Active heat dissipation type supporting system of data exchange equipment for big data laboratory

文档序号:968447 发布日期:2020-11-03 浏览:9次 中文

阅读说明:本技术 一种大数据实验室用数据交换设备的主动散热型支撑系统 (Active heat dissipation type supporting system of data exchange equipment for big data laboratory ) 是由 徐文敏 于 2020-07-28 设计创作,主要内容包括:本发明公开了一种大数据实验室用数据交换设备的主动散热型支撑系统,包括放置板,所述放置板的上端设有气压槽,所述放置板内对称设有两个散热腔,所述放置板的上端对称设有两个负压槽,两个所述负压槽分别位于两个散热腔的内侧,两个所述负压槽分别通过两个连通管与气压槽连通;负压安装机构,所述负压安装机构包括安装在气压槽槽口处的弹性薄膜,两个所述连通管内均固定连接有网状板,两个所述连通管内均设有用于左右滑动的活塞块。该支撑系统设有主动散热的功能,可以在数据交换设备发烫时对其进行主动散热,同时设有负压安装机构,可以有效的防止数据交换设备被碰倒的可能出现。(The invention discloses an active heat dissipation type supporting system of data exchange equipment for a large data laboratory, which comprises a placing plate, wherein the upper end of the placing plate is provided with an air pressure groove, two heat dissipation cavities are symmetrically arranged in the placing plate, the upper end of the placing plate is symmetrically provided with two negative pressure grooves, the two negative pressure grooves are respectively positioned at the inner sides of the two heat dissipation cavities, and the two negative pressure grooves are respectively communicated with the air pressure groove through two communicating pipes; negative pressure installation mechanism, negative pressure installation mechanism is including installing the elastic film in atmospheric pressure groove notch department, two equal fixedly connected with reticular lamina in the communicating tube, two all be equipped with the piston piece that is used for the horizontal slip in the communicating tube. The supporting system is provided with an active heat dissipation function, can actively dissipate heat of the data exchange equipment when the data exchange equipment is scalded, and is provided with the negative pressure mounting mechanism, so that the possibility that the data exchange equipment is knocked down can be effectively prevented.)

1. An active heat dissipation type support system of data exchange equipment is used in big data laboratory, its characterized in that includes:

the heat dissipation device comprises a placing plate (1), wherein an air pressure groove (3) is formed in the upper end of the placing plate (1), two heat dissipation cavities (2) are symmetrically formed in the placing plate (1), two negative pressure grooves (10) are symmetrically formed in the upper end of the placing plate (1), the two negative pressure grooves (10) are respectively located on the inner sides of the two heat dissipation cavities (2), the two negative pressure grooves (10) are respectively communicated with the air pressure groove (3) through two communicating pipes (17), and a trigger cavity (13) is formed in the placing plate (1);

the negative pressure installation mechanism comprises an elastic thin film (4) installed at the groove opening of the air pressure groove (3), two communicating pipes (17) are internally and fixedly connected with a reticular plate (18), two piston blocks (20) used for sliding left and right are arranged in the two communicating pipes (17), the two piston blocks (20) are respectively and elastically connected with one side of the corresponding reticular plate (18) through two first connecting springs (19), the inner bottom of the air pressure groove (3) is communicated with the outside through an air outlet pipe (11), and a pressure valve (12) is installed in the air outlet pipe (11);

the thermal trigger conducting mechanism comprises a conducting piston (14) arranged in a trigger cavity (13), a space of the trigger cavity (13) above the conducting piston (14) is filled with a low-boiling-point solution, the lower end of the conducting piston (14) is elastically connected with the inner bottom of the trigger cavity (13) through a second connecting spring (15), and second electric connecting blocks (16) are embedded in the inner walls of the two sides of the trigger cavity (13);

heat dissipation mechanism, heat dissipation mechanism is including setting up two fan (7) in two heat dissipation chamber (2) respectively, two the interior top in heat dissipation chamber (2) all is equipped with the opening, two all install radiator-grid (5) in the opening, two all through connecting pipe (9) and external intercommunication of heat dissipation chamber (2), one of them the upper and lower inner wall of communicating pipe (17) all inlays and is equipped with first electric connection block (8), piston piece (20) are electrically conductive material, the one side of placing board (1) is equipped with interface (6), the one end of interface (6) and be located right side second electric connection block (16) pass through wire electric connection, are located left second electric connection block (16) and first electric connection block (8) that are located the below pass through wire electric connection, are located the top first electric connection block (8), The two fans (7) are electrically connected with the other end of the interface (6) in sequence through a lead.

