阅读说明：本技术 感光性树脂组合物、显示器隔壁结构物及显示装置 (Photosensitive resin composition, display partition wall structure and display device ) 是由 朴薛基 金勋植 安基熏 李在乙 于 2020-02-28 设计创作，主要内容包括：本发明提供感光性树脂组合物、由上述感光性树脂组合物制造的显示器隔壁结构物及包含上述显示器隔壁结构物的显示装置,上述隔壁形成用感光性树脂组合物的特征在于,包含(A)着色剂、(B)碱溶性树脂、(C)聚合性化合物、(D)光聚合引发剂和(E)溶剂,由上述感光性树脂组合物制造的固化膜在450nm以上470nm以下的波长中的最大透过率小于10％,在620nm以上660nm以下的波长中的最小透过率为30％以上。本发明的感光性树脂组合物提供在隔壁形成后的厚膜中防止形成逆锥形而容易制造具有有利于形成隔壁的顺锥形形状的隔壁,且有效阻挡蓝色光的效果。(The invention provides a photosensitive resin composition, a display partition wall structure manufactured by the photosensitive resin composition and a display device comprising the display partition wall structure, wherein the photosensitive resin composition for forming partition walls is characterized by comprising (A) a coloring agent, (B) an alkali-soluble resin, (C) a polymerizable compound, (D) a photopolymerization initiator and (E) a solvent, the maximum transmittance of a cured film manufactured by the photosensitive resin composition in the wavelength of 450nm to 470nm is less than 10%, and the minimum transmittance in the wavelength of 620nm to 660nm is more than 30%. The photosensitive resin composition of the present invention prevents the formation of a reverse taper in a thick film after the formation of a partition wall, facilitates the production of a partition wall having a forward taper shape advantageous for the formation of a partition wall, and effectively blocks blue light.)

1. A photosensitive resin composition comprising (A) a colorant, (B) an alkali-soluble resin, (C) a polymerizable compound, (D) a photopolymerization initiator, and (E) a solvent,

the cured film produced from the photosensitive resin composition has a maximum transmittance of less than 10% at a wavelength of 450nm to 470nm and a minimum transmittance of 30% at a wavelength of 620nm to 660 nm.

2. The photosensitive resin composition according to claim 1, wherein when a maximum transmittance at a wavelength of 450nm to 470nm is defined as A and a minimum transmittance at a wavelength of 620nm to 660nm is defined as B, the ratio of the transmittance B to the transmittance A of the cured film is 10 or more.

3. The photosensitive resin composition according to claim 1, wherein the colorant (A) is at least one selected from the group consisting of C.I. pigment Red, C.I. pigment yellow and C.I. pigment orange.

4. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition is used for forming a partition wall of a display device using a blue light source.

5. The photosensitive resin composition according to claim 1, comprising, based on the total weight of solid components of the photosensitive resin composition:

1-30 wt% of the colorant (A);

20-70 wt% of the alkali-soluble resin (B);

5 to 50 wt% of the polymerizable compound (C);

0.01 to 10 wt% of a photopolymerization initiator; and

the photosensitive resin composition comprises (E) 60-90 wt% of a solvent based on the total weight of the photosensitive resin composition.

6. A partition structure for display devices, which is produced from the photosensitive resin composition according to any one of claims 1 to 5.

7. A display device comprising the display partition structure of claim 6.

Technical Field

The present invention relates to a photosensitive resin composition, a display partition wall structure manufactured by using the photosensitive resin composition, and a display device including the display partition wall structure.

Background

In general, in a display including a color conversion panel using a blue light source, in order to achieve light shielding characteristics for blue used as a light source and prevent color mixing of each color conversion pixel, a partition wall is formed between each color conversion pixel, and the thicknesses of the color conversion pixel and the partition wall are formed at a film thickness of about 7 μm to 15 μm due to the conversion efficiency of the color conversion pixel.

