Conduction device

文档序号:1075936 发布日期:2020-10-16 浏览:15次 中文

阅读说明:本技术 传导装置 (Conduction device ) 是由 高伟强 于 2019-04-03 设计创作,主要内容包括:一种传导装置,包含两个基底单元、三个分别位于所述基底单元间及相反两侧的导电单元、两个分别叠置于两侧导电单元外的表面单元,及导通单元。每一个基底单元包括基板、设置于所述基板的导电层,及设置于所述导电层的封板。每一个导电单元包括多个接触件,每一个接触件具有位于所述基底单元投影范围内的基部,及至少一个延伸至所述基底单元投影范围外的臂部。每一个表面单元包括绝缘板,及叠置于所述绝缘板的导电板。所述导通单元包括至少一个贯穿所述基底单元及所述表面单元,且与所述导电层与所述导电板电性连接的导通件,以因应多种电性测试需求。(A conduction device comprises two substrate units, three conductive units respectively positioned between the substrate units and on two opposite sides of the substrate units, two surface units respectively superposed outside the conductive units on the two sides of the substrate units, and a conduction unit. Each base unit comprises a substrate, a conducting layer arranged on the substrate and a sealing plate arranged on the conducting layer. Each conductive unit comprises a plurality of contact pieces, each contact piece is provided with a base part positioned in the projection range of the base unit, and at least one arm part extending out of the projection range of the base unit. Each surface unit includes an insulating plate, and a conductive plate stacked on the insulating plate. The conducting unit comprises at least one conducting piece which penetrates through the substrate unit and the surface unit and is electrically connected with the conducting layer and the conducting plate, so that various electrical test requirements can be met.)

1. A conducting device; the method is characterized in that: comprises the following steps:

the two base units are arranged in a direction that the sealing plates face each other;

the three conductive units are respectively positioned between the base units and two opposite sides of the base units, each conductive unit comprises a plurality of contact pieces, each contact piece is provided with a base part positioned in the projection range of the base unit, and at least one arm part which extends out of the projection range of the base unit from the base part and can deform towards the base part;

the two surface units are respectively superposed on the outer sides of the two conductive units positioned on the two opposite sides of the base unit, and each surface unit comprises an insulating plate contacting the conductive unit and a conductive plate superposed on the outer side of the insulating plate; and

and the conducting unit comprises at least one conducting piece which penetrates through the substrate unit and the surface unit and is electrically connected with the conducting layer and the conducting plate.

2. The conduction means of claim 1, wherein: each conductive unit further includes a plurality of spacers respectively disposed on opposite sides of the base portion of the contact member such that the arm portion of the contact member is spaced apart from the base unit and the surface unit.

3. The conduction means of claim 1, wherein: the conducting device is defined to extend along a length direction, each conducting unit further comprises a central conducting piece positioned in the center of the length direction, and two central spacers respectively arranged on two opposite sides of the central conducting piece, and the contact pieces are respectively arranged at intervals along the length direction from the central conducting piece in a direction far away from the central conducting piece.

4. A conduction means as claimed in claim 3, wherein: the central conductive piece of each conductive unit is annular and surrounds a through hole, and at least one conductive piece of the conductive unit passes through the through hole of the central conductive piece of the conductive unit.

5. A conduction means as claimed in claim 3, wherein: each contact piece of each conductive unit is provided with two arm parts, and when the arm parts of the contact pieces deform towards the projection range of the base unit, the deformed arm parts are located in the projection range of the arm parts of the adjacent contact pieces along the length direction.

6. The conduction means of claim 5, wherein: the arm portion of each conductive unit extends obliquely in a direction toward the central conductive member.

7. The conduction means of claim 1, wherein: each base unit comprises two conducting layers respectively arranged on two opposite sides of the substrate, two sealing plates respectively arranged on the conducting layers, and at least one capacitor arranged on one side of the substrate and electrically connected with the conducting layers.

Technical Field

The present invention relates to an electrical connection assembly, and more particularly, to a conductive device.

Background

Referring to fig. 1, a conventional electrical testing apparatus 9 is adapted to test a device under test 900, such as an integrated circuit, a wafer, etc., and includes a base 91 made of metal and a plurality of spring probes 92 disposed in the base 91. The spring probes 92 are electrically connected to the device under test 900 for performing various tests.

