阅读说明：本技术 传输线模组及电磁兼容处理方法 (Transmission line module and electromagnetic compatibility processing method ) 是由 王建安 陈勇利 于 2020-06-30 设计创作，主要内容包括：本发明提供了传输线模组及电磁兼容处理方法。传输线模组包括第一电路板、第二电路板以及连接第一电路板和第二电路板的连接器；该传输线模块结构还包括电连接件,电连接件将第一电路板的地层和第二电路板的地层电连接。通过电连接件将第一电路板的地层和第二电路板的地层电连接,在不改变现有连接器、第一电路板和第二电路板的设计以及不改变现有连接器与第一电路板、第二电路板之间的连接位置、连接方式等因素下,能够明显提升采用不同连接器厂家的连接器的传输线结构的电磁兼容性能,以使连接器的选择空间更大更灵活；并且电连接件设计灵活,加工简易。(The invention provides a transmission line module and an electromagnetic compatibility processing method. The transmission line module comprises a first circuit board, a second circuit board and a connector for connecting the first circuit board and the second circuit board; the transmission line module structure also includes an electrical connector electrically connecting the ground plane of the first circuit board and the ground plane of the second circuit board. The ground layer of the first circuit board is electrically connected with the ground layer of the second circuit board through the electric connecting piece, and the electromagnetic compatibility of the transmission line structure of the connector manufactured by different connector manufacturers can be obviously improved under the conditions that the design of the existing connector, the design of the first circuit board and the design of the second circuit board are not changed, the connecting position and the connecting mode between the existing connector and the first circuit board and between the existing connector and the second circuit board are not changed, so that the selection space of the connector is larger and more flexible; and the electric connector is flexible in design and easy to process.)

1. The utility model provides a transmission line module, transmission line module includes first circuit board, second circuit board and connects first circuit board with the connector of second circuit board which characterized in that:

the transmission line module further includes an electrical connector electrically connecting the ground plane of the first circuit board and the ground plane of the second circuit board.

2. The transmission line module of claim 1, wherein the electrical connectors are circumferentially spaced from the connector with a gap therebetween.

3. The transmission line module of claim 2, wherein the connector comprises at least one set of rf transmission ports, each set of rf transmission ports comprising a first rf transmission port electrically connected to the first circuit board and a second rf transmission port electrically connected to the second circuit board, the connector enabling signal transmission between the first circuit board and the second circuit board through the first rf transmission port and the second rf transmission port;

the electrical connector is disposed proximate to the set of radio frequency transmission ports.

4. The transmission line module according to claim 3, characterized in that the connector has a circumferential side wall in the circumferential direction, the circumferential side wall having a first side wall section closest to the group of radio frequency transmission ports and a second side wall section next to the group of radio frequency transmission ports, the first side wall section and/or the second side wall section being provided with the electrical connections on opposite outer sides.

5. The transmission line module of claim 4, wherein adjacent electrical connectors are integrally connected.

6. The transmission line module according to any one of claims 1 to 5, characterized in that the electrical connection element is made of an electrically conductive material or has a conductive portion electrically connecting the ground layer of the first circuit board and the ground layer of the second circuit board, the conductive portion being made of an electrically conductive material.

7. The transmission line module according to claim 6, wherein the first circuit board is a PCB or FPC; the second circuit board is a PCB or an FPC.

8. An electromagnetic compatibility processing method applied to a transmission line structure, the transmission line structure comprising a first circuit board, a second circuit board and a connector connecting the first circuit board and the second circuit board, the method comprising the steps of:

electrically connecting the ground layer of the first circuit board and the ground layer of the second circuit board by an electrical connector.

9. The method of claim 8, wherein: the method further comprises the steps of:

and adjusting the electromagnetic compatibility of the transmission line structure by changing one or more of the material, the shape, the number and the position of the electric connecting pieces and the size of a gap between the electric connecting pieces and the circumferential direction of the connector.

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of electrical elements, in particular to a transmission line module and an electromagnetic compatibility processing method.

[ background of the invention ]

With the development of the existing terminal equipment, transmission line connection needs to carry transmission with higher frequency and higher speed, and the increase of the used frequency band and bandwidth and the increase of the integration level of the terminal equipment bring more electromagnetic compatibility problems (such as electromagnetic interference (EMI), electromagnetic leakage and scattering influence other transmission links).

The transmission line is provided with a transmission member (e.g., FPC, PCB) and a connector for connecting the transmission member. The shielding effects of the connectors of different connector manufacturers are different, and the consistency of the shielding effects on the same product is difficult to realize. The existing connector and transmission component are difficult to achieve various indexes of electromagnetic compatibility with higher frequency and wider bandwidth, and the electromagnetic compatibility problem is difficult to solve by changing the design of the existing connector and transmission component.

