阅读说明：本技术 晶体定向磨料有序排布的金刚石砂轮 (Diamond grinding wheel with crystal directional grinding materials arranged in order ) 是由 胡永乐 张德嘉 毛聪 李长河 隆鹏 刘超 王佳丽 唐伟东 于 2020-08-14 设计创作，主要内容包括：本发明公开了一种晶体定向磨料有序排布的金刚石砂轮,其特征是砂轮包含基体和磨料层,磨料层由大量蜂巢状的微型磨削单元和大量交叉型的微流道组成；微型磨削单元是由无定形碳、金刚石结合层和多颗晶体定向的金刚石磨粒构成；无定形碳使得磨粒晶体能够定向,每颗磨粒顶面均为平滑的{100}晶面,侧面均为高硬度的{111}晶面,增强了磨粒的切削性能和耐磨性能；金刚石结合层将多颗磨粒连成一体,可以防止单颗磨粒脱落,且磨粒的出刃高度可以提高至微型磨削单元高度的60%~70%,延长了砂轮的服役寿命；大量蜂巢状的微型磨削单元交错有序排布,其间隙组成大量交叉型的微流道,该砂轮结构提高了磨削液有效流量、排屑能力,显著增强了砂轮磨削性能。(The invention discloses a diamond grinding wheel with orderly arranged crystal directional grinding materials, which is characterized by comprising a base body and a grinding material layer, wherein the grinding material layer consists of a large number of honeycomb-shaped micro grinding units and a large number of crossed micro channels; the micro grinding unit is composed of amorphous carbon, a diamond bonding layer and a plurality of crystal-oriented diamond abrasive grains; the amorphous carbon enables the abrasive grain crystals to be oriented, the top surface of each abrasive grain is a smooth {100} crystal face, and the side surfaces of each abrasive grain are high-hardness {111} crystal faces, so that the cutting performance and the wear resistance of the abrasive grain are enhanced; the diamond bonding layer connects a plurality of abrasive particles into a whole, so that single abrasive particle can be prevented from falling off, the cutting height of the abrasive particles can be increased to 60-70% of the height of the micro grinding unit, and the service life of the grinding wheel is prolonged; a large number of honeycomb-shaped micro grinding units are arranged in a staggered and ordered mode, gaps among the honeycomb-shaped micro grinding units form a large number of cross micro channels, the grinding wheel structure improves the effective flow rate and chip removal capacity of grinding fluid, and the grinding performance of the grinding wheel is obviously enhanced.)

1. The diamond grinding wheel with the crystal oriented abrasives arranged in order is characterized in that: the grinding wheel comprises a base body (1) and an abrasive layer (2); the abrasive layer (2) consists of a large number of honeycomb-shaped micro grinding units (3) and a large number of cross micro channels (4); the micro grinding unit (3) is composed of amorphous carbon (3-1), a diamond bonding layer (3-2) and a plurality of crystal-oriented diamond abrasive grains (3-3); the thickness of the amorphous carbon (3-1) is only tens of nanometers, the thickness of the diamond bonding layer (3-2) is 8-30 micrometers, the height of the miniature grinding unit (3) is 20-100 micrometers, and the cutting height of the diamond abrasive particles (3-3) is 12-70 micrometers, namely the cutting height of the diamond abrasive particles (3-3) can be increased to 60% -70% of the height of the miniature grinding unit (3), so that the maximum cutting depth and chip containing space of a single diamond abrasive particle (3-3) are remarkably increased, and the service life of the grinding wheel is greatly prolonged; the top surface of each diamond abrasive particle (3-3) is a {100} crystal face (5) which is flat and smooth and is parallel to the outer circumferential surface of the substrate (1), and the side surfaces are {111} crystal faces (6) which are high in hardness and have a certain inclination angle, so that the cutting performance and the wear resistance of the diamond abrasive particles (3-3) are obviously enhanced; a large number of honeycomb-shaped micro grinding units (3) are arranged on the outer circumferential surface of the substrate (1) in a staggered and ordered manner, and gaps among the micro grinding units (3) form a large number of crossed micro channels (4), so that the effective flow of cooling liquid in a grinding area is increased, and the chip removal capacity is improved; the amorphous carbon (3-1) is fully diffused to enable the {100} crystal face (5) and the {111} crystal face (6) to be respectively oriented to the top face and the side face of the diamond abrasive grain (3-3), and the diamond bonding layer (3-2) connects a plurality of diamond abrasive grains (3-3) into a whole, so that the falling-off of the single diamond abrasive grain (3-3) in the grinding process is effectively prevented.

