阅读说明：本技术 电子部件装置 (Electronic component device ) 是由 加茂宣卓 于 2018-02-28 设计创作，主要内容包括：电子部件装置具有：框体,其由如果接收到放射线则产生电荷而使放射线的能量丧失的部件形成；以及电子部件,其收容于框体。上述部件是具有PN结的半导体元件部件。电子部件具有与电源连接的电源端子和与接地连接的接地端子。也可以是框体的第一部位与将电源和电源端子连结的电气路径连接,框体的第二部位与将接地和接地端子连结的电气路径连接。也可以还具有电源控制电路,该电源控制电路在大于或等于预先确定的判定值的大小的电流流过框体时,使从电源向电子部件供给的电源电压降低。(The electronic component device includes: a housing formed of a member that generates an electric charge if radiation is received and loses energy of the radiation; and an electronic component housed in the housing. The above-described component is a semiconductor element component having a PN junction. The electronic component has a power supply terminal connected to a power supply and a ground terminal connected to ground. The first portion of the housing may be connected to an electrical path connecting the power supply and the power supply terminal, and the second portion of the housing may be connected to an electrical path connecting the ground and the ground terminal. The electronic component may further include a power supply control circuit that reduces a power supply voltage supplied from the power supply to the electronic component when a current having a magnitude greater than or equal to a predetermined determination value flows through the housing.)

1. An electronic component device, comprising:

a frame body formed of a semiconductor element member having a PN junction; and

and an electronic component housed in the housing.

2. The electronic component device according to claim 1,

the electronic component has a power terminal connected to a power source and a ground terminal connected to a ground,

the first portion of the housing is connected to a first electrical path connecting the power supply and the power supply terminal,

the second portion of the frame is connected to a second electrical path connecting the ground and the ground terminal,

the electronic component device is configured in such a manner that, if the casing receives radiation, a short-circuit path is generated through which current flows to the ground via the power supply, the first portion, the surface of the casing, and the second portion.

3. The electronic component device according to claim 1,

the electronic component control apparatus further includes a power supply control circuit connected to a power supply of the electronic component, the power supply control circuit being configured to reduce a power supply voltage supplied from the power supply to the electronic component when a current having a magnitude larger than or equal to a predetermined determination value flows through the housing.

Technical Field

The present application relates to an electronic component device.

Background

Conventionally, as described in japanese patent application laid-open No. 63-305100, for example, a rigid solar cell array has been known to protect satellite-mounted equipment from damage such as radiation.

Patent document 1: japanese laid-open patent publication No. 63-305100

Disclosure of Invention

The space in the space or the space inside the nuclear reactor, which is the subject of the above-described conventional techniques, is a severe radiation environment. Electronic component devices used in these severe radiation environments have been developed. In an electronic component device used in a radiation environment, as a measure for preventing damage of components due to radiation irradiation, a circuit or the like for improving radiation resistance may be incorporated in each of the electronic components. However, in such a countermeasure, a special structure for coping with radiation must be added to each electronic component.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component device improved so as to improve radiation resistance of the entire electronic component device as easily as possible.

The electronic component device according to the present application includes: a frame body formed of a semiconductor element member having a PN junction; and an electronic component housed in the housing.

ADVANTAGEOUS EFFECTS OF INVENTION

Since the semiconductor element component having the PN junction can lose energy of radiation, the electronic components provided inside the housing can be collectively protected by the housing by forming the housing from the semiconductor element component having the PN junction. By designing the structure of the housing, radiation resistance of the entire electronic component device can be easily improved regardless of the structural measures of the respective electronic components.

Drawings

Fig. 1 is a schematic diagram showing an internal structure of an electronic component device according to an embodiment.

Fig. 2 is a schematic diagram showing an internal structure of an electronic component device according to a modification of the embodiment.

Fig. 3 is a schematic diagram showing an internal structure of an electronic component device according to a modification of the embodiment.

Fig. 4 is a schematic diagram showing an internal structure of an electronic component device according to a modification of the embodiment.

Detailed Description

Fig. 1 is a schematic diagram showing an internal structure of an electronic component device 10 according to an embodiment. The electronic component device 10 includes an outer frame 2, an inner frame 4 housed in the outer frame 2, a circuit board 5 housed in the inner frame 4, a plurality of electronic components 6 mounted on the circuit board 5, and a second power supply 3 provided so as to be positioned inside the outer frame 2 and outside the inner frame 4. The first power supply 1 is provided outside the outer frame 2.