When a photosensitive resin composition for a Black Matrix (Black Matrix) which has been conventionally used is used for forming a partition wall of a display including a color conversion panel using a blue light source, the thickness of the partition wall to be formed exceeds the conventionally used thickness of 1 μm to 1.5 μm, and the thickness of the partition wall to be formed is 7 μm to 15 μm, so that the thickness to be formed is too large, and the tapered shape of the partition wall is difficult to form a cured film in a forward tapered shape, and the partition wall is formed in a reverse tapered shape. If the partition walls are formed in a reverse tapered shape, the contact area with the lower substrate is small, and thus there is a problem that the partition wall pattern is lost. Further, if the partition walls are formed by the conventional black matrix, coating is performed in the process and a pattern is formed by the exposure process, but there is a problem that it is difficult to recognize the Align key (alignment mark) positioned at the lower portion because the color is black in the exposure process and it is difficult to form the pattern at the correct position, so that there is a limitation in using the conventional black matrix material as the material for forming the partition walls.

In addition, in the conventional techniques, a technique for manufacturing a color filter after manufacturing a color photosensitive resin composition using c.i. pigment red, c.i. pigment yellow, c.i. pigment orange, and the like is generally used. In this case, the film thickness for manufacturing the color filter is generally about 2 μm to 3 μm. Further, in the color filter technology, a white light source is used as a light source, and the purpose is to represent light of a specific wavelength by combining with a color filter, and therefore, there is a difference from the present technology regarding brightness, color coordinates, and the like.

Korean laid-open patent No. 10-2007-0094460 aims to provide a photosensitive resin composition for forming partition walls having excellent shape stability against heat, but in actuality, similarly to the above-mentioned problems, when partition walls are formed with a film thickness of about 7 to 15 μm, the problem that the thickness is too large and the tapered shape of the partition walls is not easily formed into a cured film in a forward tapered shape, but the partition walls are formed in a reverse tapered shape cannot be overcome.

Disclosure of Invention

Problems to be solved

In order to solve the above-described problems of the prior art, an object of the present invention is to provide a photosensitive resin composition which can prevent the formation of a reverse taper in a thick film after partition formation to facilitate the formation of a forward taper favorable for partition formation, and which can effectively block blue light to perform color conversion pixels, thereby improving the light emission characteristics of a display device including the color conversion pixels.

In addition, the present invention is directed to a display partition structure manufactured using the photosensitive resin composition and a display device including the display partition structure.

Means for solving the problems

The invention provides a photosensitive resin composition for forming a partition wall, which is characterized by comprising (A) a colorant, (B) an alkali-soluble resin, (C) a polymerizable compound, (D) a photopolymerization initiator and (E) a solvent, wherein a cured film produced from the photosensitive resin composition has a maximum transmittance of less than 10% at a wavelength of 450nm to 470nm and a minimum transmittance of 30% at a wavelength of 620nm to 660 nm.

In addition, the invention provides a display partition wall structure manufactured by the photosensitive resin composition.

In addition, the invention provides a display device comprising the display partition structure.

Effects of the invention

The photosensitive resin composition of the present invention prevents the formation of a reverse taper in a thick film after the formation of a partition wall, facilitates the production of a partition wall having a forward taper shape advantageous for the formation of a partition wall, and effectively blocks blue light.

Further, the above-mentioned photosensitive resin composition contains, as a colorant, at least one selected from the group consisting of c.i. Pigment Red (Pigment Red), c.i. Pigment Yellow (Pigment Yellow) and c.i. Pigment Orange (Pigment Orange), whereby the display partition wall structure manufactured from the photosensitive resin composition of the present invention can be formed of a Red color system. The partition wall structure for a red-based display can effectively absorb blue-based light and effectively transmit red-based light, and thus exhibits excellent light-shielding properties and provides an effect of improving light-emitting properties in a display device using a blue light source.

