阅读说明：本技术 一种圆片级封装mems芯片的开盖装置 (Wafer level encapsulation MEMS chip uncap device ) 是由 杨雨禾 于 2020-08-11 设计创作，主要内容包括：本发明公开了一种圆片级封装MEMS芯片的开盖装置,包括一个底座,所述底座的上表面设置有一个夹持机构,所述底座的上方设置有一个盖板机构,所述盖板机构上设置有一个固定机构,所述固定机构上设置有一个切割机构,本发明在使用时,首先将MEMS芯片放置于放置槽内并通过夹持机构对其进行夹持,然后再将盖板机构盖设在底座上,之后再下压去盖机构使得去盖机构与MEMS芯片的上表面相粘连,然后再启动加热板对MEMS芯片的外壳进行加热使得其软化,之后再通过固定机构驱动切割机构对MEMS芯片的外壳进行切割,之后再通过去盖机构向上拉动MEMS芯片的上壳体,使得MEMS芯片的外壳被分开,进而方便对MEMS芯片进行检测。(The invention discloses a cover opening device of a wafer-level packaged MEMS chip, which comprises a base, wherein the upper surface of the base is provided with a clamping mechanism, a cover plate mechanism is arranged above the base, a fixing mechanism is arranged on the cover plate mechanism, and a cutting mechanism is arranged on the fixing mechanism. Thereby being convenient for detecting the MEMS chip.)

1. The utility model provides a device of uncapping of wafer level encapsulation MEMS chip, its characterized in that, includes a base (1), the upper surface of base (1) is provided with a fixture (2), the top of base (1) is provided with a apron mechanism (3), be provided with a fixed establishment (4) on apron mechanism (3), be provided with a cutting mechanism (5) on fixed establishment (4), the upper end center department of apron mechanism (3) is provided with one and removes lid mechanism (6).

2. The cover opening device for the wafer-level packaging MEMS chip as claimed in claim 1, wherein the clamping mechanism (2) comprises a clamping groove (21), the clamping groove (21) is formed in the center of the upper surface of the base (1), a heating plate (22) is fixedly connected to the center of the bottom of the clamping groove (21), two threaded holes (23) are symmetrically formed in the opposite groove walls of the clamping groove (21), the two threaded holes (23) penetrate through the opposite groove walls of the clamping groove (21) in parallel, a threaded rod (24) is in threaded connection with each of the two threaded holes (23), one end, close to each of the two threaded rods (24), extends into the clamping groove (21) and is rotatably connected with a clamping plate (25) through a bearing, one end, far away from each of the two threaded rods (24), extends out of the base (1) and is fixedly connected with a first handle (26), two equal fixedly connected with gag lever post (27) on the lateral wall of keeping away from one side mutually of grip block (25), all run through on the centre gripping groove (21) cell wall that corresponds two gag lever post (27) positions and seted up a spacing hole (28), two the one end that gag lever post (27) kept away from mutually extends to in the spacing hole (28) that corresponds respectively.

3. The cover opening device for the wafer-level packaged MEMS chip as claimed in claim 2, wherein the cover mechanism (3) comprises a mounting seat (31), the mounting seat (31) is disposed on the upper surface of the base (1), the upper surface of the base (1) is fixedly connected with four support rods (32), four support grooves (33) are formed in the lower surface of the mounting seat (31) corresponding to the positions of the four support rods (32), the upper ends of the four support rods (32) extend into the corresponding support grooves (33), and a receiving groove (34) is formed in the lower surface of the mounting seat (31) corresponding to the position of the clamping groove (21).

4. The uncovering device for the wafer-level packaged MEMS chip according to claim 3, wherein the fixing mechanism (4) comprises two fixing slots (41), the two fixing slots (41) are symmetrically arranged on opposite outer side walls of the mounting seat (31), a lead screw (42) is rotatably connected to the center of the bottom of each fixing slot (41) through a bearing, one end of each lead screw (42) penetrates through a notch of the corresponding fixing slot (41) and extends out of the mounting seat (31), a lead screw nut (43) is connected to the rod wall of each lead screw (42) in a threaded manner, a fixing block (44) is fixedly sleeved on the outer side wall of each lead screw nut (43), one end of each fixing block (44) extends out of the corresponding fixing slot (41) and is fixedly connected with a connecting rod (45), the lower end of each connecting rod (45) is fixedly connected with a fixing rod (46), one end, close to each other, of each fixing rod (46) extends into the corresponding limiting hole (28), and the other end, located outside the mounting seat (32), of each lead screw (42) is fixedly connected with a second handle (47).

