Inverter with a voltage regulator
阅读说明:本技术 逆变器 (Inverter with a voltage regulator ) 是由 田岛豊 于 2019-02-13 设计创作,主要内容包括:提供小型化、轻量化以及低成本化的逆变器。在逆变器(1000)中,第一汇流条电极(1022)使平滑电容器(1020)的第一电极(1081)与半导体功率模块(1021)电连接。而且,第二汇流条电极(1023)使平滑电容器(1020)的第二电极(1082)与半导体功率模块(1021)电连接。半导体功率模块(1021)与第一电极(1081)分开第一距离(L1)、与第二电极(1082)分开第二距离(L2)。第二距离(L2)比第一距离(L1)长。第二汇流条电极(1023)的侧壁部(1120)沿着平滑电容器(1020)的侧面。第二汇流条电极(1023)的底部(1121)与平滑电容器(1020)的第二电极(1082)接触。侧壁部(1120)的收纳空间(1140)收纳平滑电容器(1020)。(Provided is an inverter which is reduced in size, weight, and cost. In an inverter (1000), a first bus bar electrode (1022) electrically connects a first electrode (1081) of a smoothing capacitor (1020) and a semiconductor power module (1021). The second bus bar electrode (1023) electrically connects the second electrode (1082) of the smoothing capacitor (1020) and the semiconductor power module (1021). The semiconductor power module (1021) is separated from the first electrode (1081) by a first distance (L1) and from the second electrode (1082) by a second distance (L2). The second distance (L2) is longer than the first distance (L1). The side wall portion (1120) of the second bus bar electrode (1023) is along the side surface of the smoothing capacitor (1020). A bottom portion (1121) of the second bus bar electrode (1023) is in contact with a second electrode (1082) of the smoothing capacitor (1020). The storage space (1140) of the side wall (1120) stores the smoothing capacitor (1020).)
1. An inverter, comprising:
a smoothing capacitor that smoothes a direct current, the smoothing capacitor including a capacitor having one end, another end, and a side surface extending from the one end to the another end, a first electrode disposed at the one end, and a second electrode disposed at the another end;
a semiconductor power module that generates an alternating current by switching a direct current, the semiconductor power module being separated from the first electrode by a first distance and separated from the second electrode by a second distance, the semiconductor power module being disposed at a position where the second distance is longer than the first distance;
a first bus bar electrode electrically connecting the first electrode with the semiconductor power module; and
and a second bus bar electrode electrically connecting the second electrode and the semiconductor power module, the second bus bar electrode including a side wall portion having a housing space and a bottom end, the side wall portion being along the side surface, and a bottom portion disposed at the bottom end and contacting the second electrode, the smoothing capacitor being housed in the housing space.
2. The inverter according to claim 1,
the smoothing capacitor is provided with a plurality of the capacitors electrically connected in parallel,
the second bus bar electrode further includes a partition plate that partitions the housing space into a plurality of blocks that house the plurality of capacitors, respectively.
3. The inverter according to claim 1 or 2,
the inverter further includes:
a case that houses the smoothing capacitor and the semiconductor power module; and
an electrically insulating material, which is preferably a metal,
the second bus bar electrode is fixed to the case with the electrical insulating material interposed therebetween.
4. The inverter according to claim 3,
the housing is provided with a cooler which is provided with a cooler,
the first bus bar electrode and the second bus bar electrode are fixed to the cooler with the electrical insulating material interposed therebetween.
5. The inverter according to claim 1 or 2,
the inverter further includes:
a case that houses the smoothing capacitor and the semiconductor power module;
a cooler fixed to the housing; and
an electrically insulating material, which is preferably a metal,
the first bus bar electrode and the second bus bar electrode are fixed to the cooler with the electrical insulating material interposed therebetween.
Technical Field
The present invention relates to an inverter. The present application is based on japanese patent application No. 2018-029517, filed on 22/2/2018. This application claims priority to this application. The contents of which are incorporated by reference in their entirety in this application.
Background
Conventionally, a power conversion device includes a capacitor module and a bus bar connected to the capacitor module. For example, in the power conversion device described in japanese patent application laid-open No. 2015-167428, the positive terminal of the capacitor module and the positive power terminal of the semiconductor module are connected to the positive bus bar. The negative terminal of the capacitor module and the negative power terminal of the semiconductor module are connected to a negative bus bar.
In the capacitor module, the positive electrode plate is connected to one electrode of the plurality of capacitor elements. The negative electrode plate is connected to the other electrode of the plurality of capacitor elements. A portion of the positive electrode plate becomes the positive terminal. A portion of the negative electrode plate becomes a negative terminal. Each capacitor element is a thin film capacitor.