Drawings

FIG. 1 is a graph showing the transmittance spectra of cured films of patterns produced using the photosensitive resin compositions of example 1 and comparative example 1 of the present invention.

FIG. 2 is an image showing the cross section and the minimum pattern formation mask size of a cured film produced with a film thickness of 2 μm using the photosensitive resin compositions of examples 1 to 3 of the present invention and comparative example 1.

FIG. 3 is an image showing the cross section and the minimum pattern formation mask size of a cured film produced by using the photosensitive resin compositions of examples 1 to 3 of the present invention and comparative example 1 and having a film thickness of 10 μm.

FIG. 4 is a diagram showing a method for measuring the taper angle of the photosensitive resin compositions of examples 1 to 17 and comparative examples 1 to 5 of the present invention.

Detailed Description

The photosensitive resin composition for forming partition walls is characterized by comprising (A) a colorant, (B) an alkali-soluble resin, (C) a polymerizable compound, (D) a photopolymerization initiator and (E) a solvent, wherein the maximum transmittance of a cured film made of the photosensitive resin composition at a wavelength of 450nm to 470nm is less than 10%, and the minimum transmittance at a wavelength of 620nm to 660nm is 30% or more.

Preferably, the cured film produced from the photosensitive resin composition has a maximum transmittance of less than 8% at a wavelength of 450nm to 470nm, a minimum transmittance of 35% or more at a wavelength of 620nm to 660nm, more preferably a maximum transmittance of less than 5% at a wavelength of 450nm to 470nm, and a minimum transmittance of 40% or more at a wavelength of 620nm to 660nm, when the cured film has a thickness of 7 to 15 μm

In one embodiment, the cured film is characterized in that when a maximum transmittance at a wavelength of 450nm to 470nm is defined as a and a minimum transmittance at a wavelength of 620nm to 660nm is defined as B, a ratio of the transmittance B to the transmittance a is 10 or more, thereby providing advantages of facilitating blocking of blue color and facilitating recognition of alignment marks in an exposure process.

In the case where the cured film satisfies the specific transmittance condition in the specific wavelength range, blue-based light generated on the back surface can be effectively blocked, and thus, in a display device using a blue light source including the cured film as a partition wall structure, excellent light-shielding characteristics can be exhibited, and an effect of improving light-emitting characteristics can be provided.

The photosensitive resin composition of the present invention contains at least one of the group consisting of c.i. pigment red, c.i. pigment yellow and c.i. pigment orange as the colorant, and thus can form a partition structure of a red color system, thereby effectively blocking blue light.

The quantum dot display is technically different from a color filter which uses a white light source emitted from the rear surface and which transmits light of a specific wavelength to realize colors, in that quantum dots located in each pixel realize images by converting the light into each color by means of electricity or blue light, and a partition structure for the same blocks the blue light source on the rear surface and prevents color mixing of red, blue, and green light emitted from each pixel.

Further, the conventional partition wall structure is generally formed in black, and has a problem that a cured film having a tapered shape is not easily formed when a thick film is formed, and a reverse tapered shape is generated, and a problem that a positioning mark positioned at a lower portion is not easily recognized when a pattern is formed, and it is difficult to form a pattern at a correct position, and thus there is a limitation in a material used for forming the partition wall structure.

In the present invention, the term "forward taper" means a taper angle of 90 ° or less, and the term "reverse taper" means a taper angle of more than 90 °.

The display device of the present invention comprises a display partition wall structure manufactured by using the photosensitive resin composition, and thus, the light emitting characteristics of the display device can be improved.

In addition, the photosensitive resin composition of the present invention has an advantage that a red partition structure is formed, and when a cured film is formed as a thick film later, a reverse taper can be prevented from being formed, and thus a forward taper can be easily formed.

In the thus formed forward tapered partition wall structure, the aperture ratio (aperturn) can be increased as the taper angle is increased. The taper angle is preferably 50 ° to 90 °, more preferably 70 ° to 90 °.

