阅读说明：本技术 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板 (Resin composition, prepreg, laminate, metal-clad laminate, and printed wiring board ) 是由 唐军旗 李志光 于 2018-12-29 设计创作，主要内容包括：一种树脂组合物及使用其制作的预浸料、层压板、覆金属箔层压板以及印刷线路板。该树脂组合物包括环氧树脂(A)、酚性固化剂(B)、有机硅橡胶(C)。该树脂组合物及使用其制得的预浸料、层压板以及覆金属箔层压板具有良好的耐热性及低模量、低热膨胀系数的特性,可以抑制印刷线路板加工过程中焊盘开裂的现象。(A resin composition, and a prepreg, a laminate, a metal foil-clad laminate and a printed wiring board manufactured using the resin composition. The resin composition comprises an epoxy resin (A), a phenolic curing agent (B) and a silicone rubber (C). The resin composition, and the prepreg, the laminated board and the metal foil-clad laminated board prepared from the resin composition have the characteristics of good heat resistance, low modulus and low thermal expansion coefficient, and can inhibit the phenomenon of pad cracking in the processing process of a printed circuit board.)

A resin composition, characterized in that the resin composition comprises:

epoxy resin (A), phenolic curing agent (B) and organic silicon rubber (C),

the amount of the silicone rubber (C) is 20 to 100 parts by weight, based on 100 parts by weight of the total weight of the epoxy resin (A) and the phenolic curing agent (B).

The resin composition according to claim 1, wherein the silicone rubber (C) is a polymer obtained by addition polymerization of a vinyl group-containing polysiloxane and a hydrosilicon-containing polysiloxane.

The resin composition according to claim 1, wherein the surface of the silicone rubber (C) is coated with polymethylsilsesquioxane formed by crosslinking siloxane bonds.

The resin composition according to claim 1, wherein the phenolic curing agent (B) is a phenol resin.

The resin composition according to claim 1, wherein at least one of the epoxy resin (A) and the phenolic curing agent (B) has an aralkyl group or a dicyclopentadiene structure.

The resin composition according to claim 1, wherein the silicone rubber (C) has a D50 particle size of 1 to 20 μm.

The resin composition according to claim 1, wherein the resin composition further comprises an inorganic filler (D).

The resin composition according to claim 7, wherein the amount of the inorganic filler (D) is 5 to 100 parts by weight, preferably 10 to 70 parts by weight, and more preferably 15 to 60 parts by weight, based on 100 parts by weight of the total amount of the epoxy resin (A) and the phenolic curing agent (B).

A prepreg comprising a substrate and the resin composition of any one of claims 1 to 8 attached to the substrate by impregnation or coating.

A laminate comprising at least one prepreg according to claim 9.

A metal-clad laminate comprising at least one prepreg according to claim 9 and a metal foil on one or both sides of the prepreg.

A printed wiring board comprising at least one prepreg according to claim 9.