阅读说明：本技术 用于ab类放大器的高级负载电流监测电路和方法 (Advanced load current monitoring circuit and method for class AB amplifiers ) 是由 杜如峰 李祥生 于 2020-03-03 设计创作，主要内容包括：本公开涉及用于AB类放大器的高级负载电流监测电路和方法。在实施例中,一种AB类放大器,包括：输出级,该输出级包括被配置为将被耦合至负载的一对半桥；以及电流感测电路,被耦合至所述一对半桥中的第一半桥。电流感测电路包括电阻元件、并且被配置为通过以下方式来感测流过负载的负载电流：反射流过第一半桥的第一晶体管的电流,以生成镜像电流,使镜像电流流过电阻元件,以及基于电阻元件的电压来感测负载电流。本公开还涉及一种数字输入AB类放大器,以及一种方法。(The present disclosure relates to advanced load current monitoring circuits and methods for class AB amplifiers. In an embodiment, a class AB amplifier comprises: an output stage comprising a pair of half bridges configured to be coupled to a load; and a current sensing circuit coupled to a first half bridge of the pair of half bridges. The current sensing circuit includes a resistive element and is configured to sense a load current flowing through the load by: the method includes mirroring a current flowing through a first transistor of a first half bridge to generate a mirror current, flowing the mirror current through a resistive element, and sensing a load current based on a voltage of the resistive element. The disclosure also relates to a digital input class AB amplifier, and a method.)

1. A class AB amplifier comprising:

an output stage comprising a pair of half bridges configured to be coupled to a load; and

a current sensing circuit coupled to a first half-bridge of the pair of half-bridges, the current sensing circuit including a resistive element and configured to sense a load current flowing through the load by:

mirroring the current flowing through the first transistor of the first half bridge to generate a mirror current,

causing the mirror current to flow through the resistive element, an

Sensing the load current based on a voltage of the resistive element.

2. The class AB amplifier of claim 1, wherein the current sensing circuit further comprises:

a second transistor having a control terminal coupled to an output of the first half bridge;

a third transistor having a control terminal coupled to a current path of the second transistor;

a sense transistor having a control terminal coupled to the control terminal of the first transistor and having a current path coupled to the current path of the third transistor; and

a current mirror coupled between the sense transistor and the resistive element, the current mirror configured to generate the mirrored current.

3. The class AB amplifier of claim 2 wherein the first transistor and the sense transistor are matched transistors.

4. The class AB amplifier of claim 3, wherein the first transistor has a first portion and a second portion disposed in the semiconductor substrate, and wherein the sense transistor is disposed between the first portion and the second portion.

5. The class AB amplifier of claim 4 wherein the first portion corresponds to a first half of the first transistor and the second portion corresponds to a second half of the first transistor.

6. The class AB amplifier of claim 2, wherein the current mirror comprises: a current mirror transistor configured to adjust a mirror ratio of the current mirror based on a control signal.

7. The class AB amplifier of claim 6, wherein said current sensing circuit further comprises:

a second current mirror coupled between the sense transistor and the current mirror, the second current mirror including a second current mirror transistor configured to adjust a mirror ratio of the second current mirror based on a second control signal.

8. The class AB amplifier of claim 1, further comprising: an analog-to-digital converter (ADC) configured to generate a digital signal based on the voltage of the resistive element.

9. The class AB amplifier of claim 8, further comprising:

a reference resistor; and

a reference current source configured to inject a reference current into the reference resistor to generate a reference voltage, wherein the ADC is configured to receive the reference voltage, wherein the resistive element comprises a first resistor, and wherein the first resistor and the reference resistor are matched resistors.

10. The class AB amplifier of claim 8, further comprising: a fully differential buffer coupled between the resistive element and the ADC, wherein the ADC is configured to receive a reference voltage, and wherein the fully differential buffer is configured to level shift the voltage of the resistive element to have a DC bias voltage substantially equal to a DC bias voltage of a comparator in the ADC, and wherein the DC bias voltage of a comparator in the ADC is based on the reference voltage.

11. The class AB amplifier of claim 8, further comprising: a digital core circuit configured to receive the digital signal from the ADC and configured to calculate a load impedance based on the digital signal.

12. The class AB amplifier of claim 8, further comprising: a digital core circuit configured to receive the digital signal from the ADC and configured to limit the load current based on the digital signal.

13. The class AB amplifier of claim 1, further comprising the load, wherein the load is an audio speaker coupling the pair of half-bridges.

14. The class AB amplifier of claim 1 wherein said first transistor is a low side transistor of said pair of half bridges.

15. The class AB amplifier of claim 1, wherein said resistive element comprises: a resistor having a resistance of 10 omega or higher.