The present invention will be described in detail below.

< photosensitive resin composition >

The photosensitive resin composition of the present invention includes (a) a colorant, (B) an alkali-soluble resin, (C) a polymerizable compound, (D) a photopolymerization initiator, and (E) a solvent, and the colorant (a) may include one or more selected from the group consisting of c.i. Pigment Red (Pigment Red), c.i. Pigment Yellow (Pigment Yellow), and c.i. Pigment Orange (Pigment Orange).

The photosensitive resin composition of the present invention can be used for forming a partition wall of a display device using a blue light source.

(A) Coloring agent

The colorant may include one or more selected from the group consisting of c.i. pigment red, c.i. pigment yellow, and c.i. pigment orange, and thus, the display partition wall structure manufactured from the photosensitive resin composition of the present invention may be formed in a red color system. The red-based display partition wall structure can absorb blue-based light and transmit red-based light, thereby exhibiting excellent light-shielding properties and improving light-emitting properties in a display device using a blue light source.

The c.i. pigment red may be one or more selected from the group consisting of c.i. pigment red 9, 97, 81, 105, 122, 123, 144, 149, 150, 155, 166, 168, 171, 175, 176, 177, 179, 180, 185, 192, 202, 208, 209, 214, 215, 216, 220, 222, 224, 242, 254, 255, 264, 269, 270 and 272,

the c.i. pigment yellow may be one or more selected from the group consisting of c.i. pigment yellow 11, 13, 20, 24, 31, 53, 83, 86, 93, 94, 95, 99, 108, 109, 110, 117, 125, 128, 129, 138, 139, 147, 148, 150, 151, 154, 155, 166, 167, 173, 180, 185, and 199,

the c.i. pigment orange may be one or more selected from the group consisting of c.i. pigment orange 13, 15, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65 and 71.

Preferably, the above c.i. pigment red may be one or more selected from the group consisting of c.i. pigment red 177, 179, 254, 264 and 269,

the c.i. pigment yellow may be one or more selected from the group consisting of c.i. pigment yellow 138, 139, 150 and 185,

the c.i. pigment orange may be one or more selected from the group consisting of c.i. pigment oranges 64 and 71.

Furthermore, the present invention has the following features: even if the black colorant is not contained, it can have an effect of effectively blocking light of a blue system. For this reason, the above colorant of the present invention preferably does not contain a black colorant, but may contain up to 20% by weight relative to the total weight of the colorant, if necessary. If the colorant contains the black colorant in an excessive amount, inverse taper may occur due to insufficient deep curing in the exposure step, and the light emission efficiency of the display may be lowered due to a decrease in reflectance, which is not preferable. Specifically, the black colorant may include black organic/inorganic pigments (pigments) such as carbon black, titanium black, aniline black, lactam black, and perylene black, and dyes (Dye), and may be understood to include a concept of a combination in which black can be expressed by including a plurality of colorants.

The content of the colorant may be 1 to 30% by weight, preferably 3 to 20% by weight, based on the total weight of the solid content in the photosensitive resin composition. When the content of the colorant is within the above range, the light-shielding property with respect to blue light can be improved, and the light-emitting property of the display device can be improved.

In one embodiment, the colorant may include one or more selected from the group consisting of the c.i. Pigment Red (Pigment Red), the c.i. Pigment Yellow (Pigment Yellow), and the c.i. Pigment Orange (Pigment Orange), and the c.i. Pigment Red (Pigment Red) may be included in an amount of 50 wt% or more based on the total weight of the colorant. When the content of the c.i. Pigment Red (Pigment Red) is within the above range, the transmittance at a wavelength of 660nm or more is high, and the alignment mark located at the lower portion is easily recognized in the exposure step, which is preferable.

In the present invention, the total weight of the solid components in the photosensitive resin composition means the total weight of the remaining components excluding the solvent of the photosensitive resin composition.