2. The active heat dissipation type support system of a data exchange device for a large data laboratory according to claim 1, wherein the upper surface of the elastic membrane (4) is convex.

Technical Field

The invention relates to the field of heat dissipation equipment for big data, in particular to an active heat dissipation type supporting system of data exchange equipment for a big data laboratory.

Background

Big data is a data set whose content cannot be captured, managed and processed by a conventional software tool within a certain time, and a data switch is needed to exchange data in the process of calculating and collecting big data, and the following problems exist in the process of using the existing data switch:

1. in the using process, the data exchange equipment is always placed on the placing rack and is easy to be knocked down and slide down, so that the data exchange equipment is damaged and the normal operation of data exchange is influenced;

2. data exchange devices generate heat because they are always in operation, and long-term internal heating affects the useful life of the data exchange device.

Disclosure of Invention

The invention aims to solve the defects in the prior art, and provides an active heat dissipation type supporting system of data exchange equipment for a large data laboratory.

In order to achieve the purpose, the invention adopts the following technical scheme:

an active heat dissipation type supporting system of data exchange equipment for a large data laboratory comprises a placing plate, wherein an air pressure groove is formed in the upper end of the placing plate, two heat dissipation cavities are symmetrically formed in the placing plate, two negative pressure grooves are symmetrically formed in the upper end of the placing plate, the two negative pressure grooves are respectively located on the inner sides of the two heat dissipation cavities, and the two negative pressure grooves are respectively communicated with the air pressure groove through two communicating pipes; the negative pressure installation mechanism comprises an elastic film arranged at the notch of the air pressure groove, two communicating pipes are fixedly connected with a reticular plate, piston blocks used for sliding left and right are arranged in the two communicating pipes, the two piston blocks are respectively and elastically connected with one side of the corresponding reticular plate through two first connecting springs, the inner bottom of the air pressure groove is communicated with the outside through an air outlet pipe, and a pressure valve is arranged in the air outlet pipe; the thermal triggering conductive mechanism comprises a conductive piston arranged in a triggering cavity, a space of the triggering cavity above the conductive piston is filled with a low-boiling-point solution, the lower end of the conductive piston is elastically connected with the inner bottom of the triggering cavity through a second connecting spring, and second electrical connecting blocks are embedded in the inner walls of the two sides of the triggering cavity; heat dissipation mechanism, heat dissipation mechanism is including setting up two fans in two heat dissipation chambeies respectively, two the interior top in heat dissipation chamber all is equipped with the opening, two all install the radiator-grid in the opening, two all communicate with the external world through the connecting pipe in heat dissipation chamber, one of them the upper and lower inner wall of communicating pipe all inlays and is equipped with first electrical connection block, the piston piece is electrically conductive material, the one side of placing the board is equipped with the interface, the one end of interface passes through wire electrical connection with the second electrical connection block that is located the right side, is located leftwards second electrical connection block passes through wire electrical connection with the first electrical connection block that is located the below, is located the top the other end of first electrical connection block, two fans and interface passes through wire electrical connection in proper order.

Preferably, the upper surface of the elastic membrane is convex.