16. A digital input class AB amplifier comprising:

an output stage comprising a pair of half bridges configured to be coupled to a load;

a digital communication interface configured to receive a data stream;

a digital core circuit;

a digital-to-analog converter (DAC);

a drive circuit configured to receive a signal from the DAC and to control the output stage based on the received signal;

a current sensing circuit coupled to a first half-bridge of the pair of half-bridges, the current sensing circuit including a resistive element and configured to sense a load current flowing through the load by:

mirroring the current flowing through the first transistor of the first half bridge to generate a mirror current,

causing the mirror current to flow through the resistive element, an

Sensing the load current based on a voltage of the resistive element; and

an analog-to-digital converter (ADC) coupled to the digital core circuit and configured to generate a digital signal based on the sensed load current.

17. The digital input class AB amplifier of claim 16, wherein said digital core circuit is configured to receive real-time load current data from said ADC.

18. The digital input class AB amplifier of claim 17, wherein said digital core circuit is further configured to transmit said real-time load current data to an external user via said digital communication interface.

19. The digital input class AB amplifier of claim 17, wherein the digital core circuit is further configured to calculate a load impedance of the load based on the real-time load current data.

20. The digital input class AB amplifier of claim 19, wherein said digital core circuit is further configured to transmit said load impedance via said digital communication interface.

21. The digital input class AB amplifier of claim 17, wherein the digital core circuit is further configured to limit the load current based on the real-time load current data.

22. The digital input class AB amplifier of claim 16, wherein said current sensing circuit further comprises:

a second transistor having a control terminal coupled to an output of the first half bridge;

a third transistor having a control terminal coupled to a current path of the second transistor;

a sense transistor having a control terminal coupled to the control terminal of the first transistor and having a current path coupled to the current path of the third transistor; and

a current mirror coupled between the sense transistor and the resistive element, the current mirror configured to generate the mirrored current.

23. The digital input class AB amplifier of claim 16, wherein said digital communication interface comprises inter-IC sound (I)²S) interface, wherein the data stream comprises an audio stream, and wherein the I²The S-interface is configured to receive the data stream.

24. A method, comprising:

driving a load with a class AB amplifier;

mirroring current flowing through a first transistor of an output stage of the class AB amplifier to generate a mirrored current;

causing the mirror current to flow through a resistive element; and

sensing a load current flowing through the load based on a voltage of the resistive element.

25. The method of claim 24, wherein the load is an audio speaker.

26. The method of claim 24, wherein the first transistor is a low-side transistor of the output stage.

27. The method of claim 24, wherein the resistive element comprises a resistor having a resistance of at least 10 Ω.

28. The method of claim 24, wherein the first transistor is a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET).

29. A digital input class AB amplifier comprising:

an output stage comprising a pair of half bridges configured to be coupled to an audio speaker;

a digital communication interface configured to receive an audio stream;

a digital core circuit;

a digital-to-analog converter (DAC);

a drive circuit configured to receive a signal from the DAC and to control the output stage based on the received signal;

a current sensing circuit comprising:

a second transistor having a control terminal coupled to an output of a first half-bridge of the pair of half-bridges;

a third transistor having a control terminal coupled to a current path of the second transistor;

a first sense transistor having a control terminal coupled to the control terminal of the first transistor of the first half bridge and having a current path coupled to the current path of the third transistor;

a first resistor;

a first current mirror coupled between the first sense transistor and the first resistor, the first current mirror configured to generate a first mirrored current through the first resistor;

a fourth transistor having a control terminal coupled to an output of a second half-bridge of the pair of half-bridges;

a fifth transistor having a control terminal coupled to a current path of the fourth transistor;

a second sense transistor having a control terminal coupled to the control terminal of the sixth transistor of the second half bridge and having a current path coupled to the current path of the fifth transistor;

a second resistor;

a second current mirror coupled between the second sense transistor and the second resistor, the second current mirror configured to generate a second mirrored current through the second resistor; and

an analog-to-digital converter (ADC) coupled to the first resistor and the second resistor, the ADC configured to generate a digital signal based on a voltage difference between a first node of the first resistor and a second node of the second resistor, wherein the digital core circuit is configured to estimate an impedance of the audio speaker based on the digital signal.

Technical Field

The present invention relates generally to an electronic system and method, and in particular embodiments, to an advanced load current monitoring circuit and method for a class AB amplifier.

Background

The power amplifiers are classified based on characteristics of the output stage. Specifically, the class is based on the proportion of each input cycle that the output device delivers current. Conventional class a amplifiers are simpler than class B and class AB amplifiers and use a single amplifying transistor that is biased so that it is always on. For differential class a amplifiers, the bias point is typically chosen to be equal to the maximum output current to allow amplification of the entire range of input signals.