(B) Alkali soluble resin

The alkali-soluble resin has reactivity and alkali solubility by the action of light or heat, functions as a dispersion medium for solid components such as the colorant, and a resin known in the art can be selectively used without particular limitation as long as the resin functions as a binder resin.

Specifically, the alkali-soluble resin is preferably a copolymer of an unsaturated carboxyl group-containing monomer and another monomer copolymerizable therewith.

Examples of the unsaturated carboxyl group-containing monomer include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated tricarboxylic acids, and the like having one or more carboxyl groups in the molecule, and examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, α -chloroacrylic acid, cinnamic acid, and the like. The carboxyl group-containing monomers may be used singly or in combination of two or more.

Examples of the other monomer copolymerizable with the carboxyl group-containing monomer include aromatic vinyl compounds; unsaturated carboxylic acid esters; unsaturated carboxylic acid aminoalkyl esters; unsaturated carboxylic acid glycidyl esters; vinyl carboxylates; unsaturated ethers; a vinyl cyanide compound; unsaturated amides; unsaturated imides; aliphatic conjugated dienes; and macromonomers having a monoacryloyl group or a monomethacryloyl group at the end of a branched polymer chain, such as polystyrene, polymethyl acrylate, polymethyl methacrylate, poly-n-butyl acrylate, poly-n-butyl methacrylate, or polysiloxane. These monomers may be used either individually or as a mixture of two or more thereof.

In one embodiment, the alkali-soluble resin may be a copolymer represented by the following chemical formula 1.

[ chemical formula 1]

In the chemical formula 1 described above,

x is a group represented by the following chemical formula 2,

y is a residue obtained by excluding a carboxylic anhydride group (-CO-O-CO-) from a dicarboxylic anhydride contained in maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride or glutaric anhydride,

z is a residue obtained by excluding two carboxylic anhydride groups from tetracarboxylic dianhydrides such as pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, and biphenyl ether tetracarboxylic dianhydride.

[ chemical formula 2]

In chemical formula 2, is a bond.

The alkali-soluble resin may be contained in an amount of 20 to 70 wt%, preferably 30 to 60 wt%, based on the total weight of solid components in the photosensitive resin composition. When the content of the alkali-soluble resin is within the above range, the solubility in a developer is sufficient, a cured film is easily formed, and the film is prevented from decreasing in the pixel portion of the exposed portion during development, and the peeling of the non-pixel portion is improved, which is preferable.

(C) Polymerizable compound

The polymerizable compound is a compound polymerizable by light and heat, and any polymerizable compound known in the art can be selected and used without particular limitation as long as it is polymerizable by light and heat, and specifically, a monofunctional monomer, a difunctional monomer, another polyfunctional monomer, and the like can be used.

The types of the monofunctional monomer, the difunctional monomer, and the polyfunctional monomer are not particularly limited, and examples of the polyfunctional monomer include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate, and dipentaerythritol hexa (meth) acrylate.

The content of the polymerizable compound may be 5 to 50% by weight, preferably 10 to 40% by weight, based on the total weight of the solid content in the photosensitive resin composition. When the content of the polymerizable compound is within the above range, it is preferable from the viewpoint of the strength and smoothness of the pixel portion.

(D) Photopolymerization initiator

The photopolymerization initiator may be selected from those known in the art without particular limitation. For example, acetophenone, benzophenone, triazine, thioxanthone, oxime, benzoin, and bisimidazole compounds can be used.

For example, o-ethoxycarbonyl- α -oxyimino-1-phenylpropan-1-one and the like can be used as the oxime compound, and typical examples of commercially available products include OXE-01 and OXE-02 from Ciba, Inc.

The photopolymerization initiators may be used singly or in combination of two or more.

The content of the photopolymerization initiator may be 0.01 to 10% by weight, preferably 0.01 to 5% by weight, based on the total weight of the solid components in the photosensitive resin composition. When the content of the photopolymerization initiator is within the above range, the photopolymerization reaction rate is preferably high, so that the increase of the overall process time is prevented, and the deterioration of the physical properties of the final cured film due to the photoreaction is prevented.