Therefore, it is desirable to provide a transmission line module and an electromagnetic compatibility processing method.

[ summary of the invention ]

The invention aims to provide a transmission line module and an electromagnetic compatibility processing method, and aims to solve the technical problem that the existing connector and transmission component are difficult to achieve various indexes of electromagnetic compatibility with higher frequency and wider bandwidth.

In order to solve the technical problems, the first technical scheme adopted by the invention is as follows:

a transmission line module comprises a first circuit board, a second circuit board and a connector for connecting the first circuit board and the second circuit board;

the transmission line module further includes an electrical connector electrically connecting the ground plane of the first circuit board and the ground plane of the second circuit board.

In order to solve the technical problems, the invention adopts the following technical scheme:

an electromagnetic compatibility processing method applied to a transmission line structure including a first circuit board, a second circuit board, and a connector connecting the first circuit board and the second circuit board, the method having the steps of:

electrically connecting the ground layer of the first circuit board and the ground layer of the second circuit board by an electrical connector.

The invention has the beneficial effects that: the ground layer of the first circuit board is electrically connected with the ground layer of the second circuit board through the electric connecting piece, and the electromagnetic compatibility of the transmission line structure of the connector of different connector manufacturers can be obviously improved under the conditions that the design of the existing connector, the design of the first circuit board and the second circuit board, the connecting position and the connecting mode between the existing connector and the first circuit board and the second circuit board and other factors are not changed, so that the selection space of the connector is larger and more flexible; and the electric connector is flexible in design and easy to process.

[ description of the drawings ]

Fig. 1 is a schematic diagram illustrating a positional relationship between a first circuit board, a second circuit board, a connector and an electrical connector in a transmission line module according to a first embodiment;

3 FIG. 32 3 is 3 a 3 sectional 3 view 3 taken 3 along 3 line 3 A 3- 3 A 3 of 3 FIG. 31 3; 3

FIG. 3 is a schematic view of the electrical connection being remotely located from the RF port set;

fig. 4 is a schematic diagram illustrating a positional relationship among the first circuit board, the second circuit board, the connector, and the electrical connector in the transmission line module according to the second embodiment;

FIG. 5 is a sectional view taken along line B-B of FIG. 4;

fig. 6 is a schematic view showing a positional relationship among the first circuit board, the second circuit board, the connector, and the electrical connector in the transmission line module according to the third embodiment;

FIG. 7 is a side view of FIG. 6;

fig. 8 is a schematic diagram illustrating a positional relationship among the first circuit board, the second circuit board, the connector, and the electrical connector in the transmission line module according to the fourth embodiment;

fig. 9 is a schematic diagram illustrating a positional relationship between the first circuit board, the second circuit board, the connector and the electrical connector in the transmission line module according to the fifth embodiment;

FIG. 10 is a graph of the isolation contrast between links;

fig. 11 is a connection diagram of a corresponding link one and a link two in fig. 10.

[ detailed description ] embodiments

The invention is further described with reference to the following figures and embodiments.

The transmission line module provided by the embodiment is used for improving the electromagnetic compatibility of the transmission line structure. Referring to fig. 1 to 9, the transmission line module of the present embodiment includes a first circuit board 10, a second circuit board 20, and a connector 30 connecting the first circuit board 10 and the second circuit board 20, so as to implement signal transmission between the first circuit board 10 and the second circuit board 20. The first circuit board 10 is a PCB or FPC. The second circuit board 20 is a PCB or FPC. That is, the first circuit board 10 and the second circuit board 20 may be both PCBs or both FPCs or one of the PCBs and FPCs, respectively. In this embodiment, the first circuit board 10 is an FPC, the second circuit board 20 is a PCB, and both the first circuit board 10 and the second circuit board 20 include at least one ground layer. The first circuit board 10 and the second circuit board 20 are provided with male or female terminals of the connector 30, respectively. That is, the first circuit board 10 is provided with a male connector and the second circuit board 20 is provided with a female connector, or the first circuit board 10 is provided with a female connector and the second circuit board 20 is provided with a male connector. The male and female connectors are connected to form a connector 30 to enable signals to be transmitted between the first circuit board 10 and the second circuit board 20. Further, the connector 30 includes at least one group of rf transmission port groups, each group of rf transmission ports includes a first rf transmission port 11 electrically connected to the first circuit board 10 and a second rf transmission port 21 electrically connected to the second circuit board 20, and the connector 30 realizes signal transmission between the first circuit board 10 and the second circuit board 20 through the first rf transmission port 11 and the second rf transmission port 21. Specifically, the male/female connector is connected to the rf signal line of the first circuit board 10 through the first rf transmission port 11, and the male/female connector is connected to the rf signal line of the second circuit board 20 through the second rf transmission port 21. The type of the connector 30 may be any as long as it can realize transmission of signals between the first circuit board 10 and the second circuit board 20.

