阅读说明：本技术 修整器和包括其的化学机械抛光装置 (Dresser and chemical mechanical polishing device comprising same ) 是由 韩昇澈 李龙熙 严泰民 权炳昊 李根泽 于 2019-12-19 设计创作，主要内容包括：提供了一种化学机械抛光(CMP)装置的修整器和一种包括该修整器的CMP装置。所述修整器包括：盘,所述盘用于对所述CMP装置的抛光垫进行修整；驱动器,所述驱动器用于使所述盘旋转；升降器,所述升降器用于升降所述驱动器；臂,所述臂用于使所述升降器旋转；以及连接器,所述连接器用于将所述驱动器连接到所述升降器,所述驱动器相对于所述升降器是可倾斜的。(A dresser of a Chemical Mechanical Polishing (CMP) apparatus and a CMP apparatus including the dresser are provided. The finisher includes: a disk for conditioning a polishing pad of the CMP apparatus; a drive for rotating the disk; a lifter to lift the driver; an arm for rotating the lifter; and a connector for connecting the drive to the elevator, the drive being tiltable relative to the elevator.)

1. A dresser of a chemical mechanical polishing apparatus, the dresser comprising:

a disk for dressing a polishing pad of the chemical mechanical polishing apparatus;

a drive for rotating the disk;

a lifter to lift the driver;

an arm for rotating the lifter; and

a connector for connecting the drive to the riser, the drive being tiltable relative to the riser.

2. The dresser of claim 1, wherein the connector includes a spherical bearing for securing the lifter and tiltably supporting the drive.

3. The dresser of claim 2, wherein the spherical bearing comprises:

an outer ring attached to the riser; and

an inner ring surrounded by the outer ring, the inner ring being tiltable within the outer ring and attached to the drive.

4. The trimmer of claim 3, wherein the connector further comprises a bracket connecting the lifter to an upper surface of the outer ring.

5. The trimmer of claim 3, wherein the connector further comprises:

a lower extension plate located below a lower surface of the outer ring, the lower extension plate protruding beyond an outer circumferential surface of the outer ring; and

an upper extension plate located above an upper surface of the outer ring, the upper extension plate protruding beyond the outer circumferential surface of the outer ring, a space being defined between the lower extension plate and the upper extension plate outside the outer circumferential surface of the outer ring.

6. The trimmer of claim 5, further comprising a bladder mechanism located in the space between the lower extension plate and the upper extension plate, the bladder mechanism including at least two bladders located in the space.

7. The dresser of claim 6, wherein the bladder mechanism comprises:

a first airbag block located in the space and having a first airbag; and

a second airbag block located in the space and having a second airbag.

8. The trimmer of claim 7, wherein the first and second bladder blocks are substantially the same size and substantially the same shape.

9. The trimmer of claim 8, wherein the first and second bladder blocks each have a circular arc shape with a curvature corresponding to a curvature of the outer ring.

10. The dresser of claim 8, wherein a volume of the first bladder is substantially the same as a volume of the second bladder.

11. The trimmer of claim 8, wherein the first and second bladder blocks are symmetrically arranged with respect to a center point of the outer ring.

12. The trimmer of claim 7, wherein the first and second balloons comprise a flexible material.

13. The trimmer of claim 12, wherein the flexible material comprises silicone or rubber.

14. The dresser of claim 7, wherein the bladder mechanism further comprises:

a first air line connected to the first air bag to provide a first inflation pressure to the first air bag;

a second air line connected to the second air bag to provide a second inflation pressure to the second air bag; and

a controller for controlling the first inflation pressure and the second inflation pressure.

15. The trimmer of claim 3, wherein the connector further comprises an extension plate positioned on an upper surface of the inner ring to define a space between the outer ring and the extension plate.

16. The trimmer of claim 15, further comprising a bladder mechanism located in the space between the extension plate and the outer ring, the bladder mechanism including at least two bladders located in the space.

17. The dresser of claim 16, wherein the bladder mechanism comprises:

a first airbag block located in the space and having a first airbag;

a second airbag block located in the space and having a second airbag;

a third airbag block located in the space and having a third airbag; and

a fourth airbag block located in the space and having a fourth airbag.

18. The trimmer of claim 17, wherein the first through fourth airbag blocks have substantially the same size and substantially the same shape.

19. The dresser of claim 18, wherein the first through fourth airbag blocks have a circular arc shape with a curvature corresponding to a curvature of the outer ring.

20. The trimmer of claim 1, further comprising an angle sensor positioned on the connector to measure a tilt angle of the driver.

21. The dresser of claim 1, further comprising a load cell located on the lifter to measure a load applied to the disc from the lifter.

22. A chemical mechanical polishing apparatus, the chemical mechanical polishing apparatus comprising:

a platen having a polishing pad attached thereto;

a chemical mechanical polishing mechanism located above the platen for chemical mechanical polishing of a layer on a substrate; and

a trimmer, the trimmer comprising:

a disk for conditioning the polishing pad,

a drive for rotating the disk,

a lifter to lift the driver,

an arm for rotating the lifter, an

A connector connecting the drive to the riser, the drive being tiltable relative to the riser.

23. The chemical mechanical polishing apparatus of claim 22, wherein the dresser further comprises a bladder mechanism, the bladder mechanism being located in the connector, the bladder mechanism including at least two bladders located in the connector.

24. The chemical mechanical polishing apparatus according to claim 22, wherein the dresser further includes an angle sensor located on the connector to measure an inclination angle of the driver.

25. The chemical mechanical polishing apparatus according to claim 22, wherein the dresser further includes a load cell that is located on the lifter to measure a load applied from the lifter to the disk.

Technical Field

Example embodiments relate to a dresser, a Chemical Mechanical Polishing (CMP) apparatus including the dresser, and a method of manufacturing a semiconductor device using the CMP apparatus. More particularly, example embodiments relate to a dresser for polishing a polishing pad, a CMP apparatus including the dresser, and a method of manufacturing a semiconductor device using the CMP apparatus.