In the capacitor module, the plurality of capacitor elements are sealed by the sealing member and are accommodated in the capacitor case.
Patent document 1: japanese patent laid-open publication No. 2015-
Disclosure of Invention
Problems to be solved by the invention
In the power conversion device described in japanese patent application laid-open No. 2015-167428, a plurality of capacitor elements are sealed by a sealing member and are accommodated in a capacitor case. Therefore, a space for disposing the sealing member and the capacitor case is required. Further, the inverter may become heavy corresponding to the weight of the sealing member and the capacitor case. Moreover, the cost of the inverter may increase corresponding to the cost of the sealing member and the capacitor case. Therefore, it is difficult to reduce the size, weight, and cost of the inverter.
In view of the above problems, an object of the present invention is to provide an inverter that is small in size, light in weight, and low in cost.
Means for solving the problems
An exemplary embodiment of the present invention is directed to an inverter.
The inverter includes a smoothing capacitor, a semiconductor power module, a first bus bar electrode, and a second bus bar electrode.
The smoothing capacitor smoothes the direct current. The smoothing capacitor has one end, the other end, and a side surface. The side extends from one end to the other. The smoothing capacitor includes a first electrode and a second electrode. The first electrode is configured at one end. The second electrode is configured at the other end.
The semiconductor power module switches a direct current to generate an alternating current. The semiconductor power module is separated from the first electrode by a first distance and from the second electrode by a second distance. The semiconductor power module is disposed at a position such that the second distance is longer than the first position.
The first bus bar electrode electrically connects the first electrode with the semiconductor power module.
The second bus bar electrode electrically connects the second electrode with the semiconductor power module.
The second bus bar electrode includes a sidewall portion and a bottom portion. The side wall portion has a receiving space and a bottom end, and is along a side surface of the smoothing capacitor. The bottom is arranged at the bottom end and is contacted with the second electrode. The housing space houses the smoothing capacitor.
Effects of the invention
According to an exemplary embodiment of the present invention, the smoothing capacitor provided in the inverter is housed in the second bus bar electrode for electrical connection. Therefore, the number of components for housing the smoothing capacitor can be reduced. Therefore, an inverter that is small, light, and low in cost can be provided.
Drawings
Fig. 1 is a block diagram schematically illustrating an inverter of the first embodiment.
Fig. 2 is a plan view schematically illustrating a smoothing capacitor, a first bus bar electrode, a second bus bar electrode, and a semiconductor power module provided in the inverter according to the first embodiment.
Fig. 3 is a perspective view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment.
Fig. 4 is a perspective view schematically illustrating a state in which the front end portions of the first bus bar electrode and the second bus bar electrode are omitted from the smoothing capacitor, the first bus bar electrode, and the second bus bar electrode provided in the inverter of the first embodiment.
Fig. 5 is a plan view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment.
Fig. 6 is a cross-sectional view schematically illustrating a smoothing capacitor and a second bus bar electrode provided in the inverter of the first embodiment.
Fig. 7 is a cross-sectional view schematically illustrating the second bus bar electrode, the case, and the electrical insulating material provided in the inverter according to the first embodiment.
Fig. 8 is a cross-sectional view schematically illustrating the first bus bar electrode, the second bus bar electrode, the cooler, and the electrical insulating material provided in the inverter according to the first embodiment.
Fig. 9 is a perspective view schematically illustrating a smoothing capacitor provided in an inverter according to a modification of the first embodiment.
Fig. 10 is a perspective view schematically illustrating a second bus bar electrode provided in an inverter according to a modification of the first embodiment.
Fig. 11 is a perspective view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in an inverter according to a modification of the first embodiment.
Fig. 12 is a perspective view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in an inverter according to a modification of the first embodiment.
Fig. 13 is a cross-sectional view schematically illustrating a smoothing capacitor and a second bus bar electrode provided in an inverter according to a modification of the first embodiment.
Fig. 14 is a sectional view schematically illustrating the structure of the comparison object.
Detailed Description
1 first embodiment
1.1 overview of the inverter
A first exemplary embodiment of the present invention relates to an inverter.
Fig. 1 is a block diagram schematically illustrating an inverter of the first embodiment.
