阅读说明：本技术 一种衬底研磨装置及其研磨方法 (Substrate grinding device and grinding method thereof ) 是由 严凯 卢海彬 其他发明人请求不公开姓名 于 2021-06-16 设计创作，主要内容包括：本发明公开了一种衬底研磨装置及其研磨方法,包括配液周转缸,配液周转缸砂液排出口连接小砂桶,小砂桶连接减薄机,减薄机砂液回流口连接小砂桶,小砂桶内设有液位感应器,配液周转缸砂液排出口通过第一管道连接小砂桶,第一管道上设有第一控制阀门,第一控制阀门和液位感应器之间电性连接,小砂桶连接第二管道,第二管道连接隔膜泵,隔膜泵的输出管道连接减薄机。采用容积量与减薄机完成一次作业所需砂液量呈整数倍关系的小砂桶循环加工,利用小砂桶加隔膜泵循环,每一份循环加工1盘晶片,每盘加工速率非常稳定,每盘加工后背粗基本一致同时加工效率得到很大提升。(The invention discloses a substrate grinding device and a grinding method thereof, and the substrate grinding device comprises a liquid preparation turnover cylinder, wherein a sand liquid discharge port of the liquid preparation turnover cylinder is connected with a small sand barrel, the small sand barrel is connected with a thinning machine, a sand liquid backflow port of the thinning machine is connected with the small sand barrel, a liquid level sensor is arranged in the small sand barrel, the sand liquid discharge port of the liquid preparation turnover cylinder is connected with the small sand barrel through a first pipeline, a first control valve is arranged on the first pipeline, the first control valve is electrically connected with the liquid level sensor, the small sand barrel is connected with a second pipeline, the second pipeline is connected with a diaphragm pump, and an output pipeline of the diaphragm pump is connected with the thinning machine. The small sand barrel is used for circularly processing the sand liquid required by one-time operation by adopting the volume and the thinning machine in integral multiple relation, the small sand barrel and the diaphragm pump are used for circulating, 1 disc of wafers are circularly processed in each part, the processing speed of each disc is very stable, the back of each disc of processed wafers is basically consistent in thickness, and the processing efficiency is greatly improved.)

1. The utility model provides a substrate grinder, a serial communication port, including joining in marriage liquid turnover jar, join in marriage liquid turnover jar sand liquid discharge port and connect little sand bucket, the attenuate machine is connected to little sand bucket, attenuate machine sand liquid backward flow mouth connects little sand bucket, be equipped with the liquid level inductor in the little sand bucket, join in marriage liquid turnover jar sand liquid discharge port and pass through first pipe connection little sand bucket, be equipped with first control flap on the first pipeline, electric connection between first control flap and the liquid level inductor, the second pipeline is connected to little sand bucket, the second pipe connection diaphragm pump, the output pipeline of diaphragm pump connects the attenuate machine.

2. The substrate grinding apparatus according to claim 1, wherein the volume of said liquid distribution turnover cylinder is larger than the volume of said small sand bucket, and the volume of said small sand channel is an integral multiple of the amount of sand liquid required for one operation of said thin-reducing machine.

3. The substrate grinding apparatus of claim 1, wherein the output pipeline comprises a main pipeline, and a first branch pipeline and a second branch pipeline connected with the main pipeline, the first branch pipeline is connected with the thinning machine, the second branch pipeline is connected with the waste sand liquid recycling bin, the first branch pipeline is provided with a second control valve, and the second branch pipeline is provided with a third control valve.

4. The substrate polishing apparatus according to claim 2, wherein the first control valve, the second control valve, and the third control valve are automatic valves.

5. The substrate polishing apparatus according to claim 1, wherein the diaphragm pump is fixedly installed on the thinner.

6. A substrate polishing apparatus according to claim 1, wherein the liquid-sand return port is connected to the small sand tank through a return pipe.

7. A substrate polishing apparatus according to claim 1, wherein the small sand tank is provided with stirring means for stirring the sand liquid in the small sand tank.

8. The substrate grinding apparatus of claim 1, further comprising a roughing mill fluid distribution turnover cylinder, wherein the roughing mill fluid distribution turnover cylinder sand fluid outlet is connected with the roughing mill, the roughing mill sand fluid outlet is connected with the fluid distribution turnover cylinder, the roughing mill fluid distribution turnover cylinder and the roughing mill are connected through a third pipe, and a peristaltic pump is mounted on the third pipe.