Background

In general, a CMP apparatus may be used to planarize a layer on a semiconductor substrate. The CMP apparatus may include a CMP mechanism having a polishing pad and a dresser for dressing the polishing pad with a dressing disk. In order to prepare for the tilting of the polishing pad relative to the dresser, the dresser may include a connecting module.

Disclosure of Invention

According to example embodiments, a dresser of a CMP apparatus may be provided. The finisher may include: a disk for conditioning a polishing pad of the CMP apparatus; a drive for rotating the disk; a lifter to lift the driver; an arm for rotating the lifter; and a connector for connecting the drive to the elevator, the drive being tiltable relative to the elevator.

According to example embodiments, a dresser of a CMP apparatus may be provided. The finisher may include: a disk for conditioning a polishing pad of the CMP apparatus; a drive for rotating the disk; a lifter to lift the driver; an arm for rotating the lifter; and a connector for connecting the drive to the elevator, the drive being tiltable relative to the elevator; and an airbag mechanism located in the connector, the airbag mechanism including at least two airbags located in the connector.

According to an example embodiment, a CMP apparatus may be provided. The CMP apparatus may include: a platen having a polishing pad attached thereto; a CMP mechanism located above the platen for chemical mechanical polishing of a layer on a substrate; and a finisher including: a disk for conditioning the polishing pad; a drive for rotating the disk; a lifter to lift the driver; an arm for rotating the lifter; and a connector connecting the drive to the riser, the drive being tiltable relative to the riser.

According to an example embodiment, there may be provided a method of manufacturing a semiconductor device, the method including: placing a substrate on a polishing pad; chemical mechanical polishing a layer on the substrate using the polishing pad; and dressing the polishing pad using a dresser, the dresser including: a disk for conditioning the polishing pad; a drive for rotating the disk; a lifter to lift the driver; an arm for rotating the lifter; and a connector connecting the drive to the riser, the drive being tiltable relative to the riser.

Drawings

Features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the attached drawings, wherein:

fig. 1 illustrates a cross-sectional view of a conditioner according to an example embodiment;

fig. 2 shows a sectional view of an internal structure of the dresser in fig. 1;

fig. 3 is a perspective view showing a combined structure of a lifting module, a driving module, a connecting module, and an airbag module in the finisher of fig. 1;

FIG. 4 shows a cross-sectional view of the combined construction of the lifting module, the drive module, the connection module and the airbag module of FIG. 3;

FIG. 5 shows an exploded perspective view of the connection module and airbag module of FIG. 3;

FIG. 6 shows a perspective view of the connection module and airbag module of FIG. 5;

FIG. 7 shows a perspective view of the internal structure of the spherical bearing in the connection module of FIG. 5;

figure 8 shows a perspective view of the combination of the drive module and the spherical bearing of figure 7;

figure 9 shows a perspective view of the combined structure of the lifting module and the spherical bearing of figure 7;

FIG. 10 shows a top view of the disk module and polishing pad rotation direction;

FIG. 11 illustrates a cross-sectional view of a tilted disk module of the conditioner of FIG. 1;

FIG. 12 shows a cross-sectional view of the operation of an airbag module for correcting the tilt of the disk module in FIG. 11;

FIG. 13 shows a cross-sectional view of the disk module corrected by the airbag module of FIG. 12;

fig. 14 shows a cross-sectional view of a conditioner according to an example embodiment;

fig. 15 is a sectional view showing an internal structure of the dresser in fig. 14;

fig. 16 is a perspective view showing a combined structure of a lift module, a driving module, a connecting module, and an airbag module in the finisher of fig. 14;

FIG. 17 shows a cross-sectional view of the combined construction of the lifting module, the drive module, the connection module and the airbag module of FIG. 16;

FIG. 18 shows an exploded perspective view of the connection module and airbag module of FIG. 16;

FIG. 19 shows a perspective view of the connection module and airbag module of FIG. 18;

FIG. 20 shows a perspective view of the internal structure of the spherical bearing in the connection module of FIG. 18;

figure 21 shows a perspective view of the combination of the drive module and the spherical bearing of figure 20;

figure 22 shows a perspective view of the combination of the drive module and the spherical bearing of figure 20;

figure 23 shows a perspective view of the combined structure of the lifting module and the spherical bearing of figure 20;

fig. 24 is a sectional view showing a CMP apparatus including the dresser of fig. 1; and

fig. 25 shows a flowchart of stages in a method of manufacturing a semiconductor device using the CMP apparatus in fig. 24.

Detailed Description

Hereinafter, example embodiments will be described in detail with reference to the accompanying drawings.

Trimmer

Fig. 1 is a sectional view showing a dresser according to an example embodiment, fig. 2 is a sectional view showing an internal structure of the dresser in fig. 1, fig. 3 is a perspective view showing a combined structure of a lifting module, a driving module, a connecting module and an airbag module in the finisher of fig. 1, FIG. 4 is a sectional view showing a combined structure of the lifting module, the driving module, the connecting module and the airbag module of FIG. 3, fig. 5 is an exploded perspective view illustrating the connection module and the airbag module of fig. 3, fig. 6 is a perspective view illustrating the connection module and the airbag module of fig. 5, fig. 7 is a perspective view showing an internal structure of a spherical bearing in the connection module of fig. 5, fig. 8 is a perspective view showing a combined structure of a driving module and the spherical bearing of fig. 7, and fig. 9 is a perspective view showing a combined structure of a lifting module and the spherical bearing of fig. 7.

Referring to fig. 1 and 2, the finisher 100 of this example embodiment may include an arm module 110 (e.g., an arm), a lift module 120 (e.g., a lifter), a drive module 130 (e.g., a driver), a disk module 140 (e.g., a disk), a connection module 150 (e.g., a connector), and an airbag module 160 (e.g., an airbag mechanism). Trimmer 100 may be controlled by controllers 116 and 190, which will be described in more detail below.

