阅读说明：本技术 一种led芯片散热装置 (LED chip heat dissipation device ) 是由 尤业明 刘秀林 于 2020-06-17 设计创作，主要内容包括：本发明提出一种LED芯片散热装置,包括散热垫与散热基板,所述散热垫上设有LED芯片,所述散热垫设置在散热基板上,所述散热基板内部设有多个散热孔,所述散热孔一端与进水孔端面相连,所述散热孔另一端与出水孔端面相连,所述进水孔与出水孔均为单面开口结构,所述进水孔一端通过进水电磁阀、管道与散热管相连,所述散热管顶部设有进水口,所述出水孔一端通过出水电磁阀、管道与散热管另一端相连,所述散热管设置在散热基板顶部；通过设置散热基板,并且在散热基板内部设有多个散热孔,并且通过导热管将散热垫上的热量传递给散热孔中,通过水冷将其热量吸收,并且通过散热管将吸收后的热量进行散热,实现了热量循环,有效解决了背景技术中的问题。(The invention provides an LED chip heat dissipation device, which comprises a heat dissipation pad and a heat dissipation substrate, wherein an LED chip is arranged on the heat dissipation pad, the heat dissipation pad is arranged on the heat dissipation substrate, a plurality of heat dissipation holes are formed in the heat dissipation substrate, one end of each heat dissipation hole is connected with the end face of a water inlet hole, the other end of each heat dissipation hole is connected with the end face of a water outlet hole, the water inlet hole and the water outlet holes are of a single-face opening structure, one end of each water inlet hole is connected with a heat dissipation pipe through a water inlet electromagnetic valve and a pipeline, a water inlet is formed in the top of the heat dissipation pipe, one end of each water outlet hole; through setting up the radiating basal plate to at the inside a plurality of louvres that are equipped with of radiating basal plate, and in transmitting the heat transfer on with the cooling pad for the louvre through the heat pipe, absorb its heat through the water-cooling, and dispel the heat through the heat after the cooling tube will absorb, realized heat cycle, effectively solved the problem among the background art.)

1. The utility model provides a LED chip heat abstractor, includes radiating pad and radiating basal plate, its characterized in that: the LED heat dissipation structure is characterized in that the LED chip is arranged on the heat dissipation pad, the heat dissipation pad is arranged on the heat dissipation substrate, a plurality of heat dissipation holes are formed in the heat dissipation substrate, one ends of the heat dissipation holes are connected with the end face of a water inlet hole, the other ends of the heat dissipation holes are connected with the end face of a water outlet hole, the water inlet hole and the water outlet hole are of single-face opening structures, one end of the water inlet hole is connected with the heat dissipation pipe through a water inlet electromagnetic valve and a pipeline, the top of the heat dissipation pipe is provided with a water inlet, one end of the water outlet hole is connected with the other end of the heat dissipation pipe through.

2. The LED chip heat sink according to claim 1, wherein: the bottom of the radiating substrate is provided with a plurality of radiating grooves, and the radiating grooves are concave.

3. The LED chip heat sink according to claim 1, wherein: the shape of the heat dissipation hole is s-shaped, and the shape of the heat dissipation pipe is that a plurality of continuous s-shaped heat dissipation holes are connected.

4. The LED chip heat sink according to claim 1, wherein: the bottom of the heat dissipation hole is connected with a heat conduction pipe, the material of the heat conduction pipe is a metal material, and the top of the heat conduction pipe is movably connected with the heat dissipation pad.

5. The LED chip heat sink according to claim 1, wherein: the heat dissipation pad is characterized in that a connecting hole is formed in the bottom of the heat dissipation pad, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.

6. The LED chip heat sink according to claim 1, wherein: the apopore slope sets up, apopore opening part one end height is less than the apopore other end height.

7. The LED chip heat sink according to claim 1, wherein: the water outlet electromagnetic valve and the water inlet electromagnetic valve are respectively positioned at two ends of the heat dissipation substrate, the inside of the heat dissipation hole is provided with a temperature sensor, and the temperature sensor is electrically connected with the control device.

8. The LED chip heat sink according to claim 1, wherein: the heat dissipation pad is made of metal materials, the heat dissipation pad is provided with a containing groove, and the LED chip is arranged in the containing groove.

Technical Field

The invention relates to a heat dissipation device for an LED chip, and belongs to the field of LEDs.

Background

The LED, namely the light-emitting diode, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like, because the electric energy can not be completely converted into the light energy in the use process of the LED, a part of the electric energy is heated, so that a large amount of heat is generated in the use process of the LED, if the LED can not be timely radiated, the LED parts can be damaged, the service life of the LED is reduced, the metal radiating piece is usually arranged outside the LED chip for radiating the heat of the LED at present, but since the temperature of the metal heat sink continues to increase during conduction, and then can not fine carry out the heat conduction effect between its and the air, lead to a period of time after, the heat concentrates on the radiating element, and the radiating effect is poor, can not fine reach the radiating effect.

Disclosure of Invention

The invention provides an LED chip heat dissipation device, which solves the problem that the existing heat dissipation device adopts a metal heat dissipation piece, and the temperature of the surface of the metal heat dissipation piece can be continuously increased in the heat dissipation process, so that the heat dissipation device and the air can not conduct heat well.