9. A polishing method of a substrate polishing apparatus, comprising:

s1: grinding and thinning liquid preparation: introducing the sand liquid into a liquid preparation turnover cylinder;

s2: liquid level sensing to complete liquid adding: the liquid level sensor controls the opening or closing of the automatic valve according to the amount of the sand liquid in the small sand barrel, and injects or stops injecting the sand liquid in the liquid distribution turnover cylinder into the small sand barrel;

s3: and (3) circular thinning processing: pumping the sand liquid in the small sand barrel to the thinning machine by the diaphragm pump, refluxing the sand liquid in the thinning process by a sand liquid reflux port of the thinning machine, and circularly thinning the sand liquid;

s4: recovering waste sand liquid: and after the circular thinning processing is finished, pumping the waste sand liquid in the small sand barrel to a waste sand liquid recycling bin by the diaphragm pump, and finishing the primary substrate thinning operation.

10. A polishing method of a substrate polishing apparatus, comprising:

s1: drawing coarse liquid preparation: the sand liquid completes liquid preparation in a coarse liquid preparation turnover cylinder;

s2: substrate rough drawing and grinding: pumping the sand liquid in the liquid preparation turnover cylinder to a roughing machine by a peristaltic pump, and roughing the substrate by the roughing machine;

s3: and (3) circularly thinning and processing the substrate: transferring the substrate subjected to rough grinding to a thinning machine, wherein the substrate circulating thinning processing at least comprises the following steps:

grinding and thinning liquid preparation: guiding the sand liquid processed by the roughing machine into a liquid preparation turnover cylinder;

liquid level sensing to complete liquid adding: the liquid level sensor controls the opening or closing of the automatic valve according to the amount of the sand liquid in the small sand barrel, and injects or stops injecting the sand liquid in the liquid distribution turnover cylinder into the small sand barrel;

and (3) circular thinning processing: pumping the sand liquid in the small sand barrel to the thinning machine by the diaphragm pump, refluxing the sand liquid in the thinning process by a sand liquid reflux port of the thinning machine, and circularly thinning the sand liquid;

s4: recovering waste sand liquid: and after the circular thinning processing is finished, pumping the waste sand liquid in the small sand barrel to a waste sand liquid recycling bin by the diaphragm pump.

Technical Field

The invention relates to a substrate grinding technology, in particular to a substrate grinding device and a grinding method thereof.

Background

Sapphire is an ideal LED chip material as a hard material. As an ideal material of the LED, the material has good stability, can maintain stability at high temperature, has the characteristics of high hardness, high melting point, good light transmittance, excellent thermal conductivity and electrical insulation, stable chemical properties and the like, and is widely applied to precision instruments and meters, windows and reflectors of lasers, semiconductor epitaxial substrate materials, insulated integrated chips and the like. The performance and quality of each device depend on the precision processing quality of the substrate surface, so sapphire is mainly used as an ideal substrate material in the market at present.

However, in the actual production process, the grinding and thinning processing respectively adopts a liquid preparation turnover cylinder, the manual workload of liquid preparation is large, in the grinding and thinning processing process, the volume of a circulating sand barrel (sand liquid amount: 40L-60L) with a motor of a grinding machine is large, a barrel of sand liquid is used for circularly processing a plurality of disks of wafers, the mixing amount of new sand liquid and old sand liquid is large, the speed of each disk is inconsistent, the rough consistency of the back in the processing is poor, the transmittance of the wafers and the reflectivity of rear-section products are directly influenced, and the like.

Disclosure of Invention

The invention provides a substrate grinding device and a grinding method thereof, which adopt small sand barrel circulation processing (replacing the processing of an original grinding and thinning machine with a circulation sand barrel (sand liquid amount: 40L-60L), and have the problem that the back of each disc is not consistent due to the continuous attenuation of the speed of each disc). The original barrel of sand liquid is divided into equal parts, a small sand barrel and a diaphragm pump are used for circulation, and 1 wafer is processed in each part of circulation. The processing speed of each disc is very stable, the thickness of the processed back of each disc is basically consistent, and the processing efficiency is greatly improved.

The technical scheme disclosed by the invention is as follows: the utility model provides a substrate grinder, including joining in marriage liquid turnover jar, join in marriage liquid turnover jar sand liquid discharge port and connect little sand bucket, the attenuate machine is connected to little sand bucket, the little sand bucket is connected to attenuate machine sand liquid backward flow mouth, be equipped with the liquid level inductor in the little sand bucket, join in marriage liquid turnover jar sand liquid discharge port and pass through first pipe connection little sand bucket, be equipped with first control flap on the first pipeline, electric connection between first control flap and the liquid level inductor, the second pipeline is connected to little sand bucket, the diaphragm pump is connected to the second pipe, the attenuate machine is connected to the output pipeline of diaphragm pump.