The disk module 140 may be disposed over a polishing pad configured to polish a layer on a substrate. The disk module 140 may include a conditioning disk 142 and a rotating shaft 144. The conditioning disk 142 may be disposed above the polishing pad. The conditioning disk 142 can rotate and contact the upper surface of the polishing pad to condition the upper surface of the polishing pad. A rotating shaft 144 may connect the conditioning disk 142 with the drive module 130.

The drive module 130 may be coupled to the upper surface of the conditioning disk 142 by a rotating shaft 144. The drive module 130 may transmit a rotational force to the conditioning disk 142 through the rotational shaft 144. In an example embodiment, the drive module 130 may include a motor.

The lifting module 120 may be configured to vertically move the driving module 130. The lift module 120 may transmit a vertical force to the disk module 140 through the driving module 130. Thus, the rotating conditioning disk 142 can press the polishing pad. For example, the lift module 120 may include a cylinder. For example, the lifting module 120 may include a pair of cylinders arranged to be spaced apart from each other with a uniform gap.

The arm module 110 may be configured to rotate the lift module 120 relative to a vertical axis (e.g., about a Z-axis). The arm module 110 may include an arm 112 coupled to a lift module 120 and an actuator 114 configured to rotate the arm 112 relative to a vertical axis.

The arm 112 may extend in a horizontal direction. The lift module 120 may be connected to a first end of the arm 112, e.g., the left end of the arm 112 in fig. 2. The actuator 114 may be connected to a second end (opposite the first end) of the arm 112, e.g., the right end of the arm 112 in fig. 2. The actuator 114 may rotate the arm 112 relative to a second end (e.g., a right end) of the arm 112. In an example embodiment, the actuator 114 may include a motor.

The connection module 150 may be disposed between the lifting module 120 and the driving module 130. The connection module 150 may connect the driving module 130 with the lifting module 120 to allow the driving module 130 to be tilted with respect to the lifting module 120. For example, referring to fig. 3 to 4, the driving module 130 and the lifting module 120 may be connected to different portions of the connection module 150, and thus the driving module 130 and the lifting module 120 may be connected to each other by the connection module 150. For example, the driving module 130 may be inclined to the left or right direction of a horizontal axis (e.g., X axis) with respect to the lifting module 120 by the connection module 150, as will be described in more detail below with reference to fig. 3 to 9.

As shown in fig. 5-9, the connection module 150 may include a spherical bearing. The spherical bearing of the connection module 150 may include an outer ring 152 and an inner ring 154. The outer ring 152 may have an annular shape with an axial bore. The inner ring 154 may have an annular shape with an axial bore. The inner ring 154 may be received in the axial bore of the outer ring 152 at an incline relative to a horizontal axis, e.g., the inner ring 154 may fit closely within the axial bore of the outer ring 152 so as to be movable relative to the horizontal axis within the axial bore of the outer ring 152 in the presence of frictional forces (e.g., the edge of the inner ring 154 may be inclined in the Z-axis relative to the opposite edge while frictional forces between the inner ring 154 and the outer ring 152 may retain the inner ring 154 within the outer ring 152). For example, the outermost radius of the inner ring 154 may be equal to the radius of the axial bore of the outer ring 152 such that the inner ring 154 fits within the axial bore of the outer ring 152. Thus, the outermost radius of inner ring 154 may be less than the outermost radius of outer ring 152. For example, as shown in fig. 7, the inner ring 154 may include a first portion 154a that conforms to the inner circumference (e.g., the entire inner circumference) of the outer ring 152, and a second portion 154b that extends radially from the bottom of the first portion 154a (e.g., the entire first portion 154a) toward the center of the inner ring 154, e.g., the second portion 154b may be perpendicular to the first portion 154 a. For example, as also shown in fig. 7, the second portion 154b of the inner ring 154 may define an axial bore of the inner ring 154, e.g., the axial bore of the inner ring 154 may have a radius that is less than an inner radius of the first portion 154a of the inner ring 154 by a length of the second portion 154b in the radial direction.

As shown in fig. 8, the drive module 130 may be received in an axial bore of the inner ring 154. The drive module 130 may be secured to the inner ring 154, for example, to the second portion 154b of the inner ring 154. Thus, the drive module 130 may be interlocked with the movement of the inner ring 154. That is, the driving module 130 may be tilted together with the tilt of the inner ring 154.

In contrast, as shown in fig. 9, the lift module 120 may be secured to the outer ring 152. For example, the lifting module 120 may be fixed to an upper surface of the outer ring 152 at a side of the outer ring 152 between the driving module 130 and the center of the arm 112, i.e., a right portion of the upper surface of the outer ring 152 in fig. 2 and 9. In an example embodiment, the lift module 120 may be secured to an upper surface of the outer ring 152 using a bracket 122, as shown in fig. 9. The bracket 122 may have a lower surface configured to contact, for example, a right portion of the upper surface of the outer ring 152 and an upper surface fixed to the lift module 120. Because the width of the outer ring 152 (i.e., the difference between the outer radius and the inner radius of the outer ring 152) may be narrower than the width of the lifting module 120, the width of the upper surface of the bracket 122 may be wider than the width of the lower surface of the bracket 122.

Thus, because the lift module 120 may be secured to the outer ring 152 and the drive module 130 may be secured to the inner ring 154, the tilt of the inner ring 154 in the outer ring 152 is only transmitted to the drive module 130 and not to the lift module 120. Thus, the tilt of the inner ring 154 in the outer ring 152 may produce a tilt of the drive module 130 relative to the lift module 120, while the lift module 120 may remain stationary relative to the outer ring 152.

As shown in fig. 4-6, the connection module 150 may further include a lower extension plate 156 and an upper extension plate 158. As shown in fig. 5, a lower extension plate 156 may be secured to the lower surface of the outer ring 152. The outer diameter of the lower extension plate 156 may be greater than the outer diameter of the outer ring 152. Accordingly, the lower extension plate 156 may horizontally protrude from the outer circumferential surface of the outer ring 152 (e.g., beyond the outer circumferential surface of the outer ring 152).

