阅读说明：本技术 光学距离传感器、信号处理电路、方法及电子设备 (Optical distance sensor, signal processing circuit, method and electronic device ) 是由 李�根 于 2020-05-20 设计创作，主要内容包括：本发明实施例提供一种光学距离传感器、信号处理电路、信号处理方法和电子设备,光学距离传感器包括发射器、接收器和调制器；发射器和接收器并列设置,发射器的发射端和接收器的接收端朝向同一侧,接收器用于接收发射器的发射光线对应的反射光线；调制器设置于发射光线的传播路径上；调制器包括依次层叠的第一电极层、电致变色层、离子导电层、离子贮藏层和第二电极层,其中,第一电极层和第二电极层用于与电源的电极电连接。本发明可实现电致变色层在离子注入态和离子抽离态之间切换,调节与电致变色层对应频段光线的透过率,实现对发射出的光线的信号的调制,可提高对于结构公差、盖板玻璃透过率等不利因素的容许范围,提升传感器监测准确性。(The embodiment of the invention provides an optical distance sensor, a signal processing circuit, a signal processing method and electronic equipment, wherein the optical distance sensor comprises a transmitter, a receiver and a modulator; the emitter and the receiver are arranged in parallel, the emitting end of the emitter and the receiving end of the receiver face to the same side, and the receiver is used for receiving reflected light corresponding to the emitted light of the emitter; the modulator is arranged on a transmission path of the emission light; the modulator comprises a first electrode layer, an electrochromic layer, an ion conducting layer, an ion storage layer and a second electrode layer which are sequentially stacked, wherein the first electrode layer and the second electrode layer are used for being electrically connected with electrodes of a power supply. The invention can realize the switching of the electrochromic layer between the ion injection state and the ion extraction state, adjust the transmittance of the light in the frequency band corresponding to the electrochromic layer, realize the modulation of the emitted light signal, improve the allowable range of adverse factors such as structural tolerance, cover plate glass transmittance and the like, and improve the monitoring accuracy of the sensor.)

1. An optical distance sensor applied to electronic equipment is characterized by comprising a transmitter, a receiver and a modulator;

the emitter and the receiver are arranged in parallel, the emitting end of the emitter and the receiving end of the receiver face to the same side, and the receiver is used for receiving reflected light corresponding to the emitted light of the emitter;

the modulator is arranged on a propagation path of the emission light;

the modulator comprises a first electrode layer, an electrochromic layer, an ion conducting layer, an ion storage layer and a second electrode layer which are sequentially stacked, wherein the first electrode layer and the second electrode layer are used for being electrically connected with electrodes of a power supply.

2. The optical distance sensor of claim 1 wherein the transmitter is an infrared light transmitter and the receiver is an infrared receiver.

3. The optical distance sensor as claimed in claim 2, wherein said electrochromic layer is a tungsten oxide layer, said ion-conducting layer is a tantalum pentoxide layer, and said ion storage layer is a nickel oxide layer.

4. The optical distance sensor of claim 1 wherein the modulator further comprises a first glass layer and a second glass layer;

the first glass layer is arranged on one side, away from the electrochromic layer, of the first electrode layer, and the second glass layer is arranged on one side, away from the electrochromic layer, of the second electrode layer.

5. A signal processing circuit, characterized in that it comprises a power supply, a trigger and an optical distance sensor according to any one of claims 1 to 4;

the power supply is electrically connected with the modulator;

the trigger is used for switching the connection mode of the power supply and the modulator so as to control the modulator to send out a modulation signal to modulate a carrier signal;

the receiver is provided with an integrating circuit which is used for generating an oscillating signal and carrying out integration processing on the carrier signal and the oscillating signal.

6. The signal processing circuit of claim 5, wherein the integration circuit comprises a cascaded optical-to-electrical converter, a synchronous oscillator, a phase-locked loop circuit, a multiplier, and a low-pass filter;

the output end of the photoelectric converter is electrically connected with the input end of the multiplier, the output end of the synchronous oscillator is electrically connected with the input end of the multiplier, the output end of the phase-locked loop circuit is electrically connected with the input end of the synchronous oscillator, and the output end of the multiplier is electrically connected with the input end of the low-pass filter;

the carrier signal output by the photoelectric converter and the oscillation signal output by the synchronous oscillator are input into the multiplier for multiplication, the output signal of the multiplier is input into the low-pass filter and is filtered to output a low-frequency signal, and the phase-locked loop circuit is used for locking the phase of the oscillation signal of the synchronous oscillator.