2. A diamond wheel with ordered arrangement of crystal-oriented abrasives according to claim 1, characterized in that: the base body (1) is made of titanium alloy, the diameter is phi 80-200 mm, and the thickness is 6-20 mm.

3. A diamond wheel with ordered arrangement of crystal-oriented abrasives according to claim 1, characterized in that: the cross section of each micro grinding unit (3) is a regular hexagon with the side length of 0.1-0.5 mm, and the distance between two adjacent micro grinding units (3) is 0.08-0.4 mm.

4. A diamond wheel with ordered arrangement of crystal-oriented abrasives according to claim 1, characterized in that: the cross section of the micro flow channel (3) is rectangular, the depth is 20-100 mu m, and the width is 0.08-0.4 mm.

Technical Field

The invention relates to a diamond grinding wheel, in particular to a diamond grinding wheel with crystal directional grinding materials arranged in sequence.

Technical Field

Grinding is an important method in advanced manufacturing technology and is widely applied to the fields of aerospace, national defense war industry, mechanical electronics and the like. In particular, in ultra-precision grinding of hard and brittle materials such as ceramics, glass, optical crystals, and the like, the diamond grinding wheel used is extremely required to achieve surface roughness of nanometer level, surface precision of submicron level, and damage of subsurface of micron level. In the traditional diamond grinding wheel, resin, ceramic or metal is used as a bonding agent, diamond grinding materials and the bonding agent are fully mixed and then sintered, but shrinkage and deformation are inevitable in the sintering process, and the geometric shape, the distribution rule and the edge-projecting height of each abrasive particle of the diamond grinding wheel are random, so that the number of cutting edges actually participating in grinding is small during grinding, and the grinding quality and the grinding efficiency of the grinding wheel are low. Meanwhile, the abrasive particle cutting height of the traditional diamond grinding wheel is low, the chip containing space is small, cooling liquid is difficult to enter a grinding area, the problems of grinding wheel blockage, workpiece grinding burn and the like are easily caused, and the service life of the grinding wheel is greatly reduced. In addition, since the abrasive grains have limited bonding performance, the single abrasive grains are liable to fall off when the grinding force is excessively large.

In order to prolong the service life of the diamond grinding wheel, patent publication No. CN105196196B discloses "an electroplated diamond grinding wheel with orderly arranged abrasive materials", in which a large number of orderly arranged blind holes are formed on the surface of the base body of the electroplated diamond grinding wheel, and a metal coating is deposited on the surface of the base body and in the blind holes for solidifying the abrasive materials, so that the roots of the diamond abrasive materials are embedded in the blind holes, the orderly arrangement of the abrasive materials on the surface of the base body can be realized, the holding force of the coating and the base body on the abrasive materials is increased, and the service life of the grinding wheel is effectively prolonged. However, the following problems still exist in the technical scheme: because the diamond abrasive particles are randomly pressed into the blind holes, the edge angle and the top surface shape of each abrasive particle are random, and the crystal orientation of the diamond abrasive particles cannot be realized, so that the grinding performance of the grinding wheel is improved to a limited extent, and further improvement is needed; meanwhile, the depth of the abrasive particles pressed into the blind holes is different, so that the height of the edge of the abrasive particles is greatly different, the effective grinding edge number of the grinding wheel is greatly reduced during grinding, and the grinding efficiency is reduced.