The upper extension plate 158 may be fixed to an upper surface of the inner ring 154, i.e., to an upper surface of the second portion 154b of the inner ring 154. The outer diameter of the upper extension plate 158 may be greater than the outer diameter of the outer ring 152. For example, the outer diameter of the upper extension plate 158 may be substantially the same as the outer diameter of the lower extension plate 156. In another example, the outer diameter of the upper extension plate 158 may be different from the outer diameter of the lower extension plate 156. The upper extension plate 158 may horizontally protrude from the outer circumferential surface of the outer ring 152 (e.g., beyond the outer circumferential surface of the outer ring 152). Accordingly, an annular space 151 (fig. 3) may be formed between a portion of the lower extension plate 156 protruding beyond the outer circumferential surface of the outer ring 152 and a portion of the upper extension plate 158 protruding beyond the outer circumferential surface of the outer ring 152. For example, the upper extension plate 158 may include a pair of plates. In another example, the upper extension plate 158 may comprise a single plate.

In an example embodiment, as shown in fig. 5 and 6, each upper extension plate 158 may include a rim (rim)158a, an upper fixing portion 158b, and a lower fixing portion 158 c. The rim 158a may be located outside the outer circumferential surface of the outer ring 152 to form an annular space 151 together with the lower extension plate 156. The rim 158a may have a circular arc shape. An upper stationary portion 158b may extend upward from an inner surface of the rim 158a (fig. 6), for example, an opening 158e may be formed between the rim 158a and the upper stationary portion 158b to expose the outer ring 152 and accommodate the connection between the lift module 120 and the outer ring 152. The lower fixing portion 158c may extend downward from an inner surface of the rim 158a (fig. 5). For example, the lower securing portion 158c may be configured to contact an upper surface of the inner ring 154, e.g., the lower securing portion 158c may directly contact an upper surface of the second portion 154b of the inner ring 154 (fig. 6), while the rim 158a may extend above an uppermost surface of the outer ring 152 (e.g., may overhang the uppermost surface of the outer ring 152) (fig. 6), e.g., so the lift module 120 may be secured to the outer ring 152.

The upper and lower fixing portions 158b and 158c may be disposed on the same vertical line, for example, innermost edges of the upper and lower fixing portions 158b and 158c facing the center of the rim 158a may be vertically aligned (fig. 5). The fixing hole 158d may be vertically formed through the upper and lower fixing portions 158b and 158 c. The upper extension plate 158 may be fixed to the inner ring 154 by inserting bolts into the fixing holes 158 d. However, the upper extension plate 158 may have any other convenient shape configured to form an annular space between the lower extension plate 156 and the upper extension plate 158.

As shown in fig. 3, the airbag module 160 may be disposed in the annular space 151 between the upper extension plate 158 and the lower extension plate 156. The airbag module 160 may form at least two airbags between the lift module 120 and the drive module 130. At least two air bags formed by the air bag module 160 between the lifting module 120 and the driving module 130 may have different pressures. Accordingly, the airbag module 160 may form airbags having different rigidities between the lift module 120 and the driving module 130.

In detail, as shown in fig. 3 and 5, the airbag module 160 may include a first airbag block 162 and a second airbag block 164. Further, as shown in fig. 1-2, the airbag module 160 may include a first airline 192, a second airline 194, and a controller 190. The first and second airline 192, 194 may be formed in the arm module 110, for example, may extend through the arm 112 to contact the airbag module 160 (fig. 2 and 4).

Referring to fig. 3 and 5, the first and second airbag blocks 162 and 164 may be disposed in the annular space 151 between the upper and lower extension plates 158 and 156. For example, as shown in fig. 3, first and second airbag blocks 162, 164 may, for example, completely fill the annular space 151 between the upper and lower extension plates 158, 156 outside of the outer ring 152. The first and second airbag blocks 162, 164 may have substantially the same shape and size. Because the annular space 151 may have an annular shape, each of the first and second airbag blocks 162 and 164 may have a circular arc shape. In detail, the curvature of the first and second airbag blocks 162 and 164 may be substantially the same as the curvature of the outer ring 152. However, the first and second airbag blocks 162 and 164 may have other shapes that may be accommodated in the annular space 151, in addition to the circular arc shape. Further, the first and second airbag blocks 162 and 164 may be arranged symmetrically to each other with respect to a center point of the outer ring 152. Accordingly, the first and second airbag blocks 162 and 164 may be arranged to be spaced apart from each other by a uniform gap. In addition, the first and second airbag blocks 162, 164 may include a flexible material. For example, the first and second airbag blocks 162, 164 may include silicone, rubber, or the like.

The first air bladder block 162 may have a first air bladder 161. The first bladder 161 may be formed in the first bladder block 162, for example, the first bladder 161 may be an empty space within the first bladder block 162. A first air line 192 may be connected to the first bladder 161 to provide a first inflation pressure P1 to the first bladder 161, for example, so that the first air line 192 may control the amount of air (and corresponding pressure) within the empty space of the first bladder block 162 formed of flexible material. The first inflation pressure P1 communicated to the first bladder 161 via the first airline 192 may be controlled by the controller 190.

In an example embodiment, the first air bladder 161 may be exposed through the upper and lower surfaces of the first air bladder block 162, for example, in fig. 5, the shape of the bottom of the first air bladder block 162 may be the same as the shape of the top thereof. For example, in order to seal the first airbag 161, the lower cover 153 may be disposed on the lower surface of the first airbag block 162, and the upper cover 155 may be disposed on the upper surface of the first airbag block 162, e.g., the upper surface of the lower cover 153 and the upper surface of the first airbag block 162 may be flush with each other, or the lower cover 153 may completely cover the lower surface of the first airbag block 162. In another example, the lower cover 153 may be integrally formed with the lower extension plate 156, and the upper cover 155 may be integrally formed with the upper extension plate 158. If the first air bag 161 is not exposed through the upper and lower surfaces of the first air bag block 162, the lower cover 153 and the upper cover 155 may not be provided on the first air bag block 162.