On the basis of the scheme, preferably, the volume of the liquid preparation turnover cylinder is larger than that of the small sand barrel, and the volume of the small sand through is integral multiple of the sand liquid amount required by the thinning machine for completing one-time operation.

Preferably, the volume of the liquid preparation turnover cylinder is at least 3 times or more than that of the small sand barrel.

On the basis of the scheme, as preferred, the output pipeline includes the trunk line and the first lateral conduit, the second lateral conduit that are connected with the trunk line, and the attenuate machine is connected to the first lateral conduit, and useless sand liquid recycling bin is connected to the second lateral conduit, installs the second control valve on the first lateral conduit, installs the third control valve on the second lateral conduit.

Preferably, the first control valve, the second control valve, and the third control valve are automatic valves.

In addition to the above, preferably, the diaphragm pump is fixedly mounted on the thinning machine.

On the basis of the scheme, preferably, the sand liquid return port is connected with the small sand barrel through a return pipe.

On the basis of the scheme, preferably, the small sand barrel is provided with a stirring device for stirring the sand liquid in the small sand barrel.

On the basis of the scheme, the system preferably further comprises a roughing mill liquid distribution turnover cylinder, a sand liquid outlet of the roughing mill liquid distribution turnover cylinder is connected with the roughing mill, a sand liquid outlet of the roughing mill is connected with the liquid distribution turnover cylinder, the roughing mill liquid distribution turnover cylinder and the roughing mill are connected through a third pipeline, and a peristaltic pump is mounted on the third pipeline.

The invention also provides a grinding method of the substrate grinding device, which comprises the following steps:

s1: grinding and thinning liquid preparation: introducing the sand liquid into a liquid preparation turnover cylinder;

s2: liquid level sensing to complete liquid adding: the liquid level sensor controls the opening or closing of the automatic valve according to the amount of the sand liquid in the small sand barrel, and injects or stops injecting the sand liquid in the liquid distribution turnover cylinder into the small sand barrel;

s3: and (3) circular thinning processing: pumping the sand liquid in the small sand barrel to the thinning machine by the diaphragm pump, refluxing the sand liquid in the thinning process by a sand liquid reflux port of the thinning machine, and circularly thinning the sand liquid;

s4: recovering waste sand liquid: and after the circular thinning processing is finished, pumping the waste sand liquid in the small sand barrel to a waste sand liquid recycling bin by the diaphragm pump, and finishing the primary substrate thinning operation.

The invention also provides another grinding method of the substrate grinding device, which comprises the following steps:

s1: drawing coarse liquid preparation: the sand liquid completes liquid preparation in a coarse liquid preparation turnover cylinder;

s2: substrate rough drawing and grinding: pumping the sand liquid in the liquid preparation turnover cylinder to a roughing machine by a peristaltic pump, and roughing the substrate by the roughing machine;

s3: and (3) circularly thinning and processing the substrate: transferring the substrate subjected to rough grinding to a thinning machine, wherein the substrate circulating thinning processing at least comprises the following steps:

s4: recovering waste sand liquid: and after the circular thinning processing is finished, pumping the waste sand liquid in the small sand barrel to a waste sand liquid recycling bin by the diaphragm pump.

Compared with the prior art, the invention has the following beneficial effects:

the grinding device adopts the small sand barrel for circular processing (the grinding and thinning machine replaces the original grinding and thinning machine with a circular sand barrel (the sand liquid amount is 40L-60L), and the problem of inconsistent back thickness of each plate caused by the continuous attenuation of the speed of each plate exists). The original barrel of sand liquid is divided into equal parts, a small sand barrel and a diaphragm pump are used for circulation, and 1 wafer is processed in each part of circulation. The processing speed of each disc is very stable, the thickness of the processed back of each disc is basically consistent, and the processing efficiency is greatly improved.

Drawings

FIG. 1 is a schematic structural diagram according to a first embodiment;

fig. 2 is a schematic structural diagram of the second embodiment.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.

As shown in figure 1 of the drawings, in which,

example one

(1) The grinder is changed into a small sand barrel which is provided with a motor and circulates by a diaphragm pump (sand liquid amount: 10-15L) instead of a sand barrel which is provided with a motor and circulates.