The inverter 1000 illustrated in fig. 1 is an inverter device that operates as a power conversion device that converts direct current into three-phase alternating current. The dc power and a control signal are input to the inverter 1000. The inverter 1000 smoothes an input dc current and generates a three-phase ac current by switching the smoothed dc current in accordance with an input control signal. The generated three-phase alternating current is output from the inverter 1000. The output three-phase alternating current is supplied to the motor. The generated three-phase alternating current may be supplied to a load other than the motor. Inverter 1000 may generate an alternating current other than a three-phase alternating current. For example, the inverter 1000 may also generate a single-phase alternating current.
The inverter 1000 includes a smoothing
The semiconductor power module 1021 generates an alternating current by switching the smoothed direct current in accordance with a control signal input to the inverter 1000.
The two bus bar electrodes composed of the first bus bar electrode 1022 and the second
1.2 Structure of smoothing capacitor, first bus bar electrode, second bus bar electrode, and semiconductor Power Module
Fig. 2 is a plan view schematically illustrating a smoothing capacitor, a semiconductor power module, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment. Fig. 3 is a perspective view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment. Fig. 4 is a perspective view schematically illustrating a state in which the front end portions of the first bus bar electrode and the second bus bar electrode are omitted from the smoothing capacitor, the first bus bar electrode, and the second bus bar electrode provided in the inverter of the first embodiment. Fig. 5 is a plan view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment. Fig. 6 is a cross-sectional view schematically illustrating a smoothing capacitor, a first bus bar electrode, and a second bus bar electrode provided in the inverter according to the first embodiment.
The smoothing
The semiconductor power module 1021 is separated from the first electrode 1081 by a first distance L1 and from the second electrode 1082 by a second distance L2. The semiconductor power module 1021 is arranged such that the second distance L2 is longer than the first distance L1. Therefore, the first electrode 1081 is one end electrode located at a side close to the semiconductor power module 1021. The second electrode 1082 is the other end electrode located on the side away from the semiconductor power module 1021.
The first bus bar electrode 1022 electrically connects the first electrode 1081 with the semiconductor power module 1021. The first bus bar electrode 1022 is composed of a metal. The metal may be any one of a pure metal and an alloy.
The first bus bar electrode 1022 includes a plate-shaped portion 1100.
The plate-shaped portion 1100 is in contact with the first electrode 1081 and is connected to the first electrode 1081. The plate-shaped portion 1100 is connected to the first electrode 1081, and the plate-shaped portion 1100 is electrically connected to the first electrode 1081.
The first bus bar electrode 1022 further includes a first leading end portion 1101.
The first leading end portion 1101 is connected to the plate-like portion 1100. The first tip portion 1101 is connected to the plate-shaped portion 1100, and the first tip portion 1101 is electrically connected to the plate-shaped portion 1100.
The first front end portion 1101 is connected to a power module terminal of the semiconductor power module 1021. The first front end portion 1101 is connected to a power module terminal of the semiconductor power module 1021, and the first front end portion 1101 is electrically connected to the semiconductor power module 1021.
The plate-shaped portion 1100 is electrically connected to the first electrode 1081, the first front end portion 1101 is electrically connected to the plate-shaped portion 1100 and the semiconductor power module 1021, and the first electrode 1081 is electrically connected to the semiconductor power module 1021 via the plate-shaped portion 1100 and the first front end portion 1101.
The second
The second
The
The
Second
Second front end portion 1122 is connected to
Second front end portion 1122 is connected to a power module terminal of semiconductor power module 1021. Second front end portion 1122 is connected to a power module terminal of semiconductor power module 1021, and second front end portion 1122 is electrically connected to semiconductor power module 1021.
The
The second
The
The
1.3 advantages of the configuration in which the smoothing capacitor is housed in the second bus bar electrode
1.3.1 sequence
Hereinafter, the structure of the comparison object, the problem of the structure of the comparison object, and the advantage of the structure in which the smoothing
1.3.2 construction of comparison objects
In the structure of the comparison object schematically illustrated in fig. 14, the smoothing
The
One end of the
The smoothing
The first
The second
The first
1.3.3 problem points of the structure of the comparison object
In the structure to be compared, the smoothing
In the inverter, it is desirable to reduce the parasitic inductance of the bus bar electrode in order to reduce the surge voltage generated when the switching element performs switching. Therefore, it is desirable to adopt a configuration in which the bus bar electrodes on the high potential side and the low potential side are stacked in a state of being close to each other, and the directions of currents flowing through the bus bar electrodes on the high potential side and the low potential side are reversed from each other. With this configuration, magnetic fluxes generated by currents flowing in the bus bar electrodes on the high potential side and the low potential side cancel each other out. Therefore, the parasitic inductance of the bus bar electrode becomes small.