The second airbag block 164 may have a second airbag 163. The second air cell 163 may be formed in the second air cell block 164, for example, the second air cell 163 may be an empty space inside the second air cell block 164. The volume of the second bladder 163 may be substantially the same as the volume of the first bladder 161. A second air line 194 may be connected to second bladder 163 to provide a second inflation pressure P2 to second bladder 163, e.g., so that second air line 194 may control the amount of air (and corresponding pressure) within the empty space of second bladder block 164 formed of a flexible material. The second inflation pressure P2, delivered to the second bladder 163 via the second air line 194, may be controlled by the controller 190.

In an example embodiment, the second bladder 163 may be exposed through the upper and lower surfaces of the second bladder block 164. For example, in order to seal the second airbag 163, the lower cover 153 may be disposed on the lower surface of the second airbag block 164, and the upper cover 155 may be disposed on the upper surface of the second airbag block 164. In another example, if the second air bladder 163 is not exposed through the upper and lower surfaces of the second air bladder block 164, the lower cover 153 and the upper cover 155 may not be provided for the second air bladder block 164.

Controller 190 may control a first inflation pressure P1 provided to first bladder 161 and a second inflation pressure P2 provided to second bladder 163. The first inflation pressure P1 in first bladder 161 and the second inflation pressure P2 in second bladder 163 may be substantially equal to or different from each other. Accordingly, the controller 190 may provide the first bladder 161 with a stiffness substantially equal to or different from the stiffness of the second bladder 163. The inflation pressure control of the first and second air cells 161 and 163 by the controller 190 may be determined according to the tilt of the disk module 140. Further, the controller 190 may receive a control signal from the main controller 116 for controlling the operation of the CMP apparatus including the dresser 100.

For example, the airbag module 160 may include a first airbag block 162 and a second airbag block 164 connected to a first airline 192 and a second airline 194, respectively. In another example, the airbag module 160 may include at least three airbag blocks that are each connected to a different air line.

In addition, as shown in fig. 2, the finisher 100 may further include a load cell 170. The load cell 170 may measure a load applied from the lift module 120 to the tray module 140. That is, the load cell 170 may measure the dressing force applied from the dresser 100 to the polishing pad. The load measured by the load cell 170 may be transmitted to the controller 190. In order to optimally condition the polishing pad by the dresser 100, the controller 190 may control the inflation pressure applied to the first and second bladders 161 and 163 and the load applied to the disk module 140.

Further, the finisher 100 may further include an angle sensor module 180. The angle sensor module 180 may measure an inclination angle of the driving module 130 with respect to the lifting module 120. In an example embodiment, as shown in fig. 9, the angle sensor module 180 may include a bracket 182 and an angle sensor 184. The bracket 182 may be mounted to the upper surface of the upper extension plate 158. Thus, the bracket 182 may interlock with the tilt of the inner ring 154. The angle sensor 184 may be mounted on the bracket 182. Because the bracket 182 may be tilted together with the inner ring 154, the angle sensor 184 may measure the tilt angle of the drive module 130. The tilt angle of the drive module 130 (i.e., the tilt angle of the disk module 140) measured by the angle sensor 184 may be transmitted to the controller 190.

Fig. 10 is a plan view showing a rotation direction of the disk module 140 and the polishing pad, fig. 11 is a sectional view showing the disk module 140 tilted in the dresser 100, fig. 12 is a sectional view showing an operation of the air bag module 160 for correcting the tilt of the disk module 140 in fig. 11, and fig. 13 is a sectional view showing the disk module 140 corrected by the air bag module 160.

Referring to fig. 10, when the disk module 140 rotates in the R2 direction and the polishing pad P rotates in the R1 direction, friction may be generated between the disk module 140 and the polishing pad P. Therefore, as shown in fig. 11, the disk module 140 may be inclined with respect to the vertical axis V with respect to the upper surface of the polishing pad P due to a lateral force generated by friction between the disk module 140 and the polishing pad P.

For example, referring to fig. 11, the tilted disk module 140 may have a rotation axis V1 tilted to the right with respect to the vertical axis V. Accordingly, the left portion of the disk module 140 below the first bladder block 162 may be slightly floated from the upper surface of the polishing pad P. In this case, the pressure applied to the polishing pad P from the left portion (i.e., a slightly floating portion) of the disk module 140 may be lower than the pressure applied to the polishing pad P from the right portion (i.e., a portion directly above the polishing pad P) of the disk module 140. The load cell 170 (fig. 2) may measure a pressure difference between pressures applied to the polishing pad P by the right and left side portions of the disk module 140, and the angle sensor module 180 may measure an inclination angle of the disk module 140. The pressure difference measured by the load cell 170 and the tilt angle of the disk module 140 measured by the angle sensor module 180 may be transmitted to the controller 190.

Referring to fig. 12, the controller 190 may set the inflation pressure applied to each of the first and second air bags 161 and 163 according to the measured pressure difference and inclination angle. That is, referring to fig. 11, if the left portion of the disk module 140 below the first airbag block 162 floats and the pressure exerted on the polishing pad P is lower than the right portion of the disk module 140, the controller 190 may set a first inflation pressure P1 applied to the first airbag 161 in the first airbag block 162 higher than a second inflation pressure P2 applied to the second airbag 163 in the second airbag block 164 to adjust the reduced pressure exerted by the first airbag block 162. Accordingly, since the first inflation pressure P1 applied to the left portion of the disk module 140 below the first air bladder 161 may be higher than the second inflation pressure P2 applied to the right portion of the disk module 140 below the second air bladder 163, the tilt of the disk module 140 may be corrected (fig. 13). Accordingly, the disk module 140 can condition the polishing pad P using uniform pressure.

