阅读说明：本技术 存储器插座保护罩及存储器插座组件 (Memory socket protection cover and memory socket assembly ) 是由 赖志明 高永顺 江忠伟 于 2019-05-07 设计创作，主要内容包括：一种存储器插座保护罩及存储器插座组件,存储器插座适于供一存储器模块插设,存储器模块包括一防呆凹槽,存储器插座包括对应于防呆凹槽的一防呆件,存储器插座保护罩包括两个侧墙及一耐磨件。两个侧墙适于配置于存储器插座的两侧。耐磨件连接于两个侧墙且适以设置在防呆件上,其中耐磨件的宽度大于等于防呆件的宽度,且小于防呆凹槽的宽度。当存储器模块插拔于存储器插座时,存储器模块在防呆凹槽旁的壁面适于接触耐磨件。(A memory socket protection cover and a memory socket assembly are provided, the memory socket is suitable for a memory module to be inserted, the memory module comprises a fool-proof groove, the memory socket comprises a fool-proof piece corresponding to the fool-proof groove, and the memory socket protection cover comprises two side walls and a wear-resistant piece. The two side walls are suitable for being configured at two sides of the memory socket. The wear-resistant part is connected to two side walls and is suitable for setting up on preventing slow-witted piece, and wherein the width more than or equal to of wear-resistant part prevents the width of slow-witted piece, and is less than the width of preventing slow-witted recess. When the memory module is plugged in the memory socket, the wall surface of the memory module beside the fool-proof groove is suitable for contacting the wear-resistant piece.)

1. A memory socket protection cover adapted to be assembled to a memory socket adapted for insertion of a memory module, the memory module including a fool-proof groove, the memory socket including a fool-proof member corresponding to the fool-proof groove, the memory socket protection cover comprising:

the two side walls are suitable for being configured at two sides of the memory socket; and

a wear-resistant part connected to the two side walls and adapted to be disposed on the fool-proof part, wherein the width of the wear-resistant part is greater than or equal to the width of the fool-proof part and smaller than the width of the fool-proof groove,

when the memory module is plugged in the memory socket, the wall surface of the memory module beside the foolproof groove is suitable for contacting the wear-resistant piece.

2. The memory socket protection cover of claim 1, wherein the wear-resistant member comprises a first segment, a second segment and a third segment connected in sequence, the second segment is connected to the two sidewalls and adapted to be located on the top surface of the fool-proof member, and the first segment and the third segment are adapted to be located on two sides of the fool-proof member, respectively.

3. The memory receptacle protective cover of claim 2, wherein the first section, the second section, and the third section are U-shaped posts.

4. The memory receptacle protective cover of claim 2, wherein the first section, the second section, and the third section are J-shaped posts.

5. The memory socket protective cover of claim 1, wherein the wear-resistant member is an I-shaped post, the wear-resistant member is adapted to be positioned on the top surface of the fool-proof member, and the thickness of the wear-resistant member is greater than the thickness of each of the sidewalls.

6. A memory socket assembly adapted for insertion of a memory module, the memory module including a fool-proof recess, the memory socket assembly comprising:

a memory socket including a fool-proof member corresponding to the fool-proof groove;

a memory receptacle protective cover assembled to the memory receptacle, comprising:

two side walls configured at two sides of the memory socket; and

a wear-resistant part connected with the two side walls and arranged on the foolproof part, wherein the width of the wear-resistant part is more than or equal to that of the foolproof part and is less than that of the foolproof groove,

when the memory module is plugged in the memory socket, the wall surface of the memory module beside the foolproof groove is suitable for contacting the wear-resistant piece.

7. The memory socket assembly of claim 6, wherein the wear member comprises a first segment, a second segment and a third segment connected in sequence, the second segment is connected to the two sidewalls and located on the top surface of the fool-proof member, and the first segment and the third segment are located on two sides of the fool-proof member respectively.

8. The memory socket assembly of claim 7 wherein the first, second and third sections are U-shaped posts.

9. The memory socket assembly of claim 7 wherein the first, second and third sections are J-shaped posts.

10. The memory socket assembly of claim 7, wherein the memory socket has a memory slot and two positioning grooves on two sides of the fool-proof member, the extending direction of the two positioning grooves is perpendicular to the extending direction of the memory slot, the two positioning grooves are connected to the memory slot, and the first section and the third section are inserted into the two positioning grooves for positioning.

11. The memory socket assembly of claim 6 wherein the wear-resistant member is an I-shaped post, the wear-resistant member is located on the top surface of the fool-proof member, and the thickness of the wear-resistant member is greater than the thickness of each of the sidewalls.

Technical Field

The present disclosure relates to socket protection covers and socket assemblies, and particularly to a memory socket protection cover and a memory socket assembly.

