阅读说明：本技术 一种增强聚对二甲苯薄膜与硅粘附性的方法 (Method for enhancing adhesion of parylene film and silicon ) 是由 王玮 张美璇 于 2020-05-20 设计创作，主要内容包括：本发明涉及一种增强聚对二甲苯薄膜与硅粘附性的方法,包括以下步骤：1)在待增强粘附性的硅衬底表面进行光刻定义铆钉阵列图形；2)在硅衬底正面进行深硅刻蚀至一定深度,形成铆钉阵列结构；3)去除硅衬底表面残余的光刻胶；4)在硅衬底表面淀积一定厚度的聚对二甲苯,形成平整的聚对二甲苯覆盖层,完成制备。通过深硅刻蚀工艺形成用于增加硅衬底比表面积的铆钉阵列结构,使聚对二甲苯薄膜与硅的粘附力得到显著增强。该方法采用了与现有规模制造工艺兼容的聚对二甲苯微机电系统工艺,适用于制备高性能柔性硅基电子器件,使硅基电子器件与聚对二甲苯柔性裹覆材料在反复弯折变形的过程中不易分层或脱离,保证了柔性硅基电子器件的可靠稳定工作。(The invention relates to a method for enhancing the adhesion of a parylene film to silicon, which comprises the following steps: 1) photoetching and defining a rivet array pattern on the surface of a silicon substrate to be enhanced in adhesiveness; 2) performing deep silicon etching on the front surface of the silicon substrate to a certain depth to form a rivet array structure; 3) removing the residual photoresist on the surface of the silicon substrate; 4) depositing parylene with a certain thickness on the surface of the silicon substrate to form a flat parylene coating, and finishing the preparation. The rivet array structure for increasing the specific surface area of the silicon substrate is formed through a deep silicon etching process, so that the adhesion of the parylene film and silicon is remarkably enhanced. The method adopts the parylene MEMS process compatible with the existing scale manufacturing process, is suitable for preparing high-performance flexible silicon-based electronic devices, ensures that the silicon-based electronic devices and the parylene flexible coating materials are not easy to layer or separate in the process of repeated bending deformation, and ensures the reliable and stable work of the flexible silicon-based electronic devices.)

1. A method of enhancing adhesion of a parylene film to silicon, comprising the steps of:

1) photoetching and defining a rivet array pattern on the surface of a silicon substrate to be enhanced in adhesiveness;

2) performing deep silicon etching on the front surface of the silicon substrate to a certain depth to form a rivet array structure;

3) removing the residual photoresist on the surface of the silicon substrate;

4) depositing parylene with a certain thickness on the surface of the silicon substrate to form a flat parylene coating, and finishing the preparation.

2. The method of enhancing adhesion of a parylene film to silicon as set forth in claim 1, wherein: the silicon substrate in the step 1) is a 4-inch P-type <100> single polished silicon wafer.

3. The method of enhancing adhesion of a parylene film to silicon as set forth in claim 1, wherein: the pattern of the rivet array in the step 1) is square, cross, circular or circular.

4. A method of enhancing adhesion of a parylene film to silicon as claimed in claim 3, wherein: the side length of the square is 2 μm.

5. The method of enhancing adhesion of a parylene film to silicon as set forth in claim 1, wherein: the rivet array structure in the step 2) is distributed in any non-device area of the silicon substrate.

6. The method for enhancing adhesion of parylene film to silicon as claimed in claim 1, wherein step 2) is specifically: silicon was etched by HRM 10 μm on the silicon substrate at the location of the rivet array using the photoresist as a mask.

7. The method for enhancing adhesion of parylene film to silicon as claimed in claim 1, wherein step 3) is specifically: and removing the photoresist on the surface of the silicon substrate by oxygen plasma etching.

8. The method for enhancing adhesion of parylene film to silicon as claimed in claim 1, wherein step 4) is specifically: depositing parylene 2 μm on the surface of the silicon substrate by chemical vapor deposition.

Technical Field

The invention relates to the field of micro-nano processing, in particular to a method for enhancing the adhesion of a Parylene (Parylene) film and silicon.

Background

Flexible electronics has opened the world-wide electronic technology revolution and is considered the future of the electronics industry. Among other things, flexible substrate materials are important components in achieving flexible electronic device interconnection and packaging. Flexible/elastic substrate materials that are currently widely used in the field of flexible electronics include Parylene (Parylene), Polyimide (Polyimide), Polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), and metal films, etc. The parylene is characterized by a deposition mode of room temperature Chemical Vapor Deposition (CVD), an extremely thin and pinhole-free deposition effect, colorless transparency, excellent mechanical properties, electrical insulation, biocompatibility, micromachining process compatibility and the like, and becomes an excellent material for flexible electronics, particularly for a high-performance silicon-based flexible electronic preparation scheme compatible with an integrated circuit process. Thus, in flexible silicon-based electronic devices, the adhesion between the silicon substrate and the parylene film will directly affect the mechanical reliability and cycling stability of the device. However, parylene is chemically inert, has a low surface energy, and generally does not have an active site for forming an intramolecular bond, resulting in poor adhesion to a silicon surface and easy detachment from a silicon substrate.

Currently, surface pretreatment of silicon with methacryloxypropyltrimethoxysilane (A-174) prior to deposition is a commonly used method to enhance adhesion of parylene films to silicon. The a-174 silane coupling agent chemically adheres to the silicon surface, providing an accurately non-uniform, defective surface, stimulating parylene adhesion, and facilitating more conformal bonding of parylene to the resulting surface cavities and crevices during CVD. The area of the transition layer formed by the method depends on the specific surface area of the silicon substrate, and the adhesion of the parylene film is still further improved.

