阅读说明：本技术 Cof载带及其加工方法、cof载带加工设备 (COF carrier tape, processing method thereof and processing equipment of COF carrier tape ) 是由 秦杰辉 郭星灵 张肖 于 2018-03-16 设计创作，主要内容包括：一种COF载带(100),包括至少一个COF板(10),每个所述COF板包括COF基板(11)及层叠于所述COF基板上的补强板(12),所述补强板位于所述COF基板上的补强区(S1)。一种所述COF载带加工设备(200),以及一种COF载带加工方法。通过所述补强板使得所述补强区具有较高的强度,使电容、电阻等电子元件能够直接承载于所述COF板上,从而可以直接通过所述COF板连接所述显示面板及显示器主板,不需要使用所述FPC板,从而减少所述显示器的制程,减少不良品出现的风险。(A COF carrier tape (100) includes at least one COF board (10), each of the COF boards including a COF substrate (11) and a reinforcing plate (12) laminated on the COF substrate, the reinforcing plate being located in a reinforcing region (S1) on the COF substrate. The COF carrier tape processing apparatus (200) and a COF carrier tape processing method. The reinforcing plate enables the reinforcing area to have higher strength, so that electronic elements such as capacitors and resistors can be directly borne on the COF plate, the display panel and the display main board can be directly connected through the COF plate, the FPC plate is not needed, the manufacturing process of the display is reduced, and the risk of defective products is reduced.)