Fig. 14 is a sectional view illustrating a dresser according to an example embodiment, fig. 15 is a sectional view illustrating an internal structure of the dresser of fig. 14, fig. 16 is a perspective view illustrating a combined structure of a lift module, a drive module, a connection module, and an airbag module in the dresser of fig. 14, fig. 17 is a sectional view illustrating a combined structure of a lift module, a drive module, a connection module, and an airbag module in fig. 16, fig. 18 is an exploded perspective view illustrating the connection module and the airbag module in fig. 16, fig. 19 is a perspective view illustrating the connection module and the airbag module in fig. 18, fig. 20 is a perspective view illustrating an internal structure of a spherical bearing in the connection module of fig. 18, fig. 21 is a perspective view illustrating a combined structure of a drive module and the spherical bearing in fig. 20, fig. 22 is a perspective view illustrating a combined structure of a drive module and the spherical bearing in fig. 20, fig. 23 is a perspective view showing a combined structure of the lifting module and the spherical bearing of fig. 20.

Referring to fig. 14 to 23, the finisher 200 of this example embodiment may include an arm module 210, a lift module 220, a driving module 230, a disk module 240, a connection module 250, and an airbag module 260.

The structures and functions of the arm module 210, the lift module 220, the drive module 230, and the disk module 240 according to this example embodiment may be substantially the same as those of the arm module 110, the lift module 120, the drive module 130, and the disk module 140 of fig. 1, respectively. Therefore, any further explanation regarding the arm module 210, the lift module 220, the drive module 230, and the disk module 240 according to this exemplary embodiment will be omitted herein for the sake of brevity.

The connection module 250 may be disposed between the lifting module 220 and the driving module 230. The connection module 250 may connect the drive module 230 with the lift module 220 to allow the drive module 230 to tilt relative to the lift module 220. Specifically, the driving module 230 may be inclined in the left or right direction of the horizontal axis with respect to the lifting module 220 by the connection module 250.

The connection module 250 may include a spherical bearing. The spherical bearing may include an outer ring 252 and an inner ring 254. Outer ring 252 may have an annular shape with an axial bore. The inner ring 254 may have an annular shape with an axial bore. The inner ring 254 may be received in an axial bore of the outer ring 252 at an angle to the horizontal axis. Thus, the outer diameter of inner ring 254 may be less than the outer diameter of outer ring 252.

In an example embodiment, outer diameter of outer ring 252 may be smaller than the outer diameter of outer ring 152 in FIG. 5. Further, the thickness of outer ring 252 may be greater than the thickness of outer ring 152 in FIG. 5. Accordingly, the width of outer ring 252 may be greater than the width of outer ring 152 in FIG. 5. Thus, the stiffness of outer ring 252 may be greater than the stiffness of outer ring 152 in FIG. 5.

The drive module 230 may be received in an axial bore of the inner ring 254. The drive module 230 may be secured to the inner ring 254. Thus, the drive module 230 may be interlocked with the movement of the inner ring 254. That is, the driving module 230 may be tilted together with the tilt of the inner ring 254.

In contrast, the lift module 220 may be secured to the outer ring 252. Specifically, the lifting module 220 may be fixed to a right portion of the upper surface of the outer ring 252. In an example embodiment, the lift module 220 may be secured to a right portion of the upper surface of the outer ring 252 using a bracket 222. The bracket 222 may have a lower surface configured to contact a right portion of the upper surface of the outer ring 252 and an upper surface to which the lift module 220 may be fixed. Because the width of outer ring 252 may be greater than the width of outer ring 152 in fig. 5, stent 222 may have a uniform width. That is, the width of the upper surface of the bracket 222 may be substantially the same as the width of the lower surface of the bracket 222.

Accordingly, because the lift module 220 may be secured to the outer ring 252 and the drive module 230 may be secured to the inner ring 254, the tilt of the inner ring 254 in the outer ring 252 may be transferred only to the drive module 230 and not to the lift module 220. Thus, the tilt of the inner ring 254 in the outer ring 252 may produce a tilt of the drive module 230 relative to the lift module 220.

The connection module 250 may also include an extension plate 258. An extension plate 258 may be secured to an upper surface of inner ring 254. The outer diameter of the extension plate 258 may be greater than the outer diameter of the inner ring 254. The outer diameter of extension plate 258 may be substantially the same as the outer diameter of outer ring 252. Alternatively, the outer diameter of the extension plate 258 may be different from the outer diameter of the outer ring 252. Thus, an annular space may be formed between the extension plate 258 and the outer ring 252.

In an example embodiment, the extension plate 258 may include a rim 258a and a fixed portion 258 b. Rim 258a may be positioned above outer ring 252 to form an annular space with outer ring 252. The rim 258a may include a pair of rims having a circular arc shape. The fixing portion 258b may extend downward from the inner surface of the rim 258 a. The fixing portion 258b may be fixed to the upper surface of the inner ring 254. Alternatively, the extension plate 258 may have other shapes configured to form an annular space between the extension plate 258 and the outer ring 252.

An airbag module 260 may be disposed in the space between the outer ring 252 and the extension plate 258. The airbag module 260 may form at least two airbags between the lifting module 220 and the driving module 230. In particular, at least two air cells formed by the air cell module 260 between the lift module 220 and the drive module 230 may have different pressures. Accordingly, the airbag module 260 may form airbags having different rigidities between the lifting module 220 and the driving module 230.

The airbag module 260 may include a first airbag block 262, a second airbag block 264, a third airbag block 266, a fourth airbag block 268, a first air line 292, a second air line 294, a third air line 296, a fourth air line 298, and a controller 290. First, second, third, and fourth air lines 292, 294, 296, and 298 may be formed in the arm module 210.

First through fourth bladder blocks 262, 264, 266, and 268 may be disposed in the space between extension plate 258 and outer ring 252. The first to fourth airbag blocks 262, 264, 266, and 268 may have substantially the same shape and size. Since the space may have an annular shape, the first to fourth airbag blocks 262, 264, 266, and 268 may have a circular arc shape. However, the first to fourth airbag blocks 262, 264, 266, and 268 may have other shapes that can be accommodated in the space, in addition to the circular arc shape. Further, the first to fourth balloon blocks 262, 264, 266 and 268 may be arranged symmetrically to each other with respect to the center point of the outer ring 252. Accordingly, the first to fourth airbag blocks 262, 264, 266, and 268 may be arranged to be spaced apart from each other by a uniform gap. In addition, the first to fourth airbag blocks 262, 264, 266, and 268 may include a flexible material. For example, the first to fourth air bag blocks 262, 264, 266, and 268 may include silicone, rubber, or the like.