A conventional class B amplifier uses two amplifying transistors, each operating for half a cycle in a push-pull configuration. Since the signals of each amplifying device do not overlap, class B amplifiers typically have high crossover distortion.

Conventional class AB amplifiers have a push-pull configuration that operates for more than half a cycle. To operate, class AB amplifiers use bias circuits that are typically more complex than the bias circuits of a class a or B amplifiers. The overlap helps reduce crossover distortion present in class B amplifiers at the expense of higher quiescent current.

Fig. 1 shows a conventional output stage 102 of a class AB audio power amplifier 100 for driving an audio speaker 106 and a load current sensor circuit 104 for sensing the load current flowing through the audio speaker 106. Fig. 2 shows a graph of impedance versus frequency for a typical 4 omega audio speaker.

Disclosure of Invention

According to an embodiment, a class AB amplifier comprises: an output stage comprising a pair of half bridges configured to be coupled to a load; and a current sensing circuit coupled to a first half bridge of the pair of half bridges. The current sensing circuit includes a resistive element and is configured to sense a load current flowing through the load by: the method includes mirroring a current flowing through a first transistor of a first half bridge to generate a mirror current, flowing the mirror current through a resistive element, and sensing a load current based on a voltage of the resistive element.

According to an embodiment, a digital input class AB amplifier comprises: an output stage comprising a pair of half bridges configured to be coupled to a load; a digital communication interface configured to receive a data stream; a digital core circuit; a digital-to-analog converter (DAC); a drive circuit configured to receive a signal from the DAC and configured to control the output stage based on the received signal; a current sensing circuit coupled to a first half-bridge of the pair of half-bridges, the current sensing circuit including a resistive element and configured to sense a load current flowing through the load by: mirroring a current flowing through a first transistor of a first half bridge to generate a mirror current, flowing the mirror current through a resistive element, and sensing a load current based on a voltage of the resistive element; and an analog-to-digital converter (ADC) coupled to the digital core circuit and configured to generate a digital signal based on the sensed load current.

According to an embodiment, a method comprises: driving a load with a class AB amplifier; mirroring a current flowing through a first transistor of an output stage of the class AB amplifier to generate a mirror current; causing the mirror current to flow through a resistive element; and sensing a load current flowing through the load based on the voltage of the resistive element.

According to an embodiment, a digital input class AB amplifier comprises: an output stage comprising a pair of half bridges configured to be coupled to an audio speaker; a digital communication interface configured to receive an audio stream; a digital core circuit; a DAC; a drive circuit configured to receive a signal from the DAC and to control the output stage based on the received signal; a current sensing circuit comprising: a second transistor having a control terminal coupled to an output of a first half-bridge of the pair of half-bridges; a third transistor having a control terminal coupled to the current path of the second transistor; a first sense transistor having a control terminal coupled to the control terminal of the first transistor of the first half bridge and having a current path coupled to the current path of the third transistor; a first resistor; a first current mirror coupled between the first sense transistor and the first resistor, the first current mirror configured to generate a first mirrored current flowing through the first resistor; a fourth transistor having a control terminal coupled to an output of a second half-bridge of the pair of half-bridges; a fifth transistor having a control terminal coupled to the current path of the fourth transistor; a second sense transistor having a control terminal coupled to the control terminal of the sixth transistor of the second half bridge and having a current path coupled to the current path of the fifth transistor; a second resistor; a second current mirror coupled between the second sense transistor and the second resistor, the second current mirror configured to generate a second mirrored current flowing through the second resistor; and an analog-to-digital converter (ADC) coupled to the first resistor and the second resistor, the ADC configured to generate a digital signal based on a voltage difference between a first node of the first resistor and a second node of the second resistor, wherein the digital core circuit is configured to estimate an impedance of the audio speaker based on the digital signal.

Drawings

For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a conventional output stage of a class AB audio power amplifier for driving an audio speaker, and a load current sensor circuit for sensing the load current flowing through the audio speaker;

fig. 2 shows a graph of impedance versus frequency for a typical 4 Ω audio speaker;

FIG. 3 shows a schematic diagram of a digital input class AB audio power amplifier according to an embodiment of the invention;

FIG. 4 shows a schematic diagram of the load current monitoring circuit of FIG. 3, in accordance with an embodiment of the present invention;

FIG. 5 illustrates a layout diagram of one power transistor and one sense transistor of the load current monitoring circuit of FIG. 4, in accordance with embodiments of the present invention; and

FIG. 6 shows a schematic diagram of a load current monitoring circuit according to an embodiment of the invention.

Corresponding numerals and symbols in the various drawings generally refer to corresponding parts unless otherwise indicated. The drawings are drawn to clearly illustrate the relevant aspects of the preferred embodiments and are not necessarily drawn to scale.