7. The signal processing circuit of claim 5,

the connection mode comprises a first connection mode or a second connection mode, the first connection mode is that the first electrode layer is electrically connected with the positive pole of the power supply, and the second electrode layer is electrically connected with the negative pole of the power supply; the second connection mode is that the first electrode layer is electrically connected with the negative electrode of the power supply, and the second electrode layer is electrically connected with the positive electrode of the power supply;

the trigger is used for controlling the first connection mode and the second connection switching so as to control the modulator to send out a modulation signal;

in the first connection mode, the electrochromic layer is in one of an ion injection state and an ion extraction state, in the second connection mode, the electrochromic layer is in the other of the ion injection state and the ion extraction state, and the modulator has different light transmittance in the ion injection state and the ion extraction state.

8. A signal processing method for use in a signal processing circuit according to any one of claims 5 to 7, the method comprising:

switching the connection mode of the power supply and the modulator to send out a modulation signal to modulate a carrier signal, wherein the connection mode comprises a first connection mode or a second connection mode opposite to the first connection mode;

receiving the carrier signal and the oscillation signal, wherein the carrier signal comprises a background signal and a target signal, and the target signal is a reflection signal generated when a transmitting signal is modulated by the modulation signal and meets an obstacle;

integrating the carrier signal and the oscillation signal to obtain a low-frequency signal;

normalizing the low-frequency signal to obtain a scaling signal;

determining bit error rates of the scaled signal and the modulated signal;

under the condition that the error rate is greater than a preset threshold value, outputting a first result that the barrier is far away from the optical distance sensor; and under the condition that the error rate is not greater than a preset threshold value, outputting a second result that the barrier approaches the optical distance sensor.

9. The signal processing method of claim 8, wherein the integrating the carrier signal and the oscillation signal to obtain a low-frequency signal comprises:

multiplying the carrier signal and the oscillation signal to obtain a first output signal;

and carrying out low-pass filtering processing on the first output signal to obtain a low-frequency signal.

10. An electronic device, characterized in that the electronic device comprises a signal processing circuit according to any one of claims 5 to 7.

11. The electronic device of claim 10, further comprising a display screen;

the emitter and the receiver are both arranged on the backlight side of the display screen;

the modulator is embedded in the layered structure of the display screen, or the modulator is arranged on the light-emitting side of the display screen in a stacked manner.

12. An electronic device comprising a processor, a memory, and a program or instructions stored on the memory and executable on the processor, which when executed by the processor, implement the steps of the signal processing method according to any one of claims 8 to 9.

Technical Field

The present invention relates to the field of communications technologies, and in particular, to an optical distance sensor, a signal processing circuit, a signal processing method, and an electronic device.

Background

At present, distance sensing in various electronic devices becomes a standard configuration of products, and a light ray sensor is generally adopted in a mode of realizing a distance sensing function. As shown in fig. 1, the emitting end 10 of the light sensor emits light, and the receiving end 11 receives reflected light. Without a mask above the sensor, the receiving end 11 receives a portion of the reflected light from the cover glass (as in the solid path of fig. 1), which is referred to as noise floor. In the case of a block above the sensor, the receiving end 11 receives reflected light from an obstacle (as shown by the dashed path in fig. 1), and this reflected light can be referred to as object reflected light. Therefore, in the prior art, whether an object is close to the light sensor can be judged by judging the difference value between the reflected light of the object and the background noise. If the difference is larger than zero, an object is considered to be close to the light sensor.

For better performance, the ratio between the difference and the background noise, i.e., the signal-to-noise ratio snr (signal noise ratio), needs to be as large as possible. However, due to the existence of the cover glass reflection path, when the electronic device is manufactured in a large scale, due to factors such as structural tolerance and cover glass transmittance, the energy of the cover glass reflection path cannot be estimated, so that the bottom noise is distributed in a wide range, the SNR is smaller than the original design value, the light sensor is judged incorrectly, and the monitoring accuracy is reduced or even fails.