In order to solve the technical problems, the invention provides the following technical scheme:

the invention provides an LED chip heat dissipation device, which comprises a heat dissipation pad and a heat dissipation substrate, wherein an LED chip is arranged on the heat dissipation pad, the heat dissipation pad is arranged on the heat dissipation substrate, a plurality of heat dissipation holes are formed in the heat dissipation substrate, one end of each heat dissipation hole is connected with the end face of a water inlet hole, the other end of each heat dissipation hole is connected with the end face of a water outlet hole, the water inlet holes and the water outlet holes are of a single-face opening structure, one end of each water inlet hole is connected with the heat dissipation tube through a water inlet electromagnetic valve and a pipeline, a water inlet is formed in the top of the heat dissipation tube, one end of each water outlet hole is connected with the other end of the heat dissipation tube through a water.

Preferably, a plurality of heat dissipation grooves are formed in the bottom of the heat dissipation substrate, and the heat dissipation grooves are concave.

Preferably, the shape of the heat dissipation hole is s-shaped, and the shape of the heat dissipation pipe is formed by connecting a plurality of continuous s-shaped heat dissipation holes. The radiating holes and the radiating pipes are in s shapes, so that the contact area with air is increased, and the radiating effect is improved.

Preferably, the bottom of the heat dissipation hole is connected with a heat conduction pipe, the heat conduction pipe is made of metal, and the top of the heat conduction pipe is movably connected with the heat dissipation pad.

Preferably, the bottom of the heat dissipation pad is provided with a connecting hole, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.

Preferably, the water outlet is obliquely arranged, and one end of the opening of the water outlet is lower than the other end of the water outlet.

Preferably, the water outlet electromagnetic valve and the water inlet electromagnetic valve are respectively located at two ends of the heat dissipation substrate, a temperature sensor is arranged inside the heat dissipation hole, and the temperature sensor is electrically connected with the control device.

Preferably, the heat dissipation pad adopts metal material, be equipped with on the heat dissipation pad and accomodate the groove, the LED chip sets up in accomodating the groove.

Through the technical scheme, the invention has the beneficial effects that: through setting up the radiating basal plate to at the inside a plurality of louvres that are equipped with of radiating basal plate, and in transmitting the heat transfer on with the cooling pad for the louvre through the heat pipe, absorb its heat through the water-cooling, and dispel the heat through the heat after the cooling tube will absorb, realized heat cycle, effectively solved the problem among the background art.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a water outlet;

fig. 3 is a schematic view of the water inlet hole.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

According to a LED chip heat abstractor shown in the figure, including cooling pad 2 and radiating basal plate 1, be equipped with LED chip 4 on the cooling pad 2, cooling pad 2 sets up on radiating basal plate 1, radiating basal plate 1 is inside to be equipped with a plurality of louvres 10, louvre 10 one end links to each other with inlet opening 12 terminal surface, the louvre 10 other end links to each other with apopore 9 terminal surface, inlet opening 9 is single open structure with apopore 12, inlet opening 9 one end is passed through inlet solenoid valve 5, pipeline and is linked to each other with cooling tube 7, 7 tops of cooling tube are equipped with the water inlet, 9 one end of apopore are passed through outlet solenoid valve 6, pipeline and are linked to each other with the 7 other ends of cooling tube, cooling tube 7 sets up at 1 top of radiating basal plate, inlet solenoid valve 5 passes through electric connection controlling means with outlet solenoid valve.

Preferably, a plurality of heat dissipation grooves 8 are formed in the bottom of the heat dissipation substrate 1, and the heat dissipation grooves 8 are concave.

Preferably, the radiating hole 10 has an s-shape, and the radiating pipe 7 has a plurality of s-shapes connected in series. The radiating holes and the radiating pipes are in s shapes, so that the contact area with air is increased, and the radiating effect is improved.

Preferably, the bottom of the heat dissipation hole 10 is connected to a heat pipe 11, the material of the heat pipe 11 is a metal material, and the top of the heat pipe 11 is movably connected to the heat dissipation pad 2.

Preferably, the bottom of the heat dissipation pad 2 is provided with a connecting hole, the size of the connecting hole is consistent with that of the heat conduction pipe, and a rubber ring is arranged at the connecting position of the connecting hole and the heat conduction pipe.

Preferably, apopore 9 sets up in the slope, 9 opening part one ends of apopore highly is less than the apopore 9 other end height.

Preferably, the water outlet solenoid valve 5 and the water inlet solenoid valve 6 are respectively located at two ends of the heat dissipation substrate 1, and a temperature sensor is arranged inside the heat dissipation hole 10 and electrically connected with the control device.

Preferably, the heat dissipation pad 2 is made of metal, the heat dissipation pad 2 is provided with a storage groove 3, and the LED chip 4 is arranged in the storage groove 3.

During the specific use, when needs dispel the heat, open water inlet solenoid valve 5, during cooling water enters into louvre 10 through the inlet opening, louvre 10 passes through the heat pipe and gives the cooling water in louvre 10 with the heat transfer in the cooling pad 2, detects cooling water temperature when temperature sensor in the cooling water and reaches the set temperature, opens out water solenoid valve 6, enters into cooling tube 7 with the cooling water and cools off, and then enters into louvre 10 with the cooling water through water inlet solenoid valve 6 in, the above-mentioned process of constantly circulating can dispel the heat to LED chip 4.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.