The outer frame 2 covers all directions including the upper, lower, left, right, front, and rear directions of the inner frame 4. The shape of the outer frame 2 may be a cube, or may be any polyhedron or sphere in one example. The first power source 1 is connected to a predetermined first portion 2a of the outer frame 2. The predetermined second portion 2b of the outer housing 2 is connected to the ground GND. Inside the inner housing 4, the second power supply 3 is connected to a power supply terminal 6a of the electronic component 6. As a method of connecting the second power supply 3 and the power supply terminal 6a, various power supply lines such as power supply wiring or lead lines on the circuit board 5 can be used. The circuit ground 5a of the circuit board 5 is connected to the ground GND via the second portion 2b of the outer frame 2. The ground terminal 6b of the electronic component 6 is connected to the ground GND via a ground wiring of the circuit board 5. The material of the inner frame 4 may be iron or metal such as aluminum.

The electronic component 6 includes functional components for various applications used in a space environment or a severe radiation environment. The electronic component 6 includes a semiconductor substrate, and a semiconductor active element such as an FET, a passive element such as a capacitor, and wiring are provided on the semiconductor substrate.

If the radiation 40 directly enters the electronic component 6, it may pass through various structures included in the electronic component 6 and reach the semiconductor substrate. As one example, various structures are a passivation film, a source field plate, a channel layer, a buffer layer, and the like formed over a semiconductor substrate. The radiation 40 is specifically a particle radiation. Particle radiation is heavy particles, protons, electrons, neutrons, muons, etc., and they have energies of about 1keV to 100 GeV. A large number of electron-hole pairs are generated at the periphery of the trajectory through which the radiation 40 passes. If no radiation measures are taken, the electron-hole pairs generated in the electronic components 6 damage or degrade the semiconductor by causing large damage to it during diffusion, drift, recombination, annihilation within the device.

In this regard, the outer housing 2 is formed of "a member which, if the radiation 40 is received, generates an electric charge to lose the energy of the radiation 40". The outer housing 2 can shield the radiation 40 from the inner housing 4 in all directions including up, down, left, right, front, and rear. The electronic components 6 can be protected from the radiation 40 by the outer housing 2. Further, if a short circuit between the first power supply 1 and the ground GND occurs in accordance with the generation of electric charges when the radiation 40 is injected, a current I as schematically shown in fig. 1 flows₁。

The member constituting the outer frame 2 is a semiconductor element member having a PN junction. In this case, the entire outer surface of the electronic component device 10 can be covered with the semiconductor element component having the PN junction. When radiation 40 is irradiated to a semiconductor element member having a PN junction, the radiation 40 loses energy while generating electric charges. The semiconductor element part having a PN junction may also be a solar cell panel or a diode. The semiconductor material may be Si or a compound semiconductor such as GaAs. Si has an advantage of being inexpensive as compared with a compound semiconductor or the like. Since the equipment used in the space generally includes the solar panel for power generation, the solar panel of the outer housing 2 may be used for power generation when the electronic component device 10 is assumed to be used in the space. Since the solar cell panel also has an advantage that it is relatively easy to manufacture a large area, the outer frame 2 can be easily formed into a certain size.

The radiation 40 loses energy while generating electric charges in the process of passing through the outer frame 2 constructed by the above-described members. Therefore, since it is possible to suppress serious damage of the electronic component 6 by the particle radiation having high energy, the electronic component 6 provided inside the outer frame 2 can be protected.

The provision of the outer housing 2 also has an advantage that the radiation 40 resistance of the entire electronic component device 10 can be improved regardless of the structural measures of the electronic components 6. If the advantage is described, for example, when the electronic component 6 is a compound semiconductor device, there is a countermeasure for adding a special circuit to the FET to improve the endurance. However, the electric characteristics of the electronic component 6 may be degraded by taking measures to add a special circuit, which has a disadvantage that a compromise between reliability and electric characteristics is required. In this regard, according to the above-described embodiment, since it is not necessary to take a countermeasure against the radiation 40 for each electronic component 6, a general component which does not take a countermeasure against radiation irradiation can be used as the electronic component 6. Therefore, in the countermeasure method according to the embodiment, the electronic components 6 inside are not limited, and various electronic components 6 can be mounted.

In addition, as a modification, the inner frame 4 may be formed of a PN junction semiconductor member as in the outer frame 2 described above, and in this case, the outer frame 2 may be formed of a metal material such as iron or aluminum. In this case, the electronic components 6 housed in the inner housing 4 can be reliably protected from the radiation 40. One or both of the outer frame 2 and the inner frame 4 may be formed of a semiconductor element member having a PN junction.

Fig. 2 is a schematic diagram illustrating an internal structure of an electronic component device 110 according to a modification of the embodiment. In the modification of fig. 2, the second power supply 3 of fig. 1 is omitted, and the first power supply 1 is connected to the power supply terminal 6a of the electronic component 6 via the wiring 13.