Detailed Description

The formation and use of the disclosed embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.

The following description sets forth various specific details in order to provide a thorough understanding of several example embodiments in accordance with the present description. Embodiments may be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the embodiments. Reference in this specification to "examples" indicates that: a particular configuration, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, phrases such as "in one embodiment" and the like that may be present at various points in the specification do not necessarily all refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The present invention will be described with respect to embodiments in a particular context, a load current monitoring circuit and method for a class AB audio power amplifier. Embodiments of the invention may be used in other circuits (such as, for example, other types of class AB amplifiers).

In an embodiment of the invention, the load current through the audio speaker is sensed without using a sense resistor in series with the half-bridge of the output stage of the digital input class AB amplifier. The sensed current is sensed in real-time and used to determine (e.g., in real-time) the impedance of the audio speaker. The determined impedance of the audio speaker may be advantageously used for real-time speaker protection and real-time audio quality optimization. In some embodiments, a digital interface may be used to stream real-time load current and/or real-time speaker impedance data out of a digital input class AB amplifier, for example, to extend system-level application features.

As shown in fig. 1, a conventional class AB audio power amplifier 100 monitors the current flowing on each half-bridge of the output stage 102 by utilizing respective current sense resistors 110 and 112, and uses a current sense buffer 108 to generate a voltage V_senseTo perform load current sensing. Voltage V_senseIs a voltage proportional to the current flowing through the speaker 106. The current sense resistors 110 and 112 are typically very small (e.g., on the order of a few m Ω) due to low power consumption considerations. Therefore, the voltage generated across the current sense resistors 110 and 112 is also very small, making it difficult to accurately measure small load currents.

As shown in fig. 2, the impedance of the audio speaker may be different for each frequency. For example, the impedance of an audio speaker can be modeled as a resistor in parallel with a capacitor and then in series with an inductor. Thus, the impedance of the audio speaker varies based on the frequency content of the audio signal reproduced by the speaker.

The impedance of the audio speaker is also affected by process variations. Furthermore, the impedance of the audio speaker may change over time (e.g., due to aging) as well as in real-time (e.g., due to temperature changes of the speaker). As a result, conventional audio systems tend to underutilize the audio speaker (e.g., deliver less power to the audio speaker) as a way of ensuring that the audio speaker is not damaged during operation (e.g., caused by excessive displacement and/or overheating of the audio speaker).

In an embodiment of the invention, the current sensing circuit senses the load current without using a sense resistor in series with the half bridge of the output stage. Avoiding the use of a sense resistor in series with the half bridge of the output stage advantageously allows small currents to be accurately sensed without sensing very small voltages (e.g., μ V voltages to several mV voltages) across very small sense resistors (e.g., resistors with resistances below 1m Ω to, for example, 10m Ω). The sensed load current may be used to estimate the impedance of the audio speaker in real-time, allowing for optimized audio power delivery and audio quality while still protecting the audio speaker.

Fig. 3 shows a schematic diagram of a digital input class AB audio power amplifier 302 according to an embodiment of the invention. The digital input class AB audio power amplifier 302 includes a digital interface 308, a digital core 310, a digital-to-analog converter (DAC)312, an analog class AB audio power amplifier 304, and a load current monitoring circuit 306. The analog class AB audio power amplifier 304 includes a bias and drive circuit 315 and an output stage 102. The load current monitoring circuit 306 includes a current sensing circuit 318 and an analog-to-digital converter (ADC) 316.

During normal operation, digital interface 308 receives a digital audio stream and transmits audio data to digital core 310. Digital core 310 receives audio data from digital interface 308, processes the audio data, and transmits the processed audio data to DAC 312. DAC312 receives audio data from digital core 310 and converts it to an analog signal that drives bias and drive circuit 314. The biasing and driving circuit 314 drives the output stage 102. The load current monitoring circuit 306 senses the output current by using the current sensing circuit 318. Load current monitoring circuitry 306 converts the sensed current to digital form using ADC316 and transmits it to digital core 310.

As shown in fig. 3, the current sense circuit 318 senses the load current without using a resistor in series with the half bridge of the output stage 102.

The current monitoring circuit 306 is capable of monitoring the load current continuously and in real time.

Digital core 310 may use the sensed load current for various purposes. For example, in some embodiments, digital core 310 may estimate and monitor load impedance in real time based on the sensed current. For example, in some embodiments, the digital core 310 determines the impedance R of the audio speaker 106 by the following equation_load：

Wherein, I_loadIs the current sensed by current sensing circuit 318, and V_outIs soundVoltage across the audio speaker 106. In some embodiments, the voltage V is measured directly_out. In other embodiments, the voltage V is estimated, for example, by the following equation_out：

V_out＝V_in·G (2)

Wherein, V_inIs an input voltage that can be determined from a digital input audio stream, and G is a gain that is applied to the input voltage V_inAnd is also known.