The photosensitive resin composition of the present invention may further contain a photopolymerization initiator in addition to the photopolymerization initiator. When the photopolymerization initiator and the photopolymerization initiation aid are used together, the photosensitive resin composition is preferably used because it has higher sensitivity and higher productivity.

The photopolymerization initiation assistant is a compound used for promoting polymerization of a polymerizable compound whose polymerization is initiated by the photopolymerization initiator, and preferably one or more compounds selected from the group consisting of amine and carboxylic acid compounds can be used.

The content of the photopolymerization initiation assistant is usually more than 0 mol and 10 mol or less, and preferably 0.01 mol to 5 mol per 1 mol of the photopolymerization initiator. When the content of the photopolymerization initiation aid is within the above range, the photopolymerization efficiency is improved and the effect of improving productivity can be expected.

(E) Solvent(s)

The solvent is not particularly limited, and various organic solvents known in the field of photosensitive resin compositions can be used.

From the viewpoint of coating properties and drying properties, the solvent is preferably an organic solvent having a boiling point of 100 to 200 ℃, more preferably an ester such as alkylene glycol alkyl ether acetate, a ketone, ethyl 3-ethoxypropionate, or methyl 3-ethoxypropionate, and even more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, or methyl 3-ethoxypropionate. The solvents mentioned above may be used each alone or in combination of two or more.

The content of the solvent may be 60 to 90% by weight, preferably 70 to 85% by weight, based on the total weight of the photosensitive resin composition. When the content of the solvent is within the above content range, it is preferable to perform coating using a coating device such as a roll coater, a spin coater, a slit coater (also referred to as a die coater), or an ink jet printer because the effect of improving coating properties is provided.

Thermal curing agent

The photosensitive resin composition of the present invention may further contain a thermal curing agent as needed, and when the photosensitive resin composition further contains the thermal curing agent, the deep curing of the cured product or the mechanical strength of the cured product can be improved when the cured product is formed from the photosensitive resin composition.

The thermal curing agent may be selected from the group consisting of a monofunctional alicyclic epoxy resin, a silane-modified epoxy resin, and a novolac-type epoxy resin, for example.

The content of the thermosetting agent may be 0.05 to 10% by weight, preferably 0.1 to 10% by weight, based on the total weight of the solid content in the photosensitive resin composition. In the case where the content of the thermal curing agent is within the above range, there is an advantage that chemical resistance becomes excellent, and heat resistance and developing speed can be improved.

Additive agent

The photosensitive resin composition of the present invention may further contain an additive as needed, and the type of the additive may be determined according to the needs of the user, and the present invention is not particularly limited, and examples thereof include fillers, other polymer compounds, surfactants, adhesion promoters, antioxidants, and anti-gelling agents.

The antioxidant may include one or more selected from the group consisting of a phosphorus antioxidant, a sulfur antioxidant, and a phenol antioxidant, and in this case, it is possible to suppress a color change phenomenon that may occur at a high temperature in a process or yellowing that may occur due to a light source after display manufacturing. The antioxidant may include one or more selected from the group consisting of a phenolic compound, a phosphorus compound, and a sulfur compound, and they may be used in combination of a phenolic-phosphorus compound, a phenolic-sulfur compound, a phosphorus-sulfur compound, or a phenolic-phosphorus-sulfur compound.

The content of the antioxidant may be 0.1 to 30% by weight, preferably 0.5 to 20% by weight, based on the total weight of the solid content in the photosensitive resin composition. When the content of the antioxidant is within the above range, the antioxidant is preferable in view of solving the problem of reduction in emission intensity, and has an advantage that aging due to heat is prevented at the time of after-baking in the step of forming a cured product, and an effect of maintaining color can be expected.