The first airbag block 262 may have a first airbag 261. The first airbag 261 may be formed in the first airbag block 262. A first air line 292 may be connected to first air bag 261 to provide a first inflation pressure P1 to first air bag 261. The first inflation pressure P1 communicated to first bladder 261 via first air line 292 may be controlled by controller 290.

In an example embodiment, the first airbag 261 may be exposed through upper and lower surfaces of the first airbag block 262. To seal the first airbag 261, a lower cover 253 may be disposed on a lower surface of the first airbag block 262, and an upper cover 255 may be disposed on an upper surface of the first airbag block 262. Alternatively, the upper cover 255 may be integrally formed with the extension plate 258. In contrast, when the first airbag 261 may not be exposed through the upper and lower surfaces of the first airbag block 262, the lower cover 253 and the upper cover 255 may not be provided for the first airbag block 262.

The second airbag block 264 may have a second airbag 263. The second air bag 263 may be formed in the second air bag block 264. The volume of second bladder 263 may be substantially the same as the volume of first bladder 261. A second air line 294 may be connected to the second air bag 263 to provide a second inflation pressure P2 to the second air bag 263. The second inflation pressure P2 delivered to the second bladder 263 via the second air line 294 may be controlled by the controller 290.

In an example embodiment, the second air bladder 263 may be exposed through the upper and lower surfaces of the second air bladder block 264. To seal the second airbag 263, the lower cover 253 may be disposed on a lower surface of the second airbag block 264, and the upper cover 255 may be disposed on an upper surface of the second airbag block 264. In contrast, when the second airbag 263 may not be exposed through the upper and lower surfaces of the second airbag block 264, the lower cover 253 and the upper cover 255 may not be provided for the second airbag block 264.

The third airbag block 266 may have a third airbag 265. The third air bag 265 may be formed in the third air bag block 266. The volume of the third air cell 265 may be substantially the same as the volume of the first air cell 261. A third air line 296 may be connected to the third air bag 265 for providing a third inflation pressure P3 to the third air bag 265. The third inflation pressure P3 communicated to the third air bag 265 via the third air line 296 may be controlled by the controller 290.

In an example embodiment, the third air bag 265 may be exposed through upper and lower surfaces of the third air bag block 266. To seal the third airbag 265, the lower cover 253 may be disposed on a lower surface of the third airbag block 266, and the upper cover 255 may be disposed on an upper surface of the third airbag block 266. Alternatively, the upper cover 255 may be integrally formed with the extension plate 258. In contrast, when the third airbag 265 may not be exposed through the upper and lower surfaces of the third airbag block 266, the lower cover 253 and the upper cover 255 may not be provided for the third airbag block 266.

The fourth airbag block 268 may have a fourth airbag 267. The fourth bladder 267 may be formed in a fourth bladder block 268. The volume of the fourth bladder 267 may be substantially the same as the volume of the first bladder 261. A fourth airline 298 may be connected to the fourth airbag 267 to provide a fourth inflation pressure P4 to the fourth airbag 267. The fourth inflation pressure P4 communicated to the fourth air bag 267 via the fourth air line 298 may be controlled by the controller 290.

In an example embodiment, the fourth bladder 267 may be exposed through upper and lower surfaces of the fourth bladder block 268. To seal the fourth airbag 267, the lower cover 253 may be disposed on a lower surface of the fourth airbag block 268, and the upper cover 255 may be disposed on an upper surface of the fourth airbag block 268. In contrast, when the fourth airbag 267 may not be exposed through the upper and lower surfaces of the fourth airbag block 268, the lower cover 253 and the upper cover 255 may not be provided for the fourth airbag block 268.

The controller 290 may control the first to fourth inflation pressures P1, P2, P3, and P4 supplied to the first to fourth airbags 261, 263, 265, and 267. The first inflation pressure P1 in the first air bag 261, the second inflation pressure P2 in the second air bag 263, the third inflation pressure P3 in the third air bag 265, and the fourth inflation pressure P4 in the fourth air bag 267 may be substantially equal to or different from each other. Accordingly, the controller 290 may provide substantially equal stiffness or different stiffness to the first to fourth airbags 261, 263, 265, and 267. The inflation pressure control of the first to fourth airbags 261, 263, 265 and 267 by the controller 290 may be determined according to the tilt of the disk module 240. Further, the controller 290 may receive a control signal from the main controller 216 for controlling the operation of the CMP apparatus including the dresser 200.

In an example embodiment, the airbag module 260 may include four airbag blocks 262, 264, 266, and 268. Alternatively, the airbag module 260 may include two, three, or at least five airbag blocks.

In addition, the finisher 200 may further include a load cell 270. The load cell 270 may measure the load applied to the tray module 240 from the lift module 220. The load measured by the load cell 270 may be transmitted to the controller 290. In order to optimally condition the polishing pad by the conditioner 200, the controller 290 may control the inflation pressure applied to the first to fourth bladders 261, 263, 265, and 267 and the load applied to the disk module 240.

Further, the dresser 200 may further include an angle sensor module 280. The angle sensor module 280 may measure an angle of inclination of the driving module 230 with respect to the lifting module 220. The tilt angle of the driving module 230 (i.e., the tilt angle of the disk module 240) measured by the angle sensor module 280 may be transmitted to the controller 290.

CMP device

Fig. 24 is a sectional view showing a CMP apparatus including the dresser 100 in fig. 1.

Referring to fig. 24, the CMP apparatus 300 of this example embodiment may include a platen 310, a CMP mechanism 320, and a dresser 100. The operation of the CMP apparatus 300 may be controlled by the main controller 116.

In an example embodiment, the dresser 100 of this example embodiment may include substantially the same elements as those described previously with reference to fig. 1. Accordingly, like reference numerals may refer to like elements, and any further explanation regarding the like elements is omitted herein for the sake of brevity. Alternatively, the CMP apparatus 300 may include the dresser 200 in fig. 14.