The power supply terminal 6a of the electronic component 6 is connected to the first power supply 1. The first portion 2a of the outer frame 2 is connected to the wiring 13. Thereby, the first portion 2a is connected to a first electrical path connecting the first power supply 1 and the power supply terminal 6 a. The second portion 2b of the outer frame 2 is connected to a circuit ground 5a of the circuit board 5. Thus, the second portion 2b is connected to a second electrical path connecting the ground GND and the ground terminal 6 b.

Some of the radiation 40 may enter the inside of the outer housing 2 while avoiding energy attenuation by the outer housing 2. By electrically connecting the outer frame 2 and the inner frame 4 in parallel, a short-circuit path can be created that short-circuits the first power supply 1 and the ground GND when the radiation 40 is irradiated. The short-circuit path is to make the current I₁A path that flows to the ground GND via the first power source 1, the first portion 2a, the surface of the outer housing 2, and the second portion 2 b. If a short circuit occurs between the first power supply 1 and the ground GND when the radiation 40 is injected, a current I flows as shown in fig. 2₁Therefore, the voltage applied to the electronic component 6 can be reduced or eliminated. By sufficiently suppressing the supply of power to the electronic component 6, it is possible to create a situation in which the electronic component 6 is not easily damaged even when the radiation 40 is irradiated.

If a short circuit occurs in response to all the radiations 40, the operation of the electronic component device 110 may be frequently hindered. Therefore, from the viewpoint of protecting the electronic component 6, it is preferable to set the threshold of the radiation amount at which the short circuit occurs so that the short circuit between the first power supply 1 and the ground GND is less likely to occur at a radiation amount that can be tolerated. Preferably, the outer frame 2 is constructed in such a manner that if radiation 40 exceeding the threshold value of the radiation amount is injected into the outer frame 2, the power supply from the first power supply 1 to the electronic component 6 is reduced to a predetermined power supply suppression level or lower.

Fig. 3 is a schematic diagram of an internal structure of an electronic component device 210 according to a modification of the embodiment. The ammeter 20 and the power supply control circuit 22 are housed in the outer case 2. The power supply control circuit 22 is connected to the second power supply 3. It is conceivable to mount a commonly used integrated circuit for power supply voltage detection and control. For example, if a known low power consumption voltage detector is used, an integrated circuit corresponding to a voltage drop amount of the outer housing 2, that is, a voltage to be detected can be selected. The integrated circuit can detect a decrease in the power supply voltage and transmit a signal notifying that the voltage has decreased to another integrated circuit connected thereto. By using such a component, a control circuit can be constructed which monitors the power supply voltage of the outer housing 2, and transmits a signal to the power supply of the electronic component device 110 at the time point when the voltage has decreased, so that the voltage is decreased and the electronic component can be prevented from being damaged.

If a short circuit occurs between the first power supply 1 and the ground GND when the radiation 40 is injected, a current I flows as shown in fig. 3₁. The power supply control circuit 22 is constructed in such a manner that the current I at a magnitude greater than or equal to a predetermined determination value₁When the current flows through the outer housing 2, the power supply voltage supplied from the second power supply 3 to the electronic component 6 is reduced. Specifically, the ammeter 20 can supply the current I flowing through the outer housing 2₁And (6) detecting. The power supply control circuit 22 determines the current I detected by the ammeter 20₁Whether or not it is greater than or equal to the determination value. The power supply control circuit 22 detects the current I₁When the power is equal to or greater than the determination value, the power supply power supplied to the electronic component 6 is reduced to a predetermined power level.

Some of the radiation 40 may enter the inside of the outer housing 2 while avoiding energy attenuation by the outer housing 2. If the resistance of the outer frame 2 is detected, the state of irradiation of the radiation 40 to the outer frame 2 can be detected. The power supply control circuit 22 can reduce the voltage of the second power supply 3 when radiation 40 outside the allowable range is irradiated thereto by detecting a change in resistance of the outer housing 2. Thus, even when a part of the radiation 40 that has entered the inside of the outer housing 2 reaches the electronic component 6, the power supply voltage of the electronic component 6 can be sufficiently reduced, and the electronic component 6 can be reliably protected. The amount of decrease in the voltage of the second power supply 3 may be determined in advance, and may be decreased at a rate of about 20% from the normal operating voltage, for example.

Fig. 4 is a schematic diagram showing an internal structure of an electronic component device 310 according to a modification of the embodiment. In the electronic component device 10 according to embodiment 1, the inner housing 4 may be omitted and only the outer housing 2 may be used as the housing.

Description of the reference numerals

1 first power supply

2 outer frame

2a first part

2b second site

3 second power supply

4 inner frame

5 Circuit board

5a circuit ground

6 electronic component

6a power supply terminal

6b ground terminal

10. 110, 210, 310 electronic component device

13 wire harness

20 current meter

22 power supply control circuit

40 rays