5. The cover opening device for the wafer-level packaged MEMS chip as claimed in claim 4, wherein the cutting mechanism (5) comprises a cutting groove (51), two cutting grooves (51) are arranged on opposite groove walls of the accommodating groove (34) in a parallel manner, two cutting blades (52) are slidably connected in the cutting groove (51), two opposite ends of the cutting blades (52) extend into the accommodating groove (34), two through holes (53) are vertically formed in the upper end groove wall of the cutting groove (51) in a penetrating manner, two driving rods (54) are fixedly connected to the upper surface of the cutting blade (52) at the positions of the through holes (53), two upper ends of the driving rods (54) penetrate through the corresponding through holes (53) and extend upwards into the fixing grooves (41), and two ends of the driving rods (54) located in the fixing grooves (41) are fixedly connected to fixing blocks (44) corresponding to the fixing grooves (44) respectively A lower surface.

6. The cap opening device for the wafer-level packaged MEMS chip as claimed in claim 5, wherein the cap removing mechanism (6) comprises a sliding hole (61), the sliding hole (61) is vertically formed through the center of the bottom of the receiving slot (34), a sliding rod (62) is slidably connected in the sliding hole (61), the upper end of the sliding rod (62) penetrates through the upper end opening of the sliding hole (61) and extends upwards to the outside of the mounting seat (31) and is fixedly connected with a third handle (63), the lower end of the sliding rod (62) penetrates through the lower end opening of the sliding hole (61) and extends downwards to the inside of the receiving slot (34) and is fixedly connected with a fixing plate (64), and a layer of adhesive layer (65) is fixedly connected to the lower surface of the fixing plate (64).

7. The cap opening device for the wafer-level package MEMS chip as claimed in claim 6, wherein an annular groove (66) is formed in the wall of the sliding hole (61), an annular block (67) is fixedly connected to the rod wall of the sliding rod (62) corresponding to the position of the annular groove (66), the annular block (67) is slidably connected to the annular groove (66), a spring (68) is fixedly connected to the lower surface of the annular block (67), the lower end of the spring (68) is fixedly connected to the lower end groove wall of the annular groove (66), and the spring (68) is sleeved on the rod wall of the sliding rod (62) corresponding to the position of the annular groove (66).

8. The cap opening device for the wafer level packaging MEMS chip as claimed in claim 3, wherein the upper surface of the mounting seat (31) is symmetrically and fixedly connected with two individual pull handles (7).

Technical Field

The invention relates to a cover opening device for packaging an MEMS (micro-electromechanical systems) chip, in particular to a cover opening device for a wafer-level packaging MEMS chip, and belongs to the technical field of MEMS chips.

Background

MEMS is an abbreviation of micro-electromechanical system, and is composed of an MEMS chip and an application specific control integrated circuit (ASIC) chip, and has advantages of small size, low cost, low power consumption, high intelligence, easy calibration, and easy integration, and is widely used in consumer electronics (such as mobile phones, tablet computers, toys, digital cameras, game machines, air mice, remote controllers, GPS, etc.), national defense industry (such as smart bombs, missiles, aerospace, unmanned planes, etc.), and industrial products (such as automobiles, robots, intelligent transportation, industrial automation, environmental monitoring, platform stability control, modern agriculture, security monitoring, etc.), and it can be said that the MEMS device is a foundation stone of internet of things technology.

In order to improve the safety of the MEMS chip, the damaged MEMS chip needs to be uncapped, and the electronic components inside the damaged MEMS chip need to be detected, so as to improve the performance of the damaged MEMS chip with respect to the damage point, and further improve the practicability of the damaged MEMS chip.

Disclosure of Invention

The invention provides a cover opening device for a wafer-level packaging MEMS chip, which effectively solves the problems in the prior art.

In order to solve the technical problems, the invention provides the following technical scheme:

the invention discloses a cover opening device of a wafer-level packaging MEMS chip, which comprises a base, wherein a clamping mechanism is arranged on the upper surface of the base, a cover plate mechanism is arranged above the base, a fixing mechanism is arranged on the cover plate mechanism, a cutting mechanism is arranged on the fixing mechanism, and a cover removing mechanism is arranged at the center of the upper end of the cover plate mechanism.

As a preferred technical scheme of the invention, the clamping mechanism comprises a clamping groove, the clamping groove is arranged at the center of the upper surface of the base, a heating plate is fixedly connected at the center of the bottom of the clamping groove, two threaded holes are symmetrically formed in the opposite groove walls of the clamping groove, the two threaded holes are parallelly penetrated and arranged on the opposite groove walls of the clamping groove, a threaded rod is connected in each threaded hole in a threaded manner, the ends, close to the two threaded rods, extend into the clamping groove and are rotatably connected with a clamping plate through bearings, the ends, far away from the two threaded rods, extend out of the base and are fixedly connected with a first handle, a limiting rod is fixedly connected on the side wall, far away from one side, of each clamping plate, a limiting hole is formed in the groove wall of the clamping groove corresponding to the two limiting rods, and one ends of the two limit rods, which are far away from each other, extend into the corresponding limit holes respectively.

As a preferred technical scheme of the present invention, the plate covering mechanism includes an installation seat, the installation seat is disposed on an upper surface of the base, the upper surface of the base is fixedly connected with four support rods, four support grooves are disposed on a lower surface of the installation seat corresponding to positions of the four support rods, upper ends of the four support rods respectively extend into the corresponding support grooves, and a receiving groove is disposed on a position of the lower surface of the installation seat corresponding to the clamping groove.