Referring to fig. 1 and 9, a transmission line module further includes electrical connectors 100, 200, 300, 400, 500, wherein the electrical connectors 100, 200, 300, 400, 500 electrically connect the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20. The ground layer of the first circuit board 10 and the ground layer of the second circuit board 20 are electrically connected through the electric connectors 100, 200, 300, 400 and 500, so that the electromagnetic compatibility of the transmission line structure of the connector 30 manufactured by different connectors 30 can be obviously improved under the conditions that the design of the existing connector 30, the design of the first circuit board 10 and the design of the second circuit board 20 are not changed, the connection position and the connection mode between the existing connector 30 and the first circuit board 10 and the second circuit board 20 are not changed, the selection space of the connector 30 is larger and more flexible, and the defect that the shielding effects of different connectors 30 are uneven can be overcome under the condition that the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20 are electrically connected through the electric connectors 100, 200, 300, 400 and 500.

Specifically, the electrical connectors 100, 200, 300, 400, 500 are located circumferentially of the connector 30 with a gap from the connector 30. The electrical connectors 100, 200, 300, 400, 500 have connection terminals formed thereon. The electrical connectors 100, 200, 300, 400, 500 are electrically connected with the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20 through connection terminals to achieve electrical connection between the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20. In this embodiment, the connection terminals and the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20 may be connected by soldering or plugging. Further, the electrical connector 100, 200, 300, 400, 500 is made of a conductive material or the electrical connector 100, 200, 300, 400, 500 has a conductive portion electrically connecting the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20, the conductive portion being made of a conductive material. The conductive material can be conductive metal material and alloy thereof, composite metal material, conductive plastic, conductive rubber, conductive fiber fabric, conductive paint, conductive adhesive, transparent conductive film, electronic conductive high molecular material and ionic conductive high molecular material. The outer side of the conductive part can be wrapped with an insulating layer or a shielding layer so as to separate the conductive part from the outside.

Further, the electrical connectors 100, 200, 300, 400, 500 are disposed proximate to the set of rf transmission ports. Specifically, the connector 30 circumferentially has a circumferential side wall having a first side wall section 31 closest to the radio frequency transmission port group and a second side wall section 32 next to the radio frequency transmission port group, and the outsides of the first side wall section 31 and/or the second side wall section 32 are oppositely provided with the electrical connectors 100, 200, 300, 400, 500. Namely, the first sidewall section 31 is provided with the electrical connectors 100, 200, 300, 400, 500 on the outside thereof, or the second sidewall section 32 is provided with the electrical connectors 100, 200, 300, 400, 500 on the outside thereof, or the first sidewall section 31 and the second sidewall section 32 are provided with the electrical connectors 100, 200, 300, 400, 500 on the outside thereof.

Further, adjacent electrical connectors 100, 200, 300, 400, 500 are integrally connected. The adjacent electrical connectors 100, 200, 300, 400, 500 may be proximate to two electrical connectors 100, 200, 300, 400, 500 of the same radio frequency transmission port group, the two electrical connectors 100, 200, 300, 400, 500 being located outside of the first and second sidewall sections 31, 32, respectively; the adjacent electrical connectors 100, 200, 300, 400, 500 may also be two electrical connectors 100, 200, 300, 400, 500 respectively adjacent to different sets of rf transmission ports. It is understood that in other embodiments, adjacent electrical connectors 100, 200, 300, 400, 500 may be separately disposed without being connected to each other.

The present invention is further illustrated by the following specific embodiments.

The following is an embodiment one:

referring to fig. 1 and 2 together, in the present embodiment, the first circuit board 10 includes a first body 12 and a first end 13 connected to the connector 30. The second circuit board 20 includes a second body 22 and a second end 23 connected with the connector 30. A male/female connector is provided on first end 13 for connection with a female/male connector on second end 23 to form connector 30. The first end 13 and the second end 23 are parallel and opposite to each other and are connected by a connector 30. In this embodiment, the connector 30 includes two rf transmission port sets. The first rf transmission port 11 and the second rf transmission port 21 are disposed opposite to each other. The circumferential side wall of the connector 30 has a rectangular cylindrical surface. Both sets of rf transmission ports are located near a side wall section of the same connector 30, i.e. the side wall section is the first side wall section 31. Specifically, the number of electrical connectors 100 is two and corresponds to two rf transmission port sets one by one, and the two electrical connectors 100 are located between the first end 13 and the second end 23 and spaced apart from the connector 30. The two electrical connectors 100 are integrally connected. The first sidewall section 31 is disposed opposite the first body 12, and the electrical connector 100 is located between the first body 12 and the first sidewall section 31.