The additives not contained in the above-mentioned additives may be added to the composition as needed by those skilled in the art within a range not impairing the effects of the present invention. For example, the additive may be used in an amount of 0.05 to 10 wt%, preferably 0.1 to 10 wt%, more preferably 0.1 to 5 wt% based on the total weight of the photosensitive resin composition, but is not limited thereto.

The photosensitive resin composition of the present invention can be produced by a general method known in the art, and the present invention is not particularly limited, and can be produced by the following method as an example.

The colorant is mixed with a solvent in advance, and dispersed by a bead mill or the like until the average particle diameter of the colorant becomes 200nm or less. In this case, a pigment dispersant may be used as needed, and a part or the whole of the alkali-soluble resin may be blended. To the obtained dispersion, the remaining alkali-soluble resin, polymerizable compound, and photopolymerization initiator are added, and if necessary, an additive is added, and then a solvent is further added if necessary so as to have a predetermined concentration, thereby obtaining the desired photosensitive resin composition.

< display partition wall Structure and display device >

In addition, the present invention provides a display partition wall structure comprising a color conversion panel produced from the photosensitive resin composition of the present invention and a display device comprising the display partition wall structure.

A display including a color conversion panel forms an image by driving each pixel, and thus a thin film transistor for driving each pixel is formed, an insulating film based on the shape of the transistor is further formed, and then a color conversion panel partition structure for distinguishing a pixel from a pixel is formed. The photosensitive resin composition of the invention has the following advantages when used for forming a color conversion panel partition structure: color mixing of pixels of the display is prevented, and formation of a fine cured film is facilitated, whereby a high-quality image can be realized.

Examples of the display device include a liquid crystal display device, an organic light emitting diode, a flexible display, and the like, but the display device is not limited thereto, and any display device known in the art can be applied.

The color conversion panel partition wall structure can be produced by applying the photosensitive resin composition of the present invention described above to a substrate, and then performing photocuring and development to form a cured film.

First, the photosensitive resin composition of the present invention is applied to a substrate, and then heated and dried to remove volatile components such as a solvent, thereby obtaining a smooth cured film.

The coating method may be performed by spin coating, a flexible coating method, a roll coating method, slit spin coating, slit coating, or the like, for example. After the coating, the coating is dried by heating (prebaking) or drying under reduced pressure, and then volatile components such as a solvent are volatilized by heating. Wherein the heating temperature is usually 70-150 ℃, preferably 80-130 ℃. With respect to the cured film thus obtained, ultraviolet rays are irradiated through a mask for forming a cured film of a target pattern. In this case, it is preferable to use a mask aligner, a stepper, or the like so as to irradiate the entire exposure portion with uniform parallel light and to perform precise position alignment of the mask and the substrate. When ultraviolet rays are irradiated, the ultraviolet-irradiated portion is cured.

As the ultraviolet ray, g-line (wavelength: 436nm), h-line, i-line (wavelength: 365nm) and the like can be used. The dose of the ultraviolet ray irradiation may be appropriately selected according to need, and is not limited in the present invention. The cured film having been cured by light can be formed into a cured film shape of a desired pattern by bringing the cured film into contact with a developer to dissolve and develop the unexposed portion.

The cured film thus obtained can be formed into a hard cured film by a post-curing process, and the heating temperature is usually 150 to 250 ℃, preferably 180 to 230 ℃. The heating time is usually 5 to 30 minutes, preferably 15 to 20 minutes. The thickness of the cured film after the heat drying is usually about 7 to 15 μm.

The present invention will be described in more detail below with reference to examples, but the embodiments of the present invention disclosed below are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is shown in the claims, and all modifications within the meaning and range equivalent to the description of the claims are included. In the following examples and comparative examples, "%" and "part(s)" representing the content are based on mass unless otherwise mentioned.