Background

At present, a fool-proof piece is arranged in a memory slot to prevent a user from inserting a memory module reversely, the fool-proof piece is generally a plastic injection product, and the fool-proof piece is worn after the memory module is inserted and pulled for many times, so that the alignment accuracy of a golden finger on the memory module and a connecting pad in the memory slot is influenced, and the problems of poor contact, offset dislocation or short circuit and the like between the golden finger on the memory module and the connecting pad in the memory slot are caused.

Disclosure of Invention

The invention provides a memory socket protection cover which can reduce the probability of abrasion of a fool-proof piece of a memory socket so that a golden finger on a memory module can be accurately inserted into a memory slot.

The invention provides a memory socket assembly which is provided with the memory socket protection cover.

The invention relates to a memory socket protection cover which is suitable for being assembled to a memory socket, the memory socket is suitable for being inserted by a memory module, the memory module comprises a foolproof groove, the memory socket comprises a foolproof piece corresponding to the foolproof groove, and the memory socket protection cover comprises two side walls and a wear-resistant piece. The two side walls are suitable for being configured at two sides of the memory socket. The wear-resistant part is connected to two side walls and is suitable for setting up on preventing slow-witted piece, and wherein the width more than or equal to of wear-resistant part prevents the width of slow-witted piece, and is less than the width of preventing slow-witted recess. When the memory module is plugged in the memory socket, the wall surface of the memory module beside the fool-proof groove is suitable for contacting the wear-resistant piece.

The invention relates to a memory socket assembly which is suitable for a memory module to be inserted, wherein the memory module comprises a foolproof groove, and the memory socket assembly comprises a memory socket and a memory socket protection cover. The memory socket includes a fool-proof member corresponding to the fool-proof groove. The memory socket protective cover is assembled to the memory socket. The memory socket protective cover comprises two side walls and a wear-resistant piece. The two side walls are arranged on two sides of the memory socket. The wear-resistant part is connected to two side walls and is arranged on the fool-proof part, wherein the width of the wear-resistant part is more than or equal to that of the fool-proof part and is less than that of the fool-proof groove. When the memory module is plugged in the memory socket, the wall surface of the memory module beside the fool-proof groove is suitable for contacting the wear-resistant piece.

In an embodiment of the invention, the wear-resistant member includes a first section, a second section and a third section, which are sequentially connected to each other, the second section is connected to the two side walls and is adapted to be located on the top surface of the fool-proof member, and the first section and the third section are adapted to be located on two sides of the fool-proof member respectively.

In an embodiment of the invention, the first section, the second section and the third section are U-shaped columns.

In an embodiment of the invention, the first section, the second section and the third section are J-shaped columns.

In an embodiment of the invention, the wear-resistant member is an I-shaped pillar, the wear-resistant member is suitable for being located on a top surface of the fool-proof member, and a thickness of the wear-resistant member is greater than a thickness of each side wall.

In an embodiment of the invention, the memory socket has a memory slot and two positioning grooves located at two sides of the fool-proof piece, an extending direction of the two positioning grooves is perpendicular to an extending direction of the memory slot, the two positioning grooves are communicated with the memory slot, and the first section and the third section are inserted into the two positioning grooves for positioning.

Based on the above, the wear-resistant member of the memory socket protection cover of the invention is suitable for being arranged on the fool-proof member of the memory socket, and the width of the wear-resistant member is greater than or equal to that of the fool-proof member, so that when the memory module is plugged into the memory socket, the wall surface of the memory module beside the fool-proof groove contacts the wear-resistant member, thereby reducing the probability that the fool-proof member of the memory socket is worn, and the problems of poor contact, offset dislocation or short circuit between the golden finger on the memory module and the pad in the memory slot can be reduced.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1 is a schematic diagram of a memory socket assembly not yet inserted into a memory module according to an embodiment of the invention.

Fig. 2 is an exploded schematic view of the memory receptacle assembly of fig. 1.

Fig. 3 is a cross-sectional schematic view of the memory socket assembly of fig. 1.

Fig. 4A is a cross-sectional schematic view of a memory module inserted into the memory socket assembly of fig. 1.

Fig. 4B is a partially enlarged schematic view of fig. 4A.

Fig. 5 is another schematic view of the memory socket assembly of fig. 1.

Fig. 6-8 are partial cross-sectional schematic views of various memory socket assemblies inserted into a memory module according to other embodiments of the invention.

The reference numbers are as follows:

w1, W2: width of

10: memory module

12: fool-proof groove

14a, 14 b: golden finger end

20: memory socket assembly

30: memory socket

31. 33: memory slot

32: fool-proof piece

34: positioning groove

36: bottom part

100: memory socket protective cover

110: side wall

112: convex structure

120. 120a, 120b, 120 c: wear-resistant part

122. 122 b: first section

124: second section part

126. 126 a: third section

130: short wall

140: fixing foot

150: a hooking part.