However, in the structure to be compared, the first
When the inverter operates, a current flows through the smoothing
1.3.4 advantages of the configuration in which the smoothing capacitor is housed in the second bus bar electrode
In the case of adopting a structure in which the smoothing
The second
In the case of the configuration in which the smoothing
In the configuration of the comparative subject, although currents flow in opposite directions to each other, two portions that are difficult to be laminated exist inside the
If the parasitic inductance can be reduced, the surge voltage is reduced. In the case where the surge voltage is reduced, the switching speed of the semiconductor element becomes fast. When the switching speed of the semiconductor element is increased, the switching loss of the semiconductor element is also reduced.
1.4 splitter plates
The first electrodes 1081 provided in the plurality of
Second
The
The
Since the second
1.5 fastening to the housing or the cooler
Hereinafter, an example in which the second
Fig. 7 is a cross-sectional view schematically illustrating the second bus bar electrode, the case, and the electrical insulating material provided in the inverter according to the first embodiment.
In the example illustrated in fig. 7, the inverter 1000 further includes a
The
Second
The smoothing
Fig. 8 is a cross-sectional view schematically illustrating the first bus bar electrode, the second bus bar electrode, the cooler, and the electrical insulating material provided in the inverter according to the first embodiment.
In the example illustrated in fig. 8, the inverter 1000 further includes a cooler 1201 illustrated in fig. 8 and an electrically insulating material 1202.
The cooler 1201 is included in the
First bus bar electrode 1022 and second
First bus bar electrode 1022 and second
First bus bar electrode 1022 and second
The smoothing
In an inverter, a smoothing capacitor may be increased in size in order to not only secure a required capacitance but also suppress a temperature rise associated with heat generation. That is, the capacitor may have a capacitance larger than that required for the smoothing capacitor. However, in the case where the smoothing
1.6 capacitor having rectangular parallelepiped shape
Fig. 9 is a perspective view schematically illustrating a smoothing capacitor provided in an inverter according to a modification of the first embodiment. Fig. 10 is a perspective view schematically illustrating a second bus bar electrode provided in an inverter according to a modification of the first embodiment. Fig. 11 is a perspective view schematically illustrating first bus bar electrodes, second bus bar electrodes, and a smoothing capacitor provided in an inverter according to a modification of the first embodiment.
The smoothing capacitor 1320, the first
The smoothing capacitor 1320 includes a capacitor 1340. The capacitor 1340 has a rectangular parallelepiped shape. The smoothing capacitor 1320 includes a capacitor body 1360, a first electrode 1361, and a second electrode 1362. The first electrode 1361 is a metallization electrode and is disposed at one end 1380 of the smoothing capacitor 1320. The second electrode 1362 is a metallization electrode and is disposed at the other end 1381 of the smoothing capacitor 1320.
The first
One end 1380 of the smoothing capacitor 1320 protrudes from the second
Fig. 12 is a perspective view schematically illustrating first bus bar electrodes, second bus bar electrodes, and a smoothing capacitor provided in an inverter according to a modification of the first embodiment. Fig. 13 is a cross-sectional view schematically illustrating the second bus bar electrodes and the smoothing capacitor provided in the inverter according to the modification of the first embodiment. Figure 13 illustrates a cross-section at the location of cutting line a-a of figure 12.
The smoothing capacitor 1420, the first bus bar electrode 1421, and the second bus bar electrode 1422 illustrated in fig. 12 and 13 can be used instead of the smoothing
The smoothing capacitor 1420 includes a plurality of capacitors 1440. A plurality of capacitors 1440 are electrically connected in parallel. Each of the capacitors 1440 has a rectangular parallelepiped shape.
The first bus bar electrode 1421 and the second bus bar electrode 1422 have the same features as the first bus bar electrode 1022 and the second
The present invention is not limited to the above embodiments, and various modifications can be made.
Description of the reference symbols
1000: an inverter; 1020: a smoothing capacitor; 1021: a semiconductor power module; 1022: a first bus bar electrode; 1023: a second bus bar electrode; 1040: a capacitor; 1081: a first electrode; 1082: a second electrode; 1120: a sidewall portion; 1121: a bottom; 1140: a storage space; 1141: a bottom side end; 1160: a partition plate; 1170: a block; 1180: a housing; 1181: an electrically insulating material; 1200: a housing; 1201: a cooler; 1202: an electrically insulating material; 1320: a smoothing capacitor; 1321: a first bus bar electrode; 1322: a second bus bar electrode; 1340: a capacitor; 1361: a first electrode; 1362: a second electrode; 1420: a smoothing capacitor; 1421: a first bus bar electrode; 1422: a second bus bar electrode.
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