When the electrical property test is carried out, the physical electric connecting piece is directly contacted with each contact of the electronic component to be tested, and whether the electronic component is a good product is confirmed by utilizing the conducting state of the electric signal. When the electrical connector contacts the electronic component to be tested, in addition to observing the electrical signal conduction through simple contact, in order to meet the actual condition of the operation of the electronic component, the electrical connector may need to be contacted with the electronic component by moving and scraping or pressing with a specific force. Therefore, the electrical contact member needs to have certain elasticity to meet the requirements of various contact forms, and to buffer the external force applied during contact through proper deformation, while having considerable rigidity to maintain the overall structural strength and produce the supporting effect.

In addition, because the shapes and the contact distribution of the electronic components are many, when testing various electronic components, the electrical connectors for testing need to be divided into contacts for transmitting signals and contacts for grounding according to requirements, and the design and the manufacture are complicated. Therefore, if the requirements of signal transmission and grounding for testing can be met, the testing quality of transmitting electrical signals can be optimized while simplifying the grounding configuration, and a critical breakthrough in the performance of electrical testing should be created.

Disclosure of Invention

The invention aims to provide a conduction device which can be matched with various test requirements to optimize the electrical test quality and simplify the grounding configuration.

The conduction device comprises two substrate units, three conductive units respectively positioned between the substrate units and on two opposite sides of the substrate units, two surface units respectively superposed on the outer sides of the two conductive units on the two opposite sides, and a conduction unit.

Each base unit comprises a substrate, at least one conducting layer arranged on the substrate and at least one sealing plate arranged on the at least one conducting layer, wherein the base units are arranged in the direction that the sealing plates face each other.

Each conductive unit comprises a plurality of contact pieces, each contact piece is provided with a base part positioned in the projection range of the base unit and at least one arm part which extends from the base part to the outside of the projection range of the base unit and can deform towards the base part.

Each surface unit includes an insulating plate contacting the conductive unit, and a conductive plate stacked on an outer side of the insulating plate.

The conducting unit comprises at least one conducting piece which penetrates through the substrate unit and the surface unit and is electrically connected with the conducting layer and the conducting plate.

The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.

Preferably, each of the conductive units further includes a plurality of spacers respectively disposed on opposite sides of the base portion of the contact member, so that the arm portion of the contact member is spaced apart from the base unit and the surface unit.

Preferably, each of the conductive units further includes a central conductive member located at the center in the length direction, and two central spacers respectively disposed at opposite sides of the central conductive member, wherein the contact members are respectively spaced apart from the central conductive member in the length direction in a direction away from the central conductive member.

Preferably, in the above conduction device, the central conductive member of each conductive unit is annular and surrounds a through hole, and at least one conduction member of the conduction unit passes through the through hole of the central conductive member of the conductive unit.

Preferably, each contact piece of each conductive unit has two arm portions, and when the arm portions of the contact pieces deform toward the projection range of the base unit, the projection range of the arm portion of at least one contact piece along the length direction is heavier than the arm portion of an adjacent contact piece.

Preferably, in the above-mentioned conduction device, the arm portion of each conductive unit extends obliquely in a direction toward the central conductive member.

Preferably, each of the base units includes two conductive layers respectively disposed on two opposite sides of the substrate, two sealing plates respectively disposed on the conductive layers, and at least one capacitor disposed on one side of the substrate and electrically connected to the conductive layers.

The invention has the beneficial effects that: the arm part of the contact element can be deformed, so that the buffer margin can be generated, the requirements of electrical test such as scraping, pressure contact and the like can be met, one part of the contact element can form a medium for transmitting an electrical signal, the other part of the contact element is matched with the conductive plate of the surface unit and the conducting piece of the conducting unit, the grounding can be directly formed, the shielding effect for preventing the signal from being interfered is generated, the grounding configuration is simplified, and the quality of the electrical test can be effectively optimized.