Detailed Description

FIG. 1 is a schematic diagram of a memory socket assembly not yet inserted into a memory module according to an embodiment of the invention. Fig. 2 is an exploded schematic view of the memory receptacle assembly of fig. 1. Referring to fig. 1 and fig. 2, the memory socket assembly 20 of the present embodiment is suitable for a memory module 10 to be inserted. The memory module 10 is, for example, a DDR4 memory module 10, but the kind of the memory module 10 is not limited thereto. The memory module 10 includes a fool-proof groove 12, and the fool-proof groove 12 divides the gold finger ends 14a, 14b of the memory module 10 into two segments with different lengths, for example.

As shown in fig. 2, in the present embodiment, the memory socket assembly 20 includes a memory socket 30 and a memory socket protection cover 100. The memory socket 30 has memory slots 31, 33 for the memory module 10 to be inserted, and the memory socket 30 includes a fool-proof piece 32 corresponding to the fool-proof groove 12. The fool-proof piece 32 divides the memory slots 31, 33 into two sections with different lengths, for example, to avoid the user from inserting the gold finger ends 14a, 14b of the memory module 10 into the memory slots 31, 33 reversely.

The memory socket protective cover 100 is assembled to the memory socket 30 to enhance the structural strength of the memory socket 30. In the present embodiment, the memory socket protection cover 100 includes two sidewalls 110 and a wear member 120. The two side walls 110 are disposed on two sides of the long side of the memory socket 30. In this embodiment, the memory receptacle protective cover 100 further includes two short walls 130 connected to the two side walls 110, the two short walls 130 corresponding to both sides of the short side of the memory receptacle 30. Thus, the memory socket protection cover 100 has a frame-shaped appearance and has better structural strength. Of course, the form of the memory receptacle protective cover 100 is not so limited.

In the present embodiment, the material of the memory socket protection cover 100 is, for example, metal, for example, the memory socket protection cover 100 is, for example, iron, copper, or stainless steel. Of course, the material of the memory receptacle protective cover 100 is not limited thereto as long as it can provide good structural strength. In the embodiment, since the material of the memory socket protection cover 100 is metal, it can provide good heat dissipation, and the heat generated during the operation of the memory module 10 can be guided to the memory socket protection cover 100, thereby increasing the heat dissipation effect.

Fig. 3 is a cross-sectional schematic view of the memory socket assembly of fig. 1. Fig. 4A is a cross-sectional schematic view of a memory module inserted into the memory socket assembly of fig. 1. Fig. 4B is a partially enlarged schematic view of fig. 4A.

Referring to fig. 3 to fig. 4B, in the present embodiment, the wear-resistant member 120 is connected to the two side walls 110 and disposed on the fool-proof member 32, the wear-resistant member 120 includes a first section 122, a second section 124 and a third section 126 connected in sequence, the second section 124 is connected to the two side walls 110 and located on the top surface of the fool-proof member 32, and the first section 122 and the third section 126 are respectively located on two sides of the fool-proof member 32. In the embodiment, the first section 122 and the third section 126 are approximately equal in length, and the first section 122, the second section 124 and the third section 126 are U-shaped columns, but the form of the wear-resistant member 120 is not limited thereto.

In addition, as shown in fig. 2 and fig. 3, in the embodiment, the memory socket 30 has two positioning grooves 34 located at two sides of the fool-proof member 32, the extending direction of the two positioning grooves 34 is perpendicular to the extending direction of the memory slots 31 and 33, the two positioning grooves 34 are communicated with the memory slots 31 and 33, the first section 122 and the third section 126 of the wear-resistant member 120 are inserted into the two positioning grooves 34 of the memory socket 30 for positioning, and when the memory module 10 is plugged into the memory socket 30, the first section 122 and the third section 126 can be prevented from being lifted outwards by the two positioning grooves 34, so that the wear-resistant member 120 is deformed or separated from the fool-proof member 32.

As shown in fig. 4B, in the present embodiment, the width W1 of the wear-resistant member 120 is greater than or equal to the width W2 of the fool-proof member 32. Thus, the wear member 120 overlying the fool-proof member 32 may serve as a wear structure to protect the fool-proof member 32. Furthermore, because the width W1 of the wear member 120 is less than the width of the fool-proof groove 12, the wear member 120 does not obstruct the insertion of the memory module 10 into the memory receptacle assembly 20. Therefore, when the memory module 10 is plugged into the memory socket 30, the wall of the memory module 10 near the fool-proof groove 12 contacts the wear-resistant member 120, and the fool-proof member 32 is prevented from being worn.