Real-time load impedance information may be used, for example, as an input to an Automatic Gain Control (AGC), also known as Automatic Volume Control (AVC), to input signals for different frequencies to adjust output power and optimize sound quality.

The digital core 310 may also use the sensed load current to limit the maximum current flowing through the audio speaker 106 to protect the audio speaker 106. For example, in some embodiments, upon detecting a high load current (e.g., by comparing the sensed current to a threshold), digital core 310 may reduce the amplitude of the signal fed to DAC312 (e.g., by digitally adjusting the gain) to reduce the load current. In some embodiments, digital core 310 may use analog circuitry within bias and drive circuitry 314 or outside bias and drive circuitry 314 to reduce the amplitude of the analog signal that is positively fed bias and drive circuitry 314.

In some embodiments, digital core 310 does not process audio data, but instead the same audio stream received from digital interface 308 is sent to DAC 312. In some embodiments, digital core 310 processes audio data by filtering, adding delays, performing data integrity operations, and other known audio/data processing techniques.

Digital interface 308 may be implemented in any manner known in the art. For example, in some embodiments, digital interface 308 includes inter-IC Sound (I)²S) interface, inter-integrated circuit (I)²C) An interface, a Serial Peripheral Interface (SPI), and/or any other digital interface.

As shown in fig. 3, the audio stream is received by the digital interface 308 (e.g., from an external source, such as an external controller, processor, or communication circuit). In some embodiments, the audio stream may be generated internally, e.g., from a corresponding non-volatile memory. Other embodiments are also possible.

In some embodiments, the digital core 310 transmits real-time data of the sensed load current and/or real-time data of the impedance of the audio speaker 106 to an external user (such as an external controller) via the digital interface 308. For example, in some embodiments, the external controller may use I²S communication to read real-time load current data, and can use I²C to read real-time load impedance data. Other embodiments are also possible.

The biasing and driving circuit 314 is used to drive the output stage 102. For example, a gate driver may be used to drive the control terminals of the corresponding high-side and low-side transistors of each half-bridge of the output stage 102. The biasing and driving circuit 314 may be implemented in any manner known in the art.

Digital core 310 may be implemented as custom logic, for example, and may include a state machine. In some embodiments, a general purpose controller or processor may be used to perform some or all of the functions of digital core 310.

DAC312 and ADC316 may be implemented in any manner known in the art. For example, the ADC316 may be implemented as a SAR ADC or a sigma-delta ADC. For example, DAC312 may be implemented as a delta-sigma DAC or a successive approximation DAC. Other embodiments are also possible.

In some embodiments, a single Integrated Circuit (IC) having a monolithic semiconductor substrate includes: digital interface 308, digital core 310, DAC312, bias and drive circuit 314, output stage 102, current sense circuit 318, and ADC 316. In some embodiments, some of the above-described circuits may be implemented separately. For example, in some embodiments, DAC312, digital interface 310, and digital core 310 may be implemented outside of an IC that includes current sensing circuit 318. Other embodiments are also possible.

The output stage 102 may be implemented in any manner known in the art. For example, in some embodiments, transistors 120 and 124 are power Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) of the p-type, and transistors 122 and 126 are power MOSFETs of the n-type arranged in a bridged load (BTL) configuration.

Fig. 4 shows a schematic diagram of load current monitoring circuit 306 according to an embodiment of the invention. As shown in fig. 4, the load current monitoring circuit includes a current sensing circuit 318, a fully differential buffer 417, and an ADC 316.

During normal operation, the output stage 102 drives the audio speaker 106, for example, as described with respect to fig. 3. Sense transistor 410 is used to mirror the current I flowing through power transistor 122 by using transistors 404 and 408₁₂₂Such that the drain of transistor 410 is biased at a voltage equal to the voltage of output terminal OUTM. Since the gate voltages of transistors 410 and 122 are equal and the drain voltages of transistors 410 and 122 are equal, the sense current I₄₁₀Is a current I₁₂₂Wherein the scaling factor is based on the relative size between transistor 410 and transistor 122. Likewise, sense transistor 430 is used to mirror the current I flowing through power transistor 126 by using transistors 424 and 428₁₂₆So that the drain of the transistor 430 is biased by a voltage equal to the voltage of the output terminal OUTP to generate the sensing current I₄₃₀The sensing current I₄₃₀Is a circuit I₁₂₆Scaled copies of (a).