Synthesis example 1: synthesis of alkali-soluble resin (B-1)

In a four-necked flask, 235g (epoxy equivalent weight 235g/eq) of a bisphenol fluorene type epoxy monomer represented by the following chemical formula 2-1, 110mg of tetramethylammonium chloride, 100mg of 2, 6-di-tert-butyl-4-methylphenol and 72.0g of acrylic acid were dissolved by heating at 90 ℃ to 100 ℃ while blowing air at a rate of 25 ml/min.

[ chemical formula 2-1]

Then, the solution was gradually heated to 120 ℃ in a cloudy state to be dissolved. At this time, stirring was continued while confirming that the solution gradually became transparent. Heating and stirring were continued for about 12 hours until the acid value was less than 1.0mgK 0H/g. Then, it was cooled to room temperature, to obtain a colorless transparent solid bisphenol fluorene type epoxy acrylate represented by the following chemical formula 1-1.

[ chemical formula 1-1]

Then, after dissolving 307.0g of bisphenol fluorene type epoxy acrylate obtained as above in 600g of propylene glycol monoethylether acetate (PGMEA), 80.5g of benzophenone tetracarboxylic dianhydride and 1g of tetraethylammonium bromide were mixed and reacted at 110 ℃ to 115 ℃ for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0g of 1,2,3, 6-tetrahydrophthalic anhydride was mixed and reacted at 90 ℃ for 6 hours to obtain a Cardo-based binder resin. At this time, disappearance of the acid anhydride group was confirmed by IR spectroscopy, and it was confirmed that the produced Cardo-based binder resin had a weight average molecular weight of 3,300g/mol and an acid value of 123 mgKOH/g.

Synthesis example 2: synthesis of alkali-soluble resin (B-2)

A flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen inlet tube was prepared. A mixture of 3, 4-epoxytricyclodecan-8-yl (meth) acrylate and 3, 4-epoxytricyclodecan-9-yl (meth) acrylate in a molar ratio of 50:50 (40 parts by weight), methyl methacrylate (50 parts by weight), acrylic acid (40 parts by weight), vinyl toluene (70 parts by weight), t-butylperoxy-2-ethylhexanoate (4 parts by weight), and Propylene Glycol Monomethyl Ether Acetate (PGMEA) (40 parts by weight) were added to a monomer dropping funnel and stirred. Here, a chain transfer agent dropping tank was prepared by adding 6 parts by weight of n-dodecanethiol and 24 parts by weight of PGMEA, and stirring. Then, 395 parts by weight of PGMEA was added to the flask, the atmosphere in the flask was replaced with nitrogen gas from the air, and the temperature of the flask was raised to 90 ℃ with stirring. Thereafter, dropwise addition of the monomer and the chain transfer agent was started. In the dropwise addition, the reaction was carried out for 2 hours while maintaining 90 ℃ and 1 hour, after which the temperature was raised to 110 ℃ and maintained for 5 hours, thereby obtaining a resin having a solid acid value of 100 mgKOH/g. The weight average molecular weight in terms of polystyrene measured by GPC was 17,000, and the molecular weight distribution (Mw/Mn) was 2.3.

The weight average molecular weight (Mw) of the alkali-soluble resin was measured by GPC using HLC-8120GPC (manufactured by Tosoh corporation).

As for the measurement conditions, TSK-GELG4000HXL and TSK-GELG2000HXL columns were used in series, and the column temperature was set to 40 ℃. Tetrahydrofuran was used as a mobile phase solvent, and the measurement was performed by flowing at a flow rate of 1.0 mL/min. The concentration of the measurement sample was 0.6 wt%, and the injection amount was 50. mu.L, and the analysis was performed using an RI detector. As the calibration STANDARD, TSK STANDARD POLYSTYRENE (STANDARD POLYSTYRENE) F-40, F-4, F-1, A-2500, A-500 (manufactured by Tosoh Co., Ltd.) was used, and the weight average molecular weight of the obtained alkali-soluble resin was measured under the above conditions.