Compared with the prior art, the invention has the beneficial effects that:

1. when the data exchange equipment needs to be installed, the data exchange equipment only needs to be placed at the upper end of the placing plate, the elastic film is pressed downwards, then gas is discharged into the air pressure groove, when the air pressure in the air pressure groove is increased, the two corresponding piston blocks can move back to back, the connecting spring is in a stretching state, when the elastic film is compressed to be parallel to the upper end face of the placing plate, the air pressure in the air pressure groove just reaches the threshold value of the air pressure valve, at the moment, the air pressure in the air pressure groove can be discharged through the air outlet pipe, the two piston blocks can move back under the elastic action of the first connecting spring, as the notch of the negative pressure groove is in full contact with the lower end of the data exchange equipment (the final position of the piston block moving back just conducts the two first connecting blocks), the pressure in the negative pressure groove can be reduced due to the moving back of the piston blocks, and pressure difference is generated between the negative pressure and the outside, therefore, the data exchange equipment is tightly bound on the upper end of the placing plate, and the possibility that the data exchange equipment is knocked down is avoided.

2. When data exchange equipment's temperature risees, low boiling point solution can be heated the evaporation this moment, at this moment conductive piston can move down, make two second electrical connection piece switch on, circuit switch on this moment, two fans rotate, dispel the heat, when the temperature reduces, low boiling point solution becomes the original state, at this moment conductive piston can shift up again, circuit disconnection this moment again, can initiatively dispel the heat when the high temperature, and the heat dissipation is closed after the temperature reduces, when can effectually dispel the heat, reduce the loss of electric energy.

3. Only when the piston piece is in to switch on two first electrical connection blocks, the circuit is just switched on, and data exchange equipment at this moment is just tied completely in the upper end of placing the board, can guarantee that the installation is complete time, and heat dissipation mechanism just can function, and the effectual fan of avoiding rotates and makes whole data exchange equipment who places the board and rock and lead to is shaken off probably.

Drawings

FIG. 1 is a schematic structural diagram of an active heat dissipation type support system of a data exchange device for a large data laboratory according to the present invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

fig. 3 is an enlarged schematic view of fig. 1 at B.

In the figure: 1 place board, 2 heat dissipation chambeies, 3 pneumatic groove, 4 elastic film, 5 radiator-grid, 6 interfaces, 7 fans, 8 first electrical connection blocks, 9 connecting pipes, 10 negative pressure tanks, 11 outlet ducts, 12 pressure valves, 13 trigger chamber, 14 electrically conductive pistons, 15 second connecting springs, 16 second electrical connection blocks, 17 communicating pipes, 18 netted board, 19 first connecting springs, 20 piston pieces.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-3, an active heat dissipation type supporting system of data exchange equipment for a large data laboratory comprises a placing plate 1, an air pressure groove 3 is arranged at the upper end of the placing plate 1, two heat dissipation cavities 2 are symmetrically arranged in the placing plate 1, two negative pressure grooves 10 are symmetrically arranged at the upper end of the placing plate 1, the two negative pressure grooves 10 are respectively positioned at the inner sides of the two heat dissipation cavities 2, the two negative pressure grooves 10 are respectively communicated with the air pressure groove 3 through two communicating pipes 17, and a trigger cavity 13 is arranged in the placing plate 1;

the negative pressure installation mechanism comprises an elastic thin film 4 arranged at the notch of the air pressure tank 3, two communicating pipes 17 are fixedly connected with a reticular plate 18, piston blocks 20 used for sliding left and right are arranged in the two communicating pipes 17, the two piston blocks 20 are respectively and elastically connected with one side of the corresponding reticular plate 18 through two first connecting springs 19, the inner bottom of the air pressure tank 3 is communicated with the outside through an air outlet pipe 11, and a pressure valve 12 is arranged in the air outlet pipe 11;

the heat triggers the conductive mechanism, the heat triggers the conductive mechanism to include setting up the conductive piston 14 in triggering the chamber 13, trigger the chamber 13 and lie in the space above the conductive piston 14 and pack and have low boiling point solution, the lower extreme of the conductive piston 14 passes through the elastic connection of second connecting spring 15 and triggering the interior bottom of chamber 13, trigger both sides inner wall of chamber 13 and inlay and be equipped with the second electrical connection piece 16, when the temperature rise of the data exchange equipment, heat can be transmitted to the low boiling point solution through placing the board 1, placing the board 1 and being made of heat conduction material, guarantee there is good thermal conductivity, the low boiling point solution can be heated and evaporated at this moment, the conductive piston 14 at this moment can move down, make two second electrical connection pieces 16 switch on, the circuit at this moment switches on, two fans 7 rotate, dispel the heat, when the temperature reduces, the low boiling point solution becomes the original state, at this moment conductive, the circuit is disconnected again at the moment, active heat dissipation can be carried out at high temperature, heat dissipation is closed after the temperature is reduced, the loss of electric energy is reduced while heat dissipation can be effectively carried out, and in order to ensure that the conductive piston 14 moves downwards, the space below the conductive piston 14 of the trigger cavity 13 is communicated with the heat dissipation cavity 2 on the right side through a communicating air channel;