(2) Dividing the original sand liquid into 3-4 equal parts, and circularly processing a disc of wafer by thinning each sand liquid by using a diaphragm pump. Rotation speed of 10-30rpm, pressure of 10-30g/cm, speed of 0.8-4um/min, removal amount of 50-100um, and processing temperature of 18-25 ℃.

(3) And performing direct-current drawing after grinding and thinning are finished. Rotation speed of 10-20rpm, pressure of 10-30g/cm, removal amount of 5-20um and processing temperature of 18-25 ℃.

(4) After finishing the grinding and drawing, chamfering is carried out, the processing diameter is 100, the grinding speed is 5-8mm/sec, and the processing temperature is 18-25 ℃.

The grinding machine is changed into a small sand barrel (sand liquid amount: 10-15L) from a circulating sand barrel (sand liquid amount: 40-60L) with a motor by utilizing a diaphragm pump for circulation, a liquid preparation turnover cylinder and a waste sand recycling barrel are added, and an electromagnetic automatic valve and a liquid level sensor are utilized to realize an integrated thinning and processing circulating device; and (3) circulating flow: the attenuate joins in marriage the liquid picture and passes through automatic valve liquid feeding, and the liquid feeding is accomplished in the liquid level response, utilizes little sand bucket to add diaphragm pump circulation attenuate processing, and the processing is accomplished the back sand waste and is returned.

More specifically, as shown in figure 1,

the utility model provides a substrate grinder, is including joining in marriage liquid turnover cylinder 1, joins in marriage 1 sand liquid discharge port of liquid turnover cylinder and connect little sand bucket 2, and little sand bucket 2 is connected attenuate machine 3, and 3 sand liquid backward flow mouths of attenuate machine connect little sand bucket 2, and the volume of joining in marriage liquid turnover cylinder 1 is greater than the volume of little sand bucket 2, the volume of little sand logical 2 with attenuate machine accomplishes the integral multiple of the required sand liquid volume of one-time operation. Preferably, the volume of the liquid preparation turnover cylinder 1 is at least 3 times or more than that of the small sand barrel.

Be equipped with liquid level sensor 4 in the little sand bucket 2, join in marriage 1 sand liquid discharge port of liquid turnover jar and connect little sand bucket 2 through first pipeline 5, be equipped with first control flap 6 on the first pipeline 5, electric connection between first control flap 6 and the liquid level sensor 4.

The small sand barrel 2 is connected with a second pipeline 7, the second pipeline 7 is connected with a diaphragm pump 8, and an output pipeline of the diaphragm pump 8 is connected with the thinning machine 3.

The output pipeline comprises a main pipeline 9, a first branch pipeline 10 and a second branch pipeline 11, the first branch pipeline 10 is connected with the main pipeline, the thinning machine 3 is connected with the first branch pipeline 10, the second branch pipeline 11 is connected with a waste sand liquid recovery barrel 12, a second control valve 13 is installed on the first branch pipeline 10, and a third control valve 14 is installed on the second branch pipeline 11.

The first control valve 6, the second control valve 13, and the third control valve 14 are automatic valves.

The diaphragm pump 8 is fixedly arranged on the thinning machine 3.

The sand liquid return port is connected with the small sand barrel 2 through a return pipe 15.

The small sand barrel 2 is provided with a stirring device for stirring the sand liquid in the small sand barrel.

The grinding operation flow of the thinning machine is as follows:

s1: grinding and thinning liquid preparation: the sand liquid is led into a liquid preparation turnover cylinder 1;

s2: liquid level sensing to complete liquid adding: the liquid level sensor 4 controls the automatic valve to open or close according to the amount of the sand liquid in the small sand barrel 2, and injects or stops injecting the sand liquid in the liquid distribution turnover cylinder 1 into the small sand barrel 2;

s3: and (3) circular thinning processing: the diaphragm pump 8 pumps the sand liquid in the small sand barrel 2 to the thinning machine 3, the sand liquid in the thinning process flows back through a sand liquid backflow port of the thinning machine 3, and the sand liquid is circularly thinned;

s4: recovering waste sand liquid: after the circular thinning processing is finished, the diaphragm pump 8 pumps the waste sand liquid in the small sand poking 2 to the waste sand liquid recycling bin 12 to finish the primary substrate thinning operation.