Referring to fig. 24, a polishing pad P may be disposed on an upper surface of a platen 310. The CMP mechanism 320 may contact a layer on the substrate with the polishing pad P to chemically-mechanically polish the layer using the slurry.

The dresser 100 may be disposed above the polishing pad P. The dresser 100 may bring the rotating disk module 140 into contact with the rotating polishing pad P to dress the polishing pad P.

Specifically, the arm module 110 may rotate the lift module 120, the driving module 130, the disk module 140, the connection module 150, and the airbag module 160 to position the disk module 140 over the conditioning region of the polishing pad P. The lift module 120 may move the driving module 130, the disk module 140, the connection module 150, and the airbag module 160 downward toward the polishing pad P to bring the disk module 140 into contact with the polishing pad P. The drive module 130 may rotate the disk module 140. Accordingly, the rotating disk module 140 may pressurize the polishing pad P to condition the polishing pad P.

During the trimming process, the driving module 130 may be tilted with respect to the lifting module 120 by the connection module 150. In particular, since the airbag module 160 may include at least two airbags in the connection module 150, the deformation of the connection module 150 may be buffered by the airbags. Accordingly, the connection module 150 may have improved durability against fatigue failure (failure) caused by friction between the polishing pad P and the disk module 140.

In addition, the load cell 170 may measure a load applied from the lift module 120 to the tray module 140. The load measured by the load cell 170 may be transmitted to the controller 190. The angle sensor module 180 may measure an inclination angle of the driving module 130 with respect to the lifting module 120. The tilt angle of the driving module 130 (i.e., the tilt angle of the disk module 140) measured by the angle sensor module 180 may be transmitted to the controller 190.

The controller 190 may control the first and second inflation pressures P1 and P2 supplied to the first and second airbags 161 and 163, respectively, according to the load and the inclination angle. Specifically, the controller 190 may provide different inflation pressures to the first and second air cells 161 and 163 according to the inclination angle of the disc module 140 measured by the angle sensor module 180 to correct the inclination of the disc module 140. Further, the dressing force applied from the disk module 140 to the polishing pad P may correspond to the sum of the load of the lift module 120 and the pressures in the first and second air bladders 161 and 163. Accordingly, the controller 190 may selectively control the inflation pressure in the first and second bladders 161 and 163 to provide an optimal trimming force to the disc module 140.

Method for manufacturing semiconductor device

Fig. 25 is a flowchart showing a method of manufacturing a semiconductor device using the CMP apparatus in fig. 24.

Referring to fig. 24 and 25, a substrate having a layer may be disposed on the upper surface of the polishing pad P (ST 400). The CMP mechanism 320 may perform chemical mechanical polishing of the layer using the polishing pad P using the slurry (ST 410).

The arm module 110 may rotate the lift module 120, the driving module 130, the disk module 140, the connection module 50, and the airbag module 160 to position the disk module 140 over the dressing region of the polishing pad P (ST 420).

The lift module 120 may move the driving module 130, the disk module 140, the connection module 150, and the airbag module 160 downward toward the polishing pad P to bring the disk module 140 into contact with the polishing pad P (ST 430).

The driving module 130 may rotate the disk module 140 (ST 440). Accordingly, the rotating disk module 140 may pressurize the polishing pad P to condition the polishing pad P.

The load cell 170 may measure the load applied from the lift module 120 to the disk module 140 (ST 450). The load measured by the load cell 170 may be transmitted to the controller 190.

The angle sensor module 180 may measure the inclination angle of the driving module 130 with respect to the lifting module 120 (ST 460). The tilt angle of the driving module 130 (i.e., the tilt angle of the disk module 140) measured by the angle sensor module 180 may be transmitted to the controller 190.

The controller 190 may control the first and second inflation pressures P1 and P2 supplied to the first and second airbags 161 and 163, respectively, according to the load and the inclination angle (ST 470). Specifically, the controller 190 may provide different inflation pressures to the first and second air cells 161 and 163 according to the inclination angle of the disc module 140 measured by the angle sensor module 180 to correct the inclination of the disc module 140. Further, the dressing force applied from the disk module 140 to the polishing pad P may correspond to the sum of the load of the lift module 120 and the pressures in the first and second air bladders 161 and 163. Accordingly, the controller 190 may selectively control the inflation pressure in the first and second bladders 161 and 163 to provide an optimal trimming force to the disc module 140.

By way of summary and review, a connection module of a dresser in a CMP mechanism may be disposed between a motor for rotating a dressing disk and the dressing disk. The connection module may directly receive a vertical load of the dresser and a frictional torque between the rotating dressing disk and the connection module, so that the connection module may have a weak fatigue failure. However, since only the dressing disk can contact the inclined polishing pad, a vertical load loss of the dresser may occur, resulting in a low dressing ability of the dresser.

In contrast, example embodiments provide a conditioner with improved conditioning capability. Example embodiments also provide a CMP apparatus including the conditioner described above. Example embodiments also provide methods of manufacturing semiconductor devices using the CMP apparatus described above.

That is, according to example embodiments, the connection module may connect the drive module to the lift module to allow the drive module to be tilted with respect to the lift module, so that the connection module may have improved durability against fatigue failure caused by friction between the polishing pad and the disk module. Furthermore, the airbag module may comprise at least two airbags in the connection module, so that a deformation of the connection module may be cushioned by the airbags. In particular, different pressures may be applied to the bladder according to the slope of the disk module so that the disk module may uniformly contact the polishing pad. Thus, the dresser can have improved dressing ability. Therefore, the polishing pad dressed by the dresser may also have improved polishing ability, so that the CMP apparatus may have improved CMP ability.

Example embodiments have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purposes of limitation. In some instances, features, characteristics and/or elements described in connection with a particular embodiment may be used alone or in combination with features, characteristics and/or elements described in connection with other embodiments, unless specifically stated otherwise, as will be apparent to one of ordinary skill in the art from the filing of the present application. It will, therefore, be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as set forth in the appended claims.