Further, the number of the electrical connectors 100 is one, two, or more than two. The shape of the electrical connector 100 may be arbitrary. In the present embodiment, the number of the electrical connector 100 is one. The electrical connector 100 is plate-shaped and parallel to the first side 31. The left and right ends of electrical connector 100 project outwardly of the plane of the corresponding second sidewall section 32. The upper and lower ends of the electrical connector 100 are electrically connected to the ground layer of the first circuit board 10 and the ground layer of the second circuit board 20, respectively.

For comparison, the electrical connector 100 is disposed near the rf transmission port set, and a comparative example is provided in this embodiment, as shown in fig. 3, which is a schematic diagram of the electrical connector 100 disposed far from the rf transmission port set. Fig. 3 differs from fig. 1 only in the position of the electrical connector 100. The electrical connector 100 of fig. 3 is positioned remotely from the rf transmission port set as an arrangement of the electrical connector 100, but the arrangement shown in fig. 3 is less preferred than the arrangement of the electrical connector 100 of fig. 1 and 2 that is positioned remotely from the rf transmission port set.

The following is embodiment two:

referring to fig. 4 and 5, a transmission line module according to a first embodiment of the present invention includes: electrical connector 200 is disposed outside of second sidewall section 32. Specifically, the circumferential side wall of the connector 30 has a rectangular cylindrical surface. The connector 30 includes two sets of rf transmission ports. Both sets of rf transmission ports are located close to the side wall section of the same connector 30, i.e. the first side wall section 31. Each rf transmission port group corresponds to a sidewall segment next to it, i.e., the sidewall segment is the second sidewall segment 32. Therefore, in the present embodiment, the number of the electrical connectors 200 is two, and the two electrical connectors 200 are separately provided without being connected to each other. In the present embodiment, the electrical connector 200 is also plate-shaped. Two electrical connectors 200 are provided in a one-to-one correspondence with the two second sidewall sections 32. Further, the electrical connector 200 is parallel to the second sidewall section 32. Electrical connector 200 is located at one end of first sidewall section 31 and projects out of the plane of first sidewall section 31.

The following is the third embodiment:

referring to fig. 6 and 7 together, a transmission line module according to the first embodiment has the following features: the outer sides of the first and second side wall sections 31 and 32 are each provided with an electrical connector 300. Specifically, the circumferential side wall of the connector 30 has a rectangular cylindrical surface. The connector 30 includes two sets of rf transmission ports. Both sets of rf transmission ports are located near a side wall section of the same connector 30, i.e. the side wall section is the first side wall section 31. Each rf transmission port group corresponds to a sidewall segment next to it, i.e., the sidewall segment is the second sidewall segment 32. Therefore, in the present embodiment, the number of the electrical connectors 300 is four, the electrical connectors 300 corresponding to the same rf transmission port group are adjacent and connected as a whole, the two electrical connectors 300 corresponding to different rf transmission port groups on the same first sidewall section 31 are adjacent and connected as a whole, and the four electrical connectors 300 form a U-shaped groove.

The following is embodiment four:

as shown in fig. 8, a transmission line module is different from the transmission line module in the third embodiment in that: electrical connectors 400 are cylindrical in shape and adjacent electrical connectors 400 are individually positioned without interconnecting.

The following is embodiment five:

as shown in fig. 9, a transmission line module is different from the transmission line module of the fourth embodiment in that: the electrical connector 500 is in the shape of a regular quadrangular prism.

Through test experiments, the transmission line module with the electric connecting piece has better electromagnetic compatibility. Some performance parameters are shown in tables 1 and 2, where table 1 is electromagnetic interference performance test data of the transmission line module 1 with or without the electrical connector in the first embodiment, and table 2 is radiation scattering performance test data of the transmission line module 1 with or without the electrical connector in the first embodiment.

In addition, fig. 10 is a graph showing a contrast of the isolation between the transmission line module 1 and the standard antenna 3. The curves 1 and 2 are isolation curves between the first rf transmission port 11 of the transmission line module 1 and the standard antenna 3, the curves 3 and 4 are isolation curves between the second rf transmission port 21 of the transmission line module 1 and the standard antenna 3, the transmission line module 1 is not provided with an electrical connector in the tests represented by the curves 2 and 4, and the transmission line module 1 is provided with an electrical connector in the tests represented by the curves 1 and 3. The test scheme is shown in fig. 11, in which the vector network analyzer 4 to the standard antenna 3 forms a link one 2, and the vector network analyzer 4 to the transmission line module 1 forms a link two 5. As can be seen from fig. 10, the electrical connector is advantageous for improving the electromagnetic compatibility of the transmission line module 1.