The current I is sensed by using a current mirror 416₄₁₀Is reflected as a sense current I₄₁₄The current mirror 416 includes transistors 406 and 412. Sensing the current I₄₁₄Flows through the sense resistor 414 to generate a voltage V_senseM. Likewise, by using current mirror 436, the current I is sensed₄₃₀Is reflected as a sense current I₄₃₄The current mirror 436 includes transistors 426 and 432. Sensing the current I₄₃₄Flows through sense resistor 434 to generate voltage V_senseP。

The fully differential buffer 417 receives the voltage V_sensePAnd V_senseMAnd isLevel-shifting their DC bias to be the same as that of the comparator of ADC316, wherein the DC bias of the comparator of ADC316 is based on reference voltage V_{ref_adc}. In some embodiments, the fully differential buffer 417 produces a differential voltage Δ V produced with a gain different from 1 (e.g., 2, 2.5, 5, 10, or more, or 0.9, 0.75, 0.5, or less). In other embodiments, the fully differential buffer 417 generates a differential voltage Δ V generated with a gain equal to 1.

ADC316 samples the differential voltage Δ V and generates a digital output ADC_outThe digital output ADC_outIs sent to digital core 310. As shown in FIG. 4, ADC316 receives a reference voltage V_{ref_adc}. Then, the output ADC of the ADC316_outIs a differential voltage Δ V and a reference voltage V_{ref_adc}As a result of the comparison of (1). In some embodiments, by making the reference current I_refFlows through resistor 452 to generate reference voltage V_{ref_adc}. In some embodiments, resistor 452 matches resistors 414 and 434. By matching resistors 414, 434, and 452, process variations that affect the resistance of resistors 414 and 434 are compensated for, advantageously allowing accurate load current sensing over process variations.

Matching between resistors 414, 434, and 452 may be accomplished in any manner known in the art. For example, in some embodiments, resistors 414, 434, and 452 are disposed next to each other in a layout of ICs having an interdigital structure. For example, resistors 414, 434, and 452 may be divided into several fingers that are inserted into each other in a symmetrical fashion.

In some embodiments, the reference current I_refMay be trimmed to further improve the accuracy of the current sensing. Trimming may be performed during manufacturing and may be performed in a manner known in the art.

Current sources 402 and 422 are used to bias transistors 404 and 424, respectively. In some embodiments, current sources 402 and 422 each generate a current of about 100 μ A. Other current magnitudes may be used.

As shown in fig. 4, sense resistors 414 and 434 are not in series with power transistors 120, 122, 124, or 126. Thus, the sense resistor may have a resistance higher than a few m Ω without affecting the power consumption or the output voltage of the output stage 102. For example, in some embodiments, the sense resistors 414 and 434 have a resistance between 50 Ω and 150 Ω or about 100 Ω. Other resistance values (e.g., higher than 150 Ω or lower than 50 Ω) may also be used, such as, for example, 10 Ω or lower.

In some embodiments, transistors 122 and 410 and transistors 126 and 430 are matched such that current I is₄₁₀Tracking current I₁₂₂And current I₁₂₆Tracking current I₄₃₀. Fig. 5 shows a layout 500 of transistors 122 and 410 according to an embodiment of the invention. Transistors 126 and 430 may be implemented in a similar manner.

As shown in fig. 5, the transistor 122 is disposed in a semiconductor substrate 502 and is divided into two portions 122A and 122B (e.g., of the same size). The sense transistor 410 is also divided into two portions 410A and 410B (e.g., of the same size). Two portions of transistor 410 are disposed between two portions of transistor 122. For example, by placing transistor 410 between two portions of transistor 122, a good match between transistor 122 and transistor 410 is advantageously achieved when transistors 122 and 410 are to be exposed to substantially the same temperature. Placing transistors 122 and 410 in close proximity (such as shown in fig. 5) also advantageously allows for minimal impact of process variations (i.e., any process variation will affect both transistors in a similar manner).

By achieving good matching between transistor 122 and transistor 410, and between transistor 126 and transistor 430, current I is advantageously allowed₄₁₀And I₄₃₀Accurately tracking current I₁₂₂And I₁₂₆。

Advantages of some embodiments include: the accuracy of real-time current sensing for small and large load currents is improved. The sensed current may be used for speaker protection and to improve sound quality, which characteristics are desirable in applications such as automotive sound systems.

In some embodiments, the load current monitoring circuit may be configured to perform current measurements for more than one current range. For example, fig. 6 shows a schematic diagram of a load current monitoring circuit 606 according to an embodiment of the invention. Load current monitoring circuit 606 operates in a similar manner as load current monitoring circuit 306. However, the load current monitoring circuit 606 includes current mirrors 624, 626, 644, and 646, which current mirrors 624, 626, 644, and 646 may be configured to modify the current mirror ratio. For example, transistors 616, 622, 636, and 642 may be disabled or activated to modify the current mirror ratio. For example, in some embodiments, transistors 616, 622, 636, and 642 are enabled by connecting the gates of transistors 616, 622, 636, and 642 to the gates of transistors 614, 620, 634, and 640, respectively. In such an embodiment, the transistors 616 and 636 may be disabled by connecting the gates of the transistors 616 and 636 to GND, and the transistors 622 and 642 may be disabled by connecting the gates of the transistors 616 and 636 to PVDD. It should be understood that transistors 616, 622, 636, and 642 can be enabled or disabled independently of each other.