Disclosure of Invention

The embodiment of the invention provides an optical distance sensor, a signal processing circuit, a signal processing method and electronic equipment, which can solve the problems that the conventional light sensor is easy to misjudge, and the monitoring accuracy is reduced or even fails.

In order to solve the technical problem, the invention is realized as follows:

in a first aspect, an embodiment of the present invention provides an optical distance sensor applied to an electronic device, where the optical distance sensor includes a transmitter, a receiver, and a modulator;

the emitter and the receiver are arranged in parallel, the emitting end of the emitter and the receiving end of the receiver face to the same side, and the receiver is used for receiving reflected light corresponding to the emitted light of the emitter;

the modulator is arranged on a propagation path of the emission light;

the modulator comprises a first electrode layer, an electrochromic layer, an ion conducting layer, an ion storage layer and a second electrode layer which are sequentially stacked, wherein the first electrode layer and the second electrode layer are used for being electrically connected with electrodes of a power supply.

In a second aspect, an embodiment of the present invention further provides a signal processing circuit, where the signal processing circuit includes a power supply, a trigger, and any one of the optical distance sensors described above;

the power supply is electrically connected with the modulator;

the trigger is used for switching the connection mode of the power supply and the modulator so as to control the modulator to send out a modulation signal to modulate a carrier signal;

the receiver is provided with an integrating circuit which is used for generating an oscillating signal and carrying out integration processing on the carrier signal and the oscillating signal.

In a third aspect, an embodiment of the present invention further provides a signal processing method, where the method is used in any one of the signal processing circuits described above, and the method includes:

switching the connection mode of the power supply and the modulator to send out a modulation signal to modulate a carrier signal, wherein the connection mode comprises a first connection mode or a second connection mode opposite to the first connection mode;

receiving the carrier signal and the oscillation signal, wherein the carrier signal comprises a background signal and a target signal, and the target signal is a reflection signal generated when a transmitting signal is modulated by the modulation signal and meets an obstacle;

integrating the carrier signal and the oscillation signal to obtain a low-frequency signal;

normalizing the low-frequency signal to obtain a scaling signal;

determining bit error rates of the scaled signal and the modulated signal;

under the condition that the error rate is greater than a preset threshold value, outputting a first result that the barrier is far away from the optical distance sensor; and under the condition that the error rate is not greater than a preset threshold value, outputting a second result that the barrier approaches the optical distance sensor.

In a fourth aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes a display screen and any one of the above optical distance sensors;

the emitter and the receiver are both arranged on the backlight side of the display screen;

the modulator is embedded in the layered structure of the display screen, or the modulator is arranged on the light-emitting side of the display screen in a stacked manner.

In a fifth aspect, the present invention further provides an electronic device, which includes a processor, a memory, and a program or an instruction stored in the memory and executable on the processor, and when the program or the instruction is executed by the processor, the steps of the signal processing method according to the third aspect are implemented.

In the embodiment of the present invention, by disposing a modulator on a propagation path of emitted light of an emitter of an optical distance sensor, the modulator includes a first electrode layer and a second electrode layer for electrically connecting with electrodes of a power supply, and an electrochromic layer, an ion conductive layer, an ion storage layer, which are disposed in a stacked manner between the first electrode layer and the second electrode layer. Therefore, the switching of the electrochromic layer between the ion injection state and the ion extraction state can be realized by switching the positive and negative connection mode between the modulator and the power supply, the transmittance of light rays of a frequency band corresponding to the electrochromic layer is adjusted, the modulation of signals of the emitted light rays is realized, the allowable range of adverse factors such as structural tolerance and the transmittance of cover plate glass can be enlarged, and the monitoring accuracy of the sensor is improved.

Drawings

FIG. 1 shows a schematic optical path diagram of an optical distance sensor of the prior art;

fig. 2 is a schematic diagram of an optical path of an optical distance sensor according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a layered structure of a modulator according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a layered structure of another modulator according to an embodiment of the present invention;

FIG. 5 is a schematic block diagram of a signal processing circuit according to an embodiment of the present invention;

fig. 6 is a flow chart of a signal processing method according to an embodiment of the present invention;

fig. 7 is a block diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.