Drawings

FIG. 1 is a cross-sectional view illustrating a conventional electrical testing apparatus;

FIG. 2 is an exploded perspective view illustrating a first embodiment of a conduction assembly in accordance with the present invention;

FIG. 3 is a perspective view illustrating the assembled configuration of the first embodiment;

FIG. 4 is a side view illustrating three conductive elements of the first embodiment;

FIG. 5 is a diagram illustrating deformation of a contact of a conductive element when subjected to an external force;

FIG. 6 is a side view, from a different perspective than FIG. 3, illustrating the use of a plurality of spacers of the conductive elements;

FIG. 7 is a perspective view illustrating one of the different ways in which the contacts perform signal transmission and grounding effects, respectively;

FIG. 8 is a schematic view illustrating the contact after deformation of the two arms;

FIG. 9 is an exploded perspective view illustrating the use of the first embodiment to test a device under test;

FIG. 10 is a side view, which is an auxiliary view of FIG. 9 illustrating the effect of the first embodiment in performing electrical tests; and

fig. 11 is a side view similar to fig. 6 illustrating a second embodiment of the conduction apparatus of the present invention.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

Referring to fig. 2 and 3, a first embodiment of a conduction device according to the present invention includes two substrate units 1, three conductive units 2 respectively disposed between the substrate units 1 and on opposite sides of the substrate units 1, two surface units 3 respectively stacked on outer sides of the two conductive units 2 on opposite sides, and a conduction unit 4. It should be noted that, when the conduction device of the present invention is used for electrical testing, the number of the conduction devices can be selected according to the requirement, and the conduction device of the present invention is defined to extend along a length direction L, and the substrate unit 1, the conductive unit 2, and the surface unit 3 are stacked along a stacking direction D perpendicular to the length direction L, so that as long as a plurality of conduction devices of the present invention are stacked along the stacking direction D, the area for electrical testing can be expanded by using the conductive unit 2 to meet the specification of the electronic component to be tested.

Each base unit 1 includes a substrate 11, a conductive layer 12 disposed on the substrate 11, and a sealing plate 13 disposed on the conductive layer 12, wherein the base units 1 are disposed in a direction in which the sealing plates 13 face each other. The substrate 11 is made of an insulating material, the conductive layer 12 can be formed by plating or direct attachment, and the sealing plates 13 are respectively located on two opposite sides of the conductive layer 12 along the stacking direction D with the substrate 11 to isolate the conductive layer 12 along the stacking direction D.

Referring to fig. 2 to 4, each conductive unit 2 includes a plurality of contacts 21, a plurality of spacers 22 respectively disposed on opposite sides of the contacts 21, a central conductive member 23 centrally located in the length direction L, and two central spacers 24 respectively disposed on opposite sides of the central conductive member 23 along the stacking direction D. The contact elements 21 are respectively arranged at intervals along the length direction L from the central conductive element 23 in a direction away from the central conductive element 23, each contact element 21 has a base portion 211 located within the projection range of the base unit 1, and two arm portions 212 extending from the base portion 211 to the outside of the projection range of the base unit 1 and capable of deforming toward the base portion 211, and the arm portions 212 extend obliquely toward the central conductive element 23. The central conductive member 23 of each conductive unit 2 is annular and surrounds a through hole 231.

Each surface unit 3 includes an insulating plate 31 contacting the conductive unit 2, and a conductive plate 32 stacked outside the insulating plate 31. The conducting unit 4 includes a plurality of conducting members 41 penetrating through the base unit 1 and the surface unit 3 and electrically connected to the conductive layer 12 and the conductive plate 32. The conductive member 41, which is located at the center in the length direction L, passes through the through hole 231 of the center conductive member 23 of the conductive unit 2.

Referring to fig. 5, in order to cooperate with the actions of scraping, pressing, etc. required for testing the electronic components, the arm portions 212 of each contact 21 are deformed in directions toward each other when an external force is applied to the base portion 211, thereby providing a buffering action during contact. In addition, in order to allow the arm portions 212 of the contact member 21 to be deformed more smoothly, as shown in fig. 6, the spacer 22 allows the arm portions 212 of the contact member 21 to be spaced apart from the base unit 1 and the surface unit 3, so that the arm portions 212 are not affected by the base unit 1 and the surface unit 3 when being deformed.