Modification of the range of current measurements (e.g., by enabling or disabling transistors 616, 622, 636, and 642) may be controlled by one or more control signals. Such one or more control signals may be received, for example, from digital interface 308. In some embodiments, such control signals may be generated by digital core 310. For example, in some embodiments, a first range (e.g., 2A) may be initially selected. Upon detecting that the sensed current exceeds or is close to exceeding 2A, the control signal enables/disables one or more of the transistors 616, 622, 636, and 642 to change the measurement range to a second range (e.g., 4A).

Modifying the current mirror ratio advantageously allows optimizing the accuracy of current sensing for a particular range. For example, in some embodiments, the current mirror ratio may be selected such that the load current monitoring circuit 606 operates in a 1A, 2A, 4A, or 8A range. By selecting the optimized range (e.g., 2A when the maximum expected load current is 2A), the dynamic range and overall signal-to-noise ratio (SNR) is optimized.

Example embodiments of the present invention are summarized herein. Other embodiments may be understood from the entire specification and claims set forth herein.

Example 1. A class AB amplifier comprising: an output stage comprising a pair of half bridges configured to be coupled to a load; and a current sensing circuit coupled to a first half-bridge of the pair of half-bridges, the current sensing circuit including a resistive element and configured to sense a load current flowing through the load by: the method includes mirroring a current flowing through a first transistor of a first half bridge to generate a mirror current, flowing the mirror current through a resistive element, and sensing a load current based on a voltage of the resistive element.

Example 2. The class AB amplifier of example 1, wherein the current sensing circuit further comprises: a second transistor having a control terminal coupled to an output of the first half bridge; a third transistor having a control terminal coupled to the current path of the second transistor; a sense transistor having a control terminal coupled to the control terminal of the first transistor and having a current path coupled to the current path of the third transistor; and a current mirror coupled between the sense transistor and the resistive element, the current mirror configured to generate a mirrored current.

Example 3. The class AB amplifier of any of examples 1 or 2, wherein the first transistor and the sense transistor are matched transistors.

Example 4. The class AB amplifier of any one of examples 1 to 3, wherein the first transistor has a first portion and a second portion disposed in the semiconductor substrate, and wherein the sense transistor is disposed between the first portion and the second portion.

Example 5. The class AB amplifier of any one of examples 1 to 4, wherein the first portion corresponds to a first half of the first transistor and the second portion corresponds to a second half of the first transistor.

Example 6. The class AB amplifier of any one of examples 1 to 5, wherein the current mirror comprises: a current mirror transistor configured to adjust a mirror ratio of the current mirror based on the control signal.

Example 7. The class AB amplifier of any one of examples 1 to 6, wherein the current sensing circuit further comprises: a second current mirror coupled between the sense transistor and the current mirror, the second current mirror including a second current mirror transistor configured to adjust a mirror ratio of the second current mirror based on a second control signal.

Example 8. The class AB amplifier of any one of examples 1 to 7, further comprising: an analog-to-digital converter (ADC) configured to generate a digital signal based on a voltage of the resistive element.

Example 9. The class AB amplifier of any one of examples 1 to 8, further comprising: a reference resistor; and a reference current source configured to inject a reference current into a reference resistor to generate a reference voltage, wherein the ADC is configured to receive the reference voltage, wherein the resistive element comprises a first resistor, and wherein the first resistor and the reference resistor are matched resistors.

Example 10. The class AB amplifier of any one of examples 1 to 9, further comprising: a fully differential buffer coupled between the resistive element and the ADC, wherein the ADC is configured to receive a reference voltage, and wherein the fully differential buffer is configured to level shift the voltage of the resistive element to have a DC bias substantially equal to a DC bias of a comparator in the ADC, and wherein the DC bias of the comparator in the ADC is based on the reference voltage.

Example 11. The class AB amplifier of any one of examples 1 to 10, further comprising: a digital core circuit configured to receive the digital signal from the ADC and configured to calculate a load impedance based on the digital signal.

Example 12. The class AB amplifier of any one of examples 1 to 11, further comprising: a digital core circuit configured to receive the digital signal from the ADC and configured to limit the load current based on the digital signal.

Example 13. The class AB amplifier of any one of examples 1-12, further comprising a load, wherein the load is an audio speaker coupled to the pair of half-bridges.