Therefore, an improved process method needs to be invented, which utilizes the conformal deposition property and micro-nano processing means of the parylene to further enhance the adhesion of the parylene film and silicon, thereby improving the mechanical reliability of the flexible silicon-based electronic device wrapped by the parylene in the dynamic deformation process.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a method for enhancing the adhesion of a parylene film and silicon based on a Micro Electro Mechanical System (MEMS) process. The rivet array structure is prepared on the silicon substrate through a silicon deep etching process, the specific surface area of the silicon substrate and the parylene for bonding is increased, and the adhesion of the parylene and the silicon substrate is improved by utilizing the conformal deposition of the parylene. The method is compatible with the MEMS process, the graph of the prepared rivet array structure can be designed in a diversified manner in a layout, so that the effective device area of the silicon-based electronic device is reasonably utilized, and the method is the method for enhancing the adhesion of the parylene and the silicon, and has strong operability and wide applicability.

In order to achieve the above purposes, the technical scheme adopted by the invention is as follows:

a method of enhancing adhesion of a parylene film to silicon, comprising the steps of:

1) photoetching and defining a rivet array pattern on the surface of a silicon substrate to be enhanced in adhesiveness;

2) performing deep silicon etching on the front surface of the silicon substrate to a certain depth to form a rivet array structure;

3) removing the residual photoresist on the surface of the silicon substrate;

4) depositing parylene with a certain thickness on the surface of the silicon substrate to form a flat parylene coating, and finishing the preparation.

Further, the silicon substrate in the step 1) is a 4-inch P-type <100> single polished silicon wafer.

Further, the rivet array in the step 1) is square, cross, circular or circular.

Further, the sides of the square are 2 μm in length.

Further, the rivet array structure in the step 2) is distributed on any non-device area of the silicon substrate.

Further, the step 2) is specifically as follows: silicon was etched by HRM 10 μm on the silicon substrate at the location of the rivet array using the photoresist as a mask.

Further, the step 3) is specifically as follows: and removing the photoresist on the surface of the silicon substrate by oxygen plasma etching.

Further, the step 4) is specifically as follows: depositing parylene 2 μm on the surface of the silicon substrate by chemical vapor deposition.

The invention has the beneficial effects that: based on a standard MEMS process, a rivet array structure for increasing the specific surface area is prepared on a silicon substrate by adopting a deep etching process, so that the adhesion between the parylene film and silicon is obviously enhanced. The reinforcing method provided by the invention can ensure that the silicon-based electronic device and the parylene flexible coating material are not easy to delaminate or separate in the process of repeated bending deformation, thereby ensuring the reliable and stable operation of the flexible silicon-based electronic device.

Drawings

The invention has the following drawings:

FIG. 1 is a schematic view of a silicon substrate;

FIG. 2 is a schematic illustration of a photolithographic rivet array pattern;

FIG. 3 is a schematic diagram of an etched rivet array structure;

FIG. 4 is a schematic view of photoresist removal;

FIG. 5 is a schematic illustration of the deposition of parylene;

FIG. 6 is a schematic illustration of a five rivet array pattern.

In the figure: 1-a silicon substrate; 2, photoresist; 3-rivet array structure; 4-parylene coating.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The vacuum vapor deposition apparatus used in this example was a PDS2010 deposition apparatus manufactured by scs (special Coating system) in the united states; the used Parylene polymer prepolymer is C-type Parylene, and the used deep silicon etching equipment is STS HRM high-density etching machine.

The method for enhancing the adhesion of the parylene film to silicon of the embodiment comprises the following specific implementation steps:

1) preparing tablets: a 4-inch P-type <100> single-polished silicon wafer is used as a silicon substrate 1, as shown in FIG. 1;

2) photoetching: spin-coating a layer of photoresist 2 on the front surface of a silicon wafer, and performing photoetching on the photoresist 2 to form a rivet array pattern (a square with the side length of 2 microns), as shown in FIG. 2; forming a rivet array by the rivet array pattern;

3) deep silicon etching: etching silicon 10 μm on the silicon substrate 1 at the rivet array position by HRM using the photoresist as a mask to form a rivet array structure 3, as shown in FIG. 3;

4) removing the photoresist: the photoresist 2 on the surface of the silicon substrate 1 is removed by oxygen plasma etching, as shown in fig. 4;

5) deposition: depositing parylene 2 μm on the surface of the silicon substrate 1 by using a CVD (chemical vapor deposition) method to form a flat parylene coating 4, thereby completing the preparation, as shown in FIG. 5;

further, the rivet array pattern in step 2) may be designed in various shapes, such as a square shape with a side of 2 μm, a cross shape, a circular shape, or a circular shape, as shown in fig. 6, in addition to the square shape with a side of 2 μm in the present embodiment. Different designs have different effects on increasing the specific surface area of the silicon substrate, thereby changing the adhesion of parylene to silicon.

Further, the rivet array structure 3 in the step 3) can be distributed on any non-device area of the silicon substrate, and the optimized layout can make the adhesion force distribution of the parylene and the silicon uniform.

The above embodiments are only for illustrating the invention and are not meant to be limiting, and those skilled in the relevant art can make various changes and modifications without departing from the spirit and scope of the invention, so that all equivalent technical solutions also belong to the protection scope of the invention.

Those not described in detail in this specification are within the skill of the art.