Patent publication CN104070467B, "microedge grinding article, and its preparation method and application", etches concave microdefects on a plane of diamond abrasive grains by a pulsed laser, so as to form a large number of microedges for grinding in the plane. The diamond abrasive particles participating in grinding are not in a single particle form any more, but a plurality of micro blades participate in grinding at the same time, and the grinding efficiency is improved. However, the following problems still exist in the technical scheme: the invention is mainly applied to diamond brazing products, and the diamond grinding layer made by brazing has low edge height and small chip containing space, so that the chip removal and cooling capacity of the grinding wheel is poor; on the other hand, the working surface of the diamond abrasive grain has a large number of micro defects etched by the pulse laser, and although the effective grinding edge number of the grinding wheel is increased during grinding, the micro defects also damage the strength and the crystal form of the diamond abrasive grain to a certain extent, and the service life of the diamond grinding wheel is shortened.

Disclosure of Invention

In order to solve the problems of the grinding wheel and the prior art, the invention provides a diamond grinding wheel with crystal directional grinding materials arranged in sequence, so as to improve the grinding efficiency, service life and processing surface quality of the diamond grinding wheel. The structure is mainly characterized in that the {100} crystal face with excellent cutting performance is used as the top face of the diamond abrasive grain, namely a grinding working face, by orienting the crystal of a single diamond abrasive grain, and the side face of the diamond abrasive grain is a {111} crystal face with high hardness and a certain inclination angle, so that the grindability of the grinding wheel is greatly improved; a plurality of diamond abrasive particles are connected into a whole by a diamond bonding layer to form a miniature grinding unit, so that the service life of the grinding wheel is prolonged; the cutting height of the single diamond abrasive particle can reach 60-70% of the particle size of the single diamond abrasive particle, and the maximum cutting depth and chip containing space of the single diamond abrasive particle are obviously increased; a large number of honeycomb-shaped micro grinding units are arranged in a staggered and orderly mode, gaps among the micro grinding units form a large number of cross micro channels, effective flow of cooling liquid in a grinding area is increased, and orderly chip removal paths are formed.

In order to realize the purpose, the diamond grinding wheel with the crystal oriented abrasive material orderly arranged is characterized in that: the wheel comprises a substrate and an abrasive layer. The abrasive layer consists of a large number of honeycomb-shaped micro grinding units and a large number of cross micro channels. The micro-grinding unit is composed of amorphous carbon, a diamond bonding layer and a plurality of crystal-oriented diamond abrasive grains. The thickness of the amorphous carbon is only tens of nanometers, the thickness of the diamond bonding layer is 8-30 micrometers, the height of the miniature grinding unit is 20-100 micrometers, and the height of the edge of the diamond abrasive particles is 12-70 micrometers, namely the height of the edge of the diamond abrasive particles can be increased to 60% -70% of the height of the miniature grinding unit, so that the maximum cutting depth and chip containing space of a single diamond abrasive particle are remarkably increased, and the service life of the grinding wheel is greatly prolonged. The top surface of each diamond abrasive particle is a {100} crystal surface which is flat and smooth and is parallel to the outer circumferential surface of the matrix, and the side surfaces of each diamond abrasive particle are {111} crystal surfaces which are high in hardness and have a certain inclination angle, so that the cutting performance and the wear resistance of the diamond abrasive particles are obviously enhanced. A large number of honeycomb-shaped micro grinding units are arranged on the outer circumferential surface of the substrate in a staggered and ordered mode, and gaps among the micro grinding units form a large number of cross micro channels, so that the effective flow of cooling liquid in a grinding area is increased, and the chip removal capacity is improved. The amorphous carbon is fully diffused to enable the {100} crystal face and the {111} crystal face to be oriented to the top face and the side face of the diamond abrasive grain respectively, and the diamond bonding layer connects a plurality of diamond abrasive grains into a whole, so that the falling of the single diamond abrasive grain in the grinding process is effectively prevented.

The base body is made of titanium alloy, the diameter of the base body is phi 80-200 mm, and the thickness of the base body is 6-20 mm.

The cross section of each micro grinding unit is a regular hexagon with the side length of 0.1-0.5 mm, and the distance between two adjacent micro grinding units is 0.08-0.4 mm.

The cross section of the micro flow channel is rectangular, the depth is 20-100 mu m, and the width is 0.08-0.4 mm.

Compared with the prior art, the invention has the following beneficial effects.