Example 14. The class AB amplifier according to examples 1 to 13, wherein the first transistor is a low side transistor of the pair of half bridges.

Example 15. The class AB amplifier of any one of examples 1 to 14, wherein the resistive element comprises: having a resistor with a resistance of 10 omega or higher.

Example 16. A digital input class AB amplifier comprising: an output stage comprising a pair of half bridges configured to be coupled to a load; a digital communication interface configured to receive a data stream; a digital core circuit; a digital-to-analog converter (DAC); a driver circuit configured to receive a signal from the DAC and configured to control the output stage based on the received signal; a current sensing circuit coupled to a first half-bridge of the pair of half-bridges, the current sensing circuit including a resistive element and configured to sense a load current flowing through a load by: mirroring a current flowing through a first transistor of a first half bridge to generate a mirror current, flowing the mirror current through a resistive element, and sensing a load current based on a voltage of the resistive element; and an analog-to-digital converter (ADC) coupled to the digital core circuit and configured to generate a digital signal based on the sensed load current.

Example 17. The digital input class AB amplifier of example 16, wherein the digital core circuit is configured to receive real-time load current data from the ADC.

Example 18. The digital input class AB amplifier of any one of examples 16 or 17, wherein the digital core circuit is further configured to transmit the real-time load current data to an external user via a digital communication interface.

Example 19. The digital input class AB amplifier of any one of examples 16 to 18, wherein the digital core circuit is further configured to calculate a load impedance of the load based on the real-time load current data.

Example 20. The digital input class AB amplifier of any one of examples 16 to 19, wherein the digital core circuit is further configured to transmit the load impedance via a digital communication interface.

Example 21. The digital input class AB amplifier of any of examples 16 to 20, wherein the digital core circuit is further configured to limit the load current based on the real-time load current data.

Example 22. The digital input class AB amplifier of any one of examples 16 to 21, wherein the current sensing circuit further comprises: a second transistor having a control terminal coupled to an output of the first half bridge; a third transistor having a control terminal coupled to the current path of the second transistor; a sense transistor having a control terminal coupled to the control terminal of the first transistor and having a current path coupled to the current path of the third transistor; and a current mirror coupled between the sense transistor and the resistive element, the current mirror configured to generate a mirrored current.

Example 23. The digital input class AB amplifier of any one of examples 16 to 22, wherein the digital communication interface comprises inter-IC sound (I)²S) an interface, wherein the data stream comprises an audio stream, and wherein I²The S-interface is configured to receive a data stream.

Example 24. A method, comprising: driving a load with a class AB amplifier; mirroring a current flowing through a first transistor of an output stage of the class AB amplifier to generate a mirror current; causing the mirror current to flow through a resistive element; and sensing a load current flowing through the load based on the voltage of the resistive element.

Example 25. The method of example 24, wherein the load is an audio speaker.

Example 26. The method of any one of examples 24 or 25, wherein the first transistor is a low-side transistor of the output stage.

Example 27. The method of any one of examples 24 to 26, wherein the resistive element comprises a resistor having a resistance of at least 10 Ω.

Example 28. The method of any of examples 24 to 27, wherein the first transistor is a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET).

Example 29. A digital input class AB amplifier comprising: an output stage comprising a pair of half bridges configured to be coupled to an audio speaker; a digital communication interface configured to receive an audio stream; a digital core circuit; a digital-to-analog converter (DAC); a driver circuit configured to receive a signal from the DAC and configured to control the output stage based on the received signal; a current sensing circuit comprising: a second transistor having a control terminal coupled to an output of a first half-bridge of the pair of half-bridges; a third transistor having a control terminal coupled to the current path of the second transistor; a first sense transistor having a control terminal coupled to the control terminal of the first transistor of the first half bridge and having a current path coupled to the current path of the third transistor; a first resistor; a first current mirror coupled between the first sense transistor and the first resistor, the first current mirror configured to generate a first mirrored current flowing through the first resistor; a fourth transistor having a control terminal coupled to an output of a second half-bridge of the pair of half-bridges; a fifth transistor having a control terminal coupled to the current path of the fourth transistor; a second sense transistor having a control terminal coupled to the control terminal of the sixth transistor of the second half bridge and having a current path coupled to the current path of the fifth transistor; a second resistor; a second current mirror coupled between the second sense transistor and the second resistor, the second current mirror configured to generate a second mirrored current flowing through the second resistor; and an analog-to-digital converter (ADC) coupled to the first resistor and the second resistor, the ADC configured to generate a digital signal based on a voltage difference between a first node of the first resistor and a second node of the second resistor, wherein the digital core circuit is configured to estimate an impedance of the audio speaker based on the digital signal.

While the present invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. It is therefore intended that the appended claims cover any such modifications or embodiments.