It should be noted that the degree of deformation of the arm 212 of each contact 21 can be adjusted according to the distance from the adjacent contact 21, the requirements of the test, and even the requirements of the overall strength of the contact 21. The adjustment may be accomplished by, for example, changing the conductive material, changing the shape of each arm 212, etc.

Referring to fig. 7 in conjunction with fig. 6, when performing a test operation of an electronic component, the contacts 21 need to be responsible for transmitting electrical signals and conducting ground respectively. For the purpose of the following description of the efficacy of the first embodiment in performing electrical testing, a part of the contacts 21 of the conductive unit 2 located at the center along the stacking direction D is defined as signal contacts 21(a) [ illustrated in a relatively dark color for identification ] responsible for transmitting electrical signals, and the rest are ground contacts 21 (B). As shown in fig. 7, a reference plane a is aligned with the same side of the base unit 1 and the surface unit 3, on the reference plane a, the signal contact 21(a) is surrounded by a plurality of ground contacts 21(B), and when the arm portion 212 of the signal contact 21(a) deforms toward the projection range of the base unit 1, the projection range of the arm portion 212 of the signal contact 21(a) along the length direction L overlaps with the projection range of the arm portion 212 of the ground contact 21(B) adjacent to the length direction L as shown in fig. 8, so as to provide a metal shield along the length direction L by the adjacent ground contacts 21 (B). Referring to fig. 7 and fig. 8 again, the conductive layer 12 of the substrate unit 1 and the conductive plate 32 of the surface unit 3 can form a more complete shield of metal material, so that when the signal contact 21(a) transmits an electrical signal, the transmitted signal can be prevented from being interfered, thereby improving the quality of the test.

In addition, in order to make the conductive layer 12 of the base unit 1 and the conductive plate 32 of the surface unit 3 conduct with each other to form a Ground (Ground) function and a Power (Power) function together, or to play a role of transmitting a test Signal (Signal) according to a test requirement, the conductive piece 41 of the conduction unit 4 is connected between the conductive layer 12 and the conductive plate 32, so that a circuit configuration of Ground, Power transmission, or Signal transmission can be simply completed by electrically connecting a matched device from the conductive plate 32 on the surface of the first embodiment during a test.

Referring to fig. 9 and 10, in order to facilitate the use of the conductive device of the present invention in a complete package for testing a device 9 to be tested, the conductive device of the present invention is preferably mounted in a package housing 8 configured with a circuit for testing, the package housing 8 includes two panels 81 respectively located at opposite sides, and each panel 81 is formed with three through slots 810 spaced in parallel with each other. Each through slot 810 is capable of allowing the arm 212 of one conductive element 2 facing the same side to pass through and expose outwards to connect with the electrical contacts 91 of the device under test 9. Since the arm portions 212 are exposed to opposite sides, the arm portion 212 on the side opposite to the side contacting the device under test 9 can be connected to a driving module 7 for providing power and control information to drive the detection process of testing the device under test 9. Finally, it is only necessary to determine whether the electrical signal generated by the device under test 9 is normal, so as to determine whether the device under test 9 is good.

It should be noted that, in the inspection application shown in fig. 9 and 10, the contact 21 is also divided into a signal contact 21(a) for transmitting signals (illustrated in a relatively dark color for identification), and a ground contact 21(B) for generating a ground function, and besides the shielding is formed by surrounding the signal contact 21(a) with the ground contact 21(B), if the panel 81 of the package housing 8 is made of a metal material, the shielding effect can be generated to further optimize the inspection performance.

Referring to fig. 11, a second embodiment of the conducting device of the present invention is shown, which differs from the first embodiment in that: each base unit 1 includes two conductive layers 12 respectively disposed on two opposite sides of the substrate 11, and two sealing plates 13 respectively disposed on the conductive layers 12, and each base unit 1 further includes two capacitors 14 respectively disposed on two opposite sides of the substrate 11 and electrically connected to the conductive layers 12. By temporarily storing a part of the electric energy in the capacitor 14, the direct current Offset (DC-Offset) of the electric signal conducted between the conductive layers 12 can be eliminated, so that the interpretation is more accurate, and the performance of the electrical detection is further optimized.

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