The quality of the ground surface is effectively improved. By carrying out crystal orientation on the diamond abrasive particles on the working surface of the grinding wheel, the top surface of each diamond abrasive particle is a {100} crystal surface which is flat, smooth and parallel to the outer circumferential surface of the substrate, and plays a role in cutting a workpiece in the grinding process. The anisotropy of the diamond abrasive grain crystals is determined by the difference of the atom arrangement form, the atom density and the crystal face spacing on each crystal face of the diamond abrasive grain, wherein the {100} crystal face is smoother and smoother relative to other crystal faces and has no micro twin crystal defect, and is considered as the crystal face with the best cutting performance of the single crystal diamond abrasive grain.

And the service life of the grinding wheel is obviously prolonged. By carrying out crystal orientation on the diamond abrasive grains, the side surfaces of each diamond abrasive grain are {111} crystal planes with high hardness and a certain inclination angle, so that the problem that the {111} crystal planes are easy to break and cleave under the action of parallel force is solved. Due to the anisotropy of the diamond abrasive grain crystals, the density, hardness and wear resistance of the {111} crystal planes are the highest of all the crystal planes, and the {100} crystal planes on the top surfaces of the abrasive grains play a role in arch protection, so that the high strength and excellent crystal forms of the diamond abrasive grains are maintained, and the wear resistance of the diamond abrasive grains is remarkably improved. Meanwhile, the diamond bonding layer connects a plurality of diamond abrasive grains into a whole to form a miniature grinding unit with the amorphous carbon, so that the holding force of the matrix on the diamond abrasive grains is greatly enhanced, the single abrasive grains are prevented from falling off due to overlarge stress or concentrated stress, and the service life of the grinding wheel is remarkably prolonged.

And the heat dissipation and chip removal capabilities of the grinding wheel are effectively improved. A large number of honeycomb-shaped micro grinding units are arranged in a staggered and ordered mode on the working surface of the grinding wheel, and cross-type micro channels with excellent heat mass transport characteristics are formed in gaps among the honeycomb-shaped micro grinding units. The grinding wheel structure is beneficial to forming a honeycomb fractal flow field, the smallest network perimeter can be obtained by adopting the regular hexagon structure of the section of the miniature grinding unit when the same area is densely paved, namely the total length of the cross-type micro-channel under the honeycomb fractal is shortest, so that the flow resistance is small, the heat exchange rate is high, the effective flow of the cooling liquid in a grinding area is increased, an ordered chip removal path can be formed in the grinding process of the grinding wheel, the heat dissipation and chip removal capacity of the grinding wheel is effectively improved, and the problems of grinding wheel blockage and workpiece surface grinding burn are avoided.

And fourthly, the grinding efficiency of the grinding wheel is greatly improved. The abrasive particle edge-projecting height of the traditional diamond grinding wheel is only 40% of the self particle size, and the electron-assisted chemical vapor deposition (EACVD) technology is adopted, so that the edge-projecting height of the diamond abrasive particles of the grinding wheel can be increased to 60% -70% of the self particle size, the maximum cutting depth and chip-containing space of a single diamond abrasive particle are obviously increased, and the grinding efficiency of the grinding wheel is greatly improved.

Drawings

FIG. 1 is a schematic diagram of a diamond grinding wheel with ordered arrangement of crystal-oriented abrasives and a partial enlarged view thereof.

Fig. 2 is a schematic of a micro-grinding unit structure and crystal-oriented diamond grit.

The labels in the above fig. 1 to 2 are: 1. base body, 2, abrasive layer, 3, micro grinding unit, 3-1, amorphous carbon, 3-2, diamond bonding layer, 3-3, diamond abrasive grain, 4, micro channel, 5, {100} crystal face, 6, {111} crystal face.

Detailed Description

The technical scheme of the invention is further explained by combining the drawings and the specific examples.

A diamond grinding wheel with orderly arranged crystal directional abrasives is characterized in that: the grinding wheel comprises a substrate 1 and an abrasive layer 2. The base body 1 is made of titanium alloy, the diameter is phi 100 mm, and the thickness is 10 mm. The abrasive layer 2 is composed of a plurality of honeycomb-shaped micro grinding units 3 and a plurality of cross-shaped micro channels 4. The micro grinding unit 3 is composed of amorphous carbon 3-1, a diamond bonding layer 3-2, and a plurality of crystal-oriented diamond abrasive grains 3-3.

