阅读说明：本技术 一种高速i/o连接器的信号模块差分对布置结构 (Signal module differential pair arrangement structure of high-speed I/O connector ) 是由 张建 许春锋 于 2020-11-19 设计创作，主要内容包括：本发明涉及一种高速I/O连接器的信号模块差分对布置结构,其特征在于：所述信号模制差分对至少具有一侧固定端,一侧接触端；所述固定端与接触端通过弧形段连接；所述信号端子的单片结构中,在同一平面内相邻的差分对为圆弧构成的桁架结构；该平面内相邻的差分对中间设置有空气槽,且空气槽沿着单片的信号端子中弧形连接段的延伸方向呈弧形设置在信号端子之间；通过在模制绝缘体上设置信号模制差分对,信号模制差分对的固定端与接触端通过弧形段连接；同时模制绝缘体上的空气槽同样采用弧形的分布方式,一方面节省了材料,改善了串扰的影响,可实现高频传输信号,降低了损耗。(The invention relates to a signal module differential pair arrangement structure of a high-speed I/O connector, which is characterized in that: the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section; in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the single signal terminal; the molded insulator is provided with a signal molded differential pair, and the fixed end of the signal molded differential pair is connected with the contact end through an arc-shaped section; meanwhile, the air grooves on the molded insulator are also distributed in an arc shape, so that on one hand, materials are saved, the influence of crosstalk is improved, high-frequency transmission signals can be realized, and the loss is reduced.)

1. A signal modular differential pair arrangement for a high speed I/O connector includes a signal molded differential pair and a ground terminal; the signal molding differential pair and the grounding terminal are formed in an overlapped mode; the method is characterized in that:

the signal molded differential pair comprises a signal terminal and a molded insulator, wherein the signal terminal is provided with two pieces which are stacked through the molded insulator, and the signal terminal is arranged in the molded insulator; the signal terminals are stacked with a grounding terminal by adopting two pieces to form a signal molding differential pair, and the two pieces of signal terminals are arranged adjacently;

the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section;

in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the signal terminal of the single chip.

2. The differential pair arrangement of signal modules for a high speed I/O connector of claim 1, wherein: and positioning columns and positioning holes for the adjacent molded insulators to be in layered stacking positioning fit are arranged on the two side surfaces of the molded insulators.

3. The differential pair arrangement of signal modules for a high speed I/O connector of claim 1, wherein: the air groove extends from the fixing end to the contact end direction, and is gradually separated into a plurality of air groove units in point-break connection by one air groove unit.

Technical Field

The invention relates to the technical field of signal module difference, in particular to a signal module difference pair arrangement structure of a high-speed I/O connector.

Background

The current high-speed I/O connector is mainly used for transmitting high-speed and high-quality signals and mainly comprises a shell and a signal module, wherein the signal module comprises an insulator and a differential pair fixed on the insulator; the general insulator structure is provided with a plurality of intermittent air grooves, but the differential pairs are generally distributed on the inner sides of the air grooves, the structure for connecting the contact terminal and the grounding terminal on the differential pairs generally adopts a right-angle triangular connecting structure, the structure of the air grooves on the insulator also adopts a plurality of independent right-angle line structures, the length of the connecting structure is increased due to the structure, the arrangement is inconvenient, the loss is increased, and the crosstalk influence is large.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a signal module differential pair arrangement structure of a high-speed I/O connector, which can solve the problems of high loss and large crosstalk influence of a differential pair structure of a signal module of a general high-speed I/O connector.

In order to solve the technical problems, the technical scheme of the invention is as follows: a signal modular differential pair arrangement for a high speed I/O connector includes a signal molded differential pair and a ground terminal; the signal molding differential pair and the grounding terminal are formed in an overlapped mode; the innovation points are as follows:

the signal molded differential pair comprises a signal terminal and a molded insulator, wherein the signal terminal is provided with two pieces which are stacked through the molded insulator, and the signal terminal is arranged in the molded insulator; the signal terminals are stacked with a grounding terminal by adopting two pieces to form a signal molding differential pair, and the two pieces of signal terminals are arranged adjacently;

the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section;

in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the signal terminal of the single chip.

Furthermore, positioning columns and positioning holes for the adjacent molded insulators to be in layered stacking positioning fit are arranged on the two side surfaces of the molded insulators.

Furthermore, the air groove extends from the fixing end to the contact end, and is gradually separated into a plurality of air groove units in point-break connection by one air groove unit.

The invention has the advantages that:

1) according to the invention, the molded signal differential pair is arranged on the molded insulator, and the fixed end of the molded signal differential pair is connected with the contact end through the arc-shaped section; meanwhile, the air grooves on the molded insulator are also distributed in an arc shape, so that on one hand, materials are saved, the influence of crosstalk is improved, high-frequency transmission signals can be realized, and the loss is reduced.

2) The air groove structure on the single-chip signal terminal adopts an intermittent continuous arc structure, the air groove extends from the fixed end of the single-chip signal terminal to the contact end, and the air groove unit is gradually separated into a plurality of air groove units in point-break connection, so that the influence of crosstalk can be effectively improved.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

FIG. 1 is a block diagram of a differential pair arrangement of signal modules of a high speed I/O connector according to the present invention.

Fig. 2 is a signal terminal monolithic block diagram of a signal module differential pair arrangement mechanism of a high speed I/O connector according to the present invention.

Fig. 3 is an internal view of the signal terminals of the differential pair arrangement of the signal module of the high speed I/O connector of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

A signal module differential pair arrangement of a high-speed I/O connector as shown in fig. 1 to 3 includes a signal molded differential pair 1 and a ground terminal; the signal molded differential pair 1 is stacked with a ground terminal.

The signal molded differential pair 1 comprises a signal terminal 11 and a molded insulator 12, wherein the signal terminal 1 is provided with two pieces which are stacked through the molded insulator, and the signal terminal 11 is arranged in the molded insulator; the signal terminals 11 are stacked with a ground terminal using two pieces to form the signal molded differential pair 1, and the two pieces of signal terminals are disposed adjacently.

The signal molded differential pair 1 has at least one side fixed end 13 and one side contact end 14; the fixed end 13 is connected to the contact end 14 via an arc-shaped section 15.

In the monolithic structure of the signal terminal 11, adjacent differential pairs in the same plane are in a truss structure formed by arcs; air grooves 16 are provided in the middle of adjacent differential pairs in the plane, and the air grooves 16 are provided between the signal terminals 11 in an arc shape along the extending direction of the arc-shaped connecting sections 15 in the signal terminals 11 of one piece.

The molded insulator 12 is provided on both side surfaces thereof with positioning posts and positioning holes for the adjacent molded insulators 12 to be positioned in a layered stack.

The air slot 16 extends from the fixed end to the contact end, and is gradually separated into a plurality of air slot units in point-break connection by one air slot unit.

The working principle of the invention is as follows: by molding the differential pair on the molded insulator by the signal, connecting the contact end and the fixed end of the molded differential pair on the molded insulator by the arc-shaped connecting section, and simultaneously adopting the arc-shaped distribution mode for the air slot on the molded insulator, on one hand, the material is saved, the influence of crosstalk is improved, the high-frequency signal transmission can be realized, and the loss is reduced.

It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.