heat dissipation mechanism, heat dissipation mechanism is including setting up two fans 7 in two heat dissipation chambeies 2 respectively, the interior top in two heat dissipation chambeies 2 all is equipped with the opening, all install radiator-grid 5 in two openings, all communicate with the external world through connecting pipe 9 for two heat dissipation chambeies 2, the upper and lower inner wall of one of them communicating pipe 17 all inlays and is equipped with first electric connection block 8, piston block 20 is electrically conductive material, the one side of placing board 1 is equipped with interface 6, interface 6's one end with be located right side second electric connection block 16 and pass through wire electric connection, be located left second electric connection block 16 and be located the first electric connection block 8 of below through wire electric connection, be located the first electric connection block 8 of top, the other end of two fans 7 and interface 6 passes through wire electric connection in proper order.

Wherein, the upper surface of the elastic film 4 is a convex surface, which ensures the normal operation of the system.

In the invention, in an initial state, as shown in fig. 1, the interface 6 is connected to a corresponding joint, and a circuit in the initial state is in a disconnected state;

the invention is suitable for the data exchange equipment with a plane bottom, when the data exchange equipment needs to be installed, the data exchange equipment only needs to be placed at the upper end of a placing plate 1, the elastic film 4 is pressed downwards at the moment, then gas is discharged into a gas pressure groove 3, when the gas pressure in the gas pressure groove 3 is increased, two corresponding piston blocks 20 move back and forth, the first connecting spring 19 is in a stretching state at the moment, when the elastic film 4 is compressed to be parallel to the upper end surface of the placing plate 1, the gas pressure of the gas pressure groove 3 just reaches the threshold value of a pressure valve 12, the gas pressure in the gas pressure groove 3 is discharged through a gas outlet pipe 11, the two piston blocks 20 move back under the elastic action of the first connecting spring 19 at the moment, because the notch of the negative pressure groove 10 is positioned at the lower end of the data exchange equipment and completely contacts (the final position where the piston blocks 20 move back is communicated with two first electrical connecting blocks 8), the pressure in the negative pressure groove 10 is reduced by the back movement of the piston block 20, and a pressure difference is generated between the piston block and the outside, so that the data exchange equipment is tightly bound on the upper end of the placing plate 1, and the possibility that the data exchange equipment is knocked down is avoided;

in addition, in order to ensure that the notch of the negative pressure groove 10 is completely contacted with the lower end of the data exchange equipment, a sealing ring can be arranged at the notch of the negative pressure groove 10, and the upper end surface of the sealing ring is slightly higher than the upper end surface of the placing plate 1 by 1-2 mm.

When the temperature of the data exchange equipment rises, the low-boiling-point solution is heated and evaporated, the conductive piston 14 moves downwards to enable the two second electrical connection blocks 16 to be connected, the circuit is connected, the two fans 7 rotate to dissipate heat, the low-boiling-point solution is changed into an original state when the temperature is reduced, the conductive piston 14 moves upwards, the circuit is disconnected again, active heat dissipation can be performed at high temperature, heat dissipation is closed after the temperature is reduced, and the loss of electric energy is reduced while heat dissipation can be effectively performed;

it is worth noting that only when the piston block 20 is in conduction with the two first electrical connection blocks 8, the circuit is conducted, the data exchange device at this time is just completely constrained at the upper end of the placing plate 1, and it can be ensured that the heat dissipation mechanism operates when the installation is complete, thereby effectively avoiding the possibility that the fan 7 rotates to enable the whole placing plate 1 to shake and the data exchange device caused by shaking off.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

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