TABLE 1

TABLE 2

The following is embodiment six:

an electromagnetic compatibility processing method is applied to a transmission line structure, and the transmission line structure comprises a first circuit board, a second circuit board and a connector for connecting the first circuit board and the second circuit board so as to realize signal transmission between the first circuit board and the second circuit board. The first circuit board is a PCB or FPC. The second circuit board is a PCB or FPC. That is, the first circuit board and the second circuit board may be both PCBs or both FPCs or one of the PCBs and FPCs, respectively. In this embodiment, the first circuit board is an FPC, and the second circuit board is a PCB, each of which includes at least one ground layer. The first circuit board and the second circuit board are respectively provided with a male head and a female head, and the connector is formed by connecting the male head with the female head. Namely, the first circuit board is provided with a male connector and the second circuit board is provided with a female connector, or the first circuit board is provided with a female connector and the second circuit board is provided with a male connector. The male head and the female head are connected to form a connector, so that signals can be transmitted between the first circuit board and the second circuit board. Furthermore, the connector comprises at least one group of radio frequency transmission port groups, each radio frequency transmission port group comprises a first radio frequency transmission port electrically connected with the first circuit board and a second radio frequency transmission port electrically connected with the second circuit board, and the connector realizes signal transmission between the first circuit board and the second circuit board through the first radio frequency transmission port and the second radio frequency transmission port. Specifically, the male/female head is connected to the first circuit board by connecting a first radio frequency transmission port, and the male/female head is connected to the second circuit board by connecting a second radio frequency transmission port. The connector type may be any as long as it can realize transmission of signals between the first circuit board and the second circuit board.

The method comprises the following steps:

the ground layer of the first circuit board and the ground layer of the second circuit board are electrically connected by an electrical connector. The ground layer of the first circuit board is electrically connected with the ground layer of the second circuit board through the electric connecting piece, the electromagnetic compatibility of the transmission line structure of the connector manufactured by different connector manufacturers can be obviously improved under the conditions that the design of the existing connector, the first circuit board and the second circuit board is not changed, the connecting position and the connecting mode between the existing connector and the first circuit board and between the existing connector and the second circuit board are not changed, the selection space of the connector is larger and more flexible, namely, under the condition that the ground layer of the first circuit board is electrically connected with the ground layer of the second circuit board through the electric connecting piece, the defect that the shielding effects of different connectors are uneven can be overcome.

Specifically, the electrical connector is located at the circumference of the connector with a gap therebetween. The electrical connector has a connection terminal formed thereon. The electric connector is electrically connected with the ground layer of the first circuit board and the ground layer of the second circuit board through the connecting terminal so as to realize the electric connection between the ground layer of the first circuit board and the ground layer of the second circuit board. In this embodiment, the connection terminal may be connected to the ground layer of the first circuit board and the ground layer of the second circuit board by soldering or plugging.

Further, the electrical connection member is made of a conductive material or the electrical connection member has a conductive portion that electrically connects the ground layer of the first circuit board and the ground layer of the second circuit board, the conductive portion being made of a conductive material. The conductive material can be conductive metal material and alloy thereof, composite metal material, conductive plastic, conductive rubber, conductive fiber fabric, conductive paint, conductive adhesive, transparent conductive film, electronic conductive high molecular material and ionic conductive high molecular material. The outer side of the conductive part can be wrapped with an insulating layer or a shielding layer so as to isolate the conductive part from the outside.

Further, the electrical connector is disposed proximate to the set of rf transmission ports. Specifically, the connector has a circumferential side wall in a circumferential direction, the circumferential side wall has a first side wall section closest to the radio frequency transmission port group and a second side wall section next to the radio frequency transmission port group, and the connector is oppositely arranged on the outer side of the first side wall section and/or the second side wall section. Namely, the connector is arranged on the outer side of the first side wall section, or the connector is arranged on the outer side of the second side wall section, or the connectors are arranged on the outer sides of the first side wall section and the second side wall section.

The method further comprises the following steps:

the electromagnetic compatibility of the transmission line structure is adjusted by changing one or more of the material, shape, number and position of the electric connecting piece and the size of a gap between the electric connecting piece and the connector in the circumferential direction.

The above are only embodiments of the present invention, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these are all within the scope of the present invention.