According to a preferable technical scheme, the fixing mechanism comprises two fixing grooves, the two fixing grooves are symmetrically formed in opposite outer side walls of the mounting seat, a lead screw is rotatably connected to the center of the bottom of each fixing groove through a bearing, one end of each lead screw penetrates through a notch of the corresponding fixing groove and extends out of the mounting seat, a lead screw nut is connected to each rod wall of the two lead screws in a threaded mode, a fixing block is fixedly sleeved on each outer side wall of each lead screw nut, one end of each fixing block extends out of the corresponding fixing groove and is fixedly connected with a connecting rod, the lower end of each connecting rod is fixedly connected with a fixing rod, the adjacent ends of the two fixing rods respectively extend into the corresponding limiting holes, and the end, located outside the mounting seat, of each lead screw is fixedly connected with a second handle.

According to a preferable technical scheme of the invention, the cutting mechanism comprises a cutting groove, two cutting grooves are parallelly arranged on opposite groove walls of the accommodating groove, a cutting blade is slidably connected in each cutting groove, opposite ends of the two cutting blades extend into the accommodating groove, a through hole is vertically formed in the upper groove wall of each cutting groove in a penetrating manner, a driving rod is fixedly connected to the upper surface of each cutting blade corresponding to the position of each through hole, the upper ends of the two driving rods penetrate through the corresponding through holes and extend upwards into the accommodating groove, and one end of each driving rod in the accommodating groove is fixedly connected to the lower surface of the corresponding fixing block.

As a preferable technical scheme of the invention, the cap removing mechanism comprises a sliding hole, the sliding hole is vertically penetrated through the center of the bottom of the accommodating groove, a sliding rod is connected in the sliding hole in a sliding manner, the upper end of the sliding rod penetrates through the upper end orifice of the sliding hole and extends upwards to the outside of the mounting seat and is fixedly connected with a third handle, the lower end of the sliding rod penetrates through the lower end orifice of the sliding hole and extends downwards to the inside of the accommodating groove and is fixedly connected with a fixing plate, and the lower surface of the fixing plate is fixedly connected with an adhesion layer.

As a preferred technical scheme of the invention, an annular groove is formed in the wall of the sliding hole, an annular block is fixedly connected to the wall of the sliding rod corresponding to the position of the annular groove, the annular block is connected in the annular groove in a sliding manner, a spring is fixedly connected to the lower surface of the annular block, the lower end of the spring is fixedly connected to the wall of the lower end groove of the annular groove, and the spring is sleeved on the wall of the sliding rod corresponding to the position of the annular groove.

As a preferred technical scheme of the invention, the upper surface of the mounting seat is symmetrically and fixedly connected with two individual pull handles.

The invention has the following beneficial effects:

1. when the cover opening device for the wafer-level packaging MEMS chip is used, the MEMS chip is placed in the placing groove and clamped through the clamping mechanism, then the cover opening mechanism is covered on the base, then the cover removing mechanism is pressed downwards to enable the cover removing mechanism to be adhered to the upper surface of the MEMS chip, then the heating plate is started to heat the shell of the MEMS chip to enable the shell of the MEMS chip to be softened, then the fixing mechanism drives the cutting mechanism to cut the shell of the MEMS chip, and then the cover removing mechanism pulls the upper shell of the MEMS chip upwards to enable the shell of the MEMS chip to be separated, so that the MEMS chip can be detected conveniently.

2. According to the cover opening device for the wafer-level packaging MEMS chip, when the fixing mechanism drives the seven mechanisms to clamp and fix the chip, the two connecting rods are synchronously driven to move, and the connecting rods can synchronously drive the fixing rods to enter the limiting holes, so that the base and the mounting seat can be fixed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a side view in cross-section of the construction of the present invention;

FIG. 4 is a sectional view of the mounting base of the present invention;

fig. 5 is an enlarged schematic view of a portion a of fig. 1 according to the present invention.

In the figure: 1. a base; 2. a clamping mechanism; 21. a clamping groove; 22. heating plates; 23. a threaded hole; 24. a threaded rod; 25. a clamping plate; 26. a first handle; 27. a limiting rod; 28. a limiting hole; 3. a cover plate mechanism; 31. a mounting seat; 32. a support bar; 33. a support groove; 34. a receiving groove; 4. a fixing mechanism; 41. fixing grooves; 42. a screw rod; 43. a feed screw nut; 44. a fixed block; 45. a connecting rod; 46. fixing the rod; 47. a second handle; 5. a cutting mechanism; 51. cutting the groove; 52. a cutting blade; 53. a through hole; 54. a drive rod; 6. a cover removing mechanism; 61. a slide hole; 62. a slide bar; 63. a third handle; 64. a fixing plate; 65. an adhesion layer; 66. an annular groove; 67. a ring block; 68. a spring; 7. and lifting the handle.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.