It should be noted that, in the present embodiment, the memory socket protection cover 100 may be manufactured by stamping or bending a metal plate, that is, the thickness of the wear-resistant member 120 itself is the same as that of the sidewall 110, but the form of the wear-resistant member 120 is not limited thereto.

Fig. 5 is another schematic view of the memory socket assembly of fig. 1. Referring to fig. 5, in the present embodiment, the memory socket protection cover 100 further includes at least one fixing pin 140, at least one hooking portion 150, and at least one protruding structure 112. In the present embodiment, the number of the fixing legs 140, the hooking portions 150 and the protruding structures 112 is plural. The fixing legs 140 extend downward from the two sidewalls 110 to be inserted into a main board (not shown) so as to be stably fixed to the main board. The hook portion 150 is bent from the lower portion of the two side walls 110 toward the bottom 36 of the memory socket 30 to increase the strength of the memory socket protection cover 100 fixed to the memory socket 30. The protruding structures 112 are located on the two side walls 110 to increase the structural strength of the two side walls 110.

Fig. 6-8 are partial cross-sectional schematic views of various memory socket assemblies inserted into a memory module according to other embodiments of the invention. Referring to fig. 6, the main difference between the wear-resistant part 120a of fig. 6 and the wear-resistant part 120 of fig. 4B is that in fig. 4B, the first section 122 and the third section 126 of the wear-resistant part 120 are approximately equal in length, so that the first section 122, the second section 124 and the third section 126 are U-shaped columns. In fig. 6, the first section 122 and the third section 126a of the wear part 120a are not equal in length. The length of the third segment 126a is smaller than that of the first segment 122, so that the first segment 122, the second segment 124 and the third segment 126a are J-shaped columns.

As can be seen from fig. 6, even if the first segment 122 and the third segment 126a of the wear-resistant member 120a are not equal in length, in fig. 6, the right side of the fool-proof member 32 is still covered by the third segment 126a at a position close to the top surface. Therefore, the third segment 126a of the wear-resistant member 120a can still protect the fool-proof member 32, and can replace the fool-proof member 32 to contact the wall surface of the memory module 10 beside the fool-proof groove 12 when the memory module 10 is plugged into or unplugged from the memory socket 30.

Referring to fig. 7, the length of the third section 126 of the wear-resistant member 120b of fig. 7 is greater than the length of the first section 122 b. Although the length of the first segment 122b of fig. 7 is small, the left side of the fool-proof piece 32 is still covered by the first segment 122b at a portion near the top surface. Therefore, the first section 122b of the wear-resistant member 120 can still protect the fool-proof member 32, and can replace the fool-proof member 32 to contact the wall surface of the memory module 10 beside the fool-proof groove 12 when the memory module 10 is plugged into or pulled out of the memory socket 30.

Referring to fig. 8, in the present embodiment, the wear-resistant member 120c is an I-shaped pillar, and the wear-resistant member 120c is located on the top surface of the fool-proof member 32. That is, in the embodiment, the wear-resistant member 120c does not extend to the two sides of the fool-proof member 32, but since the wear-resistant member 120c is located on the top surface of the fool-proof member 32 and the width W1 of the wear-resistant member 120c is greater than or equal to the width W2 of the fool-proof member 32, when the memory module 10 is plugged into the memory socket 30, the wall surface of the memory module 10 beside the fool-proof groove 12 will still contact with the two sides of the wear-resistant member 120c first, thereby reducing the probability that the wall surface of the memory module 10 beside the fool-proof groove 12 will rub against the fool-proof member 32.

It should be noted that, in the embodiment, the wear-resistant member 120c has a certain thickness to provide the left and right sides for the wall of the memory module 10 beside the foolproof groove 12 to contact or rub, so the thickness of the wear-resistant member 120c may be larger than the thickness of other parts (such as the side walls 110) of the memory socket protection cover 100, and a manufacturer may fix the wear-resistant member 120c with a larger thickness to the two side walls 110 by welding, bonding, or the like. Alternatively, the manufacturer may first use a plate body with the same thickness to manufacture the wear-resistant member by stamping or bending, and then increase the thickness of the wear-resistant member 120c by electroplating or sputtering. Of course, the manner and structure of the wear-resistant member 120c are not limited thereto.

In summary, the wear-resistant member of the memory socket protection cover of the present invention is suitable for being disposed on the fool-proof member of the memory socket, and the width of the wear-resistant member is greater than or equal to the width of the fool-proof member, so that when the memory module is plugged into the memory socket, the wall surface of the memory module beside the fool-proof groove contacts the wear-resistant member, thereby reducing the probability that the fool-proof member of the memory socket is worn, and reducing the problems of poor contact, offset dislocation or short circuit between the gold finger on the memory module and the pad in the memory slot.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.