Former equipment is improved to the circulating attenuate processing of little sand bucket from circulating sand bucket in area for every set of processing of attenuate all is by joining in marriage the leading-in new sand liquid of liquid turnover jar 1, and not used repeatedly, is vat sand before, and every bucket is used for processing a lot of if 5 batches, because new and old sand mixes, the speed that leads to next batch is different, leads to the staff to judge the process time of input according to the experience, low rule appears very easily, lead to scrapping, perhaps high rule, to repeat the operation, the main advantage of keg: the simple operation, every bucket only processes a batch, and every dish speed uniformity of attenuate processing is stable, and the thick uniformity of wafer back is stable, and little sand bucket adds diaphragm pump circular processing attenuate efficiency and promotes 20% simultaneously.

Example two

1. The grinding machine is changed into a small sand barrel (sand liquid amount: 10-15L) from a circulating sand barrel (sand liquid amount: 40-60L) with a motor by utilizing a diaphragm pump for circulation, a liquid preparation turnover cylinder and a waste sand recycling barrel are added, and an electromagnetic automatic valve and a liquid level sensor are utilized to realize an integrated thinning and processing circulating device; and (3) circulating flow: draw thick liquid map of joining in marriage drawing thick and passing through peristaltic pump direct current processing, the liquid is joined in marriage in the attenuate, through automatic valve liquid feeding, liquid level response accomplishes the liquid feeding, utilizes little sand bucket to add diaphragm pump circulation attenuate processing, and useless sand is retrieved.

(2) Grinding and thinning: placing the sorted wafers into a disc 85, placing the wafers into a planetary wheel of a grinding machine with the U surface of a material box facing upwards, rotating at 10-30rpm, pressure at 10-30g/cm2, speed at 0.8-4um/min, removing amount at 50-100um, processing temperature at 18-25 ℃, removing edge of the whole disc without edge breakage when the products are placed in the machine, and enabling TTV to be less than or equal to 3 um;

(3) grinding and coarse pulling: placing the thinned wafer in a planetary wheel of a grinder with the U-face of a material box upwards at the rotating speed of 10-20rpm and the pressure of 10-30g/cm, and removing the amount of 5-20um and the processing temperature of 18-25 ℃. The product is discharged from the machine, the whole disc has no broken edge and no scratch, and the TTV is less than or equal to 3 um; bow is less than or equal to 3 um.

More specifically, as shown in fig. 2, a roughing mill liquid distribution circulating cylinder 16 was added to the polishing apparatus according to the first example, a roughing mill liquid distribution circulating cylinder 16 was connected to a roughing mill 17 at a sand liquid discharge port, a roughing mill sand liquid discharge port was connected to the liquid distribution circulating cylinder 1, the roughing mill liquid distribution circulating cylinder 16 and the roughing mill 17 were connected to each other through a third pipe 18, and a peristaltic pump 19 was installed on the third pipe.

Grinding and thinning sand circulation operation flow:

s1: drawing coarse liquid preparation: the sand liquid completes the liquid preparation in the rough liquid preparation turnover cylinder 16;

s2: substrate rough drawing and grinding: the peristaltic pump 19 pumps the sand liquid in the liquid preparation turnover cylinder to the roughing machine 17, and the roughing machine 17 performs roughing grinding on the substrate;

s3: and (3) circularly thinning and processing the substrate: transferring the substrate subjected to rough grinding to a thinning machine 3, wherein the substrate circulating thinning processing at least comprises the following steps:

grinding and thinning liquid preparation: guiding the used sand liquid processed by the roughing mill into a liquid preparation turnover cylinder 1;

liquid level sensing to complete liquid adding: the liquid level sensor 4 controls the automatic valve to open or close according to the amount of the sand liquid in the small sand barrel 2, and injects or stops injecting the sand liquid in the liquid distribution turnover cylinder 1 into the small sand barrel 2;

and (3) circular thinning processing: the diaphragm pump 8 pumps the sand liquid in the small sand barrel 2 to the thinning machine 3, the sand liquid in the thinning process flows back through a sand liquid backflow port of the thinning machine 3, and the sand liquid is circularly thinned;

s4: recovering waste sand liquid: after the circular thinning processing is finished, the diaphragm pump 8 pumps the waste sand liquid in the small sand poking 2 to the waste sand liquid recycling bin 12.

The roughing mill 17 is always processed by using originally prepared new sand liquid, the liquid preparation turnover cylinder 1 temporarily stores the sand liquid processed by the roughing mill 17, and the small sand barrel 2 is utilized for operation, and only one-time preparation of the new liquid is needed. The problem of traditional draw thick machine and grind the attenuate machine and all need join in marriage liquid turnover jar alone, need carry out twice and join in marriage liquid, join in marriage new liquid volume greatly, extravagant raw and other materials, staff's intensity of labour is big is solved.

It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.