Amorphous carbon 3-1 has a thickness of only several tens of nanometers, and is sufficiently diffused to allow {100} crystal plane 5 and {111} crystal plane 6 to be oriented to the top surface and the side surface of diamond abrasive grain 3-3, respectively.

The diamond bonding layer 3-2 has a thickness of 30 μm and connects a plurality of diamond abrasive grains 3-3 as a whole to constitute a micro grinding unit 3 together with amorphous carbon 3-1, and the height of the micro grinding unit 3 is 100 μm.

The height of the edge of the diamond abrasive grain 3-3 is 70 μm, i.e., the height of the edge of the diamond abrasive grain 3-3 can be increased to 70% of the height of the micro grinding unit 3. Compared with the traditional diamond grinding wheel, the abrasive grain exposure height is only 40% of the self grain diameter, the exposure height of the grinding wheel diamond abrasive grains 3-3 can be improved to 70% of the self grain diameter through the electron-assisted chemical vapor deposition (EACVD) technology, the maximum cutting depth and the chip containing space of the single diamond abrasive grain 3-3 are obviously increased, and the grinding efficiency of the grinding wheel is greatly improved.

The top surface of each diamond abrasive grain 3-3 is a {100} crystal face 5 which is flat and smooth and is parallel to the outer circumferential surface of the substrate 1, the anisotropy of the abrasive grain crystals caused by the difference of atomic arrangement form, atomic density and crystal face spacing on each crystal face of the abrasive grain is fully exerted, wherein the {100} crystal face 5 is more flat and smooth compared with other crystal faces and has no micro-twin crystal defects, and is considered as the crystal face with the best cutting performance of the single crystal diamond abrasive grain 3-3. The side surfaces of each diamond abrasive grain 3-3 are all the {111} crystal faces 6 with high hardness and a certain inclination angle, so that the problem that the {111} crystal faces 6 are easy to break and cleave under the action of parallel force is solved, and similarly, due to the anisotropy of the abrasive grain crystals, the density, hardness and wear resistance of the {111} crystal faces 6 are the highest among all crystal faces, and the {100} crystal faces 5 on the top surfaces of the abrasive grains play a role in arch protection, so that the high strength and excellent crystal forms of the diamond abrasive grains 3-3 are maintained, and the wear resistance of the abrasive grains is remarkably improved.

The section of the micro grinding unit 3 is a regular hexagon with the side length of 0.5 mm, and the distance between two adjacent micro grinding units 3 is 0.4 mm. Since the single micro grinding unit 3 is formed by connecting a plurality of diamond abrasive grains 3-3 into a whole by the diamond bonding layer 3-2, and is formed together with the amorphous carbon 3-1. The holding force of the matrix 1 on the diamond abrasive grains 3-3 can be greatly enhanced, the single diamond abrasive grains 3-3 can be effectively prevented from falling off due to overlarge stress or concentrated stress, and the service life of the grinding wheel is remarkably prolonged.

A large number of honeycomb-shaped micro grinding units 3 are arranged on the outer circumferential surface of the substrate 1 in a staggered and ordered mode, gaps among the micro grinding units 3 form a large number of cross-type micro channels 4 with excellent heat and mass transport characteristics, the cross-section shapes of the cross-section channels are rectangular, the depth of the cross-section channels is 100 micrometers, and the width of the cross-section channels is 0.4 mm. The grinding wheel structure is beneficial to forming a honeycomb fractal flow field, and the regular hexagon can obtain the minimum network perimeter when the same area is densely paved, namely the total length of the cross micro-channel 4 under the honeycomb fractal is the shortest, so that the flow resistance is small, the heat exchange rate is high, the effective flow of the cooling liquid in a grinding area is increased, an ordered chip removal path can be formed in the grinding process of the grinding wheel, the heat dissipation and chip removal capacity of the grinding wheel is effectively improved, and the problems of grinding wheel blockage and workpiece surface grinding burn are avoided.

The above-described embodiments are only specific examples for further explaining the object, technical solution and advantageous effects of the present invention in detail, and the present invention is not limited thereto. All equivalents, modifications, etc. that come within the scope of the disclosure are to be embraced therein.