阅读说明：本技术 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板 (Resin composition, prepreg, laminate, metal-clad laminate, and printed wiring board ) 是由 唐军旗 李志光 于 2018-12-29 设计创作，主要内容包括：一种树脂组合物及使用其制作的预浸料、层压板、覆金属箔层压板以及印刷线路板。该树脂组合物包括环氧树脂(A)、酚性固化剂(B)、有机硅橡胶(C)。该树脂组合物及使用其制得的预浸料、层压板以及覆金属箔层压板具有良好的耐热性及低模量、低热膨胀系数的特性,可以抑制印刷线路板加工过程中焊盘开裂的现象。(A resin composition, and a prepreg, a laminate, a metal foil-clad laminate and a printed wiring board manufactured using the resin composition. The resin composition comprises an epoxy resin (A), a phenolic curing agent (B) and a silicone rubber (C). The resin composition, and the prepreg, the laminated board and the metal foil-clad laminated board prepared from the resin composition have the characteristics of good heat resistance, low modulus and low thermal expansion coefficient, and can inhibit the phenomenon of pad cracking in the processing process of a printed circuit board.)