film constitutes the second pattern film 52;

9. referring to fig. 8, electroforming a second metal layer 32 on the substrate 1, wherein the second metal layer 32 covers the first metal layer 31, and the second metal layer 32 leaves a through hole 4 in the area of the first metal layer 31 due to the obstruction of the second pattern film 52;

10. referring to fig. 9, the second pattern film 52 is removed to expose the first metal layer 31;

11. and removing the substrate 1 to obtain the required mask.

In summary, the method for manufacturing the positioning point of the metal mask provided by the embodiment of the application further has the advantages of simple process and low cost.

Second embodiment

The second embodiment of the present application further provides a mask plate, which can be manufactured by the method of the first embodiment, or by other methods.

Specifically, referring to fig. 12, the mask plate includes:

the body 6, the surface of body 6 is provided with blind hole 7, and the colour of the metal material on the diapire of blind hole 7 is different with the colour of the metal material on the surface of body 6.

The mask plate of the present embodiment may be manufactured by the method of the first embodiment, or may be manufactured by another method.

Compared with the prior art, the metal mask plate of the embodiment of the application distinguishes the positioning points from the peripheral metal material through different metal material colors. Due to the fact that the metal is distinguished through the color of the metal, compared with a mode of cutting through laser or dot black glue, abrasion and falling are not prone to occur, and the service life of the positioning point is longer. In addition, the edges are quite even because destructive damage is not required to be produced on the surface of the mask plate by adopting laser and black glue is not required to be pasted at the positioning points.

Further, optionally, the metal material on the bottom wall of the blind hole 7 is black. Further, the color of the metal material on the bottom wall of the blind hole 7 can be obtained by an etching process.

The black blind hole 7 obtained by means of the corrosion process of the metal material has longer service life and higher identification precision when being used as a positioning point.

It is to be understood that the terminology used in the description of the embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and "a" and "an" generally include at least two, but do not exclude at least one, unless the context clearly dictates otherwise.

It should be understood that although the terms first, second, third, etc. may be used in the embodiments of the present application to describe certain components, these components should not be limited by these terms. These terms are only used to distinguish one component from another. For example, a first certain component may also be referred to as a second certain component, and similarly, a second certain component may also be referred to as a first certain component, without departing from the scope of the embodiments of the present application.

It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.

In the various embodiments described above, while, for purposes of simplicity of explanation, the methodologies are shown and described as a series of acts, it is to be understood and appreciated by those of ordinary skill in the art that the methodologies are not limited by the order of acts, as some acts may, in accordance with one or more embodiments, occur in different orders and/or concurrently with other acts from that shown and described herein or not shown and described herein, as may be understood by those of ordinary skill in the art.

Those of skill would further appreciate that the various illustrative logical blocks, modules, units, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, units, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

Finally, it should be noted that those skilled in the art will appreciate that embodiments of the present application present many technical details for the purpose of enabling the reader to better understand the present application. However, the technical solutions claimed in the claims of the present application can be basically implemented without these technical details and various changes and modifications based on the above-described embodiments. Accordingly, in actual practice, various changes in form and detail may be made to the above-described embodiments